AEWIN provides a series of performant Network Appliances and Edge Server powered by single AMD Zen 4c EPYC 8004 processor codenamed Siena. The latest AMD Siena CPU is produced with 5 nm manufacturing technology to have up to 64 cores (extreme density of 2CCX/CCD) and 225 W TDP with lower energy consumption compared to EPYC SP5. Siena SP6 CPU has the best performance per watt and is with the support of rich I/O and CXL 1.1.

SCB-1945 (1U) and SCB-1947A (2U) are two performant Network Appliances supporting 12x DDR5 sockets and 4x/8x PCIe Gen 5 slots for AEWIN self-design NICs with 1G to 100G copper/fiber interfaces (with/without bypass function) or other accelerators and NVMe SSDs. Both models provide the flexibility to change 2x front panel PCIe slots to 1x PCIe x16 slot for installing off-the-shelf add-on card for additional functions required. It can support 400G NIC card installed such as NVIDIA Mellanox PCIe 5.0 NIC.

Silicon Motion Technology Corporation ("Silicon Motion"), a global leader in designing and marketing NAND flash controllers for solid state storage devices, today introduced its UFS (Universal Flash Storage) 4.0 controller, the SM2756, as the flagship of the industry's broadest merchant portfolio of UFS controller solutions for the growing requirements of AI-powered smartphones as well as other high-performance applications including automotive and edge computing. The company also added a new, second generation SM2753 UFS 3.1 controller to broaden its portfolio of controllers now supporting UFS 4.0 to UFS 2.2 standards. Silicon Motion's UFS portfolio delivers high-performance and low power embedded storage for flagship to mainstream and value mobile and computing devices, supporting the broadest range of NAND flash, including next-generation high speed 3D TLC and QLC NAND.

The new SM2756 UFS 4.0 controller solution is the world's most advanced controller, built on leading 6 nm EUV technology and using MIPI M-PHY low-power architecture, providing the right balance of high performance and power efficiency to enable the all day computing needs of today's premium and AI mobile devices. The SM2756 achieves sequential read performance exceeding 4,300 MB/s and sequential write speeds of over 4,000 MB/s and supports the broadest range of 3D TLC and QLC NAND flash with densities of up to 2 TB.

Seizing the Edge: Cervoz Adapts to Shifting Data Landscape—The rapid emergence of technologies like AIoT and 5G and their demand for high-speed data processing has accelerated the data transition from the cloud to the edge. This shift exposes data to unpredictable environments with extreme temperature variations, vibrations, and space constraints, making it critical for edge devices to thrive in these settings. Cervoz strategically targets the blooming edge computing sector by introducing an extensive array of compact product lines, enhancing its existing SSDs, DRAM, and Modular Expansion Cards to meet the unique needs of edge computing.

Cervoz Reveals NVMe M.2 SSDs and Connectivity Solutions to Power the Edge
Cervoz introduces its latest compact PCIe Gen. 3x2 SSD offerings, the T421 M.2 2242 (B+M key) and T425 M.2 2230 (A+E key). These space-efficient design and low power consumption feature offer exceptional performance, catering to the storage needs of fanless embedded PCs and motherboards for purpose-built edge applications. Cervoz is also leading the way in developing connectivity solutions, including Ethernet, Wi-Fi, Serial, USB, and CAN Bus all available in M.2 2230 (A+E key) and M.2 2242/2260/2280 (B+M) form factors. The M.2 (B+M key) 2242/2260/2280 card is a versatile three-in-one solution designed for maximum adaptability. While it initially comes in a 2280 form factor, it can be easily adjusted to fit 2260 or 2242 sizes. It offers an effortless upgrade of existing systems without sacrificing connection capability, especially in edge devices.

The World AI Cannes Festival (WAICF) is set to be the epicenter of artificial intelligence innovation, where the globe's top 200 decision-makers and AI innovators will converge for three days of intense discussions on groundbreaking AI strategies and use-cases. Against the backdrop of this premier event, GIGABYTE has strategically chosen to participate, unveiling its exponential growth in the AI and High-Performance Computing (HPC) market segments.

The AI industry has witnessed unprecedented growth, with Cloud Service Providers (CSP's) and data center operators spearheading supercomputing projects. GIGABYTE's decision to promote its GPU server portfolio with over 70+ models, at WAICF is a testament to the increasing demands from the French market for sovereign AI Cloud solutions. The spotlight will be on GIGABYTE's success stories on enabling GPU Cloud infrastructure, seamlessly powered by NVIDIA GPU technologies, as GIGABYTE aims to engage in meaningful conversations with end-users and firms dependent on GPU computing.

EdgeCortix, the Japan-based fabless semiconductor company focused on energy-efficient AI processing, predicts that 2024 is set to be a watershed moment for Edge AI. Through its predictions for the year, EdgeCortix believes that Edge AI landscape will be transformed during this exciting year for the industry. Next-gen AI chips, hybrid edge-cloud architectures, software supremacy and the rise of new generative-AI applications "at the edge," will revolutionize the world of business as we know it.

1. Next-Gen efficient Edge AI Chips will break barriers:
Prepare for a hardware uprising! EdgeCortix foresees next-gen energy-efficient AI chips that not only break the barriers of processing power but redefine them. These chips are not just powerful; they are customized for multi-modal generative AI and efficient language models, enabling cutting-edge AI capabilities at low power for a whole new spectrum of applications.

MemryX Inc. is announcing the availability of production level silicon of its cutting-edge AI Accelerator (MX3). MemryX is a pioneering startup specializing in accelerating artificial intelligence (AI) processing for edge devices. In less than 30 days after receiving production silicon from TSMC, MemryX will publicly showcase the ability to efficiently run hundreds of unaltered AI models at the 2024 Consumer Electronics Show (CES) in Las Vegas from Jan 9 through Jan 12.

ADLINK Technology Inc., a global leader in edge computing, a global supplier of industrial PCs and motherboards, and a Titanium member of the Intel Partner Alliance, announces the launch of the new IMB-M47 industrial ATX motherboard for 12th and 13th Gen Intel Core i9/i7/i5/i3 processors. The IMB-M47 ATX motherboard delivers high-performance computing power, with multiple I/O and expansion ports, including three simultaneous independent displays, USB 3.2 Gen 2x2 (20 Gb/s), up to 128 GB DDR5 4800 MHz, 3x 2.5 GbE, multi-M.2 Key M, TPM 2.0, and PCIe 5.0 high-performance add-on cards for complex Edge AIoT processing tasks in industrial automation, machine vision, factory automation, and logistics.

The IMB-M47 industrial ATX motherboard supports 12th and 13th Gen Intel Core processors that utilize a high-performance hybrid architecture with up to sixteen E-cores (Efficient-cores) for multi-threaded background task management and multitasking, and up to eight P-cores (Performance-cores) for demanding single-threaded work such as graphics and video rendering. The 13th Gen Intel Core processors speed up edge applications that benefit from faster memory performance with faster DDR5 memory.

Cisco today unveiled the next milestone of its ongoing work with NVIDIA to deliver AI-powered meetings for hybrid workers. Cisco announced the launch of Room Kit EQX and the expansion of its Cinematic Meetings capabilities—both powered by NVIDIA's AI engine—with the goal of enhancing collaboration experiences with audio and video intelligence and enabling more equitable hybrid meetings.

"In order for people to want to come to the office, companies must fundamentally reimagine and reconfigure workspaces to provide seamless and immersive collaboration experience," said Jeetu Patel, Executive Vice President and General Manager, Cisco Security and Collaboration. "Our collaboration with NVIDIA helps make this possible as we expand our portfolio of AI-powered solutions that unlock the potential of hybrid workers."

Advantech has skillfully incorporated 13th Gen Intel Core processors across a wide array of products, setting new benchmarks for performance and capability. These enhanced solutions harness cutting-edge CPU architectures in their latest designs, delivering a noticeable performance boost over the previous processor generation. This upgrade significantly enhances application efficiency in smart factories, computer vision, intelligent retail, healthcare, and edge AI applications. At Advantech, we are unwavering in our commitment to providing long-term support, ensuring that customers can rely on our products for uninterrupted operation.

Advantech's new solutions offer Intel processors with up to 24 cores and 32 threads, up to 128 GB of DDR5 memory, and a PCIe 4.0/5.0 x16 slot for efficient multitasking. Experience optimized productivity with Advantech's Embedded Design-In Services and quality solutions featuring industrial-grade components. Advantech's embedded OS and value-added software options include Windows, Ubuntu, and Yocto BSP, along with the Edge AI Suite for AI performance evaluation and DeviceOn for device management.

Intel has informed ecosystem partners about the cessation of direct investment in its Next Unit of Compute (NUC) business—ServeTheHome was the first outlet to report on this development earlier today, following industry rumors cropping up on Monday. Intel has been pulling back on non-core business operations—back in April its server building operation was sold to MiTAC. Today's announcement signals Team Blue's exit from the PC building industry—their (internally manufactured) NUC products included SFF computers, kits, laptop reference systems and boards.

Intel sent an official statement to HardwareLuxx (translated from German): "We have decided to stop direct investment in the Next Unit of Compute (NUC) Business and pivot our strategy to enable our ecosystem partners to continue NUC innovation and growth. This decision will not impact the remainder of Intel's Client Computing Group (CCG) or Network and Edge Computing (NEX) businesses. Furthermore, we are working with our partners and customers to ensure a smooth transition and fulfillment of all our current commitments."

Intel's marketing machine is not always all-encompassing with new product launches—case in point the recent whisper quiet appearance of a trio of "Arizona Beach" Atom SKUs on the market. It took a ServeTheHome reader to inform the publication about edge-based solutions becoming available to clients—mosty notably Silicom's Valencia Network Appliance. Ark site information from 2022 suggested that Team Blue launched its Arizona Beach series last summer, but zero marketing (at their end) has resulted in publications only taking notice a year later. Silicom started advertising its Valencia network models just before Christmas.

The Intel Atom C1100 (dual-core), C1110 (quad-core), and C1130 (octa-core) have been compared to the Alder Lake-N series—at first glance somebody could assume that the new platform is related to older E-core solutions. The site is already familiar with the previous generation since a staffer recently reviewed a Fanless Intel N100 Firewall. The top-end C1130 has a TDP rating of 32 W which comes as mild surprise—this is an Intel 7 part with a 2.5 GHz base and turbo frequency clock, alongside 6 MB L3 cache and 4 MB L2 cache. ServeTheHome compiled their own spec infographic of the Atom SKUs side-by-side, and soon discovered key selling points: support for dual-channel LPDDR5 memory and PCIe Gen 4 in "either 1x x16 + 1x x4 or 2x x8 + 1x x4 configurations." They conclude that the new Atom series has the potential to become an excellent platform for low-power edge devices, the author also hopes that a Mini-ITX option will turn up eventually.

Hackboard today announced the launch of Hackboard 2, an affordable single-board computer (SBC) about the size of a smartphone but with the power of a desktop computer and one of the lowest-priced Intel-powered and Windows-based single-board computers ever made. It's ideal for Makers and Hobbyists, IoT, Edge Computing, and Embedded Solutions with customizable Hackboards, contact Support@Hackboard.com for more info. Soon, Hackboard will ship Personal Computer Kits, ideal for work-from-home users, remote learners and the classroom.

The Hackboard 2 allows users to create their ideal computing environment at an affordable price, while taking advantage of the benefits of industry standard technology. With optional 4G or 5G modules, users can connect to the internet from almost anywhere. Users can plug the system into nearly any monitor with an HDMI input, including their TV.

Aetina teams up with CVEDIA to launch advanced AI-powered video analytics solutions for enhanced public safety, smarter cities and safer traffic networks. The solutions involve Aetina's embedded computers built with the latest NVIDIA Jetson Orin system-on-modules (SoMs) and CVEDIA's synthetic AI models, enabling low-latency object and human motion detections at the edge. By adopting AI-enabled video analytics, security companies and system integrators can optimize operations and enhance security measures. During ISC West 2023, Aetina and CVEDIA will showcase the solutions to demonstrate how they leverage deep learning to accurately detect, track, and analyze objects and events from videos, enabling businesses to quickly generate insights and improve their decision-making processes.

Aetina's embedded computers that support the NVIDIA Jetson AGX Orin, Orin NX, or Orin Nano SoMs are designed for the creation of different types of vertical AI. The embedded computers provide the computing power for CVEDIA's AI solutions to run real-time inference processes; they are also compatible with any kind of camera to receive high-resolution videos for the analytics tasks.

ADLINK Technology Inc., a global leader in edge computing, a global supplier of industrial PCs and motherboards, and a Titanium member of the Intel Partner Alliance, announces the launch of the new IMB-M47H industrial ATX motherboard for 12th/13th Gen Intel Core i9/i7/i5/i3, Pentium and Celeron processors. The IMB-M47H ATX motherboard delivers scalable, high-performance computing power and supports three simultaneous independent displays, external USB, 2.5GbE, and high-performance add-on cards for complex processing tasks in smart manufacturing, 5G manufacturing, semiconductor, and machine vision applications.

The IMB-M47H industrial ATX motherboard supports Gen 12 Intel processors and importantly the latest Intel Core processors that utilize a high-performance hybrid architecture with up to eight E-cores (Efficient-cores) for multi-threaded background task management and multitasking, and up to eight P-cores (Performance-cores) for demanding single-threaded work such as graphics and video rendering. The 12th/13th Gen Intel Core processors boost single-thread performance by 1.36x and multi-thread performance by 1.35x compared to 10th Gen Intel Core processors delivering more power-efficient general-purpose processing and offering powerful processing for intensive operations.

Think Silicon, the leading provider of ultra-low-power GPU IP for embedded systems, will showcase its latest graphics and AI solutions for edge computing devices in Hall 4, Booth 476 at Embedded World 2023 taking place in Nuremberg, Germany from March 14-16. The solutions demonstrate how Think Silicon is meeting the complex needs of ultra-low-power graphics and AI applications in the wearables, smart home, industrial and automotive markets.

Think Silicon's booth will feature the industry's first RISC-V-based GPU - the NEOX IP Series. NEOX represents a new era of smart GPU architectures with programmable compute shaders, running on a real-time operating system (RTOS) and supported by lightweight graphics and machine learning programming frameworks. NEOX serves as a GPU platform addressing a wide variety of vertical markets, including next-generation ultra-low-power smartwatches, augmented reality (AR) eyewear, surveillance and entertainment video, and smart displays for point-of-sale/point-of-interaction terminals.

Nfina announces the addition of three new server systems to its lineup, customized for hybrid/multi-cloud, hyperconverged HA infrastructure, HPC, backup/disaster recovery, and business storage solutions. Featuring 3rd Gen Intel Xeon Scalable Processors, Nfina-Store, and Nfina-View software, these scalable server systems fill a void in the marketplace, bringing exceptional multi-socket processing performance, easy-to-use management tools, built-in backup, and rapid disaster recovery.

"We know we must build systems for the business IT needs of today while planning for unknown future demands. Flexible infrastructure is key, optimized for hybrid/multi-cloud, backup/disaster recovery, HPC, and growing storage needs," says Warren Nicholson, President, and CEO of Nfina. He continues by saying, "Flexible infrastructure also means offering managed services like IaaS, DRaaS, etc., that provide customers with choices that fit the size of their application and budget - not a one size fits all approach like many of our competitors. Our goal is to serve many different business IT applications, any size, anywhere, at any time."

Supermicro, Inc., a Total IT Solution Provider for Cloud, AI/ML, Storage, and 5G/Edge, at the 2022 Super Computing Conference is unveiling the most extensive portfolio of servers and storage systems in the industry based on the upcoming 4th Gen Intel Xeon Scalable processor, formerly codenamed Sapphire Rapids. Supermicro continues to use its Building Block Solutions approach to deliver state-of-the-art and secure systems for the most demanding AI, Cloud, and 5G Edge requirements. The systems support high-performance CPUs and DDR5 memory with up to 2X the performance and capacities up to 512 GB DIMMs and PCIe 5.0, which doubles I/O bandwidth. Intel Xeon CPU Max Series CPUs (formerly codenamed Sapphire Rapids HBM High Bandwidth Memory (HBM)) is also available on a range of Supermicro X13 systems. In addition, support for high ambient temperature environments at up to 40° C (104° F), with servers designed for air and liquid cooling for optimal efficiency, are rack-scale optimized with open industry standard designs and improved security and manageability.

"Supermicro is once again at the forefront of delivering the broadest portfolio of systems based on the latest technology from Intel," stated Charles Liang, president and CEO of Supermicro. "Our Total IT Solutions strategy enables us to deliver a complete solution to our customers, which includes hardware, software, rack-scale testing, and liquid cooling. Our innovative platform design and architecture bring the best from the 4th Gen Intel Xeon Scalable processors, delivering maximum performance, configurability, and power savings to tackle the growing demand for performance and energy efficiency. The systems are rack-scale optimized with Supermicro's significant growth of rack-scale manufacturing of up to 3X rack capacity."

AAEON continues to innovate and improve with the introduction of their UP Squared 6000 Edge Computing Kit, which offers customers elite, exclusive features in a plug-and-play industrial turnkey solution powered by the Intel Atom x6425RE SoC (formerly Elkhart Lake).

An upgrade from the UP Squared 6000 Edge, the UP Squared 6000 Edge Computing Kit provides a wealth of additional features while only outgrowing its predecessor's form factor by 1 centimeter in height. This centimeter houses an integrated carrier board containing a HAT2-compatible 40-pin PSE header, doubling the expansion options available compared to previous iterations of the UP Board series. This is in addition to an already impressive I/O, which features four Gigabit Ethernet ports, two COM ports, three USB 3.2 ports, along with three M.2 sockets to incorporate AI, SSD, 5G, and Wi-Fi5/6 modules.

Today, rugged embedded computer brand Cincoze added the high-performance and essential DV-1000 rugged embedded computer series to its DIAMOND product line. The DV-1000 is a high-performance embedded computer with a compact chassis and flexible expansion options. It is an excellent fit for high-performance industrial applications with limited installation space, such as smart manufacturing, machine vision, and railway computing. With Cincoze's unwavering focus on smart manufacturing, the new DV series rounds out the Cincoze DIAMOND product line, providing industrial customers more performance, scalability, size, power, and certification options. Cincoze now holds its selection of product series to satisfy every requirement as a key advantage in smart manufacturing.

The DV-1000 has a footprint of only half a sheet of A4 paper, with a chassis measuring 224 × 162 × 64 mm, and is powered by a 9/8th Gen Intel Core i7/i5/i3 CPU (Coffee Lake-R S series) that supports up to 128 GB of DDR4 2666 MHz memory. Storage options include 1x 2.5 SATA HDD/SSD tray, 2x mSATA slots, and 1x M.2 Key M 2280 slot for a high-speed NVMe SSD. It is small in size, but it can meet applications in different fields with high-speed computing and multiple storage options.

UP! Bridge the Gap, a brand belonging to a leading manufacturer of AI Edge hardware solutions, AAEON, has unveiled the UP Squared 6000 Edge Computing Kit - a compact, industrial turnkey solution featuring an innovative software package to ease and simplify the development process for system integrators, independent software vendors (ISVs), and IoT developers.

Based on the latest Intel Atom x6000E series processors (formerly Elkhart Lake), the UP Squared 6000 Edge Computing Kit delivers upgraded single-thread, multi-thread, and graphical performances to accelerate computer vision and deep learning applications and enables the features of the Intel Programmable Services Engine (Intel PSE).

ADATA Industrial, a leading manufacturer of high-performance DRAM modules, NAND Flash products, and mobile accessories today announces the launch of a new generation of industrial-grade DDR5 memory modules that offer a major leap forward in performance. They are geared toward assisting the development of 5G, AI, Edge Computing, High-Performance Computing, Automated Vehicles, and Smart Healthcare, to name a few.

According to Yole Developments, DDR5 memory shipments will exceed DDR4 by 2023 and DDR5 sales will account for 90% of the market by 2026. DDR5 will be the undisputed standard of the future and a key component of 5G, AIoT, and other applications. To meet the future demands of its customers, ADATA has unveiled a slew of DDR5 memory modules, including U-DIMM and SO-DIMM variants. The modules utilize select high-quality ICs straight from the manufacturer and will come with capacities of 8 GB and above. Compared with DDR4, DDR5 has twice the bandwidth and offers higher frequencies of up to 4800 MHz. What's more, they operate on just 1.1 V for improved energy efficiency.

AAEON, an industry leader in embedded solutions, introduces the BOXER-6643-TGU compact industrial system. With rugged construction, the system delivers the performance and innovative technologies of the 11th Generation Intel Core U processors (formerly Tiger Lake) to applications in tough environments, providing wide operating temperature range and 5G support, to power embedded controller and Industrial IoT (IIoT) gateway applications.

The BOXER-6643-TGU is powered by the 11th Generation Intel Core U processors, delivering greater performance over previous generations, with innovative Intel technologies ensuring more accurate, secure data processing. With up to 64 GB of memory, the system allows users to utilize the full extent of the system's processing capabilities, and with the Intel Iris Xe embedded graphics, users can leverage more powerful GPU processing to power AI and Edge Computing industrial applications. With dual HDMI ports, the system can also support 4K high definition video on two monitors, perfect for powering digital signage.

AAEON, an industry leader in AI Edge Computing solutions, announces the PICO-TGU4 compact PICO-ITX board powered by the 11th Generation Intel Core U processors. By leveraging AAEON's expertise and the cutting-edge technologies offered with this latest generation of processors, the PICO-TGU4 delivers performance and flexibility to power the next generation of industrial AI and machine vision applications.

The 11th Generation Intel Core processors (formerly Tiger Lake) are the third generation of Intel's 10 nm microarchitecture, delivering up to 15~20% better performance than the previous generation processors. The PICO-TGU4 offers users the choice of Intel Core U i3/i5/i7 or Intel Celeron processors to power their projects. These processors support a range of technologies to ensure data integrity, accuracy and security, including on-board TPM 2.0 and in-band memory ECC (with select SKUs). Combined with up to 32 GB of on-board LPDDR4x memory, the PICO-TGU4 helps unlock the performance needed to deploy a wide range of embedded and edge computing applications.

AAEON, an industry leader in embedded solutions, announces the GENE-CML5 3.5" subcompact board featuring the 10th Generation Intel Core processors (formerly Comet Lake). The GENE-CML5 brings the latest in computing technology and flexibility, enabling developers to deploy their next generation industrial and AI Edge applications.

The GENE-CML5 brings the LGA1200 socket 10th Generation Intel Core i3/i5/i7 processors, as well as Intel Pentium and Celeron processors to the 3.5" subcompact form factor. Supporting processors up to 4.4 GHz CPU frequency, the GENE-CML5 leverages the socket-type chipset to allow developers and end users to easily maintain, scale, and upgrade the platform to suit their processing requirements. Combined with 64 GB DDR4 memory, the GENE-CML5 delivers fast processing speeds on par with desktop systems. Additionally, the chipset allows the compact board to take advantage of Intel vPro and Intel Active Management Technology (iAMT), enabling remote system monitoring and management.

AAEON, an industry leader in AI Edge hardware solutions, announces the latest entry in their UP Bridge the Gap brand, the UP Squared Pro. The UP Squared Pro offers developers an updated platform based on the popular UP Squared platform, offering greater expandability and I/O features. With support for 5G modules and AI accelerators, the UP Squared Pro takes AI Edge computing to the Pro level.

The UP Squared Pro (UPN-APL) is an updated rebuild based on the popular UP Squared board. Powered by Intel Celeron N3350, Pentium N4200 and Atom E3950 processors (formerly known as Apollo Lake), the UP Squared Pro maintains the same familiar ecosystem allowing developers to easily migrate any projects built on the UP Squared platform. UP Squared Pro also features on-board physical TPM 2.0, to enhance data security. Altogether, the board offers the performance and efficiency to power a range of edge applications, including drones and autonomous robots.