At Computex 2025 in Taipei, Chieftec unveiled an extensive lineup of power supplies, PC cases, and CPU coolers designed for enthusiasts and professionals alike. The company's new VEGA M series power supplies combine modern efficiency with robust performance. Available in both Black (PPG-1000-C) and White (PPG-1000-CW) finishes, the units deliver configurable output levels of 1,000 W, 850 W, and 750 W (Black) or a fixed 1,000 W (White). Both models employ an LLC Half‑Bridge converter with DC‑to‑DC technology, support ATX 3.1 and PCIe Gen 5, accept 100-240 V AC input at 12 A, and feature a 135 mm fluid-dynamic‑bearing fan alongside 80 Plus Gold certification. Complementing the VEGA M series, the Stealth SPX‑1200‑FC pushes the envelope with 1,200 W capacity, Platinum efficiency, and premium Japanese capacitors. It shares the same advanced cooling design and Gen 5 compatibility, offering a 100-240 V AC input range at 13-6.5 A and ensuring stable power delivery under heavy load.

Here are some close-up shots we took of AMD's latest client and enterprise processors. Starting things off is the Ryzen AI Max "Strix Halo." This is a rather large chip, with a package size resembling some high-end GPUs. This chiplet-based processor is dominated by a large SoC+iGPU tile built on the TSMC N4P process, and two "Zen 5" CCDs. These are the same CCDs as "Granite Ridge," "Fire Range," and "Turin," which come with full 512-bit data paths for the FPU, and large 32 MB L3 caches per CCD. The SoC+graphics tile has the iGPU with 40 compute units. The package is large not just because of the size of the chip, but also its 256-bit wide LPDDR5X memory interface.

Next up, is the Ryzen AI 9 HX Pro mobile processor, which comes in the regular mobile processor package AMD has been using for several generations now. The chip is based on the "Strix Point" monolithic silicon built on TSMC N4P. This particular SKU has the AMD Pro feature-set, and targets commercial notebooks. Lastly, there's the Ryzen Z2 Extreme. This particular chip is built on an optimized variant of "Strix Point," with a few disabled CPU cores, but a maxed out iGPU with all 16 CU enabled. This processor targets gaming handhelds. Winding things up is the EPYC 9006 "Turin" processor with its glorious 12 "Zen 5" CCDs.

GeIL Memory brought its latest gaming PC memory products to Computex 2025. We begin our tour with the GeIL Aquarius DDR5 memory, which features a solid gold mirror-finish aluminium heat spreader that puts it in the same category of premium as the G.Skill Royal. There's just one silicone RGB diffuser along the sides. The GeIL Aquarius is expected to come in various high DDR5 speeds (think 8000 MT/s and above). Next up, is the Gemini V RGB, the company's performance-segment memory that comes with a prominent silicone RGB diffuser along the top, upper mid-range speeds, and capacities of up to 64 GB. Lastly, there's the Orion V RGB, the company's high-performance memory series that comes in asymmetric capacities such as 24 GB, to make up 96 GB memory configurations, and speeds of 6000 MT/s and above.

Netac at Computex 2025 brought its latest consumer storage products. We begin our coverage with the NVI50MK, the company's flagship M.2 NVMe Gen 5 SSD. This drive comes with a factory fitted aluminium heatsink, and comes in capacities of up to 4 TB. The company didn't reveal the controller+NAND flash combination, but mentioned that it offers DRAM caching, and sequential transfer speeds of up to 14 GB/s reads, with up to 11 GB/s sequential writes.

Next up, is the HDIOM2 Pr, a magnetic SSD enclosure for M.2-2242 and M.2-2230 NVMe SSDs. Its bridge chip offers a Gen 3 x2 connection internally, which it wires out as 10 Gbps USB 3.2 Gen 2. The enclosure is magnetized to stick to most smartphones, with a short length USB-C cable. We also spied the coin-sized US9 USB flash drive, which comes with USB-C and USB-A receptacles, up to 1 TB of capacity, and sequential transfer speeds of up to 1000 MB/s over the drive's 10 Gbps-capable USB 3.2 Gen 2 connection. The ZX20-II is a credit card-sized magnetic portable SSD with a 10 Gbps USB 3.2 Gen 2 type-C connection, and a slender 8 mm profile that weighs just 49 g. The drive comes in capacities of up to 2 TB.

During our visit of the jam-packed Computex day one, we stopped by the Phanteks booth to see what the company prepared for this year. The spotlight fell on two new Matrix editions of Phanteks' flagship cases. The Evolv X2 Matrix, offered in black or white, retains the original's sleek tri panel layout while introducing soft touch fabric panels. Beneath the refined surfaces, a 900 LED matrix sits along the bottom section. Through the NEXLINQ app, builders can customize display elements such as system statistics, text or simple animations without compromising the case's clean lines. Likewise, the XT View Matrix model shares the fabric exterior and integrates a 600 LED matrix panel on its side. Despite the added flair, it still accommodates up to ten fans and provides ample space for modern motherboards prioritizing cable management.

Corsair's Computex booth has plenty of new products on display, particularly for those looking for a new PC case or a powerful PSU to manage the demanding NVIDIA RTX 50 Series GPUs. We will start with the new premium FRAME 5000D case that takes its inspiration from the well-known FRAME 4000D series. This new model is not just a bigger case that supports reverse connection motherboards (ASUS BTF, MSI Project Zero, and Gigabyte Project Stealth), it also comes with fine details and updates like the modular pegboard pattern on its motherboard tray (known as Corsair RapidRoute 2.0) that helps with cable management.

The large size of the case, which measures 556 mm x 250 mm x 542 mm lets users install up to ten 140 mm fans (3x front, 3x top, 3x side, 1x rear) as well as radiators up to 420 mm (360 mm front, 420 mm top and 360 mm side). The FRAME 5000D is available in two variants, first with four RS120 ARGB fans pre-installed and the second one featuring four non-RGB RS120 fans (both variants are offered in black and white color options). On display Corsair also showcases a FRAME 5000D with an optional Xeneon Edge LCD add-on side panel.

FSP, the channel brand of power supply giant Fortron, brought a large lineup of their latest gaming PC power supplies, cooling products, and PC cases to Computex 2025. We begin our tour with the things FSP specializes in—power supplies. The Cannon Pro 2500 W is a titan, which maxes out your 16 A wall socket for 2.5 kW of continuous power delivery, with excursions within the ATX 3.1 and PCIe 5.1 specs. The PSU offers Cybenetics Platinum and 80 Plus Platinum switching efficiency. Putting the 2.5 kW output to use are four (!) 600 W-capable 12V-2x6 power connectors, making this PSU fit for AI acceleration builds.

A notch below the Cannon Pro 2500 W is the Mega Ti series, which comes in high-wattage variants of 1650 W, 1350 W, and 1000 W. This is considered FSP's flagship power product, because of its Cybenetics Titanium and 80 Plus Titanium switching efficiency. Both the 1650 W and 1350 W models offer two 12V-2x6 connectors, while the 1000 W model offers one of these. The PSUs offer fanless cooling up to a fairly high load factor. The Mega PM series is positioned a notch below the Mega Ti series in FSP's product stack. As the name suggests, these offer 80 Plus Platinum and Cybenetics Platinum certified efficiency. These only come in 1650 W and 1350 W variants, both of which offer two 12V-2x6 connectors.

Gamdias' product portfolio spans more than just cases, as the company has dipped its toes into a wide variety of PC peripherals. The company kicked off its peripherals reveal with the THOR P2 Series fully modular power supplies. Available in 850 W, 1,000 W, and 1,200 W outputs, each unit carries an 80 Plus Gold efficiency rating and fully complies with ATX 3.1 and PCIe Gen 5.1 standards, guaranteeing compatibility with the latest graphics cards and motherboards. Builders will appreciate the fully detachable cable harness for streamlined cable management, while the rotatable AC inlet affords 90‑degree positioning flexibility in tight cases. All-Japanese electrolytic capacitors pair with a semi‑bridge LLC resonance and 12 V synchronous rectification DC-DC design to deliver steadfast voltages. A 135 mm sleeve‑bearing fan provides robust airflow under heavy loads, intelligently pausing when demand falls below 40 percent to maintain whisper‑quiet operation. Heavy-duty protections and a 10‑year warranty back the new THOR P2 series.

Intel at the 2025 Computex showed off its next-generation Core Ultra Series 3 processor, codenamed "Panther Lake." The mobile H-segment version of the chip comes with a slender rectangular package similar to "Arrow Lake-H" and "Meteor Lake." It is a tile-based disaggregated processor, but comes in a unique arrangement of tiles we haven't seen with the past two generations. The chip is dominated by two large tiles, one is very likely the Graphics + SoC tile, the smaller of the two being the Compute tile with the CPU cores, and the slender rectangular tiles being related to I/O.

As for IP, "Panther Lake" introduces a new generation iGPU powered by the Xe3 "Celestial" graphics architecture. The CPU complex consists of "Cougar Cove" P-cores, and "Darkmont" E-cores, both of which are expected to provide generational IPC improvements over the current "Lion Cove" and "Skymont." At Computex, we not only got to go hands-on with the mobile packages of "Panther Lake," but also see the chip in action, installed on a testing and platform validation system. The engineering goal with "Panther Lake," Intel says, is to offer efficiency similar to "Lunar Lake," but with performance generationally exceeding "Arrow Lake-H." The Compute tile is expected to be built on the new Intel 18A foundry node. Intel says "Panther Lake" is on track for mass-production in the second half of 2025, with the first consumer products expected at CES 2026.

We visited the Gamdias booth at Computex 2025, and there was quite a lot to unpack there. Being a PC peripheral manufacturer, Gamdias makes cases, keyboards, PSUs, and many other products. Now, we focus on cases. The centerpiece, the ATLAS P4 mid‑tower, breaks with convention by placing the power supply at the front. This simple repositioning channels fresh air directly over high‑end graphics cards, and with five preinstalled 120 mm ARGB PWM fans, coordinated through an eight‑port ARGB/PWM hub, thermals should remain low under any load. A seamless panoramic tempered‑glass side panel offers a clear, aquarium‑like view of the interior, while a vibrant 6‑inch IPS LCD lets builders monitor temperatures, adjust fan curves, or even display custom artwork.

Lexar at the 2025 Computex showed off its two flagship SSDs. Starting things off is the NM1090, the company's top-of-the-line drive with a 6 nm controller, and 3D Xtracking NAND flash memory that offers up to 14 GB/s sequential reads, with up to 13 GB/s sequential writes, and up to 2.1 million IOPS 4K random access speeds. We have an NM1090 review sample back home, and will review it soon. Next up, is the company's previous flagship, which can now be had for attractive prices, the NM990. This drive offers up to 14 GB/s sequential reads, but slightly lower writes speeds, of up to 11 GB/s.

At Essencore's Computex 2025 booth, we saw the company's latest M.2 Gen 5 NVMe SSDs, and LPCAMM2 memory modules. We begin our coverage with the Genuine E540, a mid-range Gen 5 NVMe SSD that is powered by a MaxioTech MAP1806A controller. This drive is DRAMless, and offers performance in the 12-10 GB/s class. Moving things up a notch is the E550, a Gen 5 SSD powered by a premium Silicon Motion SM2508 controller with DRAM cache. This drive comes in capacities ranging from 1 TB to 4 TB, with sequential read speeds of 14 GB/s, and depending on the variant, write speeds of up to 12.5 GB/s for the top variant, and up to 11 GB/s for the 1 TB variant. Lastly, the company showed us their LPCAMM2 memory modules targeting ultrathin notebooks. These modules feature LPDDR5X-8533 speeds, and come in capacities of 16 GB, 32 GB, and 64 GB.

MSI's Computex booth has prepared new products for everyone, even for overclockers in microATX form factors. The company has presented a microATX MPOWER B850E motherboard, as we expected the MPOWER series comeback, with a very simple visual layout, aiming to please overclockers and even extreme LN2 users, with little add-ons to obstruct operations. Based on the B850E chipset, it accommodates AM5 processors with up to 16 cores and 32 threads in the top-end AMD Ryzen 9 9950X SKU. There are two eight-pin CPU connectors instead of the regular single eight-pin connector, for more overclocking headroom. VRM phases are covered in low-profile heatsinks so that LN2 coolers, often large and chunky, don't interfere with motherboard elements, which would usually require removal and later thermal isolation. What is particularly interesting is the usage of two memory DIMM slots, which is ideal for overclocking as it requires less CPU signaling to the memory. For easy signaling, MSI's EZ dashboard integrates power, reset, clear CMOS buttons, and a debug LED for CPU status codes.

As part of our continuing coverage of Sudokoo at the 2025 Computex, beginning with the company's liquid CPU coolers, we now move on to its air coolers and fans. The company brought two premium air-based CPU coolers to Computex, the SK700V and SK620V. The SK620V is a D-type cooler—aluminium dual fin-stack tower. The heatsink is completely shrouded from the sides, and has a pair of pre-installed 120 mm FDB fans in push-pull configuration. Sudokoo recommends this cooler for AMD Socket AM5, and rates its cooling capacity at 220 W, making it fit for even the top 16-core Ryzen 9 processors. The cooler's star attraction is an LED segment display which puts out ACPI system monitoring stats. The cooler comes win black and white color variants.

Next up, is the SK700V, the company's flagship air cooler, though it continues to be rated for 220 W TDP. Unlike the SK620V, this is a U-type single fin-stack cooler, however the fin-stack is very thick, and is capable of having fans in push-pull configuration, however only one 120 mm FDB fan is included. As with the SK620V, the top plate shroud has a segment LED display that puts out system monitoring stats. Moving on, we were shown the company's premium case fan lineup, the Mach 140 and Mach 120. These fans feature a premium hydraulic bearing, and a transparent hubcap letting you see the motor's winding inside. The motor features a 10-pole/12-slot winding, with 3-phase power. The hydraulic bearing is sourced from Porite Corporation. Lastly, Sudokoo showed us various tag-on accessories for its fans, letting you put their 30 mm thickness to good use.More pictures follow.

Sudokoo is a recent entrant to the PC case and cooling scene, we recently did a Giveaway with this brand just before we took off for Taipei. The company made its debut at Computex with its first product stack. We begin our coverage with the company's liquid cooling products. Starting things off, is the Energlo, a fairly premium all-in-one liquid CPU cooler, which features a large cubical pump-block with an LED segment display. This display puts out CPU temperature, CPU load, frequency, and power values, which it pulls from software via a USB connection. This software reads the values from ACPI. Perhaps the most interesting feature is its corded breakaway module that gives you a rotary dial that lets you cycle information, control fan speed, cycle through RGB presets, etc.

Next up, is the Proteus series. This was one of the prizes in our recent Giveaway. This is the company's high-end offering, and dominating it is a cube-shaped pump-block that has a 3.4-inch true-color LCD with 480 x 480 pixels resolution. The display can be rotated 90-degree to orient with the way you installed it, without needing any tools. The cooler also offers certain premium features such as compound fans, including fans that are 30 mm-thick for larger impellers that turn at lower RPM to achieve the target airflow, and end up quieter. We thought the 360 mm variant was the largest one, but at Computex, we were shown an even larger Proteus 420, with a 420 mm x 140 mm radiator. Sudokoo claims that this AIO can deal with thermal loads of 350 W.More pictures follow.

Cooler Master is making a big splash at Computex 2025 with its "One Cooler Master—Where Cooling Drives the Future" showcase, held at its headquarters in Taipei. The company is showing off how it's bringing together its enterprise-level engineering and consumer-focused design into a single, streamlined approach. The idea is simple: take the cutting-edge solutions developed for demanding industries like finance and AI and turn them into powerful, customizable gear for gamers, creators, and everyday builders. CEO Jimmy Sha says it best—this structure allows ideas and tech to flow in both directions, ensuring innovation benefits everyone.

"At Cooler Master, we work as one team," Sha explains. "Whether it's solving tough problems for enterprise clients or building tools for passionate creators, we take those lessons and turn them into products everyone can use. That's what "One Cooler Master' is all about" making sure breakthroughs don't stay locked away in server rooms, but instead power the desktops and rigs our community loves to build."

At COMPUTEX 2025, In Win Development Inc. (InWin), renowned for its brand philosophy of 'Contemporary and Innovative' and a recipient of numerous international design awards, showcased its innovative special edition ChronoMancy chassis and its advanced L11 liquid cooling rack system assembly capabilities for AI datacenters.

40th Anniversary Special Edition Chassis
Time-honored and trophy-inspired, ChronoMancy is a uniquely shaped PC chassis created to commemorate InWin's 40th anniversary. Designed as a trophy to symbolize the passage of time, the top panel features blue engineering-grade plastic engraved with InWin's legacy of special edition chassis, celebrating its heritage and innovation. It is supported by five pillars representing the five continents, symbolizing InWin's global presence and future growth.

Maxsun is getting ready to release new graphics cards at Computex 2025, starting with the newly and highly expected entry-level RTX 5060 series that NVIDIA just announced and continuing with some fresh models of its iCraft AIGA series. One of the first that we noticed is the MS GeForce RTX 5060 LP 8G (8 GB 128-bit GDDR7), a low-profile, two-slot version measuring 182 x 69 x 38 mm. This particular implementation uses for cooling three 5 cm fans in combination with a heatsink and dual heat-pipes. The card is powered by a standard 8-pin connector and sports 2x DisplayPort and 2x HDMI output connectors. Still in the RTX 5060 series, we also noticed Maxsun's GeForce RTX 5060 Ti iCraft OC16G AIGA X2 Classic graphics card. This card comes in a more compact format measuring 252 x 124 x 43 mm, is equipped with 16 GB GDDR7 memory and sports two 9 cm fans with intelligent fan control technology and a heatsink with three heat pipes. The design follows Maxsun iCraft AIGA theme and includes iCraft Skylight RGB lighting for a more appealing aesthetics.

In the same iCraft AIGA series, Maxsun's lineup included the RTX 5070 iCraft OC12G AIGA and the RTX 5080 iCraft OC16G AIGA Plus running at 2295 MHz (2617 MHz Boost). The RTX 5070 uses three 9 cm fans with six heat pipes for cooling while for the RTX 5080 Maxsun opted for three 10 cm fans. However, Maxsun products are currently restricted to the Chinese market, so we will not be seeing any of them at Western retailers.

Inno3D is exhibiting many already released graphics card products at their Computex 2025 booth, but TechPowerUp's day zero visit focused on an intriguing wall-mounted demo unit. Earlier today, NVIDIA announced the official launch of its affordable GeForce RTX 5060 8 GB desktop and laptop designs. Prior to full-on introduction, media outlets have expressed dissatisfaction regarding Team Green's "Blackwell" GPU entry-mainstream review conditions. Currently, many professional reviewers are "on-site" in Taiwan. At this rate, the publication of in-depth evaluations will occur following the conclusion of this week's extremely important trade event.

The Inno3D GeForce RTX 5060 TWIN X2 OC White SKU reuses a familiar dual-fan setup; as featured on readily available GeForce RTX 5060 Ti 8 GB options (black/silver or white/silver). Interestingly, the manufacturer also extends this dual-slot thick design into triple-fan territories (for RTX 5060 Ti and above). The TechPowerUp GPU database does not allude to any Inno3D GeForce RTX 5060 (non-Ti) models being outfitted with a third fan. As discussed in a mid-April PR piece, Inno3D engineers have drummed up a custom PCB layout. Despite the implementation of a very shallow overclock, the TWIN X2 cooling solution is not expected to struggle—when tasked with the tempering of Team Green's GB206 GPU die.

Acer's dedicated Computex 2025 preview landing page mostly concentrates on brand-new AI PC products, but eagle-eyed observers have noticed the inclusion of an NDA-busting item. The manufacturer's web marketing team has inadvertently unveiled their forthcoming Nitro Radeon RX 9060 XT OC 16 GB model; days in advance of AMD's official unveiling (May 21). Over a week ago, momomo_us shared a screenshot of an unnamed retailer's listing of not-yet-official Acer Nitro 16 GB and 8 GB SKUs. The keen tech industry watcher followed up with today's discovery; complete with a promotional render.

As expected, the Taiwanese brand has prepared a new dual-fan design—borrowing elements from semi-recently revealed Radeon RX 9070 Series cards. Despite rumors of leveraging lesser hardware—probably a "Navi 44 XT" GPU—Acer's pre-launch hype material has outlined an ambitious resolution target: "enjoy stunning 8K visuals and use AI tools to craft your next masterpiece based on RDNA 4 architecture." Acer acts as a board partner for Team Red and Team Blue—surprisingly, the firm's pre-game teaser does not outline an upcoming Intel Xe2 "Battlemage" desktop product line. Instead, a fresh-ish Nitro Arc "Alchemist" A380 LP 6 GB model was placed next to the aforementioned Radeon RX 9060 XT card. So far—during day zero booth inspections—the TechPowerUp has not stumbled upon any physical examples of cheaper RDNA 4 options.

Over a month ago, TechPowerUp published a review of the Thermaltake TR100 compact dual-chamber ITX chassis. Darksaber was seriously impressed by his Hydrangea Blue variant; thus the resultant "Editor's Choice" and "Great Value" badges of honor. Prior to the receiving of a lone sample evaluation sample, TPU staff members inspected demonstration units on two separate occasions. At last year's Computex trade event, and then at CES 2025. At launch, four colors were made available: Black, Snow (aka white), Matcha Green, and Hydrangea Blue. During the setup of this year's booth, the Thermaltake crew granted early access to members of the press. Upon arrival, TechPowerUp's photographer spotted an intriguing "Gravel Sand" TR100 model. This colorway/finish is a familiar sight, as sported by various readily available "The Tower" and "View" models.

The company's TR100 product page mentions two other color options: Bubble Pink and Mint Strawberry. At the time of writing, their Gravel Sand sibling is not listed. Brand-new taller TR300 and TR200 cases were sat to the left of the original 18.4-liter small form factor (SFF) design. The former seems to be approaching mid-tower elevation; likely voluminous enough to accommodate larger components. An optional front panel piece—sporting Scandi-esque wooden slats—was placed nearby; implying a swappable configuration. Thermaltake's "in-the-middle" TR200 SKUs could be tall enough to accept microATX format motherboards. A snow-white demonstration unit was prepped and running an installed 3.9-inch LCD Screen Kit (also present on the TR300 demo unit)—currently available as an extra attachment for the TR100 series.

LIAN LI Industrial Co. Ltd., a leading manufacturer of chassis and PC accessories, will attend Computex 2025, located at Nangang Exhibition Center, Hall 2, 4F, booth R0602, from May 20th to May 23rd. LIAN LI is presenting a lineup designed to enhance the PC building experience. Visitors will get an exclusive first look at LIAN LI's latest innovations, including the LANCOOL 4, O11D MINI V2, and DAN Case B4, LANCOOL 217 INF and Vector V200; cooling takes center stage with a new AIO solution- the HydroShift III, equipped with a 2K panoramic LCD screen; and four innovative PSU prototypes with the DWS Series, RS Series, RB Series, and SP Series, each pushing the boundaries of power and design.

The LANCOOL 217 INF enhances the iconic LANCOOL 217 chassis design with a stunning Infinity Mirror front panel that seamlessly integrates glass ventilation for effective airflow. Equipped with built-in lighting controls, users can easily switch modes and adjust colors, delivering a fully customizable visual experience. Additionally, the LANCOOL 217 INF features an integrated L-Wireless receiver for effortless wireless control right out of the box. Maintaining the signature toolless mounting for the PSU shroud fans, dual PSU mounting orientations, along with toolless mesh panels and support for motherboards up to SSI-EEB and even back-connect ATX and microATX motherboards, the LANCOOL 217 INF is designed for those who demand both style and functionality.

Here is the first picture of the Antec Vortex View, a premium all-in-one closed-loop liquid CPU cooler. The Vortex View is characterized by what looks like a 4-inch 16:9 display on top of the pump-block. This display connects to your graphics card over HDMI, and can be programmed to show just about anything. An app included with the cooler reads system monitoring information from ACPI and displays onto this screen, but to the system it's just another display head, and can be programmed to show just about anything. This is the white model of the Vortex View, and comes with not just white sleeved tubing, but also a white radiator—including white fins. The whitewash continues onto the three included FDB fans. The CLC supports all modern client desktop sockets, including AM5 and LGA1851.

Prior to official kick-off day, the TechPowerUp team was kindly invited to have a sneak peek around the ASUS booth. Brand-new Republic of Gamers (ROG) Harpe II Ace gaming mice were on full view (with black or white livery), sitting atop second-gen Sheath XXL mouse pads. The original ROG Harpe design was released over two years ago; as an Ace Aim Lab Edition. Last year, two spin-offs were introduced last summer: Harpe Ace Extreme and Harpe Ace Mini. ROG's freshest offering appears to utilize familiar internal components; most notably the cutting-edge AimPoint Pro optical sensor—very likely derived from Pixart's flagship PAW3950 model. Other mainstays include ROG's Optical Micro Switches (rated up to 100 million clicks) and SpeedNova 8K wireless system.

The ROG Harpe II Ace is built with a special and innovative bio-based nylon material, that contributes very little weight. A product placard advertises a total unit weight of 49 grams; only 2 g lighter than the ultra-premium Harpe Ace Extreme model. This $249.99 (MSRP) option features a fully CNC-machined carbon fiber top shell. The company has collaborated with Max "Demon1" Mazanov and other esport champions; thus refining the right-hand ambidextrous Harpe design for a new generation. Instead of using three or four skates, the Harpe II Ace is outfitted with two large chunks of rounded-edge pure PTFE. Gear Link—a web-based platform—grants access to hardware configuration; a massive plus point. TechPowerUp's pzogel has often directed criticism at the manufacturer's Armoury Crate software suite. A "lighter" and "less intrusive" package—called Armoury Crate Gear—was pushed out in recent times, but gaming mouse purists (largely) remain unconvinced.

MiTAC Computing Technology Corporation, a leading server platform designer, manufacturer, and a subsidiary of MiTAC Holdings Corporation, has launched its full suite of next-generation servers for data centers and enterprises at COMPUTEX 2025 (Booth M1110). Powered by Intel Xeon 6 processors, including those with Performance-cores (P-cores), MiTAC's new platforms are purpose-built for AI, HPC, cloud, and enterprise applications.

"For over five decades, MiTAC and Intel have built a close, collaborative relationship that continues to push innovation forward. Our latest server lineup reflects this legacy—combining Intel's cutting-edge processing power with MiTAC Computing's deep expertise in system design to deliver scalable, high-efficiency solutions for modern data centers." - Rick Hwang, President of MiTAC Computing.