IBM Working on CPU Stacking
IBM Moves Moore's Law into the Third-Dimension
Armonk, NY - 12 Apr 2007: IBM (NYSE: IBM) today announced a breakthrough chip-stacking technology in a manufacturing environment that paves the way for three-dimensional chips that will extend Moore's Law beyond its expected limits. The technology - called "through-silicon vias" -- allows different chip components to be packaged much closer together for faster, smaller, and lower-power systems.
The IBM breakthrough enables the move from horizontal 2-D chip layouts to 3-D chip stacking, which takes chips and memory devices that traditionally sit side by side on a silicon wafer and stacks them together on top of one another. The result is a compact sandwich of components that dramatically reduces the size of the overall chip package and boosts the speed at which data flows among the functions on the chip.
Armonk, NY - 12 Apr 2007: IBM (NYSE: IBM) today announced a breakthrough chip-stacking technology in a manufacturing environment that paves the way for three-dimensional chips that will extend Moore's Law beyond its expected limits. The technology - called "through-silicon vias" -- allows different chip components to be packaged much closer together for faster, smaller, and lower-power systems.
The IBM breakthrough enables the move from horizontal 2-D chip layouts to 3-D chip stacking, which takes chips and memory devices that traditionally sit side by side on a silicon wafer and stacks them together on top of one another. The result is a compact sandwich of components that dramatically reduces the size of the overall chip package and boosts the speed at which data flows among the functions on the chip.