Today, AMD announced the extension of its 3rd Gen AMD EPYC processor family with six new offerings providing a robust suite of data center CPUs to meet the needs of general IT and mainstream computing for businesses seeking to leverage the economics of established platforms. The complete family of 3rd Gen AMD EPYC CPUs complements the leadership performance and efficiency of the latest 4th Gen AMD EPYC processors with impressive price-performance, modern security features and energy efficiency for less technically demanding business critical workloads.

The race to deliver AI and high performance computing is creating a technology gap for IT decision-makers seeking mainstream performance. To meet the growing demand for widely deployed, cost effective and proven mainstream solutions in the mid-market and in the channel, AMD is extending the 3rd Gen EPYC CPU offering to provide excellent value, performance, energy efficiency and security features for business-critical applications. The 3rd Gen AMD EPYC CPU portfolio enables a wide array of broadly deployed enterprise server solutions, supported by trusted channel sellers and OEMs such as Cisco, Dell Technologies, Gigabyte, HPE, Lenovo and Supermicro.

GIGABYTE Technology, Giga Computing, a subsidiary of GIGABYTE and an industry leader in high-performance servers, server motherboards, and workstations, today announced direct liquid cooling (DLC) multi-node servers for NVIDIA Grace CPU & NVIDIA Grace Hopper Superchip. In addition, a DLC ready Intel-based server for the NVIDIA HGX H100 8-GPU platform and a high-density server for AMD EPYC 9004 processors. For the ultimate in efficiency, is also a new 12U single-phase immersion tank. All these mentioned products will be at GIGABYTE booth #355 at SC23.

Just announced high-density CPU servers include Intel Xeon-based H263-S63-LAN1 and AMD EPYC-based H273-Z80-LAN1. These 2U 4 node servers employ DLC for all eight CPUs, and although it is dense computing CPU performance achieves its full potential. In August, GIGABYTE announced new servers for NVIDIA HGX H100 GPU, and now adds the DLC version to the G593 series, G593-SD0-LAX1, for NVIDIA HGX H100 8-GPU.

AMD (NASDAQ:AMD) today announced revenue for the third quarter of 2023 of $5.8 billion, gross margin of 47%, operating income of $224 million, net income of $299 million and diluted earnings per share of $0.18. On a non-GAAP basis, gross margin was 51%, operating income was $1.3 billion, net income was $1.1 billion and diluted earnings per share was $0.70.

"We delivered strong revenue and earnings growth driven by demand for our Ryzen 7000 series PC processors and record server processor sales," said AMD Chair and CEO Dr. Lisa Su. "Our data center business is on a significant growth trajectory based on the strength of our EPYC CPU portfolio and the ramp of Instinct MI300 accelerator shipments to support multiple deployments with hyperscale, enterprise and AI customers."

Velocity Micro, the premier builder of award-winning enthusiast desktops, laptops, high performance computing solutions, and professional workstations announces the immediate availability of the ProMagix G480a and G480i - two GPU servers optimized for High Performance Computing and Artificial Intelligence. Powered by either dual AMD Epyc 4th Gen or dual 4th Gen Intel Scalable Xeon processors, these 4U form factor servers support up to eight dual slot PCIe Gen 5 GPUs to create incredible compute power designed specifically for the highest demand workflows including simulation, rendering, analytics, deep learning, AI, and more. Shipments begin immediately.

"By putting emphasis on scalability, functionality, and performance, we've created a line of server solutions that tie in the legacy of our high-end brand while also offering businesses alternative options for more specialized solutions for the highest demand workflows," said Randy Copeland, President and CEO of Velocity Micro. "We're excited to introduce a whole new market to what we can do."

AMD today announced the signing of a definitive agreement to acquire Nod.ai to expand the company's open AI software capabilities. The addition of Nod.ai will bring an experienced team that has developed an industry-leading software technology that accelerates the deployment of AI solutions optimized for AMD Instinct data center accelerators, Ryzen AI processors, EPYC processors, Versal SoCs and Radeon GPUs to AMD. The agreement strongly aligns with the AMD AI growth strategy centered on an open software ecosystem that lowers the barriers of entry for customers through developer tools, libraries and models.

"The acquisition of Nod.ai is expected to significantly enhance our ability to provide AI customers with open software that allows them to easily deploy highly performant AI models tuned for AMD hardware," said Vamsi Boppana, senior vice president, Artificial Intelligence Group at AMD. "The addition of the talented Nod.ai team accelerates our ability to advance open-source compiler technology and enable portable, high-performance AI solutions across the AMD product portfolio. Nod.ai's technologies are already widely deployed in the cloud, at the edge and across a broad range of end point devices today."

SilverStone introduced the XE360-SP5, an all-in-one liquid CPU cooler for AMD Socket SP5, making it fit for servers and workstations based on the EPYC "Genoa" and "Genoa-X" processors, and its upcoming Ryzen Threadripper HEDT processors, assuming AMD sticks to this socket infrastructure. The cooler features a copper water block that's optimized for the chiplet design of Socket SP5 processors, considering the hottest components (the up to twelve "Zen 4" CCDs) are toward the edges, and the central region has the relatively cooler sIOD. The block does not have an integrated pump, which makes it 1U-capable. It measures 92 mm (W) x 25 mm (H) x 118 mm (D). The block is made of nickel-plated copper, with come of its structural parts being made of aluminium.

A set of 46 cm-long coolant tubes connects the block to the 28 mm-thick 360 mm x 120 mm radiator. This radiator has an integrated pump that turns at speeds of up to 4,000 RPM. A set of three SilverStone 120 mm fans comes included, each of these takes in 4-pin PWM input, turns at speeds ranging between 600 to 2,800 RPM, with a noise level of up to 46 dBA, airflow of up to 87.72 CFM, and 3.09 mm H₂O pressure. The company didn't reveal pricing.

A couple of slides from AMD's internal presentation were leaked to the web by Moore's Law is Dead, referencing what's allegedly the next-generation "Zen 5" microarchitecture. Internally, the performance variant of the "Zen 5" core is referred to as "Nirvana," and the CCD chiplet (CPU core die) based on "Nirvana" cores, is codenamed "Eldora." These CCDs will make up either the company's Ryzen "Granite Ridge" desktop processors, or EPYC "Turin" server processors. The cores themselves could also be part of the company's next-generation mobile processors, as part of heterogenous CCXs (CPU core complex), next to "Zen 5c" low-power cores.

In broad strokes, AMD describes "Zen 5" as introducing a 10% to 15% IPC increase over the current "Zen 4." The core will feature a larger 48 KB L1D cache, compared to the current 32 KB. As for the core itself, it features an 8-wide dispatch from the micro-op queue, compared to the 6-wide dispatch of "Zen 4." The integer execution stage gets 6 ALUs, compared to the current 4. The floating point unit gets FP-512 capabilities. Perhaps the biggest announcement is that AMD has increased the maximum cores per CCX from 8 to 16. At this point we don't know if it means that "Eldora" CCD will have 16 cores, or whether it means that the cloud-specific CCD with 16 "Zen 5c" cores will have 16 cores within a single CCX, rather than spread across two CCXs with smaller L3 caches. AMD is leveraging the TSMC 4 nm EUV node for "Eldora," the mobile processor based on "Zen 5" could be based on the more advanced TSMC 3 nm EUV node.

GIGABYTE Technology, Giga Computing, a subsidiary of GIGABYTE and an industry leader in high-performance servers, server motherboards, and workstations, today announced ahead of exhibiting at the OCP Global Summit new OCP ORv3 based solutions, including ones designed for GPU centric workloads in immersion cooling. The new GIGABYTE products include a 2OU node tray, TO25-BT0, and compute nodes: TO25-S10, TO25-S11, TO25-S12, TO25-Z10, TO25-Z11, and TO25-Z12. For immersion cooling server deployments with ORv3 specifications are the new GPU servers: TO15-S40, TO15-S41, and TO15-Z40.

Our commitment to support Open Compute Project's designs dates back almost a decade starting with our OCP v1.0 products, and now we are releasing some well-designed, in demand ORv3 products. Through discussions with several customers, we decided to move forward with the development of these configurations. These designs check the boxes for specifications that are required," said Vincent Wang, Sales VP at Giga Computing. "We will continue supporting ORv3 specifications and we have more products on the horizon in Q1 2024.

Samsung Electronics today announced a new collaboration with AMD to advance 5G virtualized RAN (vRAN) for network transformation. This collaboration represents Samsung's ongoing commitment to enriching vRAN and Open RAN ecosystems to help operators build and modernize mobile networks with unmatched flexibility and optimized performance. The two companies have completed several rounds of tests at Samsung's lab to verify high-capacity and telco-grade performance using FDD bands and TDD Massive MIMO wide-bands, while significantly reducing power consumption. In this joint collaboration, Samsung used its versatile vRAN software integrated with the new AMD EPYC 8004 processors, focused on telco and intelligent edge. During technical verification, the EPYC 8004 processors combined with Samsung's vRAN solutions delivered optimized cell capacity per server as well as high power efficiency.

"This technical collaboration demonstrates Samsung's commitment to delivering network flexibility and high performance for service providers by building a larger vRAN and Open RAN ecosystem," said Henrik Jansson, Vice President and Head of SI Business Group, Networks Business at Samsung Electronics. "Samsung has been at the forefront of unleashing the full potential of 5G vRAN technology to meet rising demands, and we look forward to collaborating with industry leaders like AMD to provide operators the capabilities to transform their networks."

EK, the industry-leading manufacturer of premium liquid cooling solutions, proudly announces another addition to its Pro line - the EK-Pro CPU WB sTR, an enterprise-grade water block meticulously designed for AMD EPYC and Ryzen Threadripper processors. Engineered with precision and expertise, this liquid cooling solution promises unmatched performance and reliability.

Precision Craftsmanship
EK-Pro CPU WB sTR - Nickel + Acetal water block is custom-designed for AMD processors, making it suitable for desktop PCs, workstations, and taller server racks. With three standard G1/4" threaded ports on the top and an EK G1/4 plug equipped with an O-ring, this water block ensures effortless and secure connections for your liquid cooling system.

ASRock Rack, the leading innovative server company, today announced its latest server motherboard lineup now supports the AMD EPYC 8004 Series processors which extend the 4th Gen EPYC Family into new markets.

The AMD EPYC 8004 Series processors bring the benefits of the "Zen 4c" processor core to markets that seek strong performance but also have significant requirements for efficient, dense form factors, limited available power, and quieter operations. "AMD EPYC 8004 Processors are purpose-built to deliver strong performance and energy efficiency in an optimized, single-socket package," said Lynn Comp, corporate vice president, Server Product and Technology Marketing, AMD. "The combination of impressive performance and streamlined platform componentry of the EPYC 8004 Series CPUs means system builders can offer their customers cost-efficient business-relevant configurations."

GIGABYTE Technology: Giga Computing, a subsidiary of GIGABYTE and an industry leader in high-performance servers, server motherboards, and workstations, today announced new GIGABYTE enterprise series solutions for the AMD EPYC 8004 Series processors. Giga Computing is committed to reaching all sizes of data centers to deliver the best compelling solution, and now is doing so with new AMD EPYC 8004 CPUs that target edge applications, CSPs, and value enterprises. For these uses, the new R243 and R143 server series are poised alongside ME33 and ME03 motherboard series to deliver cost-optimized performance.

Leveraging the "Zen 4c" core architecture, the AMD EPYC 8004 Series CPUs deliver performance and power efficiency with built-in security capabilities in an optimized single-socket platform. Additionally, the new SP6 socket was designed to enable the power, cost, and form factor requirements for the AMD EPYC 8004 Series CPUs' target markets as well as diverse applications such as intelligent edge computing and telco.

TYAN, an industry-leading server platform design manufacturer and a subsidiary of MiTAC Computing Technology Corporation, today announced availability of new single-socket server platforms supporting AMD EPYC 8004 Series processors. These platforms are purpose built for cloud services and intelligent edge deployments while offering lower operating costs and delivering impressive energy efficiency.

"The AMD EPYC 8004 Series CPUs deliver a great combination of impressive performance and streamlined platform componentry which enables us to develop business-relevant server configurations for our customers," said Eric Kuo, Vice President of the Server Infrastructure Business Unit at MiTAC Computing Technology. "TYAN's innovative server platform, fueled by EPYC 8004 Series CPUs, empowers us to provide our customers with cost-effective solutions while also expanding into new markets."

Supermicro, Inc., a Total IT Solution Provider for Cloud, AI/ML, Storage, and 5G/Edge, is announcing the AMD based Supermicro H13 generation of WIO Servers, optimized to deliver strong performance and energy efficiency for edge and telco datacenters powered by the new AMD EPYC 8004 Series processors. The new Supermicro H13 WIO and short-depth front I/O systems deliver energy-efficient single socket servers that lower operating costs for enterprise, telco, and edge applications. These systems are designed with a dense form factor and flexible I/O options for storage and networking, making the new servers ideal for deploying in edge networks.

"We are excited to expand our AMD EPYC-based server offerings optimized to deliver excellent TCO and energy efficiency for data center networking and edge computing," said Charles Liang, president and CEO of Supermicro. "Adding to our already industry leading edge-to-cloud rack scale IT solutions, the new Supermicro H13 WIO systems with PCIe 5.0 and DDR5-4800 MHz memory show tremendous performance for edge applications."

Hardware leaker, YuuKi_AnS, has briefly turned their attention away from all things Team Blue—their latest leak points to upcoming server-grade processors chez AMD. A Zen 6 core-based 9006 EPYC CPU series, codenamed "Venice," is expected to arrive within two to three years along with an all-new SP7 socket—this information seems to have been sourced from an unnamed server manufacturer's product roadmap. A partial view of said slide also reveals forthcoming equipment powered by Intel "Falcon Shore" and NVIDIA "Blackwell" GPU technologies.

As reported a couple of months ago, older insider info has AMD using "Weisshorn" as an in-house moniker for Zen 6 "Morpheus" architecture, destined for Venice CPUs—alleged to form part of a 2025/2026 EPYC lineup. YuuKi_AnS proposes that these will utilize either 12-channel or 16-channel DDR5 memory configurations—thus providing plenty of bandwidth across hundreds of Zen cores. Altogether very handy for cloud, enterprise, and HPC workloads—industry experts reckon that 384-core counts are feasible on single packages. Naturally, a Team Red timeline dictates that Zen 5 "Nirvana" is due before Zen 6 "Morpheus," so EPYC 9005 "Turin(-X)" and 8005 "Turin-Dense" lineups are (allegedly) up for a 2024-ish launch window on SP5 (LGA-6096) and SP6 (LGA 4094) socket types.

AMD has published the source code for AMD Secure Encrypted Virtualization (SEV) technology, the backbone of AMD EPYC processor-based confidential computing virtual machines (VMs) available from cloud service providers including Amazon Web Services (AWS), Google Cloud, Microsoft Azure and Oracle Compute Infrastructure (OCI). This release from AMD will drive greater transparency for the security industry and provide customers the opportunity to thoroughly review the technology behind confidential computing VMs powered by AMD EPYC processors.

"As a leader in confidential computing, we are committed to a relentless pursuit of innovation and creating modern security features that complement our ecosystem partners' most advanced cloud offerings," said Mark Papermaster, executive vice president and chief technology officer, AMD. "By sharing the underpinnings of our SEV technology, we are delivering transparency for confidential computing and demonstrating our dedication to open source. Involving the open-source community will further strengthen this critical technology for our partners and customers who expect nothing less than the utmost protection for their most valuable asset - their data."

Today, at VMware Explore 2023 Las Vegas, AMD continued to showcase its proven performance and growing adoption of AMD EPYC CPUs, AMD Pensando data processing units (DPUs) and adaptive computing products as ideal solutions for the most efficient and innovative virtualized environments. For instance, a system powered by a 4th Gen AMD EPYC 9654 CPUs and a Pensando DPU, delivers approximately 3.3x the Redis application performance and 1.75x the aggregate network throughput when compared to a 4th Gen EPYC system with standard NICs. Additionally, servers with 2P 4th Gen EPYC 9654 CPUs alone can enable using up to 35% fewer servers in an environment running 2000 virtual machines (VMs) compared to 2P Intel Xeon 8490H based servers.

"AMD is helping enterprise customers fully realize the benefits of their virtualized data centers with the latest generation EPYC CPUs and Pensando DPUs," said Forrest Norrod, executive vice president and general manager, Data Center Solutions Business Group, AMD. "Consolidation and modernization enable businesses to increase server utilization and efficiency while delivering impressive performance for critical enterprise workloads. Our ongoing collaboration with VMware enables customers to get more efficient and agile to reach their digital transformation goals."

Today, AMD announced Amazon Web Services (AWS) has expanded its 4th Gen AMD EPYC processor-based offerings with the general availability of Amazon Elastic Compute Cloud (EC2) M7a and Amazon EC2 Hpc7a instances, which offer next-generation performance and efficiency for applications that benefit from high performance, high throughput and tightly coupled HPC workloads, respectively.

"For customers with increasingly complex and compute-intensive workloads, 4th Gen EPYC processor-powered Amazon EC2 instances deliver a differentiated offering for customers," said David Brown, vice president of Amazon EC2 at AWS. "Combined with the power of the AWS Nitro System, both M7a and Hpc7a instances allow for fast and low-latency internode communications, advancing what our customers can achieve across our growing family of Amazon EC2 instances."

Today, AMD released the findings from a new survey of global IT leaders which found that 3 in 4 IT leaders are optimistic about the potential benefits of AI—from increased employee efficiency to automated cybersecurity solutions—and more than 2 in 3 are increasing investments in AI technologies. However, while AI presents clear opportunities for organizations to become more productive, efficient, and secure, IT leaders expressed uncertainty on their AI adoption timeliness due to their lack of implementation roadmaps and the overall readiness of their existing hardware and technology stack.

AMD commissioned the survey of 2,500 IT leaders across the United States, United Kingdom, Germany, France, and Japan to understand how AI technologies are re-shaping the workplace, how IT leaders are planning their AI technology and related Client hardware roadmaps, and what their biggest challenges are for adoption. Despite some hesitations around security and a perception that training the workforce would be burdensome, it became clear that organizations that have already implemented AI solutions are seeing a positive impact and organizations that delay risk being left behind. Of the organizations prioritizing AI deployments, 90% report already seeing increased workplace efficiency.

Supermicro, Inc., a Total IT Solution Provider for Cloud, AI/ML, Storage, and 5G/Edge, is delivering a high-throughput, low latency E3.S storage solutions supporting the industry's first PCIe Gen 5 drives and CXL modules to meet the demands of large AI Training and HPC clusters, where massive amounts of unstructured data must be delivered to the GPUs and CPUs to achieve faster results.

Supermicro's Petascale systems are a new class of storage servers supporting the latest industry standard E3.S (7.5 mm) Gen 5 NVMe drives from leading storage vendors for up to 256 TB of high throughput, low latency storage in 1U or up to a half petabyte in 2U. Inside, Supermicro's innovative symmetrical architecture reduced latency by ensuring the shortest signal paths for data and maximized airflow over critical components, allowing them to run at optimal speeds. With these new systems, a standard rack can now hold over 20 Petabytes of capacity for high throughput NVMe-oF (NVMe over Fabrics) configurations, ensuring that GPUs remain saturated with data. Systems are available with either the 4th Gen Intel Xeon Scalable processors or 4th Gen AMD EPYC processors.

AMD today announced revenue for the second quarter of 2023 of $5.4 billion, gross margin of 46%, operating loss of $20 million, net income of $27 million and diluted earnings per share of $0.02. On a non-GAAP basis, gross margin was 50%, operating income was $1.1 billion, net income was $948 million and diluted earnings per share was $0.58.

"We delivered strong results in the second quarter as 4th Gen EPYC and Ryzen 7000 processors ramped significantly," said AMD Chair and CEO Dr. Lisa Su. "Our AI engagements increased by more than seven times in the quarter as multiple customers initiated or expanded programs supporting future deployments of Instinct accelerators at scale. We made strong progress meeting key hardware and software milestones to address the growing customer pull for our data center AI solutions and are on-track to launch and ramp production of MI300 accelerators in the fourth quarter."

Inventec, a global leader in high-powered servers headquartered in Taiwan, is launching its cutting-edge C805G6 server for data centers based on AMD's newest 4th Gen EPYC platform—a major innovation in computing power that provides double the operating efficiency of previous platforms. These innovations are timely, as the industry worldwide faces converse challenges—on one hand, a growing need to reduce carbon footprints and power consumption, while, on the other hand, the push for ever higher computing power and performance for AI. In fact, in 2022 MIT found that improving a machine learning model tenfold will require a 10,000-fold increase in computational requirements.

Addressing both pain points, George Lin, VP of Business Unit VI, Inventec Enterprise Business Group (Inventec EBG) notes that, "Our latest C805G6 data center solution represents an innovation both for the present and the future, setting the standard for performance, energy efficiency, and security while delivering top-notch hardware for powering AI workloads."

The escalating challenges in acquiring high-performance x86 servers have prompted Chinese data center companies to accelerate the shift to Arm-based system-on-chips (SoCs). Investment banking firm Bernstein reports that approximately 40% of all Arm-powered servers globally are currently being used in China. While most servers operate on x86 processors from AMD and Intel, there's a growing preference for Arm-based SoCs, especially in the Chinese market. Several global tech giants, including AWS, Ampere, Google, Fujitsu, Microsoft, and Nvidia, have already adopted or developed Arm-powered SoCs. However, Arm-based SoCs are increasingly favorable for Chinese firms, given the difficulty in consistently sourcing Intel's Xeon or AMD's EPYC. Chinese companies like Alibaba, Huawei, and Phytium are pioneering the development of these Arm-based SoCs for client and data center processors.

However, the US government's restrictions present some challenges. Both Huawei and Phytium, blacklisted by the US, cannot access TSMC's cutting-edge process technologies, limiting their ability to produce competitive processors. Although Alibaba's T-Head can leverage TSMC's latest innovations, it can't license Arm's high-performance computing Neoverse V-series CPU cores due to various export control rules. Despite these challenges, many chip designers are considering alternatives such as RISC-V, an unrestricted, rapidly evolving open-source instruction set architecture (ISA) suitable for designing highly customized general-purpose cores for specific workloads. Still, with the backing of influential firms like AWS, Google, Nvidia, Microsoft, Qualcomm, and Samsung, the Armv8 and Armv9 instruction set architectures continue to hold an edge over RISC-V. These companies' support ensures that the software ecosystem remains compatible with their CPUs, which will likely continue to drive the adoption of Arm in the data center space.

The GPU at the heart of the China-exclusive AMD Radeon RX 7900 GRE (Golden Rabbit Edition) sparked much curiosity. It is a physically different GPU from the one found in desktop Radeon RX 7900 XT and RX 7900 XTX graphics cards. AMD wouldn't go through all that effort designing a whole different GPU just for a limited edition graphics card, which means this silicon could find greater use for the company—for example, this could be the package AMD uses for its upcoming mobile RX 7900 series. AMD wouldn't go through all the effort designing a first-party MBA (made by AMD) PCB for the silicon just for the RX 7900 GRE, and so this PCB, with this particular version of the "Navi 31" silicon, could see a wider global launch, probably as the rumored Radeon RX 7800 XT, or something else (although with a different set of specs from the RX 7900 GRE).

We compared the sizes of the new "Navi 31" package found in the RX 7900 GRE, with those of the regular "Navi 31" powering the RX 7900 XT/XTX, the previous-generation "Navi 21" powering the RX 6900 XT, and the NVIDIA AD103 silicon powering the desktop GeForce RTX 4080. There are some interesting findings. The new smaller "Navi 31" package is visibly smaller than the one powering the RX 7900 XT/XTX. It is a square package, compared to the larger rectangular one, and has a significantly thinner metal reinforcement brace. What's interesting is that the 5 nm GCD is still surrounded by six 6 nm MCDs. We don't know if they've disabled two of the six MCDs, or whether they're dummies. AMD uses dummy chiplets as structural reinforcement in some of its EPYC server processors. The dummies spread some of the mounting pressure applied by the IHS or cooling solution, so the logic behind surrounding the GCD with six of these MCDs could be the same.

A new vulnerability has been discovered in AMD Zen 2 based CPUs by Tavis Ormandy, a Google Information Security researcher. Ormandy has named the new vulnerability Zenbleed—also known as CVE-2023-20593—and it's said to affect all Zen 2 based AMD processors, which means Ryzen 3000, 4000 and 5000-series CPUs and APUs, as well as EPYC server chips. The reason why Zenbleed is of concern is because it doesn't require a potential attacker to have physical access to the computer or server in question and it's said to be possible to trigger the vulnerability via executing a javascript on a webpage. This means that the attack vector ends up being massive, at least when we're talking about something like a webhosting company.

Zenbleed is said to allow a potential attacker to gain access to things like encryption keys and user logins via triggering something called "the XMM Register Merge Optimization2, followed by a register rename and a mispredicted vzeroupper." Apparently this requires some precision for the vulnerability to work, but due to these registers being used system wide, even a sandboxed attacker can gain access to them. AMD has already issued a patch for its EPYC server CPUs, which obviously are the most vulnerable systems in question and the company is planning to release patches for all of its Zen 2 based CPUs before the end of the year. Hit up the source links for more details about Zenbleed.