We know from older reports that Intel will refresh its socket LGA2011 HEDT (high-end desktop) product family with three new parts, based on the new 22 nm "Ivy Bridge-E" silicon. A table detailing their clock speeds was leaked to the web. In addition, we got details of what Intel's entry-level Core i3 "Haswell" line of dual-core processors would look like, specs-wise. The Ivy Bridge-E silicon, is to a large part an optical shrink of the Sandy Bridge-E silicon, with a few improvements. The chip is fabricated on Intel's 22 nm node with tri-gate transistors, the IMC natively supports DDR3-1866 MHz, the PCI-Express root complex is gen 3.0 certified, and the CPUID features the new RdRAND instruction set. Aside from these clock speeds are increased across the board, although TDP isn't lowered from the previous 130W.

Leading the Core i7 "Ivy Bridge-E" pack is the Core i7-4960X Extreme Edition, with its 3.60 GHz core, 4.00 GHz maximum Turbo Boost, unlocked base-clock multiplier, and 15 MB L3 cache. This six-core chip will command a four-figure price. Next up, is the Core i7-4930K, with 3.40 GHz core, 3.90 GHz maximum Turbo Boost, unlocked base-clock multiplier, and 12 MB L3 cache. This chip could be 30-40 percent cheaper than the i7-4960X. The cheapest of the lot, though, is the Core i7-4820K. This quad-core part, interestingly, features unlocked base-clock multiplier, unlike its predecessor, the i7-3820. Perhaps Intel didn't want a repeat of Core i7-3770K cannibalizing the i7-3820. The i7-4820K features 3.70 GHz core, 3.90 GHz Turbo Boost, and 10 MB of L3 cache. The chip may be priced in the same range as the i7-4770K. All three parts feature quad-channel DDR3 integrated memory controllers, with native support for DDR3-1866.

First sighted in January, ASUS' P9X79-E WS socket LGA2011 motherboard is ready to take on the new breed of Core "Ivy Bridge-E" and Xeon "Ivy Bridge-EP" lines of processors, even if initial versions of its BIOS don't advertise that support. Based on Intel X79 Express chipset, the board is built in the 305 x 267 mm SSI-CEB form-factor. The LGA2011 socket is powered by a 10-phase VRM, with 2+2 phase memory VRM. The CPU socket is wired to eight DDR3 DIMM slots, four on its either sides, supporting up to 64 GB of quad-channel DDR3-2133 MHz memory. The board features a total of seven PCI-Express x16 slots. 4-way NVIDIA SLI and AMD CrossFireX are supported.

Storage connectivity on the P9X79-E WS includes two SATA 6 Gb/s ports from the X79 PCH, four SATA 6 Gb/s from a Marvell-made 4-port SATA 6 Gb/s AHCI/RAID controller, four SATA 3 Gb/s from the PCH, and an additional two eSATA 6 Gb/s from an ASMedia-made controller. There are just four USB 3.0 ports on offer, all ASMedia-made controllers. Other connectivity includes two gigabit Ethernet interfaces, both driven by Intel-made controllers, 8-channel HD audio, legacy connectivity such as PS/2 and RS232 COM (header), and a pinch of overclocker-friendly features in the BIOS and on-board. The P9X79-E WS from ASUS is priced at US $499.99.

The one and only ace of overclocking Nick Shih continues to push DDR3 memory frequencies to new boundaries which no man has ever set foot on. He has reached a ludicrous DDR3 4285.6MHz with ASRock's Z87M OC Formula, the micro sized Z87 motherboard he designed specifically for overclocking, and it all happened on this year's overclocking show at COMPUTEX TAIPEI 2013.

ASRock's Z87M OC Formula meets Team Group Xtreem-LV-2666! Nick Shih tops the memory clock world record with an unbelievable DDR3 4285.6MHz score (validation). The masterpiece is done by the world's best overclocking team : Nick Shih, HKEPC's John Lam and Splave.

SK Hynix Inc. announced that it has developed the world's first 8 Gb(Gigabit) LPDDR3 (Low Power DDR3) using its advanced 20nm class process technology. This product is a top-performance mobile memory solution which features high density, ultrahigh speed and low power consumption.

The new products can be stacked up and realize a high density of maximum 4 GB(Gigabytes, 32 Gb) solution in a single package. In addition, the height of this package becomes dramatically thinner than the existing 4 Gb-based one. In terms of its high density and competitive package height, it is suitable for the newest trend of the mobile applications.

Transcend Information, Inc., a leading manufacturer of industrial-grade products, today announced the addition of the SSD740 2.5" SATA III 6Gb/s solid state drive (SSD) to its industrial SSD product line. Combining cutting-edge SATA III technology with a number of performance and reliability features, the SSD740 is the ultimate SSD upgrade solution - especially for devices equipped with modern processors running more advanced operating systems, such as Ultrabooks, Industrial PCs and notebooks, gaming systems, and handheld appliances.

Transcend's SSD740 SSD takes advantage of the next-generation SATA III 6 Gb/s interface, DDR3 DRAM cache, and an advanced JMicron JMF667H controller to achieve extremely fast transfer speeds of up to 530 MB/s read and 470 MB/s write. Essential for handling incompressible data, such as videos, music, and images, the SSD740 also delivers impressive 4K random read/write speeds of up to 283/267 MB per second. Full support of the TRIM command, which automatically removes deleted data permanently, and Native Command Queuing (NCQ), which optimizes the order in which received read and write commands are executed, allow the SSD740 to sustain an incredibly high level of performance while enhancing SSD durability and efficiency.

GeIL showed off its newest EVO Potenza line of memory modules built for 4th generation Core "Haswell" processors, offering speeds ranging from DDR3-1600 to DDR3-3000, available in 4 GB and 8 GB densities, and as many as four color options for the heatspreaders: military green, indigo, red with black, and silver with chrome. At its booth, GeIL ran a live demo of a system with four 4 GB DDR3-3000 modules running at advertised speeds, with 12-14-14-36 / CL2T, on a Core i7-4770K (ES) based machine. GeIL put some of these modules through makeshift "torture-racks" (enclosures with high temperature and humidity), which survived and went on to work. GeIL uses similar torture-racks on its production line, on a much larger scale, which it calls "Die-hard Burn-in Technology" or DBT. They're used as QA. EVO Potenza will be sold as single modules, and in dual- and quad-channel memory kits.

While Sapphire's LGA1150 motherboard lineup came across as a little lukewarm, the company more than made up for that with its fleet of motherboards that take advantage of AMD's newest A-series and E-series APUs and SoCs. First, there's the PGS A320M, a micro-ATX motherboard that ships with a FirePro A320 socket FM2 APU pre-installed. Largely identical to an A10-5800K, and based on the "Trinity" micro-architecture, the A320 features FirePro-branded professional graphics that's certified for most modern 3D productivity applications, and can give display output at resolutions as high as 4096 x 2160. The board features one each of DisplayPort 1.2, dual-link DVI-I, and D-Sub display outputs. Other features include eight SATA 6 Gb/s ports, four USB 3.0, gigabit Ethernet (Broadcom controller), and 8-channel HD audio.

Things get interesting with a contraption called IPC-FS1r2A75. This board comes in a proprietary IPC form-factor, features an FS1 rev 2.0 socket, which seats R-series APUs, an embedded AMD Radeon E6000 series GPU based on the Graphics CoreNext arhitecture, with its own dedicated GDDR5 memory on-package, and AMD A75 FCH chipset. The board offers six mini-DisplayPort and four HDMI outputs, two DDR3 SO-DIMM slots, an open-ended PCI-Express 2.0 x4 slot, four mPCIe slots (in stacks of two), five SATA 6 Gb/s ports, six USB 3.0 ports, two gigabit Ethernet connections, and 6-channel audio.

AMD today announced its 2013 Elite A-Series Accelerated Processing Unit (APU) for desktops, codenamed "Richland", which delivers a superior PC solution with increased computational performance, discrete-level graphics and an easy upgrade infrastructure. At COMPUTEX TAIPEI 2013, AMD showcased the complete breadth of its 2013 APU portfolio with the launch of the new Elite A-Series APU for desktops which power a diverse range of OEM systems and feature new generations of software and applications that harness the unrivaled compute power of the 2013 AMD APU product lineup: the fastest AMD APUs ever.

"The new AMD A-Series APU is ideal for desktop PC builders and mainstream gamers wanting outstanding performance for their money, and today AMD delivers an excellent new follow-on to the recently announced mobile lineup," said Bernd Lienhard, corporate vice president and general manager, Client Products Division at AMD. "The combination of high-performance, third-generation desktop APUs with our existing portfolio of low-power, mobile APUs gives us our strongest-ever lineup of products for our customers and our technology partners."

ECS' socket LGA1150 motherboard series launch was rather low-key, and with good reason. The company was saving its best, the Z87H3-AH series, for a Computex unveiling. Pictured below are the Z87H3-AH and Z87H3-AH Golden "Gank Machine" motherboards. The non-golden variant doesn't get dull gray this time around, but a red, black, and silver color scheme. The Golden variant, on the other hand, gets gold, silver, and black. Both boards are otherwise identical. The LGA1150 socket is powered by a 12-phase VRM. The bigger of the two VRM clusters is cooled by an active fan-heatsink.

The CPU is wired to four DDR3 DIMM slots, and three of the board's four PCI-Express x16 slots (electrical gen 3.0 x16/x8/NC or x8/x4/x4), the fourth x16 slot is electrical gen 2.0 x4, wired to the Z87 PCH. On the storage connectivity front, you get six SATA 6 Gb/s ports, an eSATA 6 Gb/s port, and an mSATA 6 Gb/s slot. Display outputs include HDMI and mini-DisplayPort, which doubles up as Thunderbolt. The rest of the board's notable connectivity includes two gigabit Ethernet interfaces, one driven by Bigfoot Killer E2201, and the other by common Realtek fare; 802.11 b/g/n WiFi (using a USB dongle), Creative Sound Core3D 8-channel audio, and ten USB 3.0 ports. The board features several overclocker-friendly features, such as a 3-digit POST diagnostic readout, voltage measurement points, quick CMOS reset/restore, etc.

ECS unveiled one of the very few mini-ITX motherboards to ship with an AMD "Kabini" A6-5200. The chip integrates both the APU and FCH, making it a true system-on-chip (SoC). It packs four x86-64 "Jaguar" CPU cores, a Radeon HD 8400 series GPU with 128 stream processors, a dual-channel DDR3 memory controller, and a modern FCH chipset. On the KBN-I, the 28 nm chip is cooled by a small fan-heatsink. The PCB area gained by the single-chip solution is used to create two mPCIe expansion slots, in addition to the PCI-Express 2.0 x16. The board draws power from just a 24-pin ATX connector. Connectivity include two SATA 6 Gb/s ports, 6-channel HD audio, D-Sub and HDMI display outputs, four USB 3.0 ports, and a gigabit Ethernet connection.

Crucial, a leading global brand of memory and storage upgrades, today announced the immediate availability of the Crucial Ballistix Sport XT memory, which offers a new aggressively-styled, taller heat spreader design that improves thermal performance. Designed for gamers and enthusiasts looking for fast and responsive performance, Ballistix Sport XT modules offer XMP profiles for advanced speeds and timings as well as easy BIOS configuration in supported systems.

"The Crucial Ballistix Sport series is designed to provide mainstream users and performance enthusiasts with a reliable, no-hassle gaming experience," said Jeremy Mortenson, senior product manager, Crucial. "The new Sport XT memory offers an attractive new heat spreader styling for gamers who are looking for enhanced thermal performance, and a new colour that complements popular motherboards."

ASUS announced its first Republic of Gamers (ROG) motherboard in the mini-ITX form-factor, the Maximus VI Impact, which could go on to become choice number one for SFF gaming PC builders. Arguably the most feature-rich mini-ITX motherboard ever made, the Maximus VI Impact is a socket LGA1150 motherboard based on Intel Z87 Express chipset, which supports 4th generation Core "Haswell" processors.

The board draws power from a combination of 24-pin ATX and 8-pin EPS connectors, and conditions it using a 10-phase VRM that off-shoots into its own little PCB, with heatsink. The other three daughterboards on the Maximus VI Impact include the SupremeFX Impact, a sound-card with an audiophile-grade 115 dBA DAC, OPAMPs, and audio-grade capacitors; and an mPCIe combo card that lends it 802.11 ac WiFi and Bluetooth 4.0; and an ImpactControl card that gives overclockers POST diagnostic readouts and CMOS reset/restore at the push of a button, right from the rear panel.

Corsair, a worldwide designer of high-performance components to the PC hardware market, today announced the Corsair Vengeance Pro Series of high-performance DDR3 computer memory for PC overclockers, enthusiasts, and system builders. Available initially in capacities up to 64 GB and speeds up to 2933 MHz, the Vengeance Pro Series memory modules are designed to set new levels of value and overclocking performance with the 4th generation Intel Core processor family (codenamed Haswell) and previous generation Intel and AMD platforms.

Vengeance Pro Series memory modules are built with eight-layer PCBs and RAM ICs specially selected for speed and overclocking headroom, and like all Vengeance memory, incorporate XMP 1.3 profiles allow for automatic, reliable overclocking. The memory kits are designed with new aggressively styled, aluminum heat spreaders for superior cooling. The memory kits are available in black with silver, red, blue, or gold accents to enable enthusiasts, gamers, and modders to customize the look of their PCs.

At Computex, GIGABYTE showed off the first AMD platform motherboard in its coveted G1.Killer series, which targets gamers and overclockers, the G1.Sniper A85X. The board is based on AMD A85X FCH chipset, and comes with out-of-the-box support for AMD A-series "Richland" APUs, including the AMD A10-6800K quad-core APU, with the fastest integrated graphics in market. Built in the narrow ATX form-factor, the G1.Sniper A85X draws power from a combination of 24-pin ATX and 8-pin EPS connectors, and uses a 6-phase VRM to condition it for the APU.

The FM2 socket is wired to four DDR3 DIMM slots, which support up to 64 GB of dual-channel DDR3-3000 MHz memory; and a PCI-Express 2.0 x16 slot. In addition, the board offers a PCI-Express 2.0 x16 (electrical x4, wired to the FCH), three PCI-Express 2.0 x1, and two legacy PCI. The board shines in connectivity, where it offers eight SATA 6 Gb/s internal ports, a combination of DVI, D-Sub, and HDMI display outputs, Creative Sound Core3D audio with user-replaceable OPAMP and audio-grade capacitors, four USB 3.0 ports, and gigabit Ethernet. The board is driven by AMI Aptio UEFI BIOS, backed by GIGABYTE Dual-UEFI redundancy, and the new BIOS interface that made its debut with GIGABYTE's socket LGA1150 motherboards.

Toshiba's Digital Products Division (DPD), a division of Toshiba America Information Systems, Inc., today introduced the company's first Windows 8 device designed for business users, the Portege Z10t Detachable Ultrabook. The versatile Portege Z10t is an Ultrabook when needed and a tablet when wanted. Switch instantly between notebook and tablet by simply detaching the screen. Equipped with an 11.6-inch diagonal, Full HD, IPS anti-glare touchscreen display1, the Portege Z10t is an ideal choice for on-the-go professionals looking for a single, versatile device that offers more screen real estate than most tablets, but all the same ultra-responsive performance of a laptop.

The built in digitizer adds even more functionality for those who want to write and take notes on-screen. Ultra-slim, lightweight, encased in sleek style and dressed in durability with all the essential ports and security features, the Portege Z10t makes it easy to create, share or consume content anytime, anywhere. Powered by the latest Intel Core processors the device is equipped with all the business essential ports needed for a "dongle-free" experience, the Portege Z10t delivers excellent speed and performance - everything expected from a business-class Portege.

We've had GIGABYTE's premium mainline socket LGA1150 motherboards, the Z87-UD4H and Z87-UD5H detailed last week. A little earlier, we've been through the company's gamer-centric G1.Sniper series, and Z87 OC Force. Below are pictures of the company's sub-$150 lineup based on the Z87 Express and B85 Express chipsets, the B85M-D3H, the Z87-D3HP, and the Z87-UD3H.

The B85M-D3H, as the name might give away, is based on Intel's B85 chipset that gives you most of the platform's feature-set, including Small Business Advantage, but excluding CPU overclocking features. Built in the micro-ATX form-factor, the board offers a simple 4-phase CPU power supply, four DDR3 DIMM slots, a single PCI-Express 3.0 x16, a PCI-Express 2.0 x16 (electrical x4), two legacy PCI, four SATA 6 Gb/s and two SATA 3 Gb/s, four USB 3.0 ports (two rear, two by header), a combination of DVI, HDMI, and D-Sub display outputs; gigabit Ethernet, and 8-channel HD audio.

After bagging chip supply deals for all three new-generation consoles -- Xbox One, PlayStation 4, and Wii U, things are looking up for AMD. While Wii U uses older-generation hardware technologies, Xbox One and PlayStation 4 use the very latest AMD has to offer -- "Jaguar" 64-bit x86 CPU micro-architecture, and Graphics CoreNext GPU architecture. Chips that run the two consoles have a lot in common, but also a few less-than-subtle differences.

PlayStation 4 chip, which came to light this February, is truly an engineer's fantasy. It combines eight "Jaguar" 64-bit x86 cores clocked at 1.60 GHz, with a fairly well spec'd Radeon GPU, which features 1,156 stream processors, 32 ROPs; and a 256-bit wide unified GDDR5 memory interface, clocked at 5.50 GHz. At these speeds, the system gets a memory bandwidth of 176 GB/s. Memory isn't handled like UMA (unified memory architecture), there's no partition between system- and graphics-memory. The two are treated as items on the same 8 GB of memory, and either can use up a majority of it.

ASUS announced a fleet of socket LGA1150 motherboards, covering its mainline (classic), Republic of Gamers (ROG), and The Ultimate Force (TUF) lines. With this series, ASUS is adopting a new color scheme for its mainline motherboards, breaking away from the black PCB with blue heatsinks scheme it maintained since the first LGA1156 motherboards, almost four years ago. The new mainline motherboards from ASUS feature black PCBs with golden-colored heatsinks covering the VRM and PCH, and simpler naming. ASUS' first wave of Z87-based mainline (classic) motherboards include the entry-level Z87-C and Z87-A, mid-range Z87-PLUS and Z87-PRO, and premium Z87-DELUXE.

Here are some of the first clear pictures of MSI Z87 MPower, one of the company's top socket LGA1150 motherboards, which will be unveiled a little later. The board retains the black+yellow color-scheme from its predecessor, the Z77 MPower, built more solidly. The board appears to feature a 16-phase CPU power delivery, which uses a combination of SFC chokes, DrMOS, and high-C tantalum capacitors. It draws power from two 8-pin EPS connectors, in addition to the 24-pin ATX.

The CPU socket on the Z87 MPower is wired to four DDR3 DIMM slots, supporting up to 64 GB of dual-channel memory, and three PCI-Express 3.0 x16 slots (x16/NC/NC or x8/x8/NC or x8/x4/x4); three PCI-Express x1 slots make for the rest of the expansion area. Connectivity includes an enhanced onboard audio solution named "Audio Boost," which we imagine is an onboard amp for select channels; gigabit Ethernet, 802.11 b/g/n WLAN, Bluetooth, display outputs that include dual-HDMI and DisplayPort connectors, and a number of USB 3.0 ports. Storage connectivity includes eight SATA 6 Gb/s ports. Find more pictures at the source.

AMD today announced availability of servers based on its AMD Open 3.0 specification, defined as part of the Open Compute Project, delivering workload versatility and performance equal to competing proprietary OEM servers at significantly lower cost. In comparison to benchmarks running virtual desktop infrastructure (VDI), the AMD Open 3.0-based system supported just as many virtual desktops and reduced total cost of ownership (TCO) by 57 percent: $4,589 versus $10,669 for just a single server. This cost effectiveness translates into a dramatic reduction in cost per virtual desktop, from $91.19 to only $38.24 per desktop. More details on the findings are available online and will be discussed at a roundtable event tomorrow in New York City and other select cities. The servers will be available through distributor partners.

"Global IT organizations have the difficult task of choosing between price and performance when investing in servers," said Bob Ogrey, cloud evangelist and fellow, AMD. "We don't believe organizations have to compromise one for the other. Using systems based on the AMD Open 3.0 specification -- the first open source, modular platform for the masses -- enables high performance and energy efficiency at a reasonable price, making it the best choice for organizations.

SMART Modular Technologies, Inc., a leading independent designer, manufacturer and supplier of value added subsystems including memory modules, flash memory cards and other solid state storage products, today announced the addition of a 24GB CoolFlex RDIMM to its product lineup. The 24GB DDR3-1333 1.35V RDIMM helps solve unique memory capacity constraints in servers. SMART's CoolFlex module product family uses state-of-the-art flexible substrate technology to increase system memory capacity.

Servers configured with two processors and sixteen registered DIMMs are generally limited to a maximum memory capacity of 256GB. When using 16GB DDR3-1333 RDIMMs these systems can be fully populated. However, when switching to 32GB four-rank RDIMMs, the maximum number of DIMMs per Channel (DPC) drops down to one. A system configured with two channels per processor and four DIMMs per channel can only be populated with one 32GB RDIMM per channel for a total memory capacity of 128GB. SMART's new 24GB Coolflex RDIMM solves this constraint by allowing these systems to be fully populated with sixteen 24GB RDIMMs totaling 384GB and representing a 50% increase in memory capacity.

Silicon Power, the world's leading provider of memory storage solutions today unveils the new generation of Xpower DDR3 Overclocking series memory module. Built in a special-made metallic heat sink, the new Xpower DDR3 is able to provide a better cooling solution and increase the heat dissipation area, maintaining a powerful speed and stability to meet the needs of overclocking enthusiasts and hardcore gamers.

Silicon Power new Xpower DDR3 Overclocking series are available in various duel channel kits in DDR3-1600, 1866, 2133, and 2400 MHz variants, reaching the high capacity from 8 GB (4 GBx2) to 16 GB (8 GBx2). Compatible with Intel Core Gen 3 and the latest Z77 platform, Xpower Overclocking series can maximize the transfer speed, unleashing the extreme system performance to the next level.

At a media event held in its Taipei headquarters, GIGABYTE demonstrated its AMP-UP integrated audio solution that will feature on some of its upcoming motherboards. On that pretense, it even got to show of two of its top socket LGA1150 motherboards, built for Core "Haswell" processors, the G1.Sniper 5, and the G1.Sniper M5. Positioned in gamer-overclocker targeted G1.Killer series, the two boards are based on Intel Z87 Express chipset. The G1.Sniper 5 is the larger standard ATX motherboard; while the M5 is a compact micro-ATX offering. The pictures also confirm that socket LGA1150 retention module and bolt-spacing is identical to sockets LGA1155 and LGA1156.

The G1.Sniper 5 appears to feature a 16-phase VRM, which uses ferrite-core chokes, and the same International Rectifier PowIRstage components as Ultra Durable 5 motherboards from the previous generation. This time around, the CPU plays a greater role in voltage regulation. The driver-MOSFETs on the board are cooled by an active fan-heatsink, which also has a liquid channel running through it, so you could make it part of your CPU loop. Thankfully GIGABYTE didn't let its imagination run away with designs of the other heatsinks on the board, one of which cools the Z87 Express chipset, and the other we imagine, a PLX PEX8747 48-lane PCI-Express 3.0 bridge chip. This chip gets you 4-way SLI/CrossFireX support.

QNAP Systems, Inc. today announced the release of the Turbo NAS TS-x21 and TS-x20 series for home users and home offices. The new models in the TS-x21 series are equipped with 2.0 GHz CPU, 1GB DDR3 RAM, and the TS-x20 series with 1.6 GHz CPU, 512MB DDR3 RAM. Both series deliver superior performance for daily routines in file storage, sharing, and data backup, and serve as ideal media centers for storing and sharing huge multimedia files.

The TS-x21 and TS-x20 series feature the brand-new Turbo NAS operating system QTS 4.0. The new QTS 4.0 integrates multi-window operations into the web-based user interface, adds cross-device file synchronization, several smart mobile apps, and more. In an era where almost everyone has at lease one mobile phone or tablet device, the QTS 4.0 fulfills people's needs of mobile data access and synchronization, and storage for huge quantities of data. What's more, the QTS 4.0's multi-window user interface introduces users to an unprecedented NAS management experience. In addition, the multimedia applications and multi-tasking designs not only increase management efficiency but also transform home entertainment.

ADATA Technology Co., Ltd. a world leader in DRAM modules and NAND Flash storage application products, today announced the start of shipments of its latest advanced in gaming technology, the XPG Gaming v2.0 Series DDR3-2600 MHz DRAM 8GB modules. These dual channel kits are designed and engineered to bring optimum performance to third generation Intel Core processors and the Z77 platform.

XPG DRAM modules signify Xtreme Performance Gear, providing the extreme speed and performance required by advanced users. The XPG Gaming series v2.0 is targeted specifically at the distinct performance and cooling needs of the worldwide gaming community. These latest DDR3 2600G 8GB modules offer new levels of data transfer speed, along with the many features that are hallmarks of the XPG series.