Acer announced new additions to its Aspire laptop line, showcasing an extensive range of performance and design options to support everyday computing needs.

The Aspire Vero 16 is the latest from its Vero product line, powered by the new Intel Core Ultra processors with Intel AI Boost and Wi-Fi 7 compatibility. Acer has committed to carbon neutrality for the Aspire Vero 16, following international standards for carbon footprint calculation and carbon neutrality. Actions are taken at each stage of the device lifecycle to minimize its carbon footprint, and then, high-quality carbon credits will be applied to attain carbon neutrality. The Intel Evo Edition laptop has increased the usage of post-consumer recycled (PCR) materials on the chassis, doubling that of the 2021 model, to combine eco-innovation and premium PC experiences on the device.

TerraMaster, a professional brand focused on providing innovative storage products for homes and businesses, recently introduced the 424 series, a new upgrade of 423 series. It is equipped with an Intel Core i3 CPU and up to 32 GB DDR5 memory, catering to the needs of individuals and business users who demand higher performance. The 424 series will come with TOS 5.1 operating system and can be smoothly upgraded to the TerraMaster TOS 6 in the future.

Peak Performance 4-Bay NAS
Intel Core i3 8-core 8-thread CPU at 3.8 GHz (turbo), integrated UHD GPU at 1.25 GHz, 32 GB DDR5, dual 2.5G Ethernet ports, and dual M.2 NVMe slots for SSD caching.

Montage Technology, a leading data processing and interconnect IC company, today introduced its 4th-gen DDR5 Registering Clock Driver (RCD), also called DDR5 RCD04, to the industry. Designed for DDR5 RDIMM memory modules, this chip supports blazing-fast data rates up to 7200 MT/s, a 50% increase over the 1st-gen DDR5 RCDs.

As a leader in memory interface technologies, Montage has led the development of JEDEC standards for DDR5 RCD chips and sustains high R&D investments to enable continuous product iterations and upgrades. Since debuting its 1st-gen DDR5 memory interface and memory module supporting chips in 2021, the company successfully released the second and third generation DDR5 RCD chips in 2022 and 2023 respectively.

V-COLOR Technology Inc. is proud to unveil the Manta XFinity Series, our newest product tailored for PC enthusiasts and end users in pursuit of high performance. Engineered for extreme speeds and dependability, this series places a strong emphasis on facilitating high overclocking with straightforward compatibility and enhanced heat dissipation. The module has been tested on systems utilizing 14th generation CPUs, including the Gigabyte Z790 AORUS TACHYON X and ROG MAXIMUS Z790 APEX Motherboards. The XFinity Series has undergone extensive testing on motherboards from reliable manufacturers to guarantee smooth integration with a range of systems in configuration.

AMD's upcoming Ryzen 5 8600G Socket AM5 desktop APU will feature the truncated Radeon 760M integrated graphics, and not the previously believed Radeon 780M, or the full iGPU configuration present on the silicon. At this point, there are still conflicting reports on which exact silicon the Ryzen 8000G desktop APUs are even based on, with some of the older reports and Geekbench detecting 8600G engineering samples to be based on "Phoenix," and some of the newer reports suggesting that it's based on "Hawk Point." Both "Phoenix" and "Hawk Point" are nearly identical, except for the latter to feature a faster NPU.

The Ryzen 5 8600G is configured with a 6-core/12-thread CPU based on the "Zen 4" microarchitecture, with 1 MB of L2 cache per core, and 16 MB of shared L3 cache. The CPU base frequency is set to a healthy 4.35 GHz, and maximum CPU boost frequency of 5.00 GHz. These CPU clocks are very similar to those of the mobile Ryzen 5 7640H (which has a base frequency of 4.30 GHz, but the same 5.00 GHz boost), but in case of the 8600G, the 65 W TDP and possible 90 W PPT should help with boost frequency residency. The Radeon 760M gets 8 out of 12 RDNA3 compute units physically present on the silicon, giving it 512 stream processors. Geekbench detects an engine clock (GPU clock) of 2.80 GHz, compared to the 2.60 GHz of the Radeon 760M on the Ryzen 5 7640H. The 8600G ES was running on an MSI MEG X670E Ace motherboard, with 32 GB of dual-channel DDR5-6000 memory.

MINISFORUM's first Mini WorkStation MS-01, is officially available for pre-order on the official store. Tailored for tech-savvy gamers, this high-performance Mini WorkStation boasts the fastest network speed, strongest expansion capabilities, and maximum storage. It offers options with Intel Core i9-13900H and i9-12900H processors, starting at a price of $549 USD.

The MS-01 is powered by the Intel 13th generation's most robust mobile Core i9 processor, the i9-13900H, featuring 14 cores and 20 threads, a base frequency of 2.6 GHz, and a turbo boost frequency of 5.4 GHz. With the integrated 96EU Intel Iris Xe graphics, running at up to 1.5 GHz, it delivers outstanding flagship performance for tasks ranging from daily graphics processing to video production. In addition to its impressive performance, the MS-01 boasts a plethora of interfaces, enabling network transfer speeds of up to 65 Gbps, making it the fastest Mini PC in terms of network speed of MINISFORUM.

Rambus Inc., a premier chip and silicon IP provider making data faster and safer, today announced the availability of its state-of-the-art Gen 4 DDR5 Registering Clock Driver (RCD) which began sampling to the major DDR5 memory module (RDIMM) manufacturers in the fourth quarter of 2023. The Rambus Gen 4 RCD boosts the data rate to 7200 MT/s, setting a new benchmark for performance and enabling a 50% increase in memory bandwidth over today's 4800 MT/s DDR5 module solutions. It supports the rapid pace of server main memory performance improvements to meet the demands of generative AI and other advanced data center workloads.

"With memory being an essential enabler of server performance, the need for greater memory bandwidth continues its meteoric rise driven by demanding workloads like generative AI," said Sean Fan, chief operating officer at Rambus. "The Rambus Gen 4 DDR5 RCD is the latest demonstration of our commitment to providing leadership products ahead of the market need to support our customers' current and planned server platforms."

MSI is planning to expand its small lineup of motherboards with ATX12VO power connectivity—the new desktop motherboard power standard that does away with the 5 V and 3.3 V power domains, and relies entirely on 12 V, with the aim of simplifying PSU designs and desktop PC power cabling. ATX12VO is still an emerging standard that hasn't gained traction in the DIY channel, but PC OEMs and systems integrators are beginning to catch on, for the cost savings to be had. MSI has been targeting this class of customers—OEMs and small SI, with motherboards under its mainstream PRO series. For the Socket LGA1700, the company has the PRO H610M 12VO, and now the company has its first ATX12VO motherboard for AMD Socket AM5—the PRO B650M 12VO/WiFi.

The company hasn't finalized the board design, but we know from its silhouette to be a Micro-ATX (240 mm x 240 mm) board, with the Socket AM5 wired to two DDR5 DIMM slots, a PCI-Express 4.0 x16, a handful M.2 NVMe Gen 4 slots, and some basic connectivity, including onboard Wi-Fi. As with all ATX12VO motherboards we've seen to date, onboard VRM is used to switch 12 V to lower voltage domains, including 5 V and 3.3 V needed for SATA drives, and the likes. MSI also revealed that it is working on a branded ATX12VO power supply series, so both the retail and OEM/SI channel customers can buy the motherboard+PSU as combos from a single source. Not much else is known about these PSUs at this point.

AMD continues to release new Ryzen 5000 series processor models for the Socket AM4 platform to this day, with new processors expected to launch next month. That's over 6 years of longevity for the platform, considering that AMD has extended official Ryzen 5000 series support all the way back to its first line of AM4 motherboards based on the 300-series chipset. The company plans a similar longevity for Socket AM5. In an interview with Overclockers UK, AMD's client channel business head David McAfee said "I think that we certainly recognized that the longevity of the AM4 platforms was one of the biggest reasons that led to the success of Ryzen and as we think and as we think about the future, 2025 and beyond, that decision to move to a next-generation of socket is one that's going to be really thought through really really carefully. We know the impact that moving to a new socket brings and we want to stay on AM5 for as long as we possibly can. We are firmly committed to 2025 and beyond and we will see how long that promise lasts beyond 2025."

AMD Socket AM5 is designed to deliver up to 230 W of package power, and has a contemporary I/O that includes a dual-channel DDR5 memory interface (4x 40-bit sub-channels); and 28 PCIe Gen 5 lanes (x16 PEG, two x4 NVMe, and x4 chipset bus), besides the usual SoC connectivity. With the upcoming Ryzen 8000G "Phoenix" APUs, we could expect to see that the socket even wires out modern display I/O such as DisplayPort 2.1 with USB type-C, and the bandwidth for 12-bit HDR up to 68 billion colors. AMD debuted Socket AM5 with the "Zen 4" microarchitecture, with "Zen 5" expected to launch in 2024. It's conceivable that the company's 2025 client architecture, "Zen 6," could also see its desktop presence on AM5, given that DDR5 memory and PCIe Gen 5 will remain relevant till at least that time.

Intel's entry-level 14th Gen Core desktop processor, the Core i3-14100, got its first retailer listing, with ShopBLT putting it up for $150.24. The 4-core/8-thread chip that only has performance cores (P-cores), is based on the same H0 silicon that drives the Core i5-12600, which physically lacks E-cores. Intel has been reusing its "Alder Lake" silicon across the non-K variants of its 13th Gen and now 14th Gen Core i3 and Core i5 processor SKUs. One way to spot them is by the size of their dedicated L2 caches for the P-cores, which is 1.25 MB, compared to 2 MB on the 8P+16E "Raptor Lake-S" silicon used to carve out Core i7 and Core i9 SKUs across the 13th Gen and 14th Gen.

The Core i3-14100 offers a tiny speed bump over its predecessor, the i3-13100. With the base frequency set at 3.50 GHz, and boost frequency probably at 4.70 GHz, compared to the 3.40 GHz and 4.50 GHz of the i3-13100. Each of the four P-cores has 1.25 MB of L2 cache, and they share 12 MB of L3 cache. The chip gets the same I/O as the rest of the lineup, with a dual-channel DDR4/DDR5 memory interface, and PCIe connectivity that includes a Gen 5 x16, a CPU-attached Gen 4 x4 for NVMe slots, and a DMI 4.0 x8 chipset bus. The iGPU on offer is the UHD Graphics 730 based on Xe-LP, with 24 EU, compared to the 32 that's standard with higher 14th Gen Core desktop processor models. The chip has a processor base power of 60 W, and a possible maximum turbo power of 110 W. Intel is expected to announce its locked 14th Gen Core desktop processor lineup in January 2024, which should include the i3-14100, and its cheaper sibling, the i3-14100F, which lacks integrated graphics.

GIGABYTE Technology, a leading global powerhouse in motherboards, graphics cards, and cutting-edge hardware solutions, proudly announces that GIGABYTE DDR5 motherboards deliver breakthrough support for a memory capacity of single DIMM 64 GB with the latest Kingston FURY Renegade DDR5 memory. The 4DIMM model boosts the memory capacity up to 256 GB, while the 2DIMM model has a maximum capacity of up to 128 GB.⁠

With innovative layout design and top-notch components, GIGABYTE motherboards have played a leading role in memory performance. From the Intel 700 and 600 series to the AMD 600 series, GIGABYTE DDR5 motherboards will support a memory capacity of single DIMM 64 GB through BIOS update. The updated BIOS and memory support list will be available on the GIGABYTE official website, coinciding with the launch of the latest Kingston FURY Renegade DDR5 memory. Please stay tuned to the GIGABYTE official website for further information.

Chinese chipmaker Montage Technology has unveiled new data center processors under its Jintide brand based on Intel's latest Emerald Rapids Xeon architecture. The 5th generation Jintide lineup offers anywhere from 16-core to 48-core options for enterprise customers needing advanced security specific to China's government and enterprise requirements. Leveraging a long-running joint venture with Intel, Jintide combines standard high-performance Xeon microarchitectures with added on-die monitoring and encryption blocks, PrC (Pre-check) and DSC (Dynamic Security Check), which are security-hardened for sensitive Chinese use cases. The processors retain all core performance attributes of Intel's vanilla offerings thanks to IP access, only with extra protections mandated by national security interests. While missing the very highest core counts, the new Jintide chips otherwise deliver similar Emerald Rapids features like 8-channel DDR5-5600 memory, 80 lanes of speedy PCIe 5.0, and elevated clock speeds over 4.0 GHz at peak. The Jintide processors have 2S scaling, which allows for dual-socket systems with up to 96 cores and 192 threads.

Pricing remains unpublished but likely carries a premium over Intel list prices thanks to the localized security customization required. However, with Jintide uniquely meeting strict Chinese government and data regulations, cost becomes secondary for target customers needing compliant data center hardware. After matching lockstep with Intel's last several leading Xeon generations, Jintide's continued iteration highlights its strategic value in enabling high-performance domestic infrastructure as China eyes IT supply chain autonomy. Intel gets expanded access to the growing Chinese server market, while Chinese partners utilize Intel IP to strengthen localized offerings without foreign dependency. It manifests the delicate balance of advanced chip joint ventures between global tech giants and rising challengers. More details about the SKUs are listed in the table below.

Market research by Korean publication Danawa DPG provides valuable insights to how desktop AMD Ryzen processor users are charting their upgrade paths given the long upgrade longevity of AMD sockets. The research follows a 10-month date range from December 2022 to October 2023, and tracks the sales of motherboards based on various AMD chipset models. We're shown that toward the turn of the year, AMD B550 chipset motherboards sell the most. This is when AMD Ryzen 5000 Socket AM4 processors top sales for the company, Given that the B550 fully supports CPU overclocking, and that there are plenty of feature-packed B550 motherboard models, it explains why the B550 covers a wide price-band.

AMD launched the Ryzen 7000 series "Zen 4" to lukewarm response in September 2022, mainly because the platform lacked DDR4 memory support that was relevant at the time, and hence wasn't as flexible to consumers as Intel's LGA1700. Its launch caused price-cuts for Ryzen 5000 series processors, clearing out some upgrade headroom for those on the AM4 platform still using Ryzen 3000. Off to a slow start, we see its successor from Socket AM5, the B650 chipset, rise steadily over the time period, and for two reasons—DDR5 memory became affordable over the course of 2023; and AMD breathed life into the Ryzen 7000 series with the introduction of the Ryzen 7000X3D series, which restored gaming performance competitiveness to Intel's 13th Gen Core "Raptor Lake." The B650 has everything you need right now for a Ryzen 7000X3D build, given that both the GeForce RTX 40-series and Radeon RX 7000 series are PCIe Gen 4 graphics cards; and that the B650 has at least a Gen 5 NVMe slot. If you absolutely need a Gen 5 x16 slot, there's the premium B650E chipset to go with.

ASRock is announcing the support of 64 GB DDR5 memory module across Intel 700 Series and AMD AM5 Series motherboards. This enhancement boosts the maximum memory capacity to 256 GB with 4 DIMMs, offering increased performance and compatibility for enthusiasts. Additionally, we are committed to expanding support for the 64 GB DDR5 memory module across more motherboards with various chipsets, enhancing productivity for memory-intensive multitasking applications.

KLEVV, the premier consumer memory and storage brand introduced by Essencore, today is excited to unveil the all-new CRAS V RGB Brilliant White edition memory kit available in extreme high speed of DDR5-8200 & DDR5-8400 configurations. As a testament to the immense popularity and growing demand for the CRAS V RGB memory kits, KLEVV has responded by introducing the long-awaited Brilliant White edition to its flagship memory lineup as well as two high-speed options for consumers. This new addition boasts striking aesthetics by keeping the tone-on-tone design, and upholds the exceptional performance standards synonymous with the CRAS V RGB series, solidifying its position as the preferred choice among enthusiasts and professionals alike.

Meticulously engineered for high-speed operation, KLEVV's CRAS V RGB memory kits deliver outstanding performance with remarkable speed options of DDR5-8200 (featuring timings of 38-49-49-131) and DDR5-8400 (with timings of 40-52-52-134), all while operating efficiently at a voltage of 1.45 V. Below screenshot demonstrates the test result of DDR5-8400 kit using AIDA64 Cache & Memory Benchmark tool.

At the beginning of this year, MSI announced the pioneering support for a memory capacity of 192 GB. Today, we are proud to unveil an even greater milestone - MSI motherboards now support memory capacities of up to 256 GB for 4 DIMMs motherboards and 128 GB for 2 DIMMs motherboards. This significant enhancement empowers DIY enthusiasts with unparalleled flexibility to optimize multitasking capabilities and ensures a seamless computing experience.

This accomplishment underscores the strong collaboration between MSI and leading memory brands to achieve enhanced performance and remarkable milestones. The partnered memory for this achievement is Kingston FURY Renegade DDR5 memory, offering an impressive 64 GB capacity per module. Built on Micron's industry-leading 1β (1-beta) technology, enables new capacities not seen before for dual channel PCs.

GIGABYTE, the world's leading computer brand, proudly introduces the latest evolution in gaming laptops for 2024 - the AORUS 17 and AORUS 15 - delivering cutting-edge performance in their signature sleek and portable package.

Powered by the all-new Intel Core Ultra 7 processors and equipped with full-powered NVIDIA GeForce RTX 40 Series Laptop GPUs alongside expandable DDR5 memory, the AORUS 17 and AORUS 15 effortlessly handle demanding gaming and creative tasks on the go. The exclusive WINDFORCE Infinity cooling technology ensures optimal performance in a super-portable chassis, while the addition of Dolby Vision and Dolby Atmos technologies provides an immersive personal cinema experience.

GIGABYTE Technology: Giga Computing, a subsidiary of GIGABYTE and an industry leader in high-performance servers and IT infrastructure, is thrilled to present a cutting-edge series of servers optimized for the newly launched Intel Xeon E-2400 processors. These servers deliver essential computing power, ensuring a dependable workload for a wide range of enterprise and edge computing applications, all while maintaining an impressive price-to-performance ratio.

"We are thrilled to unveil our latest server product line, which is engineered to deliver unparalleled performance and reliability," said Vincent Wang, sales VP at Giga Computing. "By leveraging the power of the new Intel Xeon E processors, our servers empower businesses to elevate their computational capabilities, enabling them to achieve greater efficiency and productivity. Whether it's for enterprise applications or edge computing tasks, GIGABYTE servers are the cornerstone of innovation in the digital landscape." ⁠

TYAN, a leading server platform design manufacturer and a MiTAC Computing Technology Corporation subsidiary, today introduced upgraded server platforms and motherboards based on the brand-new 5th Gen Intel Xeon Scalable Processors, formerly codenamed Emerald Rapids.

5th Gen Intel Xeon processor has increased to 64 cores, featuring a larger shared cache, higher UPI and DDR5 memory speed, as well as PCIe 5.0 with 80 lanes. Growing and excelling with workload-optimized performance, 5th Gen Intel Xeon delivers more compute power and faster memory within the same power envelope as the previous generation. "5th Gen Intel Xeon is the second processor offering inside the 2023 Intel Xeon Scalable platform, offering improved performance and power efficiency to accelerate TCO and operational efficiency", said Eric Kuo, Vice President of Server Infrastructure Business Unit, MiTAC Computing Technology Corporation. "By harnessing the capabilities of Intel's new Xeon CPUs, TYAN's 5th-Gen Intel Xeon-supported solutions are designed to handle the intense demands of HPC, data centers, and AI workloads.

Today at the "AI Everywhere" event, Intel launched its 5th Gen Intel Xeon processors (code-named Emerald Rapids) that deliver increased performance per watt and lower total cost of ownership (TCO) across critical workloads for artificial intelligence, high performance computing (HPC), networking, storage, database and security. This launch marks the second Xeon family upgrade in less than a year, offering customers more compute and faster memory at the same power envelope as the previous generation. The processors are software- and platform-compatible with 4th Gen Intel Xeon processors, allowing customers to upgrade and maximize the longevity of infrastructure investments while reducing costs and carbon emissions.

"Designed for AI, our 5th Gen Intel Xeon processors provide greater performance to customers deploying AI capabilities across cloud, network and edge use cases. As a result of our long-standing work with customers, partners and the developer ecosystem, we're launching 5th Gen Intel Xeon on a proven foundation that will enable rapid adoption and scale at lower TCO." -Sandra Rivera, Intel executive vice president and general manager of Data Center and AI Group.

After years of delays, Chinese chipmaker Zhaoxin has finally launched its long-awaited KX-7000 series consumer CPUs, only one of its kind in China, based on the licensed x86-64 ISA. Zhaoxin claims the new 8-core processors based on "Century Avenue" uArch deliver double the performance of previous generations. Leveraging architectural improvements and 4X more cache, the KX-7000 represents essential progress for China's domestic semiconductor industry. While still likely lagging behind rival AMD and Intel chips in raw speed, the KX-7000 matches competitive specs in areas like DDR5 memory, PCIe 4.0, and USB4 support. For Chinese efforts to attain technological independence, closing feature gaps with foreign processors is just as crucial as boosting performance. Manufactured on a 16 nm process, the KX-7000 does not use the best silicon node available.

Other chip details include out-of-order execution (OoOE), 24 PCIe 4.0 lanes, a 32 MB pool of L3 cache and 4 MB L2 cache, a base frequency of 3.2 GHz, and a boost clock of 3.7 GHz. Interestingly, the CPU also has VT-x, BT-d 2.5, SSE4.2/AVX/AVX2 support, most likely also licensed from the x86 makers Intel and/or AMD. Ultimately, surpassing Western processors is secondary for China next to attaining self-reliance. Instructions like SM encryption catering to domestic data protection priorities underscore how the KX-7000 advances strategic autonomy goals. With its x86 architecture license giving software compatibility and now a vastly upgraded platform, the KX-7000 will raise China's chip capabilities even if it is still trailing rivals' speeds. Ongoing progress closing that performance gap could position Zhaoxin as a mainstream alternative for local PC builders and buyers.

Thermaltake announced the ToughRAM RC DDR5 memory kit in its first non-binary (24 GB of 48 GB) capacity. Model number RA50D524GX2-5600C46A comes with a capacity of 48 GB (2x 24 GB), and supports both Intel XMP and AMD EXPO profiles for a frequency of DDR5-5600 with timings of 46-46-46-90 at 1.1 V. The modules lack any RGB lighting but come with preparation for the company's Floe RC liquid cooling for memory; or an RGB lighting kit. Thermaltake is backing these with lifetime warranty. We expect a street price of $150.

Patriot Memory, a leading manufacturer of high-performance enthusiast memory modules, SSDs, flash storage and gaming peripherals, has announced the upcoming release of Viper Gaming's first-ever collaboration with ASUS' gaming division, TUF Gaming: The Viper Elite 5 TUF Gaming Alliance RGB DDR5 series.

As a bold new take on the recently released Viper Elite 5 performance memory series, the Viper Elite 5 TUF Gaming Alliance RGB DDR5 series is certified by ASUS' TUF Gaming Alliance and features high-performance transfer speeds of up to 6,600MT/s, capacities of up to 48 GB and tuned overclock support for XMP 3.0 and AMD EXPO on select models. The Viper Elite 5 TUF Gaming Alliance RGB DDR5 series offers the latest in top-tier performance for gamers, tech enthusiasts and creatives alike. The Viper Elite 5 TUF Gaming Alliance RGB DDR5 series also features unique branding and design combining Viper Gaming and TUF Gaming alongside the Viper Elite 5's one-of-a-kind matte white heatshield with an RGB lightbar.

JEDEC Solid State Technology Association, the global leader in the development of standards for the microelectronics industry, today announced the publication of JESD318: Compression Attached Memory Module (CAMM2) Common Standard. This groundbreaking standard defines the electrical and mechanical requirements for both Double Data Rate, Synchronous DRAM Compression-Attached Memory Modules (DDR5 SDRAM CAMM2s) and Low Power Double Data Rate, Synchronous DRAM Compression-Attached Memory Modules (LPDDR5/5X SDRAM CAMM2s) in a single, comprehensive document. JESD318 CAMM2 is available for download from the JEDEC website.

DDR5 and LPDDR5/5X CAMM2s cater to distinct use cases. DDR5 CAMM2s are intended for performance notebooks and mainstream desktops, while LPDDR5/5X CAMM2s target a broader range of notebooks and certain server market segments.

QNAP Systems, Inc., a leading computing, and storage solutions innovator, today unveiled the new high-capacity TS-hx77AXU-RP ZFS NAS series, including 12-bay TS-h1277AXU-RP and 16-bay TS-h1677AXU-RP rackmount models powered by AMD Ryzen 7000 Series processors based on the cutting-edge AMD Socket AM5 platform. By integrating robust hardware and diverse I/O including DDR5 RAM, M.2 PCIe Gen 5, PCIe Gen 4 slots, and redundant power supplies, the TS-hx77AXU-RP series unleashes enterprise-level performance and delivers ultra-high bandwidth, futureproof expandability, and trusted reliability for performance-demanding Tier 2 storage, virtualization, 4K video editing, and PB-level storage applications.

"The whole new TS-hx77AXU-RP series ZFS NAS provides enterprises with superb performance and large storage capacity to tackle business-critical workloads and storage-demanding applications. The AMD Ryzen 7000 Series multi-core processors further unlocks the key performance of DDR5 and M.2 PCIe Gen 5," said Alex Shih, Product Manager of QNAP, adding "Paired with the ZFS file system that's most suited for business applications, the TS-hx77AXU-RP series stands out as the top choice for storage solutions that require uncompromising data integrity."