Ever since the Trump administration imposed sanctions against Huawei to stop it from purchasing parts from third-party vendors to bypass the ban announced back in May, some vendors continued to supply the company. So it seems like some Korean manufacturers will be joining the doings of the US government, and apply restrictions to Huawei. According to the reports of South Korean media outlets, Samsung Electronics and SK Hynix will be joining the efforts of the US government and the Trump administration to impose sanctions against Chinese technology giant - Huawei.

It is reported that on September 15th, both Samsung and SK Hynix will stop any shipments to Huawei, where Samsung already stopped efforts for creating any new shipments. SK Hynix is said to continue shipping DRAM and NAND Flash products until September 14th, a day before the new sanctions are applied. Until the 14th, Huawei will receive some additional chips from SK Hynix. And it is exactly SK Hynix who is said to be a big loser here. It is estimated that 41.2% of SK Hynix's H1 2020 revenue came from China, most of which was memory purchased for Huawei phones and tablets. If the company loses Huawei as a customer, it would mean that the revenue numbers will be notably lower.

Phison Electronics , the industry's leader in NAND flash controllers and storage solutions, announces availability of the world's first 15.36 TB QLC customizable Enterprise SSD solution based on Phison's S12DC controller. Phison provides its customers with industry leading SSDs that are customized to their needs by leveraging Phison's firmware, controller, PCBA design, and manufacturing. The S12DC QLC SSD is an ideal storage solution by delivering higher performance, lower power consumption, and greater rack storage density for read intensive storage applications that currently source hard disk drives.

Arm today announced a three-year partnership agreement with the U.S. Defense Advanced Research Projects Agency (DARPA), establishing an access framework to all commercially available Arm technology. With DARPA's Electronics Resurgence Initiative gaining momentum, the new agreement will enable the research community that supports DARPA's programs to quickly and easily take advantage of Arm's leading IP, tools and support, accelerating innovation in a variety of fields.

"The span of DARPA research activity opens up a huge range of opportunities for future technological innovation," said Rene Haas, president, IP Products Group, Arm. "Our expanded DARPA partnership will provide them with access to the broadest range of Arm technology to develop compute solutions supported by the world's largest ecosystem of tools, services and software."

Samsung Electronics, the world leader in advanced memory technology, today announced plans to expand its NAND flash production capacity in Pyeongtaek, Korea, reinforcing the company's ability to meet demands from emerging technologies. Construction, which began this May, will pave the way for mass production of Samsung's cutting-edge V-NAND memory in the second half of 2021.

"The new investment reaffirms our commitment to sustain undisputed leadership in memory technologies, even in uncertain times," said Cheol Choi, executive vice president of Memory Global Sales & Marketing at Samsung Electronics. "We will continue to serve the market with the most optimized solutions available, while contributing to growth of the overall IT industry and the economy in general."

Samsung Electronics, a world leader in advanced semiconductor technology, today announced that its new cutting-edge semiconductor fabrication line in Hwaseong, Korea, has begun mass production.

The facility, V1, is Samsung's first semiconductor production line dedicated to the extreme ultraviolet (EUV) lithography technology and produces chips using process node of 7 nanometer (nm) and below. The V1 line broke ground in February 2018, and began test wafer production in the second half of 2019. Its first products will be delivered to customers in the first quarter.

Samsung Electronics, the world leader in advanced memory technology, today announced the market launch of 'Flashbolt', its third-generation High Bandwidth Memory 2E (HBM2E). The new 16-gigabyte (GB) HBM2E is uniquely suited to maximize high performance computing (HPC) systems and help system manufacturers to advance their supercomputers, AI-driven data analytics and state-of-the-art graphics systems in a timely manner.

"With the introduction of the highest performing DRAM available today, we are taking a critical step to enhance our role as the leading innovator in the fast-growing premium memory market," said Cheol Choi, executive vice president of Memory Sales & Marketing at Samsung Electronics. "Samsung will continue to deliver on its commitment to bring truly differentiated solutions as we reinforce our edge in the global memory marketplace."

Panasonic, an electronics manufacturing giant, has today sold its silicon manufacturing business, marking the end of an era of Japanese semiconductor manufacturing. Once a big player in silicon manufacturing scene, particularly in the '80s and '90s era when Japan's silicon output was huge, Panasonic was considered one of the main players in the silicon manufacturing business. However, due to some difficulties like operating a business with a loss of over $215 million yearly, and having to compete with Chinese and Taiwanese silicon manufacturing firms, Panasonic is selling its silicon production lines.

The subsidiary of Panasonic called "Semiconductors Solutions" is being sold to Nuvoton Technology Corporation, a semiconductor company that spun-off from Winbond Electronics Corporation in 2008, where Winbond still owns 61% stake in Nuvoton despite the spinoff. Additionally, Panasonic forecasts a 27% drop in operating profit for this physical year, with the declining semiconductor manufacturing business counted. The reasoning behind this sale is that the company plans to exit all declining businesses that also include LCD manufacturing, as Chinese alternative manufacturers are stiff competition for Panasonic when it comes to pricing and panel output.

Three all-new Bluetooth 5.0 wireless headsets from LG Electronics combine a slim, seamless design with stunning sound performance thanks to built-in Meridian Audio technology. These latest additions to the popular LG TONE family of wearable audio systems (models HBS-XL7, HBS-SL5 and HBS-SL6S) are available for purchase on LG.com starting today and coming soon through major wireless providers nationwide. Prices and availability will vary by provider and retailer.

For music lovers, each model, backed by a Hi-fi Sound Solution with Meridian Audio, comes with improvements to the design of the original LG TONE, crafted for a clearer and more balanced sound. A composite diaphragm inside the speaker unit produces clarity in high and low ranges. The high-strength metal layer creates accurate treble, while a plastic layer produces rich, deep bass.

Scientists with the University of Leeds have managed to deploy gold in an ultra-efficient layer that's just two atoms thick, paving the way for much improved efficiency in the usage of the precious metal. The development, which university representatives claim marks a "landmark achievement", will open doors for the medical device and electronics industries-and also as a catalyst to speed up chemical reactions in a range of industrial processes. Because this 2D gold technology is up to 10x more efficient than current gold nanoparticle deployment (since all the gold particles are part of the surface, with no gold being left unused due to it being below the surface, in a bulk dispersion that's unavoidable with current coating technologies).

This means that materials savings can be achieved - which will likely be a magnet to the electronics industry, which will be able to not only increase efficiency of deployed gold, but also reduce waste of the precious material. Scientists behind the breakthrough claim this could also serve as a gateway for the development of other 2D materials, since lessons learned here may be applicable to other materials. All that remains (and that's putting it nicely) is being able to develop ways to scale-up the process, which deploys gold in a flake-like manner (scientists call it nanoseaweed of gold) that is flexible enough to be built into bendable devices.