Cervoz brings its new storage solution to industrial applications with the launch of its new T425 Series M.2 NVMe SSDs-M.2 2230 (B+M) and M.2 2242 (B+M). Available in the compact 2230 and 2242 form factors, these PCIe Gen3x2 SSDs pack impressive performance into small footprints. Engineered for reliability and efficiency, the T425 Series provides industrial-grade solutions for embedded systems and space-constrained applications.

Space-Saving Form Factors for Seamless Integration
The tiny size of the T425 Series SSDs enables easy integration into small, fanless devices where internal space is limited. From in-vehicle systems and handheld scanners to medical equipment and industrial PCs, these SSDs allow seamless upgrades without compromising capacity or performance.

Silicon Motion Technology Corporation ("Silicon Motion"), a global leader in designing and marketing NAND flash controllers for solid-state storage devices, today introduced the new generation FerriSSD NVMe PCIe Gen 4 x4 BGA SSD. This latest solution features support for i-temp and integrates advanced IntelligentSeries technology, delivering robust data integrity in extreme temperature environments that meet the rigorous demands of industrial embedded systems and automotive applications.

The latest FerriSSD BGA SSD supports PCIe Gen 4 x4 and uses high density 3D NAND within a compact 16 mm x 20 mm BGA chip-scale package. With storage capacities up to 1 TB, these high-performance embedded SSDs utilize Silicon Motion's latest innovations to achieve high sequential read speeds exceeding 6 GB/s and sequential write speeds exceeding 4 GB/s. Equipped with Silicon Motion's proprietary IntelligentSeries data protection technology that enhances reliability and performance through the use of encryption, data caching, data scanning and protect features, as well as supporting the i-temp requirements of operating in extreme temperatures from -40°C to + 85°C. This latest FerriSSD offers a high performance and highly reliable embedded storage solution for a broad range of applications and operating environments including in-car computing, thin client computing, point-of-sale terminals, multifunction printers, telecommunications equipment, factory automation tools, and a wide range of server applications.

Imagine a world where you can whisper your digital wishes into your device, and poof, it happens. That world may be coming sooner than you think. But if you're worried about AI doing your thinking for you, you might be waiting for a while. In a fireside chat Wednesday (March 20) at NVIDIA GTC, the global AI conference, Kanjun Qiu, CEO of Imbue, and Bryan Catanzaro, VP of applied deep learning research at NVIDIA, challenged many of the clichés that have long dominated conversations about AI. Launched in October 2022, Imbue made headlines with its Series B fundraiser last year, raising over $200 million at a $1 billion valuation.

The Future of Personal Computing
Qiu and Catanzaro discussed the role that virtual worlds will play in this, and how they could serve as interfaces for human-technology interaction. "I think it's pretty clear that AI is going to help build virtual worlds," said Catanzaro. "I think the maybe more controversial part is virtual worlds are going to be necessary for humans to interact with AI." People have an almost primal fear of being displaced, Catanzaro said, but what's much more likely is that our capabilities will be amplified as the technology fades into the background. Catanzaro compared it to the adoption of electricity. A century ago, people talked a lot about electricity. Now that it's ubiquitous, it's no longer the focus of broader conversations, even as it makes our day-to-day lives better.

ECS Industrial Computer Co., Ltd., also known as ECSIPC, proudly unveils its latest generation of mini PCs for quad-display industrial applications, the LIVA Z5 series, which includes the LIVA Z5 Plus, LIVA Z5E Plus, and LIVA Z5F Plus. Committed to providing industry-specific value solutions, ECSIPC focuses on developing niche products and solutions for vertical industry applications. ECSIPC has achieved success in various application areas, including educational electronic whiteboards in Europe and the US, airport real-time flight systems in India, image projection for Japan's Shinkansen bullet trains, and electronic menu and POS systems for KFC in South America, while also exploring applications in vending machines and digital signage.

The newly launched LIVA Z5 series is powered by Intel 13th and 14th generation Core processors, delivering significant performance improvements with up to 10 cores capable of efficiently handling various demanding tasks. The series has Wi-Fi 6E speeds up to 9.6 Gbps for enhanced data transmission efficiency, allowing seamless playback of high-quality audiovisual content. Additionally, the multi-storage design accommodates PCIe Gen 4 M.2 NVMe SSDs and a 2.5-inch SSD or HDD, offering greater storage flexibility. The series ensures high-speed data processing in industrial environments with two 2.5G Base-T (2.5G) ports. At the same time, support for vPro and physical TPM significantly enhances the value of industrial applications.

ASUS IoT, the global AIoT solution provider, today announced the launch of its new lineup of industrial motherboards and edge AI computers powered by the latest Intel Core (14th gen) processors. These cutting-edge solutions offer supreme computing performance, enhanced power efficiency, and accelerated connectivity, making them ideal for a wide range of industrial applications. One of the key features of these new solutions is the accelerated transfer speeds and enhanced power efficiency offered by DDR5 memory. Compared to DDR4, DDR5 memory provides 50% faster transfer speeds and 8% improved power efficiency, ensuring reliability with ECC technology.

ASUS IoT industrial motherboards also support double-speed PCI Express (PCIe) 5.0, which doubles the speed of PCIe 4.0, while maintaining full backward compatibility for system flexibility. This allows for faster data transfer and expandability, meeting the demands of modern industrial applications. The integrated Intel UHD Graphics technology in ASUS IoT motherboards supports up to 8K60 HDR video and multiple 4K60 displays, providing vivid graphics and powerful AI acceleration. This makes them ideal for various applications, including retail, healthcare and AI in smart factories.

Dylan Patel, of SemiAnalysis, has highlighted worrying industry trends from an October 2021 published report—the Center for Security and Emerging Technology (CSET) document explored and "(outlined) infrastructure investments and regulatory reforms that could make the United States a more attractive place to build new chipmaking capacity and ensure continued U.S. access to key inputs for semiconductor manufacturing." Citing CSET/World Fab Forecast findings, Patel expressed his dissatisfaction with the apparent lack of progress in the region: "The United States is the slowest relevant country in the world to build a fab thanks to NIMBY assholes and the garbage regulatory/permitting system." The SemiAnalysis staffer likely believes that unsuitable conditions remain in place, and continue to hinder any forward momentum—for greenfield fabrications projects, at least.

The CSET 2021 report posited that the proposed $52 billion CHIPS Act fund would not solve all USA chip industry problems—throwing a large sum of money into the pot is not always a surefire solution: "The United States' ability to expeditiously construct fabs has declined at the same time as the total number of fab projects in the United States has declined. Some of this is due to changes in the global semiconductor value chain, which has concentrated resources in Asia as foundries have risen in prominence, and countries like Taiwan, South Korea, and China have established significant market share in the industry from 1990 to 2020. However, during this same 30-year period, the time required to build a new fab in the United States increased 38 percent, rising from an average of 665 days (1.8 years) during the 1990 to 2000 time period to 918 days (2.5 years) during the 2010-2020 time period (Figure 2). At the same time, the total number of new fab projects in the United States was halved, decreasing from 55 greenfield fab projects in the 1990-2000 time period to 22 greenfield fab projects between 2010 and 2020." Intel's work-in-progress Ohio fabrication site has suffered numerous setbacks (including delayed CHIPS Act payments)—the latest news articles suggest that an opening ceremony could occur in late 2026 or early 2027. Reportedly, TSMC's Arizona facility is a frequently runs into bureaucratic and logistical headaches—putting pressure on company leadership at their Hsinchu (Taiwan) headquarters.

An anonymous industry source has divulged a grim set of near-future circumstances to Tom's Hardware—they believe that "NAND packages consisting of four and eight NAND devices are already in short supply," thus causing an expected "skyrocketing" of prices within higher-capacity consumer SSD product lines. This sharp climb could happen within the first quarter of 2024, and the article outlines early warning signs—"price upticks are starting to show in retail already" as documented in graphs generated by CamelCamelCamel for a sampling consisting of three 2 TB NVMe models (Samsung 990 Pro, CORSAIR MP600 PRO LPX & Team Group MP44). Their analysis of this situation continued: "A single-sided SSD in an M.2-2280 form factor can carry four 3D NAND packages. Modern 2 TB and 4 TB drives in this form factor tend to use packages consisting of four or eight 3D NAND devices to ensure high performance. There is already a shortage of these packages today as SSD makers are struggling to find adequate supply."

Late summer going into the autumn of 2023 presented a great time to pick up SSD bargains, since manufacturers had flooded the market with far too much stock (following an oversupply of NAND units). The unnamed source believes that it could take two to three months for early 2024 NAND shortages to cause large ripple effects within consumer and enterprise markets. A January 9-dated TrendForce report proposes that NAND Flash contract prices are set to rise by 15 to 20% in Q1Y24, although Tom's Hardware reckons that this "acceptance of new rates is more likely among notebook makers." TrendForce anticipates enterprise SSD contract pricing to increase by roughly 18% - 23% within the first quarter of 2024.

Intel is expanding immersion cooling collaborations with Taiwanese partners to strengthen its data center offerings for AI workloads. This includes developing an industry-first open IP complete immersion cooling solution and reference design. Partners like Kenmec and Auras Technology will be key in implementing Intel's advanced cooling roadmap. Intel is also cooperating with Taiwan's Industrial Research Institute on a new lab for certifying high-performance computing cooling technologies to international standards. With local ecosystem partners, Intel aims to accelerate next-generation cooling solutions for Taiwanese and global data centers. Advanced cooling allows packing more performance into constrained data center footprints, which is critical for AI's rapid growth. Intel touts a superfluid-based modular cooling system achieving 1500 Watts+ heat dissipation for high-density deployments.

Meanwhile, Kenmec offers a range of liquid cooling products, from Coolant Distribution Units (CDU) to customized Open Rack version 3 (ORv3) water cooling cabinets, with solutions already Intel-certified. Intel wants to solidify its infrastructure leadership as AI workloads surge by fostering an open, collaborative ecosystem around optimized cooling technologies. While progressing cutting-edge immersion and liquid cooling hardware, cultivating shared validation frameworks and best practices ensures broad adoption. With AI-focused data centers demanding ever-greater density, power efficiency, and reliability, cooling can no longer be an afterthought. Intel's substantial investments in a robust cooling ecosystem highlight it as a priority right alongside silicon advances. By lifting up Taiwanese partners as strategic cooling co-innovators, Intel aims to cement future competitiveness.

ADATA Industrial, the world's leading brand for industrial-grade embedded storage, officially released today its SATA 31D series of industrial-grade solid-state drives including 2.5-inch ISSS31D, M.2 2280 IM2S31D8, and M.2 2242 IM2S31D4, designed for retail terminals and embedded systems.

The SATA 31D series of industrial-grade SSDs utilize 112-layer 3D TLC flash memory developed by WDC, boasting a P/E Cycle of 3,000 which is comparable to MLC. The 31D series also offers a variety of ultra-thin and compact mainstream specifications such as SATA 2.5-inch, M.2 2280, M.2 2242, and various capacity options from 128 GB to 2 TB. 112-layer 3D NAND (BiCS5) 31D series SSDs all support thermal throttling technology, which reduces SSD transmission performance in stages to effectively mitigate the risk of data damage due to overheating. Furthermore, a LDPC ECC error correction mechanism and End-to-End Data Protection technology ensure reliable data transfer and improve data integrity. The 31D series is eminently suitable for POS systems, information kiosks, digital signage, and embedded equipment.

ADLINK Technology Inc., a global leader in edge computing, a global supplier of industrial PCs and motherboards, and a Titanium member of the Intel Partner Alliance, announces the launch of the new IMB-M47 industrial ATX motherboard for 12th and 13th Gen Intel Core i9/i7/i5/i3 processors. The IMB-M47 ATX motherboard delivers high-performance computing power, with multiple I/O and expansion ports, including three simultaneous independent displays, USB 3.2 Gen 2x2 (20 Gb/s), up to 128 GB DDR5 4800 MHz, 3x 2.5 GbE, multi-M.2 Key M, TPM 2.0, and PCIe 5.0 high-performance add-on cards for complex Edge AIoT processing tasks in industrial automation, machine vision, factory automation, and logistics.

The IMB-M47 industrial ATX motherboard supports 12th and 13th Gen Intel Core processors that utilize a high-performance hybrid architecture with up to sixteen E-cores (Efficient-cores) for multi-threaded background task management and multitasking, and up to eight P-cores (Performance-cores) for demanding single-threaded work such as graphics and video rendering. The 13th Gen Intel Core processors speed up edge applications that benefit from faster memory performance with faster DDR5 memory.

Swissbit, a leading manufacturer of industrial-grade flash memory solutions, today announced the release of its new product line of SATA SSDs. The series X-73, X-75 and X-78 are powered by cutting-edge industrial 112-layer 3D NAND technology, bringing unprecedented reliability and extended lifespan to the world's most crucial networks. The latest portfolio is built with Swissbit's dedication to quality and innovation. The new portfolio not only offers reduced Total Cost of Ownership (TCO) thanks to its extended product life cycle, but also comes with powersafe SSDs - Swissbit's industry-leading power loss protection feature.

The expanded SSD product line includes M.2 2242, M.2 2280, Slim SATA MO-297, and 2.5" form factors, and offers a wide capacity range from 40 GB up to 1.92 TB. With an industry-leading 100k P/E cycles, the high endurance versions in pSLC mode are aimed at addressing the increasing market demand for durable and reliable data storage solutions.

Thermaltake, the leading PC DIY premium brand for Case, Power, Cooling, Gaming peripherals, and enthusiast Memory solutions, is pleased to unveil the Pacific SW1 Plus CPU Water Block and the Pacific SF Fittings - Silver Black. The custom liquid cooling system provides considerable flexibility in design, allowing you to demonstrate your aesthetic sense. If you are an industrial chic enthusiast, the Pacific SW1 Plus and the Pacific SF Fittings, which feature a New Industrial Style, are the ideal components for leveling up your cooling system's appearance while ensuring thermal performance and installation compatibility.

Pacific SW1 Plus CPU Water Block
Designed with a modern industrial style, the Pacific SW1 Plus CPU Water Block comes in solid aluminium alloy with a screw design, displaying a beautiful glow of metals. The copper base is finished with anti-corrosive nickel plating, matching the overall industrial design and offering an outstanding heat transfer for the CPU. The central inlet design of the base enables the coolant to be distributed evenly through the 0.2 mm microchannels, achieving more effective heat dissipation. What's more, through the TT RGB Plus 2.0 software, you can simply monitor coolant temperature and customize the lighting effects of the water block's 12 addressable LEDs. To fit the latest CPUs, the Pacific SW1 Plus is also compatible with Intel LGA 1700 and AMD AM5 sockets and can be installed without additional brackets.

ASRock Industrial releases the 4X4 BOX 7040 Series Mini PCs powered by AMD Ryzen 7040U Series APUs, featuring up to 8 "Zen 4" cores and 16 threads. With the new AMD Ryzen AI, the first AI engine for an x86 platform, and support of dual-channel DDR5 5600 MHz memory up to 64 GB, the new Series sprint ahead in speed, performance, and AI capability, while guaranteeing extended runtime. The 4X4 BOX 7040 Series comes with enriched I/O connectivity in a compact appearance, enabling 4K quad-display outputs, five USB ports with two USB4, dual storage, and dual LAN up to 2.5G, Wi-Fi 6E. The faster performance with AI engine and longer runtime bring about productivity boost and next-level experience in content creation, gaming, entertainment, commerce, and many other AIoT applications.

Powered by AMD Ryzen 7040U Series APU (Ryzen 7 7840U/Ryzen 5 7640U), ASRock Industrial's 4X4 BOX 7040 Series contain selections: 4X4 BOX-7840U and 4X4 BOX-7640U. Featuring 4 nm "Zen 4" architecture with up to 8 cores and 16 threads, and enhanced dual-channel DDR5 5600 MHz SO-DIMM memory up to 64 GB, the Series guarantee faster productivity, content creation, and gaming with extended runtime. Moreover, with built-in AMD Ryzen AI - the pioneer of dedicated AI hardware in an X86 processor, the 4X4 BOX 7040 Series usher in advanced potentials in power, efficiency, and intuition for the future AI working world. This integration transforms the 4X4 BOX 7040 Series into a reliable personal virtual assistant, propelling dynamic AI applications, enhancing video conferencing, and delivering AI-inspired visuals.

FUJIFILM Corporation (President and CEO, Representative Director: Teiichi Goto) and IBM today announced the development of a 50 TB native tape storage system, featuring the world's highest native data tape cartridge capacity. Fujifilm has commenced production of a high-density tape cartridge for use with IBM's newest enterprise tape drive, the TS1170. The sixth-generation IBM 3592 JF tape cartridge incorporates a newly developed technology featuring fine hybrid magnetic particles to enable higher data storage capacity.

Innovations in achieving 50 TB Native Capacity
Fujifilm has succeeded in achieving this innovative cartridge capacity by evolving the technologies developed in previous tape generations. This involved enhancing both the areal recording density (the amount of data that can be recorded per square inch) and the overall recording area (the surface area capable of recording data).

ASRock Industrial, the leading provider of global industrial motherboards and systems, has released new Mini PCs and motherboards powered by Intel Processor N97 (Alder Lake-N). The available selections include NUC BOX-N97, iBOX-N97, and Motherboard Series consisting of NUC-N97, Pico-ITX (SOM-P104), SBC 3.5" (SBC-260, SBC-261), and Mini-ITX (IMB-1005, IMB-1006, IMB-1007) form factors. Compared to the previous Intel Celeron Processor J6412 (Elkhart Lake), the Intel Processor N97 (Alder Lake-N) showcases remarkable CPU performance increase of up to 37% and graphics performance up to 154%. The new NUC BOX-N97, iBOX-N97, and NUC-N97 Motherboard Series provide rich I/O and expansion options, including triple displays up to 4K at 60 Hz, dual 2.5G LAN, and dual storage option with SATA 3.0 and M.2 Key M, catering to diverse application needs, such as entertainment, office, business, retail, transportation, embedded, industrial, and beyond.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices, today announced its latest line-up of industrial motherboards and application systems. BIOSTAR's latest BIQ67-AHP, the BIW68-AHP, and the BIELK-PAT motherboards, with MT-J6412, and MT PRO-J6412 application systems are built to address various system integration and industrial needs, offering innovative features that ensure high performance, reliability, and longevity.

The BIQ67-AHP and BIW68-AHP motherboards are excellent for system integration, general industrial systems and GPU AI workstation. These allow businesses to have reliable computers that help stay up-to-date on customers' contact details, transaction history, accounts, communication, and business management on a reliable and efficient platform. Featuring Intel Q670 chipset and Intel W680 chipset respectively, the BIQ67-AHP and BIW68-AHP motherboards carry additional features and functionality such as DDR4 support up to 128 GB, dual Intel LAN, multiple PCI/PCIe slots, M.2 slots, USB 3.2, COM ports, and more. The BIELK-PAT motherboard, with its wide range temperature -40 °C ~ 85 °C and voltage support, is built to withstand and function optimally in diverse environments and outdoor applications. It is ideal for uses such as EV charging stations, kiosks, refrigerated factories, and is great for HMI applications for businesses of all sizes.