Samsung Electronics, a world leader in advanced semiconductor technology, unveiled the expansion of its Compute Express Link (CXL) memory module portfolio and showcased its latest HBM3E technology, reinforcing leadership in high-performance and high-capacity solutions for AI applications.

In a keynote address to a packed crowd at Santa Clara's Computer History Museum, Jin-Hyeok Choi, Corporate Executive Vice President, Device Solutions Research America - Memory at Samsung Electronics, along with SangJoon Hwang, Corporate Executive Vice President, Head of DRAM Product and Technology at Samsung Electronics, took the stage to introduce new memory solutions and discuss how Samsung is leading HBM and CXL innovations in the AI era. Joining Samsung on stage was Paul Turner, Vice President, Product Team, VCF Division at VMware by Broadcom and Gunnar Hellekson, Vice President and General Manager at Red Hat to discuss how their software solutions combined with Samsung's hardware technology is pushing the boundaries of memory innovation.

KIOXIA America, Inc. today announced that its CM7 Series and CD8P Series NVM Express (NVMe) SSDs have passed certification testing for PCI Express (PCIe) 5.0 specification and NVMe 2.0 specification compliance. Developed by PCI-SIG, the PCIe 5.0 interface specification is an upgrade that enables twice the data transfer speed and bandwidth versus the PCIe 4.0 specification - up to 14,000 Megabyte/s read throughput for a x4 lane SSD. PCIe 5.0 tests were conducted at PCI-SIG compliance workshops against PCI-SIG maintained systems, along with other leading manufacturers of PCIe products.

KIOXIA CM7 Series and CD8P Series drives can now be found on the PCI-SIG Integrator's List. Achieving compliance certification during these workshops assures users that KIOXIA drives meet the rigorous PCIe 5.0 specification requirements. KIOXIA CM7 Series and CD8P Series drives have been added to The University of New Hampshire InterOperability Laboratory's (UNH-IOL) official Integrator's List. In order to be considered for inclusion on the list, technologies must undergo conformance testing performed by the UNH-IOL through laboratory tests or during an NVMe plugfest. Successful completion of this testing provides a level of assurance that the product being tested will function properly in NVMe enabled systems and NVM Express over Fabrics (NVMe-oF) environments.

Supermicro, Inc., a Total IT Solution Provider for Cloud, AI/ML, Storage, and 5G/Edge, is delivering a high-throughput, low latency E3.S storage solutions supporting the industry's first PCIe Gen 5 drives and CXL modules to meet the demands of large AI Training and HPC clusters, where massive amounts of unstructured data must be delivered to the GPUs and CPUs to achieve faster results.

Supermicro's Petascale systems are a new class of storage servers supporting the latest industry standard E3.S (7.5 mm) Gen 5 NVMe drives from leading storage vendors for up to 256 TB of high throughput, low latency storage in 1U or up to a half petabyte in 2U. Inside, Supermicro's innovative symmetrical architecture reduced latency by ensuring the shortest signal paths for data and maximized airflow over critical components, allowing them to run at optimal speeds. With these new systems, a standard rack can now hold over 20 Petabytes of capacity for high throughput NVMe-oF (NVMe over Fabrics) configurations, ensuring that GPUs remain saturated with data. Systems are available with either the 4th Gen Intel Xeon Scalable processors or 4th Gen AMD EPYC processors.

KIOXIA America, Inc. today announced the addition of the KIOXIA CD8P Series to its lineup of data center-class solid state drives (SSDs). KIOXIA CD8P drives are well-suited to general purpose server and cloud environments that can take advantage of PCIe 5.0 (32 gigatransfers/s x4) performance. These data center applications can generate complex mixed workloads spread across large scale virtualized systems. The new drives are available in capacities up to 30.72 terabytes (TB) and in both Enterprise and Data Center Standard Form Factor (EDSFF) E3.S and 2.5-inch (U.2) form factors.

Optimized for the performance, latency, reduced power and thermal requirements of data center environments where power and cooling efficiency is critical, the KIOXIA CD8P Series provides the predictability and consistency needed for a seamless user experience. According to Jeff Janukowicz, Research Vice President, IDC, "Growth in NVMe SSDs continues with PCIe capacity shipments in servers and storage systems expected to grow at a 40% CAGR between 2022 and 2027. The new CD8P Series SSDs gives these customers the range of performance, capacity, and security choices essential for meeting the storage requirements of next-generation digital enterprise and data center infrastructure."

Inventec, a global leader in high-powered servers headquartered in Taiwan, is launching its cutting-edge C805G6 server for data centers based on AMD's newest 4th Gen EPYC platform—a major innovation in computing power that provides double the operating efficiency of previous platforms. These innovations are timely, as the industry worldwide faces converse challenges—on one hand, a growing need to reduce carbon footprints and power consumption, while, on the other hand, the push for ever higher computing power and performance for AI. In fact, in 2022 MIT found that improving a machine learning model tenfold will require a 10,000-fold increase in computational requirements.

Addressing both pain points, George Lin, VP of Business Unit VI, Inventec Enterprise Business Group (Inventec EBG) notes that, "Our latest C805G6 data center solution represents an innovation both for the present and the future, setting the standard for performance, energy efficiency, and security while delivering top-notch hardware for powering AI workloads."

Supermicro, Inc., a Total IT Solution Provider for Cloud, AI/ML, Storage, and 5G/Edge, is announcing that its entire line of H13 AMD based-systems is now available with support for 4th Gen AMD EPYC processors, based on "Zen 4c" architecture, and 4th Gen AMD EPYC processors with AMD 3D V-Cache technology. Supermicro servers powered by 4th Gen AMD EPYC processors for cloud-native computing, with leading thread density and 128 cores per socket, deliver impressive rack density and scalable performance with energy efficiency to deploy cloud native workloads in more consolidated infrastructure. These systems are targeted for cloud operators to meet the ever-growing demands of user sessions and deliver AI-enabled new services. Servers featuring AMD 3D V-Cache technology excel in running technical applications in FEA, CFD, and EDA. The large Level 3 cache enables these types of applications to run faster than ever before. Over 50 world record benchmarks have been set with AMD EPYC processors over the past few years.

"Supermicro continues to push the boundary of our product lines to meet customers' requirements. We design and deliver resource-saving, application-optimized servers with rack scale integration for rapid deployments," said Charles Liang, president, and CEO of Supermicro. "With our growing broad portfolio of systems fully optimized for the latest 4th Gen AMD EPYC processors, cloud operators can now achieve extreme density and efficiency for numerous users and cloud-native services even in space-constrained data centers. In addition, our enhanced high performance, multi-socket, multi-node systems address a wide range of technical computing workloads and dramatically reduce time-to-market for manufacturing companies to design, develop, and validate new products leveraging the accelerated performance of memory intensive applications."

Solidigm, a leading global provider of innovative NAND flash memory solutions, is expanding its D5 Product Series with the Solidigm D5-P5430, a new QLC solid-state storage drive (SSD) optimized for mainstream and read-intensive workloads. With most of today's enterprise applications read-dominant, the D5-P5430—a 4th gen PCIe QLC SSD—offers substantial storage density and Total Cost of Ownership (TCO) opportunities while delivering read performance that is equivalent to the most widely-adopted TLC SSDs.

The D5-P5430 is optimized for mainstream workloads (e.g., email/unified communications, decision support systems, object storage, and virtual desktop infrastructure) and read-intensive workloads (e.g., content delivery networks, data lakes/pipelines, video-on-demand). These workloads are typically 80% reads or higher and need to move massive amounts of data at high throughput.

KIOXIA America, Inc. today announced that its lineup of CD7 Series Enterprise and Datacenter Standard Form Factor (EDSFF) E3.S NVMe SSDs are first to ship on servers and storage from Hewlett Packard Enterprise (HPE). The industry's first EDSFF drives designed with PCIe 5.0 technology, KIOXIA CD7 E3.S SSDs increase flash storage density per drive for optimized power efficiency and rack consolidation. HPE ProLiant Gen11 servers, HPE Alletra 4000 data storage servers and the HPE Synergy 480 Gen11 Compute Module are enabled with the latest PCIe 5.0 interface, enabling up to twice the performance over PCIe 4.0, and come with optionally equipped EDSFF E3.S drive bays.

As a natural evolution of the 2.5-inch form factor, EDSFF E3.S is designed for the needs of high performance flash storage. E3.S enables more dense, efficient deployments in the same rack unit compared to 2.5-inch drives, while improving cooling and thermal characteristics and raising capacities by up to 1.5 - 2x.

Supermicro, Inc., a Total IT Solution Provider for Cloud, AI/ML, Storage, and 5G/Edge, is announcing the latest addition to its revolutionary ultra-high performance, high-density petascale class all-flash NVMe server family. Supermicro systems in this high-performance storage product family will support the next-generation EDSFF form factor, including the E3.S and E1.S devices, in form factors that accommodate 16- and 32 high-performance PCIe Gen 5 NVMe drive bays.

The initial offering of the updated product line will support up to one-half of a petabyte of storage space in a 1U 16 bay rackmount system, followed by a full petabyte of storage space in a 2U 32 bay rackmount system for both Intel and AMD PCIe Gen 5 platforms. All of the Supermicro systems that support either the E1.S or E3.s form factors enable customers to realize the benefits in various application-optimized servers.

AIC today announced its EB202-CP is ready to support newly launched 4th Gen AMD EPYC Embedded 9004 processors. By leveraging the five-year product longevity supported by AMD EPYC Embedded processors, EB202-CP provides customers with stable and long-term support. AIC and AMD will join forces to showcase EB202-CP at Embedded World in AMD stand No. 2-411 from 14th to 16th March, 2023 in Nuremberg, Germany.

AIC EB202-CP, a 2U rackmount server designed for AI and edge appliances, is powered by the newly released 4th Gen AMD EPYC Embedded processors. Featuring the world's highest-performing x86 processor and PCIe 5.0 ready, the 4th Gen AMD EPYC Embedded processors enable low TCO and delivers leadership energy efficiency as well as state-of-the-art security, optimized for workloads across enterprise and edge. EB202-CP, with 22 inch in depth, supports eight front-serviceable and hot-swappable E1.S/ E3.S and four U.2 SSDs. By leveraging the features of the 4th Gen AMD Embedded EPYC processors, EB202-CP is well suited for broadcasting, edge and AI applications, which require greater processing performance and within the most efficient, space-saving format.

Supermicro, Inc., a Total IT Solution Provider for Cloud, AI/ML, Storage, and 5G/Edge, is announcing the latest addition to its revolutionary ultra-high performance, high-density petascale class all-flash NVMe server family. Supermicro systems in this high performance storage product family will support the next-generation EDSFF form factor, including the E3.S and E1.S devices, in form factors that accommodate 16- and 32 high-performance PCIe Gen 5 NVMe drive bays.

The initial offering of the updated product line will support up to one-half of a petabyte storage space in a 1U 16 bay rackmount system, followed by a fully petabyte storage space in 2U 32 bay rackmount system for both Intel and AMD PCIe Gen 5 platforms.