The demand for data is insatiable, from 5G to the cloud to smart cities. As a society we want more autonomy, information to fuel our decisions and habits, and connection - to people, stories, and experiences.

To address these demands, the cloud infrastructure of tomorrow will need to handle the coming data explosion and the effective processing of evermore complex workloads … all while increasing power efficiency and minimizing carbon footprint. It's why the industry is increasingly looking to the performance, power efficiency, specialized processing and workload acceleration enabled by Arm Neoverse to redefine and transform the world's computing infrastructure.

Handheld portable consoles now enable a new way for people to play PC games, with flexibility. More and more brands have entered this market with constant evolution of the devices. AOKZOE, an emerging gaming&tech company in Shanghai, has now announced the world's first AMD 6800U console AOKZOE A1. In addition to A1's superior performance, the design details and console features will also surprise you.

AOKZOE will be the first to bring the portable console with AMD Ryzen 7 6800U to mass production. The much anticipated 6800U powered console will surely bring advancement to the gaming experience. With the combination of AMD Ryzen 7 6800U, the Radeon 680M graphics, along with LPDDR5X memory, AOKZOE A1 is able to deliver Elden Ring at 60 FPS and Forza over 100FPS in the official video demo.

MediaTek today announced the Dimensity 9000+, an enhancement to the company's top-of-the-line 5G smartphone chipset. This new high-end offering delivers a boost in performance over the Dimensity 9000 to make the next generation of flagship smartphones even more powerful and efficient.

The new Dimensity 9000+ system-on-chip (SoC) integrates Arm's v9 CPU architecture with a 4 nm octa-core process, combining one ultra-Cortex-X2 core operating at up to 3.20 GHz (compared to 3.05 GHz with the Dimensity 9000) with three super Cortex-A710 cores and four efficiency Cortex-A510 cores. The advanced CPU architecture and Arm Mali-G710 MC10 graphics processor built into the new chipset provide more than a 5% boost in CPU performance and more than 10% improvement in GPU performance.

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced that Qualcomm Technologies, Inc. has validated Samsung's 14-nanometer (nm) based 16-gigabit (Gb) Low Power Double Data Rate 5X (LPDDR5X) DRAM for use on Qualcomm Technologies' Snapdragon mobile platforms.

Since developing the industry's first 14 nm-based LPDDR5X DRAM last November, Samsung has worked closely with Qualcomm Technologies to optimize its 7.5 gigabit-per-second (Gbps) LPDDR5X for use with Snapdragon mobile platforms. Delivering about 1.2 times faster speed than the 6.4 Gbps LPDDR5 deployed in today's premium smartphones, Samsung's LPDDR5X is expected to boost the performance of ultra-high-resolution video recording as well as AI features such as voice recognition, image recognition and natural language processing in next-generation smartphones. Furthermore, by adopting advanced circuit designs as well as dynamic voltage and frequency scaling (DVFS), LPDDR5X power consumption can be reduced by approximately 20%.

MediaTek today launched its Dimensity 9000 5G smartphone chip for next-generation flagship smartphones, and announced device maker adoption and endorsements from some of the world's biggest smartphone brands, including OPPO, vivo, Xiaomi and Honor. The first Dimensity 9000 powered flagship smartphones will be in the market in the first quarter of next year. The Dimensity 9000 - the world's first smartphone built on the ultra-efficient TMSC N4 (4 nm-class) production process - leads the industry in computing performance, gaming, imaging, multimedia and connectivity innovations.

"The Dimensity 9000 is a milestone for MediaTek, highlighting our rise to incredible with a true flagship 5G smartphone chip. This chip signals MediaTek and our Dimensity family has entered a new phase of innovation," said Dr. Yenchi Lee, Deputy General Manager of MediaTek's Wireless Communications Business Unit. "The Dimensity 9000 is the most powerful and energy-efficient chip to date, delivering a number of industry firsts and a full suite of features for the most discerning tech enthusiasts."

Micron Technology, Inc. announced today that MediaTek Inc. has validated Micron's low-power double data rate 5X (LPDDR5X) DRAM for MediaTek's new Dimensity 9000 5G flagship chipset for smartphones. Micron is the first semiconductor company to sample and validate this fastest, most advanced mobile memory in the industry and has shipped the first batch of samples of LPDDR5X built on its first-to-market 1α (1-alpha) node. Designed for high-end and flagship smartphones, Micron's LPDDR5X allows the smartphone ecosystem to unlock the next wave of data-intensive applications powered by artificial intelligence (AI) and 5G innovation.

The market delivery and validation of Micron's industry-leading 1α-based LPDDR5X solidifies its product innovation and leadership in the mobile ecosystem, following industry-first launches for LPDDR5, 1α-based LPDDR4X, 176-layer NAND-based UFS 3.1 and uMCP5 solutions. This most recent milestone follows quickly on the heels of JEDEC's July release of the LPDDR5X extension to LPDDR5, created to offer higher bandwidth and memory speed for enhanced 5G communication and performance while still conserving power. Micron has validated samples supporting data rates up to 7.5 Gb/s, with samples supporting data rates up to 8.533 Gb/s to follow. Peak LPDDR5X speeds of 8.533 Gb/s deliver up to 33% faster performance than previous-generation LPDDR5.

"Innovating cutting-edge smartphone experiences requires memory technology built to address the massive bandwidth demands of the mobile market," said Raj Talluri, senior vice president and general manager of Micron's Mobile Business Unit. "Our collaboration with MediaTek to validate the world's most advanced mobile memory empowers the ecosystem to deliver the next wave of rich mobile features enhanced by 5G and AI."

A few years ago, MediaTek decided to leave the high-end mobile device SoC space as it decided to focus on the mid-range and entry level market, but as of today, that is no longer the case. The company has announced its new flagship Dimensity 9000 SoC and it packs all the latest cutting edge mobile SoC features you'd expect to see.

The Dimensity 9000 is based entirely on the new Arm v9 architecture and the chip itself is built in TSMC's 4 nm node, which gives MediaTek a lead on all its competitors, but Apple. As for the Arm cores in question, the main core is a Cortex-X2 at 3.05 GHz, which is accompanied by three Cortex-A710 cores at 2.85 GHz and four power efficient Cortex-A510 cores at 1.8 GHz. All of these new Arm cores were only announced at the end of May this year, so MediaTek has clearly been burning the midnight oil to get the Dimensity 9000 out before its competitors' new chips based on the Arm v9 architecture.

With its 12th Gen Core "Alder Lake-P" mobile processors still on the horizon, Intel is already building test batches of the 14th Gen "Meteor Lake" mobile processors, at its Fab 42 facility in Chandler, Arizona. "Meteor Lake" is a multi-chip module that leverages Intel's Foveros packaging technology to combine "tiles" (purpose built dies) based on different silicon fabrication processes depending on their function and transistor-density/power requirements. It combines four distinct tiles across a single package—the compute tile, with the CPU cores; the graphics tile with the iGPU: the SoC I/O tile, which handles the processor's platform I/O; and a fourth tile, which is currently unknown. This could be a memory stack with similar functions as the HBM stacks on "Sapphire Rapids," or something entirely different.

The compute tile contains the processor's various CPU core types. The P cores are "Redwood Cove," which are two generations ahead of the current "Golden Cove." If Intel's 12-20% generational IPC uplift cadence holds, we're looking at cores with up to 30% higher IPC than "Golden Cove" (50-60% higher than "Skylake."). "Meteor Lake" also debuts Intel's next-generation E-core, codenamed "Crestmont." The compute tile is rumored to be fabricated on the Intel 4 node (optically a 7 nm-class node, but with characteristics similar to TSMC N5).

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced that it has developed the industry's first 14-nanometer (nm) based 16-gigabit (Gb) Low Power Double Data Rate 5X (LPDDR5X) DRAM, designed to drive further growth throughout the high-speed data service applications including 5G, artificial intelligence (AI) and the metaverse.

"In recent years, hyperconnected market segments such as AI, augmented reality (AR) and the metaverse, which rely on extremely fast large-scale data processing, have been rapidly expanding," said SangJoon Hwang, senior vice president and head of the DRAM Design Team at Samsung Electronics. "Our LPDDR5X will broaden the use of high-performance, low-power memory beyond smartphones and bring new capabilities to AI-based edge applications like servers and even automobiles."

JEDEC Solid State Technology Association, the global leader in standards development for the microelectronics industry, today announced the publication of JESD209-5B, Low Power Double Data Rate 5 (LPDDR5). JESD209-5B includes both an update to the LPDDR5 standard that is focused on improving performance, power and flexibility, and a new LPDDR5X standard, which is an optional extension to LPDDR5.

Taken together, LPDDR5 and LPDDR5X are designed to significantly boost memory speed and efficiency for a variety of uses including mobile devices, such as 5G smartphones and artificial intelligence (AI) applications. Developed by JEDEC's JC-42.6 Subcommittee for Low Power Memories, JESD209-5B is available for download from the JEDEC website.