The first CPU-Z test results of AMD's upcoming Ryzen 7 8700G were sniffed out by serial leaker @momomo_us on X/Twitter and the new APU is looking very promising performance wise. It ends up being neck and neck with yours truly own Ryzen 7 7800X3D with a small lead to the CPU over the APU in single-threaded performance, but in the multi-threaded test the APU manages to stay ahead of the CPU, if only just. Both AMD chips are still somewhat behind Intel's Core i7-12700KF, but it has an extra four threads, even though those threads are slower due to them being on the E-cores.

The Ryzen 7 8700G test system was using an ASRock B650 Pro RS motherboard and the APU was paired with 32 GB of DDR5-6400 memory with reasonably tight timings of 32-39-39-102. The tester relied on the integrated Radeon 780M graphics in the APU and the Windows 11 operating system was installed on a 500 GB Seagate BarraCuda 510 SSD. In the single-threaded test the Ryzen 7 8700G scores 675 points vs 683 for the Ryzen 7 7800X3D and in the multi-threaded tests it came in at 7318 vs 7301. Not bad for a 65 W TDP APU vs a 120 W TDP CPU. For comparison, the average for Intel's Core i7-12700KF is 7754 in the mutli-threaded test. Although CPU-Z is far from an exhaustive test, it does at least give us a first glimpse of what to expect from the new Zen 4 APUs from AMD in terms of performance and it looks like it's in line with its best Zen 4 CPUs.

According to sources close to Seoul Economy, and reported by DigiTimes, Intel has reportedly chosen Samsung as a supplier for its next-generation Lunar Lake processors, set to debut later this year. The report notes that Samsung will provide LPDDR5X memory devices for integration into Intel's processors. This collaboration could be a substantial win for Samsung, given Intel's projection to distribute millions of Lunar Lake CPUs in the coming years. However, it's important to note that this information is based on a leak and has not been officially confirmed. Designed for ultra-portable laptops, the Lunar Lake-MX platform is expected to feature 16 GB or 32 GB of LPDDR5X-8533 memory directly on the processor package. This on-package memory approach aims to minimize the platform's physical size while enhancing performance over traditional memory configurations. With Lunar Lake's exclusive support for on-package memory, Samsung's LPDDR5X-8533 products could significantly boost sales.

While Samsung is currently in the spotlight, it remains unclear if it will be the sole LPDDR5X memory provider for Lunar Lake. Intel's strategy involves selling processors with pre-validated memory, leaving the door open for potential validation of similar memory products from competitors like Micron and SK Hynix. Thanks to a new microarchitecture, Intel has promoted its Lunar Lake processors as a revolutionary leap in performance-per-watt efficiency. The processors are expected to utilize a multi-chipset design with Foveros technology, combining CPU and GPU chipsets, a system-on-chip tile, and dual memory packages. The CPU component is anticipated to include up to eight cores, a mix of four high-performance Lion Cove and four energy-efficient Skymont cores, alongside advanced graphics, cache, and AI acceleration capabilities. Apple's use of on-package memory in its M-series chips has set a precedent in the industry, and with Intel's Lunar Lake MX, this trend could extend across the thin-and-light laptop market. However, systems requiring more flexibility in terms of configuration, repair, and upgrades will likely continue to employ standard memory solutions like SODIMMs and/or the new CAMM2 modules that offer a balance of high performance and energy efficiency.

AMD is looking to debut its Ryzen 9000 series "Granite Ridge" desktop processors based on the "Zen 5" microarchitecture some time around May-June 2024, according to High Yield YT, a reliable source with AMD leaks. These processors will be built in the existing Socket AM5 package, and be compatible with all existing AMD 600 series chipset motherboards. It remains to be seen if AMD debuts a new line of motherboard chipsets. Almost all Socket AM5 motherboards come with the USB BIOS flashback feature, which means motherboards from even the earliest production batches that are in the retail channel, should be able to easily support the new processors.

AMD is giving its next-gen desktop processors the Ryzen 9000 series processor model numbering, as it used the Ryzen 8000 series for its recently announced Socket AM5 desktop APUs based on the "Hawk Point" monolithic silicon. "Granite Ridge" will be a chiplet-based processor, much like the Ryzen 7000 series "Raphael." In fact, it will even retain the same 6 nm client I/O die (cIOD) as "Raphael," with some possible revisions made to increase its native DDR5 memory frequency (up from the current DDR5-5200), and improve its memory overclocking capabilities. It's being reported that DDR5-6400 could be the new "sweetspot" memory speed for these processors, up from the current DDR5-6000.

SK hynix Inc. announced today that it recorded an operating profit of 346 billion won in the fourth quarter of last year amid a recovery of the memory chip market, marking the first quarter of profit following four straight quarters of losses. The company posted revenues of 11.31 trillion won, operating profit of 346 billion won (operating profit margin at 3%), and net loss of 1.38 trillion won (net profit margin at negative 12%) for the three months ended December 31, 2023. (Based on K-IFRS)

SK hynix said that the overall memory market conditions improved in the last quarter of 2023 with demand for AI server and mobile applications increasing and average selling price (ASP) rising. "We recorded the first quarterly profit in a year following efforts to focus on profitability," it said. The financial results of the last quarter helped narrow the operating loss for the entire year to 7.73 trillion won (operating profit margin at negative 24%) and net loss to 9.14 trillion won (with net profit margin at negative 28%). The revenues were 32.77 trillion won.

A leaked Intel documentation we reported on a few days ago covered the Arrow Lake-S platform and some implementation details. However, there was an interesting catch in the file. The leaked document indicates that the upcoming 15th-Generation Arrow Lake desktop CPUs could lack Hyper-Threading (HT) support. The technical memo lists Arrow Lake's expected eight performance cores without any threads enabled via SMT. This aligns with previous rumors of Hyper-Threading removal. Losing Hyper-Threading could significantly impact Arrow Lake's multi-threaded application performance versus its Raptor Lake predecessors. Estimates suggest HT provides a 10-15% speedup across heavily-threaded workloads by enabling logical cores. However, for gaming, disabling HT has negligible impact and can even boost FPS in some titles. So Arrow Lake may still hit Intel's rumored 30% gaming performance targets through architectural improvements alone.

However, a replacement for the traditional HT is likely to come in the form of Rentable Units. This new approach is a response to the adoption of a hybrid core architecture, which has seen an increase in applications leveraging low-power E-cores for enhanced performance and efficiency. Rentable Units are a more efficient pseudo-multi-threaded solution that splits the first thread of incoming instructions into two partitions, assigning them to different cores based on complexity. Rentable Units will use timers and counters to measure P/E core utilization and send parts of the thread to each core for processing. This inherently requires larger cache sizes, where Arrow Lake is rumored to have 3 MB of L2 cache per core. Arrow Lake is also noted to support faster DDR5-6400 memory. But between higher clocks, more E-cores, and various core architecture updates, raw throughput metrics may not change much without Hyper-Threading.

TrendForce's latest analysis reveals that the downswing of DRAM contract prices, which had lasted for eight consecutive quarters since 4Q21, was finally reversed in 4Q23. Likewise, NAND Flash rebounded in 3Q23 after four quarters of decline. The persistence of this rally in memory prices during 2024 will largely hinge on suppliers' ongoing and effective control over their capacity utilization rates.

According to TrendForce Senior Research Vice President, Avril Wu, the first quarter of this year is already shaping up to be a season of growth, with TrendForce confirming its initial projections: a hike of around 13-18% QoQ for DRAM contract prices and a hike of 18-23% for NAND Flash contract prices. Despite a generally conservative outlook for overall market demand in 2Q24, suppliers in both DRAM and NAND Flash markets have begun raising their capacity utilization rates since the end of 4Q23. Furthermore, NAND Flash buyers are anticipated to complete their inventory restocking in advance in 1Q24. Due to the rise in capacity utilization rates and earlier restocking efforts, leading to a more moderated QoQ price increase of 3-8% for both DRAM and NAND Flash contract prices for 2Q24.

During CES, PCWorld had a chat with Donny Woligroski, Technical Marketing Manager at AMD. The new Ryzen 8000G APUs were a large part of what covered in the almost 17 minute long video and PCWorld got some details that weren't covered in the official press materials that AMD released at the launch. The officially supported memory speed listed by AMD is DDR5-5600, which is a step up from the official speed of DDR5-5200 for the Ryzen 7000-series CPUs.

However, we know that the Ryzen 7000-series is more than happy to use faster memory and as before, AMD has an unofficial memory sweet spot and just as with the Ryzen 7000-series, the Ryzen 8000G-series of APUs has a memory sweet spot of DDR5-6000. That said, it's unknown if the Ryzen 8000G-series will support faster memory or will start flaking out above DDR5-6000, like many Ryzen 7000-series CPUs do unless you switch to a 1:2 ratio. Woligroski is also pointing out that dual-channel is a must to get the best performance out of the new APUs, although this shouldn't really surprise anyone. Full video after the break.

In a surprising turn of events, SK Hynix has hinted at the possibility of the Compression Attached Memory Module (CAMM) standard, initially designed for laptops, being introduced to desktop PCs. This revelation came from a comment made by an SK Hynix representative at the CES 2024 in Las Vegas for the Korean tech media ITSubIssub. According to the SK Hynix representative, the first implementation is underway, but there are no specific details. CAMM, an innovative memory standard developed by Dell in 2022, was certified to replace SO-DIMM as the official standard for laptop memory. However, the transition to desktop PCs could significantly disrupt the desktop memory market. The CAMM modules, unlike the vertical DRAM sticks currently in use, are horizontal and are screwed into a socket. This design change would necessitate a complete overhaul of the desktop motherboard layout.

The thin, flat design of the CAMM modules could also limit the number that can be installed on an ATX board. However, the desktop version of the standard CAMM2 was announced by JEDEC just a month ago. It is designed for DDR5 memory, but it is expected to become mainstream with the introduction of DDR6 around 2025. While CAMM allows for higher speeds and densities for mobile memory, its advantages for desktops over traditional memory sticks are yet to be fully understood. Although low-power CAMM modules could offer energy savings, this is typically more relevant for mobile devices than desktops. As we move towards DDR6 and DDR7, more information about CAMM for desktops will be needed to understand its potential benefits. JEDEC's official words on the new standard indicate that "DDR5 CAMM2s are intended for performance notebooks and mainstream desktops, while LPDDR5/5X CAMM2s target a broader range of notebooks and certain server market segments." So, we can expect to see CAMM2 in both desktops and some server applications.

Global leader in embedded computing, Jetway, today introduced the JF35-ADN1, a 3.5" SubCompact single-board powered by the Intel Processor N97 CPU. A versatile board, the JF35-ADN1 is primarily targeted towards the industrial robotics sphere, with Automated Guided Vehicles (AGV) being one application singled out as being particularly suitable. However, Jetway have stated that the board also contains the right combination of display capability and encrypted mobile networking capacity to power both machine vision and payment systems solutions.

The JF35-ADN1 boasts a range of high-speed interfaces for camera, sensor, and card reader connectivity, such as two RJ-45 ports for Intel I225-V running at 2.5GbE, as well as both USB Type-A and Type-C ports. Further, a total of eight USB 2.0 interfaces are evenly split between physical ports and internal connectors. It is worth noting that the JF35-ADN1's high-speed data acquisition for its intended deployment areas is enhanced by the board's support for up to 32 GB of DDR5 system memory via SODIMM. This connectivity, alongside the board's optional onboard TPM 2.0, make it a suitable candidate to develop payment system solutions.

V-COLOR announces the launch of their DDR5 overclocking R-DIMM the TRX50 Motherboards powered by AMD Ryzen Threadripper 7000 series processors with capacity 192 GB (4x48GB) ready to hit the market in speeds ranging from 6400 MHz up to 7200 MHz for end users who require the maximum capacity and speed. This package is geared toward content makers, intensive 3D modelers, AI programmers, trading machines, and HFT (high frequency trading) firms.

With EXPO ready v-color DDR5 OC R-DIMM memory is ready to for full potential, designed for a diverse user base that includes both non-overclocking users and overclocking enthusiasts, with a specific focus on content creators, intensive 3D modelers, AI programmers, trading machines or HFT (high frequency trading) companies. This kit is meticulously crafted with the most advanced SK Hynix DDR5 chips and Automated Binning sort for more reliability and endurance, continuously tested for full compatibility with all the motherboards TRX50.

ECS Industrial Computer Co., Ltd., (ECSIPC) is pleased to announce its participation in ISE 2024 where it will showcase its latest smart retail solutions, IPC motherboards, and two new LIVA mini-PCs that are ready for applications including digital signage, smart vending machines, kiosks, factory automation equipment and AOI. Designed for digital signage and self-service kiosks in the smart retail industry, or in large vehicles fitted with display-board advertising, this unique mini-PC offers up to 4 display outputs that can showcase a variety of rich and vibrant content. The highly flexible solution can display 4 different screens, mirror all screens the same, split one image across 4 displays, or splits of 3-and-1 or 2-and-2, affording maximum flexibility to cover wide areas of retail spaces that can easily plan and push a multitude of content to inform and advertise in attractive, dynamic, high-resolution visuals, all from a single device. The LIVA X3A mini-PC is ready to go right out the box, along with ECSIPC's own content management software to streamline product deployment.

Powered by a highly efficient Rockchip octa-core featuring a 4x Arm Cortex-A76 and 4x Arm Cortex-A55 processors in this Arm-based CPU, the highly efficient, fanless design ensures a sustainable solution that accommodates many use-cases. In addition, 8 GB of fast LPDDR5 and 64 GB of internal storage is preinstalled, while dual GbE, Wi-Fi 6 and Bluetooth 5.3 provide a variety of internet connectivity built-in, which can be further expanded with optional PoE and 4G LTE to meet specific deployment requirements.

Alienware is entering new arenas at CES 2024 with the debut of notebooks, peripherals and monitors that were inspired by our community and developed to appeal to all gamers. Whether you play to compete, play to get immersed in the game or play to socialize, Alienware can outfit your gaming needs. From the beginning, Alienware has offered high-performance hardware and software to the most demanding gamers. And here's what I can tell you: our focus on the enthusiast gamer hasn't changed. At the same time, the gaming landscape has evolved and is becoming more diverse than ever.

That's why we're eager to introduce products designed for wider audiences, from students who play dorm room sessions with friends, to working professionals who wind down the evening with a relaxing indie title, and pro athletes who game for a living. While these products reach new audiences, their DNA remains distinctly Alien, meaning they deliver the latest innovations in technology, performance and design. Meet Alienware's latest product portfolio:

• Three new gaming notebooks debut - the redesigned Alienware m16 R2, the ultra-premium x16 R2, and our performance juggernaut, the m18 R2.
• We've doubled our QD-OLED family by adding the Alienware AW3225QF and AW2725DF - two first of their kind QD-OLED monitors.
• Built in collaboration with 100+ esports athletes, our new Alienware Pro Wireless Keyboard and Pro Wireless Mouse mark our breakthrough into the pro gaming peripherals space.

Lexar previewed part of their CES lineup late last week—we got a quick briefing that outlined various upcoming portable SSDs, M.2 NVMe SSDs, and professional CFExpress cards. TPU staffers spent some quality time at the storage specialist's booth in Las Vegas—they have reported back that emphasis has been placed on Lexar's portable SSD products. The headliner appears to be the prominently placed ARMOR 700 Portable SSD—this boasts an extra rugged design, thus providing the level of on-the-go protection that is required by modern professionals.

The ARMOR 700 will be available in three capacities: 1 TB, 2 TB and 4 TB. Maximum read and write speeds of 2000 MB/s are advertised on Lexar's wall-mounted exhibit, with support for 6K RAW video files. The rugged and durable housing has been certified at IP65, with drop-resistant properties. The already released SL660 BLAZE Gaming Portable SSD was showcased at CES, but it was joined by a similar looking (non-RGB equipped) sibling—the new SL600 is a more sober looking option, aimed at professional types. The SL500 Portable SSD sports credentials for a wide range of purposes: mobile devices, laptops, cameras as well as gaming on current generation games consoles. Lexar states that the SL500 is powered by Silicon Motion Technology portable SSD controllers—with speeds up to 2000 MB/s read and 1800 MB/s write. Capacities noted on the exhibit wall are 1 TB, 2 TB and 4 TB—this applies to the SL600 specification as well.

Patriot Memory brought their latest ware to the 2024 International CES that use recent advancements in tech on both the SSD and memory fronts. On the SSD front, this year sees 14 GB/s capable PCIe Gen 5 NVMe SSDs thanks to Phison's E26 Max14um controller; and a new crop of USB4 portable SSDs; while the memory front sees DDR5 speeds go far north of DDR5-6000, thanks to on-module CKDs. Patriot showed us examples of each.

First up, there's the Patriot Viper PV573 Gen 5 NVMe SSD. This thing comes in capacities of up to 4 TB, and combines a Phison E26 Max14um controller with Micron's latest B58R TLC NAND flash chips that offer 2400 MT/s per flash channel. The controller also gets some incremental thermal optimizations, which means the cooling solution for the PV573 is a 16.5 mm-tall fan-heatsink. The drive offers up to 14 GB/s sequential reads, with up to 12 GB/s sequential writes. There's also a slightly de-rated version of this drive, the Viper PV553, which has the same combination of controller and NAND flash, but with transfer speeds of up to 12.4 GB/s reads, with up to 11.8 GB/s writes.

Crucial, the client-focused brand of memory giant Micron Technology, showed off a handful new innovations at its booth along the sidelines of the 2024 International CES. First up, is a prototype USB4 portable SSD and prototype desktop SSD. These are proofs of concept, and not actual products. With this, Crucial is testing the waters with USB4 and its delicious 40 Gbps bidirectional bandwidth, which unlocks a new generation of fast removable storage devices. The prototype USB4 portable SSD comes in a tiny chassis about the size of a burner phone. It is a PCB with an M.2-2280 slot with PCIe Gen 4 x4 wiring, connected to an ASMedia ASM2464PD USB4 bridge chip. An OEM Micron Gen 4 SSD with 232-layer 3D TLC NAND flash and LPDDR4 DRAM cache, is installed on this drive. The CDM reading for this drive is 3821 MB/s sequential reads, with 885 MB/s sequential writes.

Next up, is a larger desktop SSD prototype (which again, isn't an actual product but a proof of concept). Its metal chassis is about the size of a 3.5-inch HDD. Inside is at least one M.2-2280 Gen 4 slot (there are probably more); with a preinstalled drive. An ASMedia ASM2464PD handles things here, too. The performance is mostly similar, at 3792 MB/s sequential reads, but with significantly increase 3803 MB/s sequential writes. This may seem unspectacular because Thunderbolt 4 has been delivering 40 Gbps for many years now, and we've had TB4-based external SSDs; but USB4 somewhat democratizes this kind of bandwidth.

Acer unleashes a series of powerhouse gaming laptops, headlined by the refreshed models of the Predator Helios 18 and Predator Helios 16. Acer also announced the new Predator Helios Neo 18 gaming laptop and major updates to the Predator Helios Neo 16, all outfitted with the latest Intel Core 14th gen processors and NVIDIA GeForce RTX 40 Series Laptop GPUs with DLSS 3.5 technology and NVIDIA Advanced Optimus. NVIDIA RTX Laptop GPUs are packed with specialized AI Tensor Cores enabling unmatched AI performance and accelerations in creative apps, ultra-efficient productivity, blistering fast gaming, and more. The Predator laptops feature Microsoft's Copilot in Windows 11 and a dedicated Copilot key for quick access to AI-powered task assistance. They also come with one month of Xbox Game Pass Ultimate, giving gamers access to hundreds of high-quality PC games.

Gamers seeking a competitive edge will be thrilled with the Predator Helios 18 and Predator Helios 16 laptops as they come with options for captivating Mini LED panels, MagKey 3.0 swappable mechanical switch for shorter key travel and response time, and lightning-fast network speeds with Wi-Fi 7 compatibility.

Acer today announced the Acer Nitro 17 (AN17-72) gaming laptop, unlocking improved performance, immersive experiences, plus essential features for playing and multi-tasking on the go. The device is powered by the latest Intel Core 14th gen processors, featuring Intel's Performance Hybrid Architecture with improved power and core frequencies to manage workloads efficiently. At the same time, NVIDIA GeForce RTX 40 Series GPUs with DLSS 3.5 technology. NVIDIA RTX Laptop GPUs are packed with specialized AI Tensor Cores enabling unmatched AI performance in creative apps, ultra-efficient productivity, blistering fast gaming, and more. Built with Microsoft Copilot and the next wave of computing, the Nitro laptop provides access to Copilot in Windows via a dedicated Copilot key, making it even easier to harness the power of AI to assist with productivity and creativity tasks.

Users can feast their eyes on immersive visuals and pristine colors on the device's 17-inch QHD display with a fast 165 Hz[1] refresh rate and support for the NVIDIA Advanced Optimus feature. The Nitro 17 is further supported by an advanced cooling system, AI-assisted communication features, and NitroSense software for full device control. To top it all off, the Windows 11 gaming laptop is shipped with one month of Xbox Game Pass Ultimate, providing access to a library of hundreds of high-quality games to be explored with friends on PC, console, or cloud.

GIGABYTE Technology, a leading global brand in the computer industry, debuts AORUS and GIGABYTE Gaming AI gaming laptops at the 2024 Consumer Electronics Show (CES) in the United States, marking its entry into the new battleground of AI PCs. Today, the company launches the latest AI gaming laptops: G6X, G6, and G5, featuring up to the 13th gen. Intel Core HX series processors and NVIDIA RTX 40 Laptop GPUs. All three models the highest configuration come equipped with a Intel Core i7 processor and NVIDIA RTX 4060 Laptop GPU, delivering robust AI generative content computing power.

The G6X, featuring the Intel Core i7-13650HX processor and NVIDIA GeForce RTX 4060 Laptop GPU, excels at running diverse gaming titles and professional applications for creative content creation. It offers a quicker computing experience for AI generative content creation, enabling real-time and seamless realization of creative content. The laptops integrate with Microsoft's AI assistant, Copilot, assisting users in easier task creation and completion, thereby reducing daily workload and unlocking limitless productivity. In terms of audio, the entire series incorporates Dolby Atmos technology, delivering an unprecedented sense of depth, clarity, and detailed soundscapes. This not only enables gamers to accurately locate sounds and make precise strikes but also provides an unparalleled immersive experience.

ASUS Republic of Gamers (ROG) today announced the 2024 Strix family of laptops, including the Strix SCAR 18, the first 18-inch ROG laptop equipped with the mini LED ROG Nebula HDR Display. As the vanguard of gaming laptops, all 2024 Strix machines feature the latest flagship Intel Core i9 processor 14900HX, with the Strix SCAR 16 and SCAR 18 sporting up to an NVIDIA GeForce RTX 4090 Laptop GPU with 175 W max TGP. Paired with a complete suite of the latest intelligent cooling improvements, including Tri-Fan technology and Conductonaut Extreme liquid metal on both the CPU and GPU, the 2024 Strix family of laptops has arrived to dominate the competition.

Brilliant detail
This year marks the introduction of the first ROG 18-inch display powered by Mini LED technology. HDR content and games have arrived on the big screen with the arrival of the 2024 Strix SCAR 18, with its Nebula HDR Display boasting over 2000 discrete dimming zones and 1100 nits of peak brightness. On an 18-inch panel, this dimming zone density coupled with the ROG Nebula HDR Engine minimizes blooming and haloing even in challenging scenes, giving the Strix SCAR 18 incredibly vivid HDR performance.

Intel's current generation mobile processor product stack is vast, to say the least. In Q4-2023, the company launched its Core Ultra "Meteor Lake" mobile processors spanning the U-segment (7 W to 28 W), and H-segment (35 W to 45 W). Today, the company capped the upper end of the stack with the 14th Gen Core HX-series mobile processors based on "Raptor Lake Refresh," which dial up core counts to 8P+16E. And now, the company is adding more choice to the U-segment with the Core Processor Series 1, based on a lower core-count variant of the "Raptor Lake Refresh" architecture.

The Core Processor Series 1 follows the same nomenclature as the Core Ultra, where the "Ultra" denotes the latest "Meteor Lake" architecture. Processor model numbering and case badges are similar between Core Processor Series 1 and Core Ultra, except the lack of the "Ultra" brand extension. These chips are built on the monolithic "Raptor Lake Refresh" dies on the Intel 7 foundry node, and lack innovations such as the Low-power Island cores, 3D Performance Hybrid architecture, the all important AI Boost and on-silicon NPU; as well as that 2x faster Arc Xe-LPG integrated graphics, but use existing combinations of "Raptor Cove" and "Gracemont" CPU cores, along with older Xe-LP graphics with up to 96 EU; and a mostly similar I/O.

UGREEN just announced its NASync line of NAS servers at the 2024 International CES, and we went hands on. Our tour begins with the large NASync DXP8800 Pro 8-bay 3.5-inch NAS; and DXP6800 Pro 6-bay 3.5-inch NAS. These are powered by unspecified models of 12th Gen Core i7 and Core i5 processors, respectively, along with 8 GB of single-channel DDR5 memory, a 128 GB SSD for as their internal system disk, and dual 10 GbE networking interfaces. The two also feature their own HDMI display outputs from the UHD 700-series iGPUs, SD card readers, and Thunderbolt 4 ports.

Next up, are the smaller NASync DXP4800 4-bay, and DXP2800 2-bay NAS; which are powered by Intel N-series SoCs that feature only E-cores; 8 GB of DDR5 memory, 32 GB of eMMC based system disks, an SD 3.0 card reader, and 2.5 GbE networking interfaces. The DXP4800 has two 2.5 GbE interfaces, while the DXP2800 has just the one. The star attraction is the NASync DXP480T Plus, an all-flash based NAS. It has pretty much the same underpinnings as the DXP6800, including a 12th Gen Core i5, 8 GB of DDR5 memory, and a 128 GB SSD as system drive; but comes with four M.2-2280 slots, each with PCI-Express 4.0 x4 wiring. You get one 10 GbE networking interface, two Thunderbolt 4, an unspecified Wi-Fi + Bluetooth interface (possibly 6E), and an HDMI output from the iGPU of the Core i5.

AMD today announced the Ryzen 8000G line of desktop APUs. These come in the Socket AM5 package, and are supported by all motherboards based on the AMD X670/E, B650/E, and A620 chipsets, with some requiring UEFI firmware updates. Since USB BIOS Flashback is standard issue on AMD motherboards, this should be no problem. With Ryzen 7000 series "Raphael" desktop processors that debut the "Zen 4" microarchitecture, AMD had standardized integrated graphics, however, the iGPU for these are just enough for desktop/productivity workloads, offering comparable performance to the iGPUs of Intel 13th Gen Core desktop processors. AMD doesn't consider Ryzen 7000 chips as APUs for this reason. An APU has to be a processor with powerful integrated graphics that can offer entry-level gaming, high-res content consumption, or multi-monitor productivity, and "Raphael" isn't it. Enter the Ryzen 8000G series.

The AMD Ryzen 8000G series debuts four APU models, the Ryzen 7 8700G, the Ryzen 5 8600G, the Ryzen 5 8500G, and the Ryzen 3 8300G. The 8700G and 8600G are based on the 4 nm "Hawk Point" silicon, feature Ryzen AI, and are the first desktop processors to feature an NPU (neural processing unit). The 8500G and 8300G are based on the 4 nm "Phoenix 2" silicon. The Ryzen 7 8700G leads the pack, and is a maxed out implementation of "Hawk Point," featuring an 8-core/16-thread CPU based on the "Zen 4" microarchitecture, the full Radeon 780M integrated graphics implementation with 12 RDNA3 compute units; and the Ryzen AI XDNA NPU. The processor has a combined AI throughput of 39 TOPS, with 16 TOPS from the NPU. For reference, an Intel Core Ultra 7 165H "Meteor Lake" mobile processor with its AI Boost NPU, has a combined AI throughput of 34 TOPS.

TrendForce reports that the DRAM contract prices are estimated to increase by approximately 13-18% in 1Q24 with mobile DRAM leading the surge. It appears that due to the unclear demand outlook for the entire year of 2024, manufacturers believe that sustained production cuts are necessary to maintain the supply-demand balance in the memory industry.

PC DRAM: The market is buzzing with unfilled DDR5 orders, while savvy buyers brace for a continued surge in DDR4 prices, keeping procurement engines running. This trend, however, is shadowed by a gradual industry pivot toward DDR5, casting uncertainty over the expansion of DDR4 bit procurement volumes. Despite this, both DDR4 and DDR5 prices have yet to hit the target set by manufacturers, and buyers seem ready to ride the wave of price hikes into 1Q24. This sets the stage for an estimated 10-15% in PC DRAM contract prices, with DDR5 poised to take the lead over DDR4 in this pricing rally.

Acer today announced the extension of its SpatialLabs stereoscopic 3D lineup to the Aspire line of laptops and Predator gaming monitors.

The new Aspire 3D 15 SpatialLabs Edition laptop delivers captivating 3D content for entertainment and creation on its 15.6-inch UHD display; It also comes with a suite of AI-powered SpatialLabs applications for 3D viewing and content creation, without the need for specialized glasses, delighting users when watching their favorite content and empowering developers to see their designs in their real 3D forms. With Microsoft Copilot in Windows 11, users can experience upscaled creativity and productivity with AI-powered task assistance, while Acer's suite of AI-supported solutions in Acer PurifiedView and PurifiedVoice elevate conference calls on the 3D laptop.

Acer announced new additions to its Aspire laptop line, showcasing an extensive range of performance and design options to support everyday computing needs.

The Aspire Vero 16 is the latest from its Vero product line, powered by the new Intel Core Ultra processors with Intel AI Boost and Wi-Fi 7 compatibility. Acer has committed to carbon neutrality for the Aspire Vero 16, following international standards for carbon footprint calculation and carbon neutrality. Actions are taken at each stage of the device lifecycle to minimize its carbon footprint, and then, high-quality carbon credits will be applied to attain carbon neutrality. The Intel Evo Edition laptop has increased the usage of post-consumer recycled (PCR) materials on the chassis, doubling that of the 2021 model, to combine eco-innovation and premium PC experiences on the device.