Next week at Dell Technologies World, KIOXIA America, Inc. will be on hand to demonstrate how its innovative solid state drives (SSDs) are accelerating customer application performance and enabling product breakthroughs. From SSDs designed with PCIe 5.0 technology that boost power and performance to the industry's first lineup of Enterprise and Datacenter Standard Form Factor (EDSFF) E3.S SSDs, best in class drives from KIOXIA are used in a number of Dell product lines.

KIOXIA, the inventor of NAND flash, sits at the forefront of flash storage and SSD innovation. Achievements such as the introduction of 3D flash memory, XL-FLASH storage class memory, and new form factors and interfaces underscore the contributions the company has made toward enabling next-gen applications - and transforming the digital world.

In a move that bolsters its comprehensive PCIe 4.0 solid-state drive (SSD) portfolio, Kioxia Corporation has introduced the KIOXIA XG8 Series of client SSDs for high-end notebooks, desktops, gaming systems, workstations, as well as data center boot applications. Designed to bring next-generation performance to demanding client environments, the XG8 Series enables power users to take advantage of PCIe Gen4 x4 speed and ample storage space.

The XG8 Series is available in an M.2 type 2280 form factor and supports optional security features using the latest TCG Pyrite 2.01 and TCG Opal 2.01 standards to ensure data is kept secure at home, in the office or on the road. In addition, the XG8 Series features end-to-end data path protection for greater data integrity.

Kioxia Corporation and Western Digital Corp. (NASDAQ: WDC) have finalized a formal agreement to jointly invest in the first phase of the Fab 7 (Y7) manufacturing facility at Kioxia's industry-leading Yokkaichi Plant in the Mie Prefecture of Japan. With construction of the first phase of Y7 completed, the joint-venture investment will enable initial production output beginning in the fall of this year. This marks another important milestone in the 20-year strategic joint-venture partnership between the two companies.

"We are very pleased to further deepen our strategic partnership with Western Digital through this joint investment in Y7," said Nobuo Hayasaka, President and CEO of Kioxia. "The rapid digitization of societies underpins accelerating use of memory products. We will continue to leverage our technological partnership and economies of scale to develop and produce cutting-edge semiconductor products and achieve organic corporate growth."

Kioxia Corporation, the world leader in memory solutions, today held a groundbreaking ceremony for its state-of-the-art semiconductor fabrication facility (Fab2) at its Kitakami Plant in Iwate Prefecture, Japan. Utilizing AI-based cutting-edge manufacturing, the new facility will contribute towards possible expansion of production of its proprietary 3D flash memory BiCS FLASH at the Kitakami Plant. Construction of the Fab2 facility is scheduled to be completed in 2023. The Fab2 facility will have an earthquake-absorbing structure and environmentally friendly design that utilizes advanced energy saving manufacturing equipment and renewable energy sources. In addition, an administration building will be constructed to accommodate the control management and technical departments in response to the increased staff.

"As a leader in memory, this Fab2 facility will become Kioxia's key manufacturing hub to produce our memory products at scale. We are planning to introduce automated in-facility transfers and advanced production control to make Fab2 a truly world-class smart fabrication facility," said Nobuo Hayasaka, President and CEO, Kioxia. "Fab2 will be able to intelligently coordinate and optimize its production with Fab1 at Kitakami Plant as well as our fabs in the Yokkaichi Plant, enabling the company to seize opportunities in the growing memory market in a timely manner." Under its mission of uplifting the world with memory, Kioxia is focused on developing initiatives to strengthen the competitiveness of its memory and SSD business, which it has developed over the past 35 years since inventing NAND flash memory in 1987. Kioxia remains committed to creating consistent and sustainable growth through timely capital investments that meet growing market demand.

Kioxia Corporation, a world leader in memory solutions, today announced that it has started sampling new Automotive Universal Flash Storage (UFS) Ver. 3.1 embedded flash memory devices. The new line-up utilizes the company's BiCS FLASH 3D flash memory and is available in capacities from 64 gigabytes (GB) to 512 GB to support the various requirements of evolving automotive applications that elevate driver experiences.

The storage requirement for automotive applications continue to increase as infotainment systems and ADAS in cars become more sophisticated. UFS is well-suited to support the high-performance and density needs of these applications. The new devices support a wide temperature range (-40°C to +105°C), meet AEC-Q100 Grade 2 requirements and offer enhanced reliability capabilities that increasingly complex automotive applications require.

Kioxia Corporation, the world leader in memory solutions, today announced it will begin construction of a state-of-the-art new fabrication facility (Fab2) at its Kitakami Plant in Iwate Prefecture, Japan for the possible expansion of production of its proprietary 3D Flash memory BiCS FLASH. Construction of the facility is scheduled to commence in April 2022 and is expected to be completed in 2023.

The new Fab2 facility will utilize AI-based cutting-edge manufacturing to increase production capacity of the entire Kitakami Plant and further enhance product quality, allowing Kioxia to expand its business organically and take advantage of the medium to long term growth of the flash memory market driven by the accelerating adoption of cloud services, 5G, IoT, AI, automated driving and the metaverse.

KIOXIA America, Inc., today announced that it is sampling its 2nd generation PCIe 5.0 SSD for enterprise and data center customers. After being the first vendor to offer a drive using the PCIe 5.0 interface, KIOXIA has now introduced the new CD8 Series data center NVMe SSD family. CD8 SSDs double the bandwidth per lane over PCIe 4.0 SSDs from 16 gigatransfers per second (GT/s) to 32GT/s and are optimized for hyperscale data center and enterprise server-attached workloads.

"Today, PCIe 4.0 SSDs are considered at the forefront in terms of delivering the highest levels of drive performance," commented Greg Wong, founder and principal analyst, Forward Insights. "Next generation PCIe 5.0 SSDs provide twice the level of performance, and will continue to propel the PCIe/NVMe SSD market - which is expected to grow at a CAGR of over 20% out to 2026."

Kioxia Corporation today announced that its KIOXIA PM7 Series of enterprise SAS SSDs are now available for customer evaluation. Targeted at enterprise applications and use cases - including high-performance computing, artificial intelligence, caching layer, and financial trading and analysis - the new drives bring improved performance, reliability and security to enterprise servers and storage. With an emphasis on security, the PM7 Series is FIPS 140-2 certified and currently under test for FIPS 140-3 certification.

Designed for modern IT infrastructures, 24G SAS (SAS-4) doubles effective bandwidth over 12 Gb/s SAS (SAS-3). Featuring Kioxia's 5th generation BiCS FLASH 3D flash memory, the PM7 Series delivers sequential read performance of up 4.2 Gigabytes (GB) per second (GB/s) and 720K random read IOPS, achieving approximately 20% performance improvement over the previous generation KIOXIA PM6 Series. The new Kioxia drives are available in capacities up to 30.72 terabytes (TB), making them the industry's highest capacity 2.5-inch SAS SSD.

In 4Q21, NAND Flash bit shipments grew by only 3.3% QoQ, a significant decrease from the nearly 10% in 3Q21, according to TrendForce's investigations. ASP fell by nearly 5% and the overall industry posted revenue of US$18.5 billion, a QoQ decrease of 2.1%. This was primarily due to a decline in the purchase demand of various products and a market shift to oversupply causing a drop in contract prices. In 4Q21, with the exception of enterprise SSD, the supply of which was limited by insufficient upstream components, the prices of other NAND Flash products such as eMMC, UFS, and client SSD, all fell.

TrendForce's summary of NAND Flash market sales performance in 2021 is as follows: although there have been signs of weakening since 2H21, thanks to remote services and cloud demand driven by the pandemic, revenue performance still grew significantly compared to 2020. Revenue reached US$68.6 billion, up 21.1% YoY, the second-biggest increase since 2018.

China is reacting to new outbreaks of the Omicron variant of the Coronavirus with partial lockdowns. This could further delay the availability of laptops with 12th Gen Intel Core processors and NVIDIA's Ti graphics cards, which debuted at the beginning of the year. The first factories have already been closed in Suzhou in the east of the country. Supply chain and logistics bottlenecks, a shortage of certain chip types and price increases are already on the horizon.

WDC recently stated that certain materials were contaminated in late January at NAND Flash production lines in Yokkaichi and Kitakami, Japan which are joint ventures with Kioxia, according to TrendForce's investigations. Before this incident, TrendForce had forecast that the NAND Flash market will see a slight oversupply the entire year and average price from Q1 to Q2 will face downward pressure. However, the impact of WDC's material contamination issue is significant and Samsung's experience during the previous lockdown of Xi'an due to the pandemic has also retarded the magnitude of the NAND Flash price slump. Therefore, the Q1 price drop will diminish to 5~10%. In addition, according to TrendForce, the combined WDC/Kioxia NAND Flash market share in the 3Q21 was as high as 32.5%. The consequences of this latest incident may push the price of NAND Flash in Q2 to spike 5~10%.

The contaminated products in this incident are concentrated in 3D NAND (BICS) with an initial estimate of 6.5exabytes (approximately 6,500M GB) affected. According to TrendForce, damaged bits account for 13% of the group's output in 1Q22 and approximately 3% of the total output for the year. The normal production schedule for the entire line has yet to be confirmed. It is worth noting that the damages announced by WDC likely do not account for total losses stemming for this event and the number of damaged Kioxia parts has not been aggregated, so the total number of affected bits may increase further.

What do the MP3 players of the 1990s and today's smartphones have in common? Neither would exist were it not for NAND flash memory, an innovation whose influence has reverberated throughout the decades. KIOXIA America, Inc. today announced that it has reached a new milestone - 2022 marks the 35th anniversary of the company's invention of NAND flash memory.

Back in 1987, it would have been hard to imagine all of the ways that this then brand-new technology would impact the world. NAND flash memory has ushered in entire new technological eras, and obsoleted technologies and products that had been in use for years - changing our lives in countless ways. Since starting at zero 35 years ago, the NAND flash market has grown to $70B. In terms of die density, flash memory has grown from 4 Mb to 1.33 Tb - a 333,000x increase. To put this exponential growth in perspective, in the 1990s, the largest available density flash memory could hold 1/8 of a photo. Flash forward to today, where the largest available die density is a whopping 1.33 Tb - and capable of storing 39,000 photos.

Kioxia Corporation, a world leader in memory solutions, today announced the launch of Universal Flash Storage (UFS) Ver. 3.1 [1] embedded flash memory devices utilizing the company's innovative 4-bit per cell quad-level-cell (QLC) technology. For applications needing high density, such as cutting-edge smartphones, Kioxia's QLC technology enables the capability to achieve the highest densities available in a single package.

Kioxia's UFS proof of concept (PoC) device is a 512 gigabyte prototype that utilizes the company's 1 terabit (128 gigabyte) BiCS FLASH 3D flash memory with QLC technology, and is now sampling to OEM customers. The PoC device is designed to meet the increasing performance and density requirements of mobile applications driven by higher resolution images, 5G networks, 4K plus video and the like.

TechPowerUp partnered with NAND flash pioneer KIOXIA to give you a chance to bring home one of three KIOXIA Exceria series SSDs. Based on the company's BiCS 3D NAND flash technology, the Exceria series spans various client SSD form-factors, including M.2 NVMe and 2.5-inch SATA. The brand also extends to the company's various consumer flash products, including portable SSDs, USB flash drives, and memory cards. Up for grabs in the TechPowerUp Giveaway were a 2 TB Exceria Plus G2 NVMe SSD, a 1 TB Exceria NVMe SSD, and a 960 GB Exceria SATA 2.5-inch SSD. The results are in, and we have the winners!

• Martin from Malta, wins the 2 TB Exceria Plus G2 NVMe SSD
• Pari from New Zealand, wins the 1 TB Exceria NVMe SSD
• Paul from the United Kingdom, wins the 960 GB Exceria SATA 2.5-inch SSD

A huge Congratulations to you three! TechPowerUp and KIOXIA will return with more such interesting giveaways.

TechPowerUp and KIOXIA partner to bring our readers from across the world a golden opportunity to win one of three KIOXIA Exceria SSDs across a selection of form-factors. As the technology-pioneer in NAND flash, KIOXIA brings experience and quality to the table with their Exceria line of client-segment SSDs and flash-storage products. Up for grabs are a 2 TB Exceria Plus G2 NVMe SSD, a 1 TB Exceria NVMe SSD, and a 960 GB Exceria SATA 2.5-inch SSD. Entries close on January 9th, so hurry, all you need to do is fill in a short form to help us get back to you if you've won!

For more information, and to participate, visit this page.

TechPowerUp and KIOXIA come together to bring you a change to win one of three KIOXIA Exceria client SSDs. The Exceria range of SSDs span 2.5-inch SATA and M.2 NVMe form-factors, and combine KIOXIA's in-house BiCS flash memory, and the legacy of being the inventors of flash memory. Up for grabs are a KIOXIA Exceria Plus G2 2 TB M.2 NVMe SSD, a KIOXIA Exceria 1 TB M.2 NVMe SSD, and a KIOXIA Exceria SATA 960 GB SSD. The Giveaway is open worldwide (wherever legal), entries close on January 9, 2022. To participate, simply fill up a brief form to help us get back to you if you've won. All the best!

For more information and to participate, visit this page.

According to research from Mordor Intelligence, the facial recognition market was valued at USD 3.72 billion in 2020, and is projected to be valued at USD 11.62 billion by 2026, registering a CAGR of approximately 21.71% over the forecast period. Facial recognition technology is finally coming into its own. It has gone beyond police officers looking for a suspect on a surveillance camera. Now, smart AI-driven facial recognition technology is common in smart retail, finance, transportation and even healthcare applications. But as adoption spreads, facial recognition devices are being required to operate in ever-more-challenging locations and environments. Keeping all these developments in mind, Apacer developed and has now released the CH120 series of industrial cards powered by the latest 112-layer BiCS5 3D TLC NAND technology, optimized for both AI facial recognition and smart IoT applications.

BiCS5 promises concrete, measurable advantages for SSDs, as it greatly improves capacity while keeping transmission latency ultra-low. In fact, Apacer's A2-grade CH120 series offers 4,000/2,000 IOPS for 4K image read/write performance. And compromised environments won't slow these cards down either - their wide temperature range means they operate smoothly in temperatures as low as -40 and as high as 85 degrees Celsius. The CH120 series of industrial cards are also equipped with value-adding over-provisioning and SLC-liteX technology. The former drastically reduces write amplification, extending an SSD's operational lifespan, while the latter allows an SSD to increase its endurance to up to 30,000 P/E cycles. That's 10 times higher than standard 3D TLC SSDs.

KIOXIA America, Inc. today announced that its CM6 and CD6 Series of PCIe 4.0 NVMe SSDs have earned VMware vSAN 7.0 certification, enabling them to be shared across connected hosts in a VMware vSphere cluster. Users can pool KIOXIA SSDs together in a single, distributed, shared data-store and define the storage capabilities required (such as performance, capacity and availability) for each connected virtual machine within the VMware vSAN cluster. These capabilities not only further hyper-converged infrastructure (HCI) options in virtual environments, but also ensure that storage policies are administered and maintained within the CM6 and CD6 Series with vSAN compatibility.

This certification allows VMware vSAN support for both hybrid and all-flash configurations using a two-tier storage architecture, capacity tier and cache. All write operations are sent to the cache tier and are subsequently de-staged to the capacity tier over time. When a CM6 or CD6 Series SSD is deployed within a hybrid configuration, its cache tier is used as both a read and write cache, staging hot data to improve system performance. In an all-flash configuration, 100 percent of the cache tier is used for the write buffer. Given the benefits of tiered storage, CM6 and CD6 SSDs are capable of meeting the demanding requirements of both enterprise and data center customers.

The growth of the NAND Flash market in 3Q21 was primarily driven by strong demand from the data center and smartphone industries, according to TrendForce's latest investigations. More specifically, NAND Flash suppliers' hyperscaler and enterprise clients kept up their procurement activities that began in 2Q21 in order to deploy products based on new processor platforms. Major smartphone brands, on the other hand, likewise expanded their NAND Flash procurement activities during the quarter as they prepared to release their new flagship models. As such, clients in both server and smartphone industries made significant contributions to the revenue growth of the NAND Flash industry for 3Q21. At the same time, however, suppliers also warned that orders from PC OEMs began showing signs of decline. On the whole, the industry's quarterly total NAND Flash bit shipment increased by nearly 11% QoQ for 3Q21, and the overall NAND Flash ASP rose by nearly 4% QoQ for the same quarter. Thanks to rising prices and expanding shipments, the quarterly total NAND Flash revenue increased by 15% QoQ to a new record high of US$18.8 billion in 3Q21.

Kioxia is continuing to expand its end user product range and its latest addition is an external USB-C SSD that goes by the name of Exceria Plus. It'll be available in 500 GB, 1 TB and 2 TB sizes, which seems like a decent range of size options. The USB-C interface sadly tops out at USB 3.2 Gen 2, or 10 Gbps speeds, which results in the corresponding maximum read speed of 1,050 MB/s and a maximum write speed of 1,000 MB/s.

The drive is MIL-STD-810H procedure IV impact tested, which means it can withstand a drop of about 1.2 metres onto reinforced concrete without taking any damage. The drive measures 105 x 45 x 14.7 mm (W x D x H) and weighs in at 76 grams, not including cables. Pricing in Japan starts at about US$78 and goes up to US$265.

KIOXIA, a worldwide leader in memory solutions, today announced the launch of the EXCERIA PLUS Portable SSD Series, scheduled to be released in November. The portable SSD series fits up to 2 TB of data in a new compact palm-size and rounded design. Compatible out-of-the-box with multiple host devices including PCs, smartphones, tablets and game consoles, making these portable SSDs suitable for on-the-go users and content creators seeking high-speed transfer of large data files.

The EXCERIA PLUS Portable SSD Series utilizes KIOXIA's BiCS FLASH 3D flash memory and offers a line-up of capacities in 500 GB, 1 TB and 2 TB. With a maximum sequential read speed of 1,050 MB/s, the new series features a USB Type-C connector with a USB 3.2 Gen2 interface enabling fast transferring of 4K videos and high-resolution photos. Each EXCERIA PLUS Portable SSD also includes cables of both Type-C to A and Type-C to C to ensure the drive works on both current and legacy systems.

According to an industry report by IC Insights, AMD will see a yearly growth rate of no less than 65 percent this year, compared to 2020, whereas Intel is expected to have a slightly negative growth rate of one percent. The report includes the top 25 semiconductor sales leaders, ranked by growth rate, although it should be pointed out that some of them are foundries and not just semiconductor companies.

AMD is closely followed by MediaTek, which is expected to reach a 60 percent growth rate this year, followed by Nvidia at 54 percent and Qualcomm and 51 percent growth. The only surprise in the top five is PRC based SMIC, which saw a 39 percent growth this year, despite, or maybe because of the US sanctions against various Chinese IC makers.

KIOXIA America, Inc. today announced that it has bolstered its lineup of PCIe 4.0 solid state drives (SSDs) with the addition of the KIOXIA BG5 Series. Designed to bring a suitable balance of performance, cost and power to everyday gamers and PC users, the KIOXIA BG5 Series is built with a PCIe 64 GT/s interface (Gen4 x4 lanes) and accelerated by the company's fifth-generation BiCS FLASH 3D flash memory technology.

As a virtual multi-LUN (VML)-enabled client SSD, the KIOXIA BG5 Series unlocks back-end flash performance while maintaining affordability, making it an especially attractive option for a wide range of commercial and consumer notebooks and desktops. KIOXIA BG5 SSDs also support the latest Host Memory Buffer (HMB) technology to realize a finely optimized DRAM-less SSD. The KIOXIA BG5 ships in a compact M.2 2230 single-sided, thermally optimized form factor enabling mobility and work-from-home lifestyles. M.2 2280 single-sided form factor versions are also available.

KIOXIA America, Inc. today announced the production availability of its EM6 Series Enterprise NVMe-oF solid state drives (SSDs) for Ethernet Bunch of Flash (EBOF) systems. Using the Marvell 88SN2400 NVMe-oF SSD converter controller that converts an NVMe SSD into a dual-ported 25Gb NVMe-oF SSD, KIOXIA EM6 Series drives expose the entire SSD bandwidth to the network.

Due to their ability to scale performance of NVMe SSDs, native NVMe-oF architectures are well-suited for applications such as artificial intelligence (AI)/machine learning (ML), high performance computing (HPC) and storage expansion. In the case of HPC, leveraging the Lustre file system, which is used to provide high bandwidth and parallel access to compute clusters, is beneficial to NVMe-oF based storage, such as EBOF systems with EM6 SSDs, that enable high availability (HA) configurations. An HPC HA configuration example consists of multiple and redundant network connections between a compute host and an EBOF with 88SN2400-connected NVMe SSDs, to deliver scalable throughput based on the number of SSDs.

Delivering on the promise of SSDs that address future enterprise infrastructure requirements, KIOXIA America, Inc. today announced production-ready availability of its 9.5 mm XD6 Series Enterprise and Datacenter Standard Form Factor (EDSFF) E1.S data center class SSDs. Introduced in late 2020, KIOXIA XD6 drives were the first EDSFF E1.S SSDs to address the specific requirements of hyperscale applications, including the performance, power and thermal requirements of the Open Compute Platform (OCP) NVMe Cloud SSD Specification. XD6 series also supports popular E1.S 15 mm and 25 mm form factor options, providing the flexibility to select the right balance of cooling through different E1.S heatsink options.

Representing the latest innovation in flash storage for servers in cloud and hyperscale data centers, KIOXIA EDSFF E1.S SSDs are designed to optimize system density, efficiency and management. As defined by the EDSFF consortium and leveraging the OCP NVMe Cloud SSD Specification, the small form factor E1.S replaces the M.2 form factor and delivers greater density, performance, reliability, and thermal management. E1.S is also designed to be hot pluggable for increased serviceability, which is another benefit over M.2.