Multiple leakers on Twitter/X have posted screenshots or pictures of Intel's upcoming Core i5-14600K CPU and it appears that some earlier rumours about this specific SKU weren't entirely accurate. It was believed that the Core i5-14600K was to get a core bump over the Core i5-13600K, but apparently this isn't the case, if the new leaks hold true. However, it also appears that the CPU will boost higher than expected, as earlier rumours suggested 5.3 GHz max boost clock and now it appears it'll go all the way up to 5.5 GHz, which is still lower than its Core i7 and Core i9 peers. The i5 also lacks Intel Turbo Boost Max Technology 3.0, so it won't be possible to squeeze some extra performance out of this chip without overclocking it the good old fashioned way.

@9550pro posted a screenshot of CPU-Z in Chinese showing the Core i5-14600K running in a Gigabyte Z790 Gaming X AX motherboard, but it's unknown what the rest of the system configuration was. However, it does show the CPU having a clock multiplier ranging from 8 to 55, confirming the 5.5 GHz max CPU clock speed. @wxnod posted a picture of an MSI Z690 Edge TI WiFi DDR4 motherboard with a Core i7-14700K paired with 16 GB of DDR4 memory running at 4600 MHz on Gear 1, which in itself is a feat, although it's unknown if this was stable. The CPU was shown as running at 6.3 GHz, which is most likely a manual overclock of the CPU, as the Core i7-14700K isn't expected to be a 6 GHz plus part. We're getting close to the launch of Intel's 14th gen Core processors, so we won't have to wait too long to find out the full specs of these CPUs.

Update 07:17 UTC: Twitter/X bot Benchleaks has found some Geekbench results for the Core i5-14600K which @harukaze5719 made a nice graph of that we've added below. This suggests that Intel has managed to eke out quite a bit of extra performance from these "refreshed" CPUs.

Lexar, a leading global brand of flash memory solutions, is excited to announce three additions to its gaming product lineup - the new Lexar NM790 M.2 2280 PCIe Gen 4×4 NVMe SSD, Lexar ARES DDR5 Desktop Memory in 6400MT/s, and Lexar ARES RGB DDR4 Desktop Memory in 3600MT/s.

The NM790 M.2 NVMe SSD is perfect for gamers and content creators, delivering incredible speeds of 7400 MB/s read, 6500 MB/s write thanks to its PCIe Gen 4 tech, which includes HMB 3.0 and Dynamic SLC Cache. So whether users are looking to vanquish foes in their gaming battles or conquer their latest creative pursuits, the NM790 SSD is ready to take on the challenge.

IBASE Technology Inc. (TPEx: 8050), a leading provider of industrial computing solutions, unveils the SI-624-AI industrial AI computer, which won the Embedded Computing Design's Embedded World 2023 Best in Show Award in Germany. This recognition highlights the exceptional performance and innovation of the rugged system in the field of AI deep learning.

The SI-624-AI is designed to meet the demands of high-speed multiple tasks for artificial neural network applications. Powered by the 12th Gen Intel Core CPU and incorporating the NVIDIA Ampere Architecture MXM GPU, this cutting-edge system delivers image processing capabilities that enable real-time analysis of visual data, enhancing automation, quality control, and overall production efficiency for AIoT applications in smart factory, retail, transportation or medical fields. It is suitable for use as a digital signage control system in mission-critical control rooms in transportation networks, smart retail, healthcare, or AI education where remote AI data analysis capabilities are required.

IBASE Technology Inc. (TPEx: 8050), a leading provider of embedded computing solutions, introduces the IB837 3.5" single board computer that is designed for a wide range of IoT applications, including industrial automation, smart retail, healthcare, smart city and edge AI solutions, combining powerful processing capabilities with extensive connectivity options.

At the heart of the IB837 is the onboard Intel Celeron N & J series (formerly Elkhart Lake) processor, offering a good balance of performance and power efficiency. With support for up to 16 GB of DDR4-3200 SO-DIMM memory, the SBC ensures smooth multitasking and efficient operation, delivering exceptional performance while consuming minimal power for applications requiring a compact form factor.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices, announces the best-performing business and casual motherboards for Intel 12/13th gen core processors in 2023. Tailored to cater to a wide range of users, from office applications to system integration businesses and home entertainment, the B760MX2-E, B760MZ-E PRO, B760MX2-E D4, and B760MX2-E PRO D4 motherboards pack an impressive suite of features and functionality ready to perform at the highest standard.

Powered by Intel's 12th and 13th-generation processors, these motherboards provide a seamless computing experience with higher performance, improved data integrity, and lower power consumption, setting new benchmarks in their respective segments. With B760MX2-E, B760MZ-E PRO motherboards supporting DDR5, and B760MX2-E D4, B760MX2-E PRO D4 motherboards supporting DDR4 memory, they provide exceptional memory support and performance. The B760MZ-E PRO and the B760MX2-E PRO D4 motherboards support up to 128 GB of memory while the B760MX2-E and the B760MX2-E D4 motherboards support up to 64 GB of memory capacity, providing users ample choice when it comes to system performance.

TrendForce reports that continued production cuts by DRAM suppliers have led to a gradual quarterly decrease in overall DRAM supply. Seasonal demand, on the other hand, is helping to mitigate inventory pressure on suppliers. TrendForce projects that the third quarter will see the ASP for DRAM converging towards a 0~5% decline. Despite suppliers' concerted efforts, inventory levels persistently remain high, keeping prices low. While production cutbacks may help to curtail quarterly price declines, a tangible recovery in prices may not be seen until 2024.

PC DRAM: The benefits of consolidated production cuts on DDR4 by the top three suppliers are expected to become evident in the third quarter. Furthermore, inventory pressure on suppliers has been partially alleviated due to aggressive purchasing by several OEMs at low prices during 2Q23. Evaluating average price trends for PC DRAM products in 3Q23 reveals that DDR4 will continue to remain in a state of persistent oversupply, leading to an expected quarterly price drop of 3~8%. DDR5 prices—influenced by suppliers' efforts to maintain prices and unmet buyer demand—are projected to see a 0-5% quarterly decline. The overall ASP of PC DRAM is projected to experience a QoQ decline of 0~5% in the third quarter.

Leading storage device brand, Team Group, is releasing its industrial wide temperature storage product series, ULTRA, in view of the fast-developing electric vehicle market. Consumer products typically operate within a temperature range of 0-70℃. However, industrial products are designed to withstand harsh environments and operate within a temperature range of -40-85℃. Because of the extreme temperature differences in applications such as vehicle computer systems, storage products with higher tolerance and compliance with automotive temperature grades are required. In response to the developments in EVs, Team Group has launched a new storage product series that includes an SSD and memory module and can handle temperatures of up to 105℃, the highest in the industry. The company is targeting the vehicle, fanless embedded, and rugged computer markets.

Team Group's industrial ULTRA wide-temperature storage product series uses Major Grade high-quality ICs and patented testing and grading technology (Taiwan Invention Patent No. I751093; US Invention Patent No. US11488679) and ultra-thin graphene cooling technology (Taiwan Invention Patent No. I703921; US Invention Patent No. US11051392B2), allowing stable operation in harsh temperatures. In addition, the ULTRA wide-temperature storage product series has passed the ISO-16750 Road Vehicles (environmental conditions and testing for electrical and electronic equipment in road vehicles) - 5.1.2 high-temperature 105℃ verification test. Both products also meet standards for military-grade impact resistance (MIL-STD-202G, MIL-STD-883K) and shock resistance (MIL-STD810G), guaranteeing their stability and durability. Whether it's maintaining data security or overcoming extreme conditions in automotive and industrial applications, the ULTRA storage product series will fully satisfy your needs.

Gamers Nexus has uploaded a video feature dedicated to the history of AMD's Zen CPU architecture—editor-in-chief and founder Stephen Burke ventured to Team Red's Austin, Texas-based test and engineering campus. Longer and more in-depth coverage of his lab tour will be released at a later date, but today's upload included an interesting segment covering unreleased hardware. The Gamers Nexus crew spent some time looking at several examples of current and past generation AMD 3D V-Cache CPUs. Prototype Ryzen 7000-series Zen 4 designs were shown off by principal engineer Amit Mehra and technical team member Bill Alverson. They also brought out older 5000-series Zen 3 units that never reached retail—the 16-core Ryzen 9 5950X3D was demonstrated as having a 3.5 GHz base clock, and it can boost up to 4.1 GHz. The 12-core Ryzen 9 5900X3D had 3.5 GHz base and 4.4 GHz boost clocks.

Team Red only sells one AM4 3D V-Cache model at the moment, in the form of its well received Ryzen 7 5800X3D CPU. It was released over a year ago, but recent price cuts have resulted in increased unit sales—system builders looking to maximize the potential of their older generation Ryzen 5000-series compatible mainboards are snapping up 5800X3Ds. AMD could be readying a cheaper alternative, with previous reports proposing that a "Ryzen 5 5600X3D" is positioned to take on Intel's 13th Gen Core i5 series (with DDR4). The unreleased Ryzen 9 5950X3D and 5900X3D have 3D V-Cache stacks on both of their CCDs (granting 192 MB of L3 cache), which is unique given that all retail 3D V-Cache CPUs (released so far) restrict this to a single CCD stack. Apparently AMD decided to stick with the latter setup due to it offering the best balance of performance and efficiency, plus gaming benchmarks demonstrated that there was not much of a difference between the configurations.

To help bridge the growing gap between modern systems and the legacy technology still in use around the world, global industrial computing specialists, OnLogic (www.onlogic.com), have released the Helix 511 Edge Computer. Designed for use in manufacturing, automation, energy management, and other edge and IoT applications, the Helix 511 easily interfaces with on-site systems thanks to a broad selection of modern and legacy connectivity options.

"We frequently have conversations with customers who are struggling to update their technology infrastructure simply because they can't connect existing systems to newer, more powerful and more capable devices," says OnLogic Product Manager, Hunter Golden. "The embedded computing space has traditionally lagged behind when it comes to adopting new technologies. We want to shift that paradigm while still allowing innovators to access and exchange data with their existing equipment. In many cases, you don't need to rip and replace everything, you just need a Helix 511."

Details of ASUS' upcoming Prime N100I-D D4 Mini-ITX motherboard has made an appearance in official pictures posted over at Fanlesstech, although the board was apparently shown at Computex. The interesting part here is that it's under ASUS' Prime branding, which suggests that this will be a retail product, rather than something that would only be available to OEM partners. The Intel Processor N100 is a quad core 3.4 GHz chip based on Intel's Alder Lake-N and it has a 6 W TDP, which means it can be passively cooled.

Although the SoC supports DDR4 and DDR5 memory, at least for this specific SKU, ASUS went with DDR4 support in the shape of a single SO-DIMM slot which accepts up to 3200 MHz memory. The board also sports a single PCIe 3.0 x2 M.2 slot, an M.2 slot for an optional WiFi module, a PCIe 3.0 x1 slot and a single SATA connector and a USB 3.0 header. The odd thing here is that the SoC supports a total of nine PCIe lanes, but ASUS only appears to have made use of four of them. Around the back is a pair of 10 Gbps USB Type-A ports, a pair of 5 Gbps USB Type-A ports and two USB 2.0 ports, a PS/2 port, a serial port, a D-Sub VGA connector, a DisplayPort and an HDMI port of unknown version—although the SoC supports DP 1.4 and HDMI 2.1—a Gigabit Ethernet jack and three audio jacks.

AAEON, a leading producer of single-board computers, has released the latest offering from its line of compact boards on the PICO-ITX form factor, the PICO-EHL1. Equipped with Intel Atom x6000E Series, and Intel Pentium and Celeron N and J Series Processors, the PICO-EHL1 is a lightweight, power-efficient board which the company has earmarked for low-cost applications that require flexible function, such as digital signage, smart lockers, and ATMs.

The PICO-EHL1's display interface is particularly suitable to the aforementioned markets, with dual-channel LVDS and eDP via colay design being joined by full audio functionality thanks to its line-in, line-out, and microphone connectors. Supporting both Windows and Linux operating systems, the board has discrete TPM 2.0 compatibility for data security, making it suitable for deployment in ATMs.

ASUS today announced ProArt Station PD500TE, an all-new tower PC meticulously designed to deliver seamless professional content creation. Powered by an up to 13th Generation Intel Core i9-13900 CPU and NVIDIA RTX A4000 graphics, plus support for NVIDIA GeForce RTX 4070 graphics cards, PD500TE delivers robust and stable performance for processor-intensive tasks like video editing and 3D modelling. This latest addition to the popular ProArt Station lineup also has a new thermal design for efficient, quieter cooling.

To maximize its creator-friendly credentials, PD500TE has undergone an extensive Independent Software Vendor (ISV) certification process to assure compatibility with leading creative tools. It also features customizable ASUS Lumiwiz LED indicators, a power-button shield to prevent accidental shutdowns, and even rendering-progress email notifications.

Abit unveiled the AB-B760ITX, a DIY retail segment Mini-ITX motherboard based on Intel Socket LGA1700, and B760 chipset. The board comes in two variants based on PCB color—black and white. It uses a conventional power input configuration of 24-pin ATX and 8-pin EPS, with a 10-phase VRM conditioning it for the processor. The LGA1700 processor is wired to two DDR4 memory slots for up to 64 GB of dual-channel DDR4-4000 memory; and an M.2 NVMe Gen 4 slot. The main PCIe interface is PCI_Express 5.0 x16. Connectivity includes 6-channel HD audio, Wi-Fi 6E + Bluetooth 5.2 WLAN, 2.5 GbE wired LAN, and four USB 3.2 ports. Display outputs include a pair of HDMI and one DisplayPort. Besides the M.2 slot, you get four SATA 6 Gbps ports. Abit is pricing these boards at RMB ¥599 (USD $84).

If it feels like you've seen a ghost, it's because Abit withdrew from the DIY PC component space around 2012, after fulfilling its support obligations for the last of its products shipped in 2008. Since then, the brand has been held by Universal Scientific Industrial, a mainland Chinese company that took it over from the original Taiwan-based Abit Computer.

Innodisk has the right idea about how to do PCIe Gen 5 NVMe SSDs—to ditch the M.2 form-factor, and make them PCIe add-in cards. This would remove the need for cartoonishly disproportionate cooling solutions with high-pitched 20 mm fans; and rather allow SSD designers to use cooling solutions resembling those of graphics cards. Gen 5 NVMe controllers have a TDP of around 15 W, or roughly similar to that of a motherboard chipset. The M.2-2280 form-factor is tiny for the deployment of a sufficiently large heatsink, and so SSD designers are resorting to active cooling, using 20 mm fans that don't sound pleasant. Most single-slot VGA cooling solutions can make short work of 15 W of heat while being much quieter, some even fanless.

The Innodisk 5TG-P AIC SSD uses a PCIe Gen 5 + NVMe 2.0 SSD controller with a large passive heatsink, a PCI-Express 5.0 x4 host interface, and 32 TB of capacity. The drive runs entirely on slot power, and besides the 3D TLC NAND flash, uses a large DDR4 DRAM cache. The company claims sequential transfer speeds of up to 13 GB/s in either direction. Innodisk is targeting the PCIe 5TG-P at workstation and HEDT use-cases. The company is building them in server-relevant form-factors such as U.2 and E.1S. A CDM screenshot shows 13.62 GB/s sequential reads, with 11.55 GB/s sequential writes.

Micron Technology, Inc. (Nasdaq: MU), today announced the Crucial Pro Series which features memory and storage products designed for gamers, content creators, workstation professionals or anyone needing the benefits of a robust, high-performance computing experience with plug-and-play functionality. The Crucial T700 PCIe Gen 5 SSD, the marquee product in the new Pro Series category, offers industry-leading sequential read/write speeds up to 12,400 MB/s and 11,800 MB/s respectively. Random read/write speeds of up to 1,500K IOPS enable faster gaming, video editing, 3D rendering or heavy workload applications. Another addition to the Crucial Pro Series is the Crucial DDR5 Pro and DDR4 Pro DRAM offerings with heat spreaders, providing out-of-the-box performance to improve system speed, bandwidth and responsiveness without the hassle of LEDs and the risks associated with overclocking and latency tuning.

"Today's demanding applications and user workloads require increased performance, along with greater storage capacity and memory bandwidth, to fully leverage the capabilities provided by the latest generation of CPU platforms," said Jonathan Weech, senior director of product marketing for Micron's Commercial Products Group. "The world class Crucial T700 Gen 5 SSD provides unrivaled performance to tackle gaming, UHD/8k+ photo and video editing, heavy workload applications and large data sets. Crucial DDR5 Pro DRAM offers speeds up to 5600MT/s with sleek new heat spreaders that deliver enormous bandwidth under the heaviest of workloads to ensure consistent, maximum performance for gamers and creatives alike."

PC OEM giant Acer has a growing lineup of retail channel PC products, including DIY enthusiast PC hardware under its Predator brand. The company showed some of this off at the 2023 Computex, in a booth organized by its memory products OEM BIWIN. First up, we have the Predator Hermes RGB line of high-end DDR5 memory kits. These feature elaborate aluminium heatspreaders with RGB LED illumination. We caught one of these in action, with a multi-zone RGB lighting. The Hermes RGB comes in 32 GB (2x 16 GB), and 64 GB (2x 32 GB) kits, and in speeds of DDR5-6800, DDR5-7200, DDR5-7600, DDR5-7800, and DDR5-8000, with CAS latencies ranging between 32 to 36T, and module voltages between 1.40 V to 1.45 V.

Among the consumer storage products showed off by the company include the MSC300 line of UHS-I microSDXC cards capable of 160 MB/s sequential speeds, which comes in capacities ranging between 32 GB to 256 GB. Among the SSD products shown were stuff we are already familiar with, including the FA100 Gen 4 NVMe SSD, RE100 Gen 3 NVMe SSD, the SA100 and RE100 SATA 6 Gbps SSDs; the SD100 lines of DDR4 and DDR5 SO-DIMM memory for laptops; CFE100 line of CFexpress cards, and and handful USB flash drives (UFDs).

Chinese RISC-V developers Milk-V Technology and SOPHGO recently announced their collaborative open source Milk-V Pioneer developer motherboard and workstation based on the SOPHON SG2042 RISC-V server SoC. The SOPHON SG2042 is a 64-core, 2 GHz SoC based on T-Head Semiconductor's XuanTie C920 64-bit processor design which features clusters of one to four cores, each a 12-stage out-of-order multiple issue superscalar pipeline, and a 128-bit vector engine based on the preliminary RISC-V V Extension version 0.7.1. The SG2042 packs in 64+64 KB (I+D) L1 cache per core, 1 MB of L2 cache per core cluster, 64 MB of L3 system cache, a quad-channel DDR4 controller, and 32 lanes of PCI-E Gen 4. The SG2042 contains no integrated graphics solution.

The Milk-V Pioneer incorporates this highly threaded RISC-V SoC with a modular and expandable standard mATX motherboard featuring four DIMM slots with support for up to 128 GB of DDR4, three full-length PCI-E slots wired for Gen 4 x8, two M.2 M-Key PCI-E Gen 3 x4, one M.2 E-Key for PCI-E 3.0 x1 and USB 2.0, eight USB 3.2 10 Gbps ports, five SATA 6 Gbps ports, and a pair of 2.5G Ethernet ports. The bulk of this I/O runs off an ASMedia ASM 2824 PCI-E switch, however the PCI-E Gen 4 ports run directly off the SG2024 SoC. Milk-V Pioneer is also being offered as a prebuilt small form factor workstation which puts the board into a small portable chassis called the Pioneer Box. The Pioneer Box includes 64 GB of DDR4-3200, 1 TB M.2 SSD, an Intel X520-T2 10G network card, an AMD Radeon R5 230 graphics card for display, and a 350 W power supply.

Last year, Crucial canned its Ballistix brand of gaming focused memory, but it seems like the company still wants to offer its customers a more premium product, as Crucial has just introduced its new Pro series of memory products. Crucial will offer its new Pro series in both DDR5 and DDR4 flavours at either DDR5-5600 or DDR4-3200 speeds. It should be noted that the DDR4 modules still rely on a green PCB, while the DDR5 modules get the same black PCB as Crucial's regular DDR5 modules. Beyond the heatsink, there isn't much that differs between the Pro series and Crucial's regular modules, but there is one thing that might matter to potential buyers.

Crucial has added support for AMD EXPO and Intel XMP 3.0 to its Pro series of modules. In the case of AMD EXPO this only applies to DDR5 modules, whereas the DDR4 modules support Intel XMP 2.0, in this case a feature its standard DDR4 modules lack. This should make it easier for end users to take advantage of the extra performance offered by some of these modules. That said, as Crucial has stuck to JEDEC timings, taking the Pro DDR5-5600 UDIMM kit as an example, you end up with timings of 46-46-45-45 at 1.1 Volts, where competing products have timings in the range of 36-36-36-36, although usually at 1.25 Volts or higher. Even as far as JEDEC timing goes, Crucial has chosen the middle ground for DDR5 5600, as there is a timing option from JEDEC that supports 40-40-40-40, which would make more sense for a more premium product. Price wise, a 32 GB kit with two 16 GB modules of DD5-5600 modules carries an $11 price premium over Crucials standard modules, with a retail price of US$114.99 versus US$103.99, but there are better options out there at this price point.

ATP Electronics, the global leader in specialized storage and memory solutions, introduces its 64 GB DDR4 very low profile registered DIMMS (VLP RDIMMs) built for embedded blade compute and storage, industrial single-board computers, enterprise networking, and Internet of Things (IoT) systems processing memory-intensive workloads. The new product offers twice the density of typical 32 GB VLP RDIMMs available in the market to meet the increasing memory requirements resulting from the endless generation of data from connected cars, smart factories, and other 5G IoT applications.

The high-performance 64 GB VLP RDIMMs are organized as 8192 MB x 72 bits in a 288-pin DIMM. Each module utilizes 18 chips of 8Gx4 DDR4 SDRAMs in dual-die package (DDP) stacked chips, consists of a 512-byte serial EEPROM containing the module information, and includes error correction code (ECC) to support error detection and correction.

IBASE Technology Inc., a leading provider of industrial motherboards and embedded computing solutions, has announced the release of its latest ET880 COM Express CPU module designed to meet the demands of embedded applications that require low power consumption and fanless operation. The module integrated Intel Atom x6000 series processors that are built on 10 nm technology support clock speeds of up to 3.2 GHz and Intel's Time Coordinated Computing (TCC) technology, which enables precise clock synchronization across multiple devices.

The ET880 delivers robust performance and reliability, with features that make it an ideal choice for a variety of industrial and IoT applications. The module boasts onboard 8 GB DDR4 memory and a DDR4 SO-DIMM slot for a total RAM capacity of 24 GB to ensure efficient system operation. It is equipped with a range of connectivity options, such as a I226IT PCI-E 2.5G LAN controller, two USB 3.1, four USB 2.0, two SATA III, two UART (Tx/Rx only), and three independent displays via the DisplayPort / DVI-D / LVDS or eDP interfaces on the IBASE IP419 carrier board.

TrendForce's latest research indicates that, as production cuts to DRAM and NAND Flash have not kept pace with weakening demand, the ASP of some products is expected to decline further in 2Q23. DRAM prices are projected to fall 13~18%; NAND Flash is expected to fall between 8~13%.

TrendForce reports that the significant drop in DRAM prices was mostly attributed to high inventory levels of DDR4 and LPDDR5 as PC DRAM, server DRAM, and mobile DRAM collectively account for over 85% of DRAM consumption. Meanwhile, the market share for DDR5 remains relatively low.

MSI, a world leader in high-performance and innovative computing solutions, has announced its PRO DP180 desktop, an ultimate business computer designed for creators and business professionals. The PRO DP180 is validated by NVIDIA RTX Studio, a platform designed for creative professionals who rely on powerful computing platforms to work with the most demanding applications in content creation, AI, and scientific research.

The MSI PRO DP180 is loaded with up to an Intel Core i7-13700 CPU alongside a discrete NVIDIA GeForce RTX GPU. Designed and tested specifically for creative workflows, it is capable of up to 8K video, real-time ray tracing, and other AI-assisted features. As a result, creators can efficiently work with the best out-of-box experience for them. In addition, PRO DP180 comes pre-installed NVIDIA Studio Drivers, which are extensively tested to provide performance boosts and new features in creative apps, providing artists, creators, and 3D developers the best performance and reliability.

Last October, the US Department of Commerce imposed semiconductor restrictions on Chinese imports of equipment for processes of 18 nm and below. SK hynix's Wuxi fab was granted a one-year production license, but geopolitical risks and weak demand prompted the company to reduce wafer starts by about 30% per month in 2Q23, according to TrendForce's latest research.

TrendForce reports that SK hynix had planned to transition its Wuxi fab's mainstream process from 1Y nm to 1Z nm, decreasing the output of legacy processes. However, due to limitations imposed by the US ban, the company instead opted to increase the share of its 21 nm production lines, focus-ing on DDR3 and DDR4 4Gb products. SK hynix's long-term strategy involves shifting its capacity expansion back to South Korea, while the Wuxi fab caters to domestic demand in China and the legacy-process consumer DRAM market.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices today, is proud to announce the release of its latest DDR4 DRAM, the Heatsink Storming-V series. The DDR4 DRAM, Storming-V series, is a highly versatile memory module that caters to a wide range of users, from casual content consumption such as watching TV shows, movies and listening to music, to avid gamers who demand engaging stories, stunning graphics, and solid gameplay. Moreover, pro gamers who prioritize speed and performance will find the Heatsink Storming-V series highly appealing.

With its optimized memory speed, timing, voltage settings, and unique design that offers overclocking capabilities, ultra-fast data access, and optimal cooling, the Heatsink Storming-V series delivers unmatched performance and reliability. Therefore, whether you are a casual user or a pro gamer, the Storming-V series is the perfect memory module that caters to your specific needs.

TrendForce reports that mass production of new server platforms—such as Intel Sapphire Rapids and AMD Genoa—is imminent. However, recent market reports have indicated a PMIC compatibility issue for server DDR5 RDIMMs; DRAM suppliers and PMIC vendors are working to address the problem. TrendForce believes this will have two effects: First, DRAM suppliers will temporarily procure more PMICs from Monolithic Power Systems (MPS), which supplies PMICs without any issues. Second, supply will inevitably be affected in the short term as current DDR5 server DRAM production still uses older processes, which will lead to a convergence in the price decline of DDR5 server DRAM in 2Q23—from the previously estimated 15~20% to 13~18%.

As previously mentioned, PMIC issues and the production process relying on older processes are all having a short-term impact on the supply of DDR5 server DRAM. SK hynix has gradually ramped up production and sales of 1α-nm, which, unlike 1y-nm, has yet to be fully verified by consumers. Current production processes are still being dominated by Samsung and SK hynix's 1y-nm and Micron's 1z-nm; 1α and 1β-nm production is projected to increase in 2H23.