Global memory brand, Team Group, has created numerous innovative SSD products over the years with its cutting-edge research and development to offer the very best solutions in the storage market. Today it has announced MP44L M.2 PCIe 4.0 SSD, featuring a unique breakthrough cooling technology: the industry's first SSD label to incorporate graphene copper foil. This less than 1 mm thick Heat Dissipating Graphene SSD Label has received Utility Patents and is tightly adhered to the SSD to provide precise and greater cooling. The design of MP44L M.2 PCIe 4.0 SSD's heat dissipating graphene SSD label eliminates the possibility of installation interference. Moreover, it allows users to enjoy double the cooling performance and the increased stability of PCIe Gen4 without the need to install additional thermal equipment when it's paired with an M.2 slot heatsink.

Team Group's brand new MP44L M.2 PCIe 4.0 SSD is a storage upgrade solution for Gen4 x4 SSDs. It offers a read speed of 5,000 MB/s and a write speed of 4,500 MB/s and supports SLC Cache technology, which provides over double the operation efficiency of Gen3 SSDs. By solving the problem of computer lag, it allows users to multitask with ease and enjoy fast and smooth performance. The MP44L SSD provides excellent data transfer accuracy due to its LDPC (Low-Density Parity Check Code) technology. It supports Windows TRIM optimization commands and the latest NVMe 1.4 standard.

Scythe announces the release of the new thermal paste Thermal Elixer G (SCTEG-1000), the new generation of Scythe thermal compound product. Featuring unique formula with Graphene inside, the TE-G has superior performance and long-term stability. Non-corrosive and not electrically conductive, the TE-G is suitable to use on CPU and GPU applications that require demanding performance. The Thermal Elixer G is available now in the US at an MSRP of 15.00 USD, the complete specifications can be found below.

Apos Audio is an audio retailer based out of California, and got in touch with us to let us know of the Caspian—the brand's first set of headphones. It came about as a collaboration with Soundnews and Kennerton Audio. Using the ~$1000 Kennerton Vali as the base, the Caspian gets a tweaked sound signature and different design while managing to cut down the price by half. It uses a 50 mm dynamic driver, natural oak ear cups, and oval-shaped ergonomic sheepskin ear pads. Pre-orders are now up for those interested, and further information straight from the company is seen past the break. I especially like the "How it's made" page, but that may just be the engineer in me speaking.

HDD manufacturers have tirelessly worked to reinvent the spinning drive technology (and sometimes topology) with increased storage density capabilities (potentiated by the development of technologies such as HAMR (Heat Assisted Magnetic Recording) and MAMR (Microwave Assisted Magnetic Recording). Researchers with the Cambridge Graphene Centre have collaborated with the University of Exeter, India, Switzerland, Singapore and the US to showcase how much life there might still exist in HDDs - if only graphene were to be used.

The research shows how a single graphene layer (researchers tested up to four layers) can be used as a replacement for multiple layers of carbon-based overcoats (COCs), which are deployed on platters to protect them from mechanical damages and corrosion. Current COC thickness stands at only 3 nm, but any existing space between platters presents a bottleneck to the number of platters (and thus storage density) that can be achieved in the HDD world. The researchers demonstrated that graphene enables a two-fold reduction in friction and provides better corrosion and wear protection than current state-of-the-art solutions. In fact, one single graphene layer reduces corrosion by 2.5 times. The researchers further demonstrated that graphene can still be deployed as protective layers in HAMR-totting HDDs - a feat that current carbon-based overcoats can't reproduce, as they fail at the high temperatures arising from the heat-assisted recording. Just one more feather on graphene's utility cap.

ZADAK, a leading provider of PC gaming components and innovative water cooling solutions, announces a new TWSG3 M.2 PCIe Gen 3x4 SSD using graphene heatsink technology. This appears alongside the new ZADAK Widget software which allows users to easily monitor the health of their SSD. It can be downloaded for free from the ZADAK website.

The TWSG3 features a graphene heatsink with a futuristic digital design, offering not only a stylish look but also 15% optimization of cooling performance. This heatsink will keep your SSD safe from high temperatures when it is under heavy load - whether booting your computer or loading the next game or application on your desktop PC. Graphene is a game-changing material that will be applied to many future PC technology developments - it's simply a matter of time. It really helps in reducing temperatures and was an ideal choice when searching for a complimentary material to add to the heatsink on the TWSG3.

Aipower has recently unveiled the Wearbuds Pro a set of truly wireless earbuds that are charged via the included fitness band. This bizarre product is actually in its second generation now, building upon the success of the original 1st generation Wearbuds which raised over 900k on their first round of crowdfunding. This new model brings several improvements to the earbuds and fitness band, the earbuds have gained Graphene Dynamic Drivers, Qualcomm smart audio chips, aptX support, and Bluetooth 5.0 connectivity.

The fitness band has also gained some new features such as the scratchproof, fingerprint-resistant Corning glass, 262k color TFT HD display, and matte finish metal case. The fitness band has also received upgraded firmware to offer multiple sport modes which can accurately track various activities via the built-in motion sensor, seven-axis accelerometer, heart rate sensor, and pressure sensor. The Aipower Wearbuds Pro will be available August 4th on Indiegogo with pledges starting from $89 / £71. The full press release can be found below.

Researchers at the Samsung Advanced Institute of Technology (SAIT) have unveiled the discovery of a new material, called amorphous boron nitride (a-BN), in collaboration with Ulsan National Institute of Science and Technology (UNIST) and the University of Cambridge. Published in the journal Nature, the study has the potential to accelerate the advent of the next generation of semiconductors.

Recently, SAIT has been working on the research and development of two-dimensional (2D) materials - crystalline materials with a single layer of atoms. Specifically, the institute has been working on the research and development of graphene, and has achieved groundbreaking research outcomes in this area such as the development of a new graphene transistor as well as a novel method of producing large-area, single-crystal wafer-scale graphene. In addition to researching and developing graphene, SAIT has been working to accelerate the material's commercialization.

Puro Sound Labs, the world's leading manufacturer of premium, safe-listening headphones today introduced the PuroGamer-featuring studio-grade audio, and volume-limiting-for a safe, immersive gaming experience. The new headphones employ many of the outstanding features that earned Puro Sound Labs numerous awards for their original BT-2200 kid's volume-limited headphones, including high-quality, light weight, construction, plush and comfortable noise-isolating ear-pads, the outstanding clarity of their Puro Balanced Response Curve, and a 85dB volume-limiting filter to prevent hearing damaging volume levels. In addition to the sleek design, the PuroGamer headphones add a high-quality 50 mm graphene driver, an omni-directional, detachable boom microphone, with noise canceling and anti-interference features for a competitive gaming edge. The new PuroGamer headphones will be on sale starting mid-September at Amazon.com, Amazon.ca and PuroSound.com for only $79.99.

Cryorig launched its first new product in months after going MIA in the US market with imminent plans to return, the new C7 G CPU Cooler. The company had unveiled this cooler just ahead of this year's Computex. A variant of the C7 Cu all-copper, top-flow, low-profile air cooler, the C7 G features graphene coating on the copper fins and heat-pipes. This coating increases surface-area for heat dissipation at a microscopic level, and is similar in concept to the ceramic coating that CPU cooler manufacturers dabbled with in the past. The cooler can now handle thermal loads of up to 125 W, whereas the original C7 Cu was rated for up to 115 W.

With its fan in place, the C7 G has a height of 47 mm. It uses 57 copper fins stacked perpendicular to the plane of the motherboard, to which heat drawn from the base is conveyed by four 6 mm-thick copper heat-pipes that make direct contact with the CPU. The 92 mm fan takes in 4-pin PWM input, spins between 600 to 2,500 RPM, pushing up to 40.5 CFM of air with a noise output of up to 30 dBA. The cooler only supports mainstream-desktop CPU socket types, including AM4 and LGA115x. The company didn't reveal pricing.

As of yet unannounced, it seems that Cryorig may be preparing to launch a graphene-coated version of their popular low-profile C7Cu cooler. Cryorig's own website has a product page up for the part, which makes use of graphene's qualities in both durability, lightness and thermal conductivity to increase performance in the part of the market it arguably matters the most - small form factor. This could signal an improvement in heat dissipation capabilities for this small cooler. The C7 Cu version, in full copper, has a 115W TDP specification, so perhaps the C7G will improve in that front.

The C7G FAQ isn't uploaded as of yet, which speaks to the unannounced nature of the product. The only thing we have to go by, for now, is the image for the product on Cryorig's product page, and the users' manual, which while not giving away much in terms of specifications, but does show that there are a pair of mounting clips included for users to mount their 90 mm fans - whether in 14 mm or 25 mm depth.

AMD's senior VP of AMD's datacentre group Forrest Norrod, at the Rice Oil and Gas HPC conference, said that while graphene does have incredible promise for the world of computing, it likely will take some ten years before such exotic material are actually taken advantage off. As Norrod puts it, silicon still has a pretty straightforward - if increasingly complex - path down to 3 nanometer densities. And according to him, at the rate manufacturers are being able to scale down their production nodes further, the average time between node transitions stands at some four or five years - which makes the jump to 5 nm and then 3 nm look exactly some 10 years from now, where Norrod expects to go through two additional shrinking nodes for the manufacturing process.

Of course, graphene is being hailed as the next best candidate for taking over silicon's place at the heart of our more complex, high-performance electronics, due, in part, to its high conductivity independent of temperature variation and its incredible switching resistance - it has been found to be able to operate at Terahertz switching speeds. It's a 2D material, which means that implementations of it will have to occur in deposited sheets of graphene across some other material.

Graphene has been hailed for some time now as the next natural successor to silicon, today's most used medium for semiconductor technology. However, even before such more exotic solutions to current semiconductor technology are employed (and we are still way off that future, at least when it comes to mass production), engineers and researchers seem to be increasing their focus in one specific part of computing: internal communication between components.

Typically, communication between a computer's Central Processing Unit (CPU) and a system's memory (usually DRAM) have occurred through a bus, which is essentially a communication highway between data stored in the DRAM, and the data that the CPU needs to process/has just finished processing. The fastest CPU and RAM is still only as fast as the bus, and recent workloads have been increasing the amount of data to be processed (and thus transferred) by orders of magnitude. As such, engineers have been trying to figure out ways of increasing communication speed between the CPU and the memory subsystem, as it is looking increasingly likely that the next bottlenecks in HPC will come not through lack of CPU speed or memory throughput, but from a bottleneck in communication between those two.

At the Delft University of Technology in the Netherlands, scientists were hard at work researching how to produce mechanical Graphene sensors. Working with membranes measuring only two atoms thick, there are 13 micrometer-sized round air filled cavities in a silicon surface (silicon oxide) that are covered by double-layered Graphene. Upon observing these samples, the scientists noticed that the colors of the membranes differed. When the pressure within the cavities varied, the air 'bubbles' became concave or convex, changing how light refracted through them and created different colors.

At first this disappointed the scientists, as it became apparent that the small bubbles were not homogeneous enough to build a sensor. However they quickly noticed that the effect showed promise for an entirely different path of research - the Mechanical Pixel. The scientists speculate that screens built using this technology could eventually lead to much more flexible, durable and energy efficient panels than current LED technology allows. They do however caution that this research is very much in stages of infancy, it remains to be seen whether this mechanization of Graphene could conclude in screens of comparable quality or be scaled up to mass production. Bear in mind the samples that are currently being worked with would produce a panel with a pixel density north of 1,000 DPI. An explanation for mechanical color pixels can be found in this Vimeo video.

Samsung Advanced Institute of Technology, the core R&D incubator for Samsung Electronics, has developed a new transistor structure utilizing graphene, touted as the "miracle material." As published online in the journal Science on Thursday, 17th May, this research is regarded to have brought us one step closer to the development of transistors that can overcome the limits of conventional silicon.

Currently, semiconductor devices consist of billions of silicon transistors. To increase the performance of semiconductors (the speed of devices), the options have to been to either reduce the size of individual transistors to shorten the traveling distance of electrons, or to use a material with higher electron mobility which allows for faster electron velocity. For the past 40 years, the industry has been increasing performance by reducing size. However, experts believe we are now nearing the potential limits of scaling down.Image courtesy of Sammy Hub

A new form of graphene created by researchers at The University of Texas at Austin could prevent laptops and other electronics from overheating, ultimately, overcoming one of the largest hurdles to building smaller and more powerful electronic devices.

The research team, which includes colleagues at The University of Texas at Dallas, the University of California-Riverside and Xiamen University in China, published its findings online today in the Advance Online Publication of Nature Materials. The study will also appear in the print journal of Nature Materials.

Troy, N.Y. - Electronics are getting smaller and smaller, flirting with new devices at the atomic scale. However, many scientists predict that the shrinking of our technology is reaching an end. Without an alternative to silicon-based technologies, the miniaturization of our electronics will stop. One promising alternative is graphene - the thinnest material known to man. Pure graphene is not a semiconductor, but it can be altered to display exceptional electrical behavior. Finding the best graphene-based nanomaterials could usher in a new era of nanoelectronics, optics, and spintronics (an emerging technology that uses the spin of electrons to store and process information in exceptionally small electronics).

Sweden's Chalmers University researchers demonstrated a graphene-based transistor design that allows more compact RF mixer processing. This could very well be a breakthrough, because it not only allows designing much more compact radio-frequency electronics, but also allows circuits to run faster. This could accelerate the development of Terahertz electronics systems whose applications include radar, radio astronomy, and process monitoring. Its developers have named it G-FET, or Graphene field-effect transistor. An allotrope of carbon, graphene is an honeycomb lattice of carbon atoms on an atomic-scale. It is electrically-symmetrical, giving it the ability to act as electron or hole carrier. This means that a single G-FET can act as an RF mixer without needing the feeding circuits used in current designs.

A team at Rice University has determined that a strip of graphite only 10 atoms thick can serve as the basic element in a new type of memory, making massive amounts of storage available for computers, handheld media players, cell phones and cameras. In new research available online in Nature Materials, Rice professor James Tour and postdoctoral researchers Yubao Li and Alexander Sinitskii describe a solid-state device that takes advantage of the conducting properties of graphene. Tour said such a device would have many advantages over today's state-of-the-art flash memory and other new technologies. Graphene memory would increase the amount of storage in a two-dimensional array by a factor of five, he said, as individual bits could be made smaller than 10 nanometers, compared to the 45-nanometer circuitry in today's flash memory chips. The new switches can be controlled by two terminals instead of three, as in current chips.