For those that don't remember the early days of ASRock, the company started out making some rather unusual motherboards, often with some wild and wacky upgrade paths, such as both a slot and a socket for a CPU or both AGP and PCIe graphics card slots. Since then, ASRock has become a much more mainstream motherboard maker, but the company appears to have gone back to its roots with what the company calls the X670 Xpansion Kit. Right now, the expansion card appears to be working with the B650 LiveMixer motherboard and it's unknown if it's compatible with other models from ASRock. It seems to be limited to ASRock motherboards only, due to the fact that the add-in card requires not only a x4 PCIe slot with all lanes attached, on the motherboard, but also a custom cable that is most likely for "low-speed" I/O's such as I2C, SPI and so on.

As the name suggests, the X670 Xpansion Kit allows B650 motherboards to be turned into X670 motherboards, more or less. The card is home to a second chipset, which enables not only two additional M.2 slots for PCIe 4.0 NVMe SSDs, but it also features two SATA ports, a 10 Gbps USB-C port, three USB-A ports and—maybe most interestingly—a 10 Gbps Ethernet interface. It's unclear if this will be a retail product, but the card provided to Level1Techs doesn't appear to be an engineer unit, but a full retail ready product. It's definitely an interesting upgrade path for those that have invested in a B650 motherboard and there's no real reason why this shouldn't work as well as having the second chipset on the motherboard, especially as ASRock appears to have fitted a signal re-driver on the add-in card to make sure the PCIe signals are handled properly.

AMD's entry-level A620 chipset for Socket AM5 motherboards is nearing launch, as manufacturers such as GIGABYTE and ASUS have started regulatory filing their upcoming products with the Eurasian Economic Commission (EEC). These would hopefully bring the starting prices of AM5 motherboards down to the USD $125 figure AMD promised. AMD will sufficiently differentiate A620 from the B650, using specs such as the lack of CPU overclocking capabilities, only a handful PCIe Gen 3 downstream lanes, and the lack of PCIe Gen 5 on both the PEG and CPU-attached M.2 slots (which could at least be limited to Gen 4 if not Gen 3).

While the motherboards themselves may be cheap, the overall platform costs may still end up higher than Intel's H610 or upcoming H710 chipsets; as Socket AM5 lacks DDR4 memory support, and even at the entry-level you'll be forced to buy DDR5. That said, what A620 promises is platform longevity, that the platform will support future processor generations that launch even beyond 2025. AMD dropped a major hint on A620 chipset motherboards availability in its 2023 CES Keynote address, when it pointed to "65 W CPUs and entry-level motherboards" alongside each other. The 65 W Ryzen 7000 series processors are already out, which means A620 should be just around the corner. February 2023 is when AMD looks to launch its high-end Ryzen 7000X3D processors.

Cooler Master at the 2023 International CES showed off the Cooling X, a patent-pending unique desktop PC architecture by the company where the liquid cooling of the CPU and GPU isn't confined to a couple of closed loop AIOs, but rather a giant liquid-cooling loop that even involves the side-panels of the case itself, that double up as additional heat-dissipation surfaces. Notice how some compact fanless cases use extruded-aluminium body panels that double up as heatsinks, to cool the hot components? The Cooling X re-imagines this, where instead of dissipating heat from a heatpipe, the extruded-aluminium body panels have coolant channels, so some of the heat from the liquid-cooling loop is dissipated. These panels supplement a conventional liquid-cooling radiator that's located along the rear panel, which has active ventilation. The liquid-cooling loop cools the processor and GPU.

For its compact dimensions of just 266 mm x 149 mm x 371 mm (LxWxH), the Cooling X prebuilt packs some mighty high-end hardware—an AMD Ryzen 9 5950X 16-core processor, and a Radeon RX 6800 XT GPU up to 64 GB of dual-channel DDR4-3200 memory, two 2 TB M.2 NVMe SSDs, and a homebrew 850 W 80 Plus Gold SFX power supply. For now Cooling X is just a codename, and Cooler Master intends to take this concept forward with high-performance gaming/creator prebuilt desktops sold under its own marquee.

Synology today announced the new 2-bay Synology DiskStation DS723+, the smallest expandable option in its lineup of all-in-one solutions for home offices and small businesses. Powered by the versatile Synology DiskStation Manager (DSM) operating system, the DS723+ offers comprehensive solutions to protect and manage business data, easily collaborate on documents, access files remotely, and monitor physical assets, all within a compact desktop format.

"This new unit delivers impressive performance and capability for its size," said Michael Wang, Product Manager at Synology. "With its extremely compact form factor, it will certainly appeal to those that have smaller storage requirements but don't want to give up on the convenience of centralized storage and the possibility to scale in the future."

QNAP Systems, Inc., a leading computing, networking, and storage solution innovator, today launched new high-performance TVS-h874 QuTS hero NAS models that incorporate 12th Gen Intel Core i9 sixteen-core, i7 twelve-core multi-thread processors with Intel Core Hybrid Technology for optimal computing performance and smooth multiple virtual machine (VM) operation. Integrating the reliable ZFS-based operating system, PCIe Gen 4 expandability, M.2 NVMe SSD caching, and 2.5GbE/10GbE connectivity, the TVS-h874 assists businesses in building high-performance storage environments for hosting multiple VM, application servers, and running business data backup/restore applications.

"The new TVS-h874 models adopt Intel Core Hybrid Technology, combining Performance-cores and Efficient-cores," said Andy Chuang, Product Manager of QNAP, adding "The Performance Hybrid Architecture intelligently allocates CPU cores to different tasks, thus increasing the performance of the new TVS-h874 models by 3.55 times compared with previous models."

ASRock Industrial is pleased to introduce a range of upgrades in industrial motherboards powered by 13th Gen Intel Core Processors (Raptor Lake-S) with up to 24 cores and 32 threads, supporting Intel W680, Q670, and H610 chipsets. Featured as the first DDR5 ATX motherboards, the IMB-1714, IMB-X1714, and IMB-1713 are brand-new selections while encompassing upgraded support for the 12th Gen Intel CPU motherboards lineup through BIOS update. They guarantee computing power with performance hybrid architecture and enhanced AI capabilities, rich IOs and expansions for up to PCIe Gen 5 slots, quad displays 4K@60 Hz, USB 3.2 Gen2x2 (20 Gbit/s), triple Intel 2.5 G LANs, multi-M.2 Key M, ECC memory, TPM 2.0, and more. The 13th Gen Intel CPU motherboards cover comprehensive form factors, including Mini-ITX, Micro-ATX, and ATX for diverse Edge AIoT applications, such as factory automation, kiosks, digital signage, smart cities, medical, and more.

13th Gen Intel Core Motherboards for Upgraded Performance
The upgraded motherboards feature 13th Gen Intel Core i9/i7/i5/i3 processors (Raptor Lake-S) with performance hybrid architecture, plus up to 24 cores and 32 threads that boost compute-intensive edge performance. They leap up to 1.04x/1.34x/1.25x faster in single-thread/multi-thread/CPU image classification inference performance compared to 12th Gen Intel Core processors. Leveraging its engineered flexibility and power, the new 13th Gen Intel Core motherboards run up to DDR5-5600 memory module for higher bandwidth, and PCIe 5.0 for additional expansion while supporting engaging video and digital signage experiences with Intel UHD Graphics driven by Xe architecture.

Samsung Electronics today announced production readiness of a high-performance PCIe 4.0 NVMe SSD, the PM9C1a. Integrated with a new controller based on Samsung's cutting-edge 5-nanometer (nm) process and the company's seventh-generation V-NAND technology, the PM9C1a will provide elevated computing and gaming performance in PCs and laptops.

"Our new PM9C1a SSD will deliver a robust combination of superior performance, greater power efficiency and increased security, which are the qualities that matter most to PC users," said Yong Ho Song, Executive Vice President of Memory Solution Product & Development at Samsung Electronics. "We are committed to creating storage that satisfies the diverse and changing market requirements as we continue to advance innovation in the PC SSD space."

Taiwan-based memory products OEM Datotek has been in business selling flash memory and DRAM products since 2004, with one of its most notable clients being HP. At the 2023 International CES, the company showcased its latest-generation memory products spanning not just HP-branded flash drives, but also flash drives under its own marquee, besides M.2 NVMe and 2.5-inch SATA SSDs; and PC memory spanning DDR5 and DDR4 generations. The company sells various vanilla (JEDEC spec) DDR5 and DDR4 memory modules in both standard U-DIMM and SO-DIMM form-factors. For gamers and enthusiasts, the company has the Ares line of premium DDR5 and DDR4 memory products, which come in overclocked speeds such as DDR5-6000 or DDR4-4000, including with RGB LED illumination.

Among its SSD products are a new PCIe Gen 5 NVMe SSD under the Ares brand, Gen 4 NVMe drives under the Ares Dark Sword brand, and various Gen 3 NVMe SSDs under the main Datotek brand. We also spotted several USB 3.2 portable SSDs, as well as 2.5-inch SATA 6 Gbps ones under the main brand. The idea here is to attract more brands for OEM partnerships the way rival Biwin makes SSD and DRAM products for various top brands (such as HP and Acer).

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions today announced the evolutionary AORUS Gen4 7300 SSD, which is the upgraded PCIe 4.0 SSD with read speed up to 7300 MB/s. Enhanced by the select PCIe 4.0 controller with advanced 3D-TLC NAND Flash, it provides superior performance than the previous generation PCIe 4.0 NVMe SSD. AORUS Gen4 7300 SSD with M.2 2280 interface comes in two capacity variants of 2 TB and 1 TB, along with a unique packaging design of separated SSD and heatsink packing to offer more flexible thermal solutions. Meanwhile, the GIGABYTE exclusive GCC software management platform provides the instant overview and adjustment of SSD status for a cool storage operation with high performance.

AORUS Gen4 7300 SSD equips the select Phison E18 8-channel controller, which provides users with ultimate random access rate, as well as the high-speed 3D-TLC NAND Flash and SLC cache design that brings the PCIe 4.0 into full play. Under the real test, AORUS Gen4 7300 SSD can reach a read speed up to 7300 MB/s and a write speed up to 6850 MB/s, which is faster than the previous gen. PCIe 4.0 NVMe SSD, two times faster than PCIe 3.0 SSD, and up to 13 times faster than SATA SSD. Enhanced by the multi-core architecture of the E18 controller, AORUS Gen4 7300 SSD not only improves AI multitasking to lessen the bottleneck of system performance, but powers up content creators, gamers, and users eager for extreme performance.

At the 2023 International CES, we caught a hold of Phison, makes or arguably the most popular SSD controllers, which sprung to prominence on being the first to market with PCIe Gen 4 NVMe controllers, and now hopes to repeat it with PCIe Gen 5. We'd been shown a reference-design Phison E26-powered M.2 SSD, along with some hardware specs of the controller itself. The drive itself isn't much to look at—a standard looking M.2-2280 drive with a PCI-Express 5.0 x4 host interface, and the Phison E26 controller with its shiny IHS being prominently located next to a DDR4 memory chip, and two new-generation Micron Technology 3D NAND flash memory chips.

The Phison E26 controller, bearing the long-form model number PS5026-E26, is an NVMe 2.0 spec client-segment SSD controller. It has been built on the TSMC 12 nm FinFET silicon-fabrication node. The controller features an integrated DRAM controller with support for DDR4 and LPDDR4 memory types for use as DRAM cache. Its main flash interface is 8-channel with 32 NAND chip-enable (CE) lines, support for TLC and QLC NAND flash, a dual-CPU architecture, and hardware-acceleration for AES-256, TCG-Opal, and Pyrite. The controller features Phison's 5th generation LPDC ECC and internal RAID engines. For its reference-design 2 TB TLC-based drive, Phison claims sequential transfer rates of up to 13.5 GB/s reads, with up to 12 GB/s writes. The 4K random-access performance is rated at up to 1.5 million IOPS reads, with up to 2 million IOPS writes.

A relatively new entrant to the PC cooling space, Iceberg Thermal had its first major in-person outing at CES, with the exhibition of several of its newest CPU coolers, purpose-built heatsinks, case fans, and thermal pastes. To begin with, the company showed off its IceGale Xtra, IceGale ARGB, and IceGale Silent case fans. The IceGale Xtra comes in 80 mm, 120 mm, and 140 mm sizes, and in color options of icy-blue, gray, and black. These fans lack illumination, but offer a solid combination of high RPM range and dual-ball bearings. The IceGale ARGB fans are essentially the same, but come only in 120 mm and 140 mm sizes, and only in icy-blue and black frame options. These ones feature addressable RGB LEDs in the fan impeller hub, with the frost-finish impeller blades diffusing the light. The IceGale Silent series is a line of entry-level case fans that come in 120 mm size and black trim, with sleeve bearings. The fan is claimed to offer a noise output of just 12.3 dBA.

The FuzeIce thermal interface material ships in flattened piston syringes that double up as applicators. This is an electrically non-conductive TIM that offers thermal conductivity of 11.25 W/mK, 56,000 poise viscosity, and 2.6 g/cm³ density. It comes in 3.5 g and 7 g syringes. Iceberg Thermal also showed off a wide range of custom-design heatsinks that are purpose-built for a wide range of cooling needs. These are not sold to customers in the retail channel, but the company is looking to become an OEM for purpose-built air-cooling solutions. Moving on to the good stuff, and we see the company show off a trio of its IceSleet series CPU coolers for the DIY retail channel. These include the IceSleet G4 OC, IceSleet G4 Midnight, IceSleet X5, IceSleet X6, IceSleet X7 Dual, IceSleet X9 Dual, and a couple of IceFloe low-profile coolers.

The online datasheets of some of the first AMD Ryzen 7040 series "Phoenix Point" mobile processors went live, detailing the processor's I/O feature-set. We learn that AMD has decided to give PCI-Express Gen 5 a skip with this silicon, at least in its mobile avatar. The Ryzen 7040 SoC puts out a total of 20 PCI-Express Gen 4 lanes, all of which are "usable" (i.e. don't count 4 lanes toward chipset-bus). This would mean that the silicon has a full PCI-Express 4.0 x16 interface for discrete graphics, and a PCI-Express 4.0 x4 link for a CPU-attached M.2 NVMe slot; unlike the "Raphael" desktop MCM and the "Dragon Range" mobile MCM, whose client I/O dies put out a total of 28 Gen 5 lanes (24 usable, with x16 PEG + two x4 toward CPU-attached M.2 slots).

Another interesting aspect about "Phoenix Point" is its memory controllers. The SoC features a dual-channel (four sub-channel) DDR5 memory interface, besides support for LPDDR5 and LPDDR5x. DDR5-5600 and LPDDR5-7600 are the native speeds supported. What's really interesting is the maximum amount of memory supported, which stands at 256 GB—double that of "Raphael" and "Dragon Range," which top out at 128 GB. This bodes well for the eventual Socket AM5 APUs AMD will design based on the "Phoenix Point" silicon. Older Ryzen 5000G "Cezanne" desktop APUs are known for superior memory overclocking capabilities to 5000X "Vermeer," with the monolithic nature of the silicon favoring latencies. Something similar could be expected from "Phoenix Point."

German boutique gaming notebook and mobile workstation builder Schenker XMG unveiled its latest line of mobile powerhouses that combine 13th Gen Core "Raptor Lake-HX" mobile processors and NVIDIA GeForce RTX 40-series "Ada Lovelace" Laptop GPUs. The 2023 XMG Neo 17 packs an 8P+16E Core i9-13900HX processor, two DDR5 SO-DIMM slots, an NVIDIA GeForce RTX 4090 Laptop GPU with 175 W power limit, and a 17-inch 16:10 2560 x 1600 pixels display that supports G-SYNC. The machine supports NVIDIA Advanced Optimus power management. Its centered keyboard features Cherry MX ULP Tactile mechanical keyswitches. The XMG Neo 17 is designed to provide a power-packed mobile workstation and gaming experience on the move. There is a slightly smaller version of the same notebook, the XMG Neo 15, but with a 15.6-inch display, but the same hardware.

While the XMG Neo 17 is positioned more like a mobile workstation, the 2023 XMG Ultra 17 is thoroughly wooing competitive gamers and PC enthusiasts, with its RGB LED-illuminated keyboard, a meatier heatsink designed for extended gameplay sessions, and an overall racy product design. Under the hood is similar hardware to the Neo, with an i9-13900HX 8P+16E processor, two DDR5-5600 SO-DIMM slots, an M.2 NVMe Gen 5 SSD, two Thunderbolt 4 interfaces, and that sweet GeForce RTX 4090 Laptop GPU with 175 W PL. the XMG Neo has an interesting air+liquid hybrid cooling solution that is detachable.

MSI in its 2023 International CES booth showed us their upcoming M.2 PCIe Gen 5 + NVMe 2.0 SSDs, the Spatium M570 PRO and the Spatium M570. The M570 PRO unsurprisingly is the faster of the two, and rocks a sophisticated new cooling solution by MSI. A vapor-chamber plate makes direct contact with the controller and other hot components on the drive, conveying heat to a heatsink with a very fine aluminium fin-stack, whcih is capped off by a die-cast aluminium top-plate. This design, MSI claims, optimizes convectional airflow without interference from nearby airflow sources (such as CPU coolers).

The Spatium M570 PRO offers sequential transfer rates of up to 12 GB/s reads, with up to 10 GB/s writes, and is available in capacities of 1 TB, 2 TB, and 4 TB. The MSI Spatium M570 (non-PRO) rocks a simpler ridge aluminium monoblock heatsink, and comes in the same capacity options, but with lower maximum read performance. You get up to 10 GB/s sequential reads, with up to 10 GB/s sequential writes with this one.

GIGABYTE in its 2023 International CES booth, showed off its upcoming flagship M.2 NVMe SSD, the AORUS Gen5 10000. Built in the M.2-2280 form-factor with PCI-Express 5.0 x4 interface and supporting NVMe 2.0 protocol, the drive is based on a Phison E26-series controller. coupled with the latest 3D TLC NAND flash. It comes in capacities of 1 TB, 2 TB, and 4 TB. Sequential transfer-rates put out by GIGABYTE put the drive at up to 12 GB/s reads, with up to 10 GB/s sequential writes.

That's hardly the most striking aspect of this drive, which is a massive aluminium dual-fin-stack heatsink that uses two fin-stacks joined at the hip by a pair of heatpipes, in what is a callback to GIGABYTE's Nehalem motherboards that used such enormous heatsinks over the X58 northbridge. GIGABYTE calls this heatsink the AORUS Xtreme Thermal Guard. The company's current flagship is the AORUS 7000, which rocks a Gen4 interface, offering up to 7 GB/s reads, with up to 5 GB/s writes.

Acer at the 2023 International CES showed off its latest lineup of memory and storage products targeting the DIY PC enthusiast market segment under its high-end Predator brand. Leading the booth is the Vesta II line of DDR5 memory modules featuring a high-end product design, and RGB LED lighting. The one shown to us featured a rather modest DDR5-5200 speed and 2x 16 GB density, but the company assured it is spreading the lineup to higher frequencies. The Pallas II line of performance-segment memory targeting creators, for example, does DDR5-6000.

A star attraction in the booth was the Predator GM7 M.2 NVMe SSD. Built in the M.2-2280 form-factor, the drive features a PCI-Express 4.0 x4 + NVMe 2.0 host interface, and combines a Maxiotech MAP1602 controller with YMTC 232-layer 3D TLC NAND flash based on the Xtacking 3.0 architecture. The drive offers sequential transfer speeds of up to 7400 MB/s reads, with up to 6300 MB/s writes, and comes in sizes of 512 GB, 1 TB, and 2 TB, priced at USD $49.90, $89.90, and $159.99, respectively. Acer is backing these drives with a 5-year warranty.

ADATA SE920 is the company's first portable SSD to take advantage of USB4 and offer transfer-speeds that utilize that added interface bandwidth. The drive features a 40 Gbps USB4 interface, with a single cable handling both power and host connectivity. Internally, this is an M.2 PCIe Gen 4 SSD that's been wired to an ASMedia ASM2464PD chip that converts a 40 Gbps USB4 uplink to a PCI-Express 4.0 x4 downlink, and hence the internal drive has slightly more bandwidth than PCI-Express 3.0 x4 (32 Gbps).

The ADATA SE920 comes in capacity variants of 1 TB and 2 TB. Both variants offer sequential transfer rates of up to 3800 MB/s reads, with up to 3200 MB/s writes. The brushed aluminium enclosure has a mechanism that slides out a diagonal insert with air vents for an active cooling mechanism inside, which cools the internal drive, the bridge chip, and some power components. A USB4 type-C to type-C cable is included with the drive.

Here are some of the first pictures of the yet-unnamed PCIe Gen 5-based NVMe SSD by ADATA XPG. Built in the M.2-2580 form-factor, the drive features a PCI-Express 5.0 x4 host interface and NVMe 2.0 protocol. At its core is a Silicon Motion SM2508 series controller, coupled with the latest generation 3D TLC NAND flash over a large number of flash channels; and a faster DRAM cache. The drive offers sequential transfer rates of up to 14 GB/s reads, with up to 12 GB/s writes. and 2 million IOPS 4K random transfers. It comes in capacity-based variants, with 8 TB being the largest one.

The most striking aspect about this drive is its active cooling solution. A ridged aluminium monoblock heatsink is used to cool the SM2508 controller. nestled in its center is what appears to be a miniature 10 mm lateral fan. The heatsink has surface-crystallization treatment to increase surface area for heat dissipation. A die-cast aluminium top-plate and 3-sided backplate sandwich the fan-heatsink and the main PCB. The fan is tightly controlled by temperature, and ADATA claims you should barely notice it. To use the drive to its fullest, you'll either need an AMD Ryzen 7000 "Zen 4" platform that has dedicated PCIe Gen 5 M.2 slots wired to the processor, or an Intel 700-series chipset motherboard that puts out a Gen 5 M.2 slot by subtracting lanes from the Gen 5 PEG slot.

Acer today announced refreshed models of its Aspire all-in-ones and laptops, designed to support families' day-to-day productivity and entertainment needs, while adding a touch of style to the home environment. The sleek Acer Aspire S all-in-one PCs come in both 27-inch and 32-inch models and are equipped with up to the latest 13th Gen Intel Core processors and Windows 11 to empower a seamless computing experience. Providing efficiency and reliability for multi-tasking users working from home, the Aspire 5 Series laptops come with the latest 13th Gen Intel Core processors and NVIDIA GeForce RTX GPUs, while the lightweight Aspire 3 Series notebooks deliver ready-to-go performance.

Acer also introduced the newest member of its smart speaker family with the Acer Halo Swing Smart Speaker with Google Assistant, DTS Sound and features a LED dot display, bringing users quality audio and dazzling lights everywhere they go.

Lexar, a leading global brand of flash memory solutions, is unveiling new products specifically made for gaming at the Consumer Electronics Show 2023 (CES 2023). The new gaming portfolio includes a variety of products, including DRAM, internal SSDs, portable gaming SSDs, and to keep up with increasing mobile category growth, microSD cards.

Among the gaming lineup are the new ARES DDR5 RGB 6000 MHz, as well as existing products NM800PRO with Heatsink M.2 2280 PCIe Gen 4 x4 NVMe SSD, the SL660 BLAZE Gaming Portable SSD, and the PLAY microSD UHS-I Card. "We are excited to bring the quality, performance, and reliability you expect in our professional photo and video products to the gaming market. Our gaming products are designed to meet the unique needs of gamers and enable them to play at their peak without worrying about load times, game lag, or stuttering graphics," said Joel Boquiren, General Manager of Lexar.

Leading global motherboard manufacturer, ASRock, proudly announces its new series of Intel B760 motherboards, including B760M Steel Legend WiFi, B760M Pro RS, and special edition B760M PG SONIC WiFi. These feature-filled motherboards are designed to bring supreme performance and the latest technologies - including up to PCI-Express 5.0 & overclocked DDR5 - to benefit more PC enthusiasts, gamers, and office/workstation builds than ever before. The B760 chipset is designed for the latest 13th Generation Intel Core 'K' or 'non-K' series processors (socket LGA1700), while also supporting the previous 12th generation.

Followed by the success and critical acclaim of the ASRock Z790 PG SONIC, the company has released another officially licensed motherboard featuring SEGA's Sonic the Hedgehog: the B760M PG SONIC WiFi. Based on the mainstream Intel B760 chipset, this micro ATX motherboard features all the exciting SONIC elements in a small form factor and budget friendly design.

Intel introduced the Z790 platform to the market last year and impressed enthusiastic gamers. This year, we expect the introduction of the latest B760 platform. MSI's new B760 motherboards lineup will spring a surprise for mainstream users, attracting interest and sparking widespread discussion. Targeting the mainstream market, MSI B760 motherboards have unique designs and loaded specifications. Let's explore more about the B760 platform.

The B760 platform has lots of amazing features accompanied by MSI's MPG, MAG, and PRO Series. The mainstream users' choice - MAG Series includes black TOMAHAWK and white MORTAR motherboards. The MSI MAG Series motherboards adopted 12 Duet Rail Power System with 75 A DrMOS and 6 layer PCB with 2oz thickened copper, which provides stable currents delivered to the CPU. For expansion, the MSI MAG Series supports Lightning Gen 5 PCIe and owns up to 3 onboard M.2 Gen4 slots. To deal with the heat generated in high-loading operation, the MAG Series features premium thermal solutions including All Aluminium Design and Extended Heatsink. The M.2 slots are covered with M.2 Shield Frozr as well.

MSI is announcing the launch of our new Gen4 PCIe NVMe models to its SSD category - SPATIUM M461, M452 & M453 in M.2 2280 form factors that can be easily installed into compatible desktop motherboards and laptops. These new products allow MSI to continue to refine its identity as a high-performance PC brand and grow its product ecosystem by expanding SPATIUM, our high-performance storage category. Our SSDs are built with high-quality, high-density 3D NAND flash that delivers astonishing performance and endurance for professionals, content creators, and gamers.

SPATIUM M461, The Competitive PCIe 4.0 SSD for Mainstream Segment.
SPATIUM M461 was developed to meet the expectations of mainstream SSD consumers. Blazing fast speeds up to 5000 MB/sec sequential read and 4200 MB/sec sequential write speeds allow users using the latest generation of PCs to enjoy the capabilities of the PCIe Gen4 interface. Available storage capacities are 500 GB, 1 TB, 2 TB, and 4 TB.

Greenliant is now shipping mSATA and SATA M.2 2242 ArmourDrive EX Series solid state drives (SSDs) with EnduroSLC Technology for superior data retention and high endurance ranging from 60K and 120K to the industry-leading 300K program-erase (P/E) cycles. Built with Greenliant's advanced in-house controllers, these SSDs are available in 10 GB, 20 GB, 40 GB, 80 GB, 160 GB and 320 GB capacities.

mSATA and SATA M.2 2242 ArmourDrive EX Series SSDs are included in Greenliant's Long-Term Availability (LTA) program (http://bit.ly/SSD-LTA-program), providing customers with a stable portfolio of high-endurance data storage products for up to 10 years. Greenliant is also shipping mSATA and SATA M.2 2242 / 2280 ArmourDrive PX Series SSDs using cost-effective industrial 3-bit-per-cell (TLC) 3D NAND. These SSDs support 5K P/E cycles and are available in 64 GB, 128 GB, 256 GB and 512 GB capacities.

GIGABYTE, the world's leading computer brand, is known for its stylish and high-performing motherboards, graphics cards, gaming monitors, and more. The award-winning products are praised by worldwide consumers for their class-leading build quality and performance. What makes GIGABYTE products even more impressive is their friendly designs based on a thorough understanding of user needs and expectations. These ingenious designs are primed to make the products easier to assemble and upgrade for a much-enhanced user experience.

GIGABYTE's Intel-based Z790 series and AMD AM5-based X670, B650 gaming motherboards are equipped with tech that makes PC building and upgrades as easy as possible. The DIY-friendly PCIe EZ-Latch design allows users to easily detach the graphics card from the PCIe slot with a quick-release mechanism; the M.2 EZ-Latch makes installing M.2 SSDs effortless thanks to the screwless design. These latest-gen motherboards also support Intel XMP and AMD EXPO overclocking memory modules for maximum compatibility, and GIGABYTE BIOS comes packaged with pre-installed profiles to help users get greater performance with ease.