Advantech (2395.TW), a global leader in intelligent IoT systems and embedded platforms, is excited to announce the EAI-3101, a brand-new industrial PCIe GPU card powered by the Intel Arc A380E, built for 5-year longevity. Featuring 128 Intel Xe matrix AI engines, this GPU card delivers outstanding AI computing power of 5.018 TFLOPS, surpassing the capabilities of the NVIDIA T1000, 2 times over. With ray tracing technology and Intel XeSS AI-upscaling, the EAI-3101 supports up to 8K UHD resolution and achieves a 50% enhancement in graphics performance over the NVIDIA T1000.

To aid in quickly realizing Vision AI, Advantech provides the Edge AI SDK, a rapid AI development toolkit compatible with Intel OpenVINO, which can process the same workload in 40% less time. This groundbreaking graphics solution, with optimized thermal design and an auto smart fan, is specially engineered for image processing and AI acceleration across gaming, medical analysis, and video surveillance. Advantech will demonstrate the EAI-3101 GPU card from April 9th to 11th at the Embedded World 2024 (Hall 3, booth no. 339) in Nuremberg, Germany.

We're excited to announce we're expanding our AI Inference benchmark offerings with the UL Procyon AI Image Generation Benchmark, coming Monday, 25th March. AI has the potential to be one of the most significant new technologies hitting the mainstream this decade, and many industry leaders are competing to deliver the best AI Inference performance through their hardware. Last year, we launched the first of our Procyon AI Inference Benchmarks for Windows, which measured AI Inference performance with a workload using Computer Vision.

The upcoming UL Procyon AI Image Generation Benchmark provides a consistent, accurate and understandable workload for measuring the AI performance of high-end hardware, built with input from members of the industry to ensure fair and comparable results across all supported hardware.

Qualcomm Snapdragon X Elite is about to make landfall in the ultraportable notebook segment, powering a new wave of Windows 11 devices powered by Arm, capable of running even legacy Windows applications. The Snapdragon X Elite SoC in particular has been designed to rival the Apple M3 chip powering the 2024 MacBook Air, and some of the "entry-level" variants of the 2023 MacBook Pros. These chips threaten the 15 W U-segment and even 28 W P-segment of x86-64 processors from Intel, such as the Core Ultra "Meteor Lake," and Ryzen 8040 "Hawk Point." Erdi Özüağ, prominent tech journalist from Türkiye, has access to a Qualcomm-reference notebook powered by the Snapdragon X Elite X1E80100 28 W SoC. He compared its performance to an off-the-shelf notebook powered by a 28 W Intel Core Ultra 7 155H "Meteor Lake" processor.

There are three tests that highlight the performance of the key components of the SoCs—CPU, iGPU, and NPU. A Microsoft Visual Studio code compile test sees the Snapdragon X Elite with its 12-core Oryon CPU finish the test in 37 seconds; compared to 54 seconds by the Core Ultra 7 155H with its 6P+8E+2LP CPU. In the 3DMark test, the Adreno 750 iGPU posts identical performance numbers to the Arc Graphics Xe-LPG of the 155H. Where the Snapdragon X Elite dominates the Intel chip is AI inferencing. The UL Procyon test sees the 45 TOPS NPU of the Snapdragon X Elite score 1720 points compared to 476 points by the 10 TOPS AI Boost NPU of the Core Ultra. The Intel machine is using OpenVINO, while the Snapdragon is using Qualcomm SNPE SDK for the test. Don't forget to check out the video review by Erdi Özüağ in the source link below.

At MWC 2024, Intel announced its new Edge Platform, a modular, open software platform enabling enterprises to develop, deploy, run, secure, and manage edge and AI applications at scale with cloud-like simplicity. Together, these capabilities will accelerate time-to-scale deployment for enterprises, contributing to improved total cost of ownership (TCO).

"The edge is the next frontier of digital transformation, being further fueled by AI. We are building on our strong customer base in the market and consolidating our years of software initiatives to the next level in delivering a complete edge-native platform, which is needed to enable infrastructure, applications and efficient AI deployments at scale. Our modular platform is exactly that, driving optimal edge infrastructure performance and streamlining application management for enterprises, giving them both improved competitiveness and improved total cost of ownership," said Pallavi Mahajan, Intel corporate vice president and general manager of Network and Edge Group Software.

At MWC 2024, Intel announced new platforms, solutions and services spanning network and edge AI, Intel Core Ultra processors and the AI PC, and more. In an era where technological advancements are integral to staying competitive, Intel is delivering products and solutions for its customers, partners and expansive ecosystem to capitalize on the emerging opportunities of artificial intelligence and built-in automation, to improve total cost of ownership (TCO) and operational efficiency, and to deliver new innovations and services.

Across today's announcements, Intel is focused on empowering the industry to further modernize and monetize 5G, edge and enterprise infrastructures and investments, and to take advantage of bringing AI Everywhere. For more than a decade, and alongside Intel's customers and partners, the company has been transforming today's network infrastructure from fixed-function to a software-defined platform and driving success at the edge with more than 90,000 real-world deployments.

Intel Corporation today reported fourth-quarter and full-year 2023 financial results. "We delivered strong Q4 results, surpassing expectations for the fourth consecutive quarter with revenue at the higher end of our guidance," said Pat Gelsinger, Intel CEO. "The quarter capped a year of tremendous progress on Intel's transformation, where we consistently drove execution and accelerated innovation, resulting in strong customer momentum for our products. In 2024, we remain relentlessly focused on achieving process and product leadership, continuing to build our external foundry business and at-scale global manufacturing, and executing our mission to bring AI everywhere as we drive long-term value for stakeholders."

David Zinsner, Intel CFO, said, "We continued to drive operational efficiencies in the fourth quarter, and comfortably achieved our commitment to deliver $3 billion in cost savings in 2023. We expect to unlock further efficiencies in 2024 and beyond as we implement our new internal foundry model, which is designed to drive greater transparency and accountability and higher returns on our owners' capital." For the full year, the company generated $11.5 billion in cash from operations and paid dividends of $3.1 billion.

At its "AI Everywhere" launch in New York City today, Intel introduced an unmatched portfolio of AI products to enable customers' AI solutions everywhere—across the data center, cloud, network, edge and PC. "AI innovation is poised to raise the digital economy's impact up to as much as one-third of global gross domestic product," Gelsinger said. "Intel is developing the technologies and solutions that empower customers to seamlessly integrate and effectively run AI in all their applications—in the cloud and, increasingly, locally at the PC and edge, where data is generated and used."

Gelsinger showcased Intel's expansive AI footprint, spanning cloud and enterprise servers to networks, volume clients and ubiquitous edge environments. He also reinforced that Intel is on track to deliver five new process technology nodes in four years. "Intel is on a mission to bring AI everywhere through exceptionally engineered platforms, secure solutions and support for open ecosystems. Our AI portfolio gets even stronger with today's launch of Intel Core Ultra ushering in the age of the AI PC and AI-accelerated 5th Gen Xeon for the enterprise," Gelsinger said.

Building on the AI PC use cases shared at Innovation 2023, Intel today launched the AI PC Acceleration Program, a global innovation initiative designed to accelerate the pace of AI development across the PC industry.

The program aims to connect independent hardware vendors (IHVs) and independent software vendors (ISVs) with Intel resources that include AI toolchains, co-engineering, hardware, design resources, technical expertise and co-marketing opportunities. These resources will help the ecosystem take full advantage of Intel Core Ultra processor technologies and corresponding hardware to maximize AI and machine learning (ML) application performance, accelerate new use cases and connect the wider PC industry to the solutions emerging in the AI PC ecosystem. More information is available on the AI PC Acceleration Program website.

As the world experiences a generational shift to artificial intelligence, each of us is participating in a new era of global expansion enabled by silicon. It's the "Siliconomy," where systems powered by AI are imbued with autonomy and agency, assisting us across both knowledge-based and physical-based tasks as part of our everyday environments.

At Intel Innovation, the company unveiled technologies to bring AI everywhere and to make it more accessible across all workloads - from client and edge to network and cloud. These include easy access to AI solutions in the cloud, better price performance for Intel data center AI accelerators than the competition offers, tens of millions of new AI-enabled Intel PCs shipping in 2024 and tools for securely powering AI deployments at the edge.

UDOO, known for embedded and single-board computing, has launched a pair of x86 equipped SBCs utilizing Intel's Apollo Lake SoCs and aimed at the low-power machine learning and edge AI markets. The UDOO VISION line of SBCs come in two distinct flavors at launch: VISION X5 and VISION X7. As the names imply, the VISION X5 comes equipped with an Intel Atom x5-E3940, while the VISION X7 has an Intel Atom x7-E3950. Neither of these SoCs is particularly fresh, with the designs dating back to 2014, however for the intended use case they should provide ample performance. UDOO states,"The UDOO VISION is the ultimate choice for computer vision projects thanks to the excellent performance of the Intel Apollo Lake SoC [System on Chip] and the Intel distribution of OpenVINO framework ready to be installed."

Aside from the processor differences the VISION X5 comes with 4 GB of LPDDR4 DRAM and 32 GB of eMMC storage, while the higher spec VISION X7 comes with 8 GB of LPDDR4 and 64 GB eMMC. Both models include an ATmega32U4 microcontroller, a 26-pin Arduino Leonardo's pinout for modularity, a COM port supporting RS232/RS422/RS485, two USB 2.0 headers, two USB 3.0 ports, dual Gigabit Ethernet LAN, M.2 E-Key for WLAN/Bluetooth expansion, M.2 B-Key for SATA SSD expansion, RTC, infrared, one mini DisplayPort, one eDP connector, and a fan header for the bundled full-cover active heatsink. UDOO lists the VISION X5 at $349 USD, and the VISION X7 at $419 USD.

AAEON, a leading producer of industrial motherboards, has announced the release of the MIX-Q670A1, the most advanced Mini-ITX board it has ever produced. The first AAEON solution across any of its product ranges to support both 12th and 13th Generation Intel Core i9/i7/i5/i3/Pentium /Celeron processors (formerly Alder Lake-S and Raptor Lake-S respectively), the MIX-Q670A1 harnesses up to 24 cores, 32 threads, and a host of peripheral technologies including Intel vPro, Intel Thermal Velocity Boost, and Intel UHD Graphics 770.

AAEON believe the MIX-Q670A1 will become the gold-standard for applications requiring real-time, high-performance computing on the edge. Supporting 64 GB of dual-channel DDR5 4800 MHz system memory and a PCIe [x16] Gen 5 slot, the MIX-Q670A1 offers a 44% increase in memory speed over previous generations. Combining this speed with an I/O consisting of two LAN, two COM, and ten USB ports, the MIX-Q670A1 offers both a wealth of connectors for peripheral devices and real-time data transmittance on the edge for smart city applications.

AAEON, a leading manufacturer of AI development solutions, has released the UP Squared Pro 7000, bringing the acclaimed UP Squared Pro series into its third generation. The UP Squared Pro 7000 sees dramatic improvements when compared to the boards preceding it. The first of these is that it is the world's first industrial motherboard equipped with the Intel Core /Atom /N-Series processor platform (formerly Alder Lake-N), which offers 1.4x the CPU performance of the previous generation, alongside the benefit of supporting the Intel Distribution of OpenVINO Toolkit. In addition, the board hosts 16 GB of onboard LPDDR5 4800 MHz system memory, doubling the bandwidth and data transfer speed of the previous model, while also increasing overall energy-efficiency.

A first for the UP Squared Pro product line, the UP Squared Pro 7000 supports MIPI CSI cameras via an FPC port, freeing up its two 2.5 GbE (Intel i226-IT) and three USB 3.2 Gen 2 ports for other peripheral devices. Developers also gain access to exceptional expansion from the dense, 4" x 4" (101.6 mm x 101.6 mm) board, with the same 40-pin GPIO header alongside M.2 E, M, and B Keys for CNVI, PCIe, and USB add-ons.

AAEON, a leading manufacturer of AI development solutions, announces the UP Xtreme i12 Edge, its latest addition to the UP product series. The UP Xtreme i12 Edge makes substantial upgrades on its predecessor with the power-efficient multicore architecture of 12th Generation Intel Core i7/i5/i3/Celeron Processors (formerly Alder Lake-P), onboard LPDDR5, and AI module support all contributing to its potential as a system suited to industrial, healthcare, and transport applications.

Providing exceptional expansion options, the UP Xtreme i12 Edge has four M.2 Keys for Wi-Fi 6, 5G, AI and PCIe 4.0 storage module support. With such options, users are able to bring edge AI computing capabilities to a wider variety of markets. Further, the UP Xtreme i12 Edge supports Intel Iris Xe graphics, Intel DL Boost, and the Intel Distribution of OpenVINO Toolkit, boosting GPU image classification inferencing performance by up to 2.81 times that of the previous generation.

QNAP Systems, Inc., a leading computing, and storage solutions innovator, today launched the TS-x62 NAS series. Powered by Intel Celeron dual-core processors, the series includes the 2-bay TS-262 and 4-bay TS-462 models. Both models feature a 2.5GbE port and two M.2 PCIe slots for SSD caching, enabling higher transfer speeds and faster data access to supercharge diverse storage applications. There is also a PCIe Gen 3 slot allowing users to expand NAS functionality with a range of QNAP PCIe cards. Multimedia stored on the TS-x62 can be streamed throughout the home, an enjoyed directly on a TV or monitor with the HDMI 2.1 output.

"We are pleased to have worked with QNAP to release the TS-x62 series which covers various use scenarios for home users, such as 4K media streaming, centralized storage, and efficient file backup. The Intel Celeron N4505 processor delivers attractive performance for home NAS models with its greater collaboration and multitasking capability," said Jason Ziller, General Manager, Client Connectivity Division at Intel Corporation.

Adding to its incredibly popular UP Xtreme product line, industry leader AAEON has announced the release of the UP Xtreme i12, the next generation developer board with 12th Generation Intel Core Processors (formerly Alder Lake-P). Improving upon the 11th Generation Intel Core Processor SoC of its predecessor, the UP Xtreme i11, AAEON's next-generation UP Xtreme i12 utilizes the 12 core, 16 thread hybrid architecture of 12th Generation Intel Core Processors, making it more energy-efficient despite possessing double the previous generation's thread count. With these improvements, the UP Xtreme i12 offers up to 20% greater CPU performance, while also hosting 32 GB onboard LPDDR5 system memory, which provides double the bandwidth and memory capacity of the previous generation.

The UP Xtreme i12's configuration of HDMI 2.0b, eDP 1.4, and two DP 1.4 slots give it the necessary tools to host four simultaneous 4K displays, alongside USB 4.0 and 2.5 GbE ports ensuring high-speed connectivity to peripheral cameras. Compounding this powerful, efficient function is the 2.47 x increase in graphics speed provided by Intel Iris Xe graphics, which makes the board an excellent candidate for smart retail deployments.

On Day 2 of Intel Innovation, Intel illustrated how its efforts and investments to foster an open ecosystem catalyze community innovation, from silicon to systems to apps and across all levels of the software stack. Through an expanding array of platforms, tools and solutions, Intel is focused on helping developers become more productive and more capable of realizing their potential for positive social good. The company introduced new tools to support developers in artificial intelligence, security and quantum computing, and announced the first customers of its new Project Amber attestation service.

"We are making good on our software-first strategy by empowering an open ecosystem that will enable us to collectively and continuously innovate," said Intel Chief Technology Officer Greg Lavender. "We are committed members of the developer community and our breadth and depth of hardware and software assets facilitate the scaling of opportunities for all through co-innovation and collaboration."

Intel has announced the availability of its 12th Gen Intel Core SoC processors for IoT Edge. Representing a new lineup of purpose-built edge products optimized for Internet of Things (IoT) applications, this first-of-its-kind socketed system-on-chip (SoC) delivers high performance integrated graphics and media processing for visual compute workloads, a compact footprint to enable smaller innovative form factor designs, and a wide operating thermal design power (TDP) that enables fanless designs and helps customers achieve product sustainability goals.

"As the digitization of business processes continues to accelerate—fueled by workforce demand, supply chain constraints and changing consumer behavior—the amount of data created at the edge and the need for it to be processed and analyzed locally continues to explode. Intel understands the challenges that businesses face—across a wide range of vertical industries—and is committed to help them continue to deliver innovative use cases," said Jeni Panhorst, Intel vice president and general manager of the Network and Edge Compute Division.

Intel has released the first set of open source AI reference kits specifically designed to make AI more accessible to organizations in on-prem, cloud and edge environments. First introduced at Intel Vision, the reference kits include AI model code, end-to-end machine learning pipeline instructions, libraries and Intel oneAPI components for cross-architecture performance. These kits enable data scientists and developers to learn how to deploy AI faster and more easily across healthcare, manufacturing, retail and other industries with higher accuracy, better performance and lower total cost of implementation.

"Innovation thrives in an open, democratized environment. The Intel accelerated open AI software ecosystem including optimized popular frameworks and Intel's AI tools are built on the foundation of an open, standards-based, unified oneAPI programming model. These reference kits, built with components of Intel's end-to-end AI software portfolio, will enable millions of developers and data scientists to introduce AI quickly and easily into their applications or boost their existing intelligent solutions."

Since OpenVINO launched in 2018, Intel has enabled hundreds of thousands of developers to dramatically accelerate AI inferencing performance, starting at the edge and extending to the enterprise and the client. Today, ahead of MWC Barcelona 2022, the company launched a new version of the Intel Distribution of OpenVINO Toolkit. New features are built upon three-and-a-half years of developer feedback and include a greater selection of deep learning models, more device portability choices and higher inferencing performance with fewer code changes.

"The latest release of OpenVINO 2022.1 builds on more than three years of learnings from hundreds of thousands of developers to simplify and automate optimizations. The latest upgrade adds hardware auto-discovery and automatic optimization, so software developers can achieve optimal performance on every platform. This software plus Intel silicon enables a significant AI ROI advantage and is deployed easily into the Intel-based solutions in your network," said Adam Burns, vice president, OpenVINO Developer Tools in the Network and Edge Group.