Contract prices of NAND Flash products are expected to undergo a marginal drop of 0-5% QoQ in 4Q21 as demand slows, according to TrendForce's latest investigations. Hence, the current cyclical upturn in NAND Flash prices will have lasted for only two consecutive quarters. Looking ahead, NAND Flash suppliers' capacity expansion plans will be affected by the outlook on future trends and the supply of other non-memory components. At the same time, attention will have to be paid to the demand projection. At the moment, NAND Flash suppliers appear likely to downsize their capacity expansion activities for 2022, resulting in a 31.8% YoY increase in NAND Flash bit supply next year. Annual bit demand, on the other hand, is projected to increase by 30.8% YoY. With demand being outpaced by supply and competition intensifying among suppliers for higher-layer products, the NAND Flash market will likely experience a cyclical downturn in prices in 2022.

The upcoming graphics cards based on PCIe Gen5 standard will utilize the latest PCIe connector with double bandwidth of the previous Gen4 that we use today and bring a new power connector that the next generation of GPUs brings. According to the information exclusive to Igor's Lab, the new connector will be called the 12VHPWR and will carry as many as 16 pins with it. The reason it is called 12VHPWR is that it features 12 pins for power, while the remaining four are signal transmission connectors to coordinate the delivery. This power connector is supposed to carry as much as 600 Watts of power with its 16 pins.

The new 12VHPWR connector should work exclusively with PCIe Gen5 graphics cards and not be backward compatible with anything else. It is said to replace three standard 8-pin power connectors found on some high-end graphics cards and will likely result in power supply manufacturers adopting the new standard. The official PCI-SIG specification defines each pin capable of sustaining up to 9.2 Amps, translating to a total of 55.2 Amps at 12 Volts. Theoretically, this translates to 662 Watts; however, Igor's Lab notes that the connector is limited to 600 Watts. Additionally, the 12VHPWR connector power pins have a 3.00 mm pitch, while the contacts in a legacy 2×3 (6-pin) and 2×4 (8-pin) connector lie on a larger 4.20 mm pitch.

With 2.5 Gbps Ethernet gaining popularity, we're seeing more and more companies launching 2.5 Gbps products and Akasa is the latest to join the fray. Although there's nothing really unique about this 2.5 Gbps card, it is the lowest profile card we've seen so far, which might make it suitable for certain builds where a regular card wouldn't fit.

The awkwardly named AK-PCCE25-01 features a Realtek Ethernet controller, although we can't quite make out which one, but it's one of the RTL8125 variants. The card comes with a full-height and half-height bracket and drivers for Windows 7 through 10, as well as Linux are provided. Retail pricing seems to be around US$31.95/£27.98/€29.90, which is in line with the competition, or somewhat cheaper.

Back in June of 2019, the PCI-SIG announced that work had started on PCIe 6.0 and some two years and four months later, PCIe 6.0 has reached version 0.9, which equals draft spec. What this means is that companies can now start to implement PCIe 6.0 into their products, to make sure they're compliant with the draft spec, since no additional functional changes will be made, unless something major is discovered.

PCIe 6.0 will be the first PCIe standard to use PAM-4 encoding, something it shares with GDDR6 memory among other standards. What this means is that twice the data can be sent per clock cycle for 64GT/s, or twice that of PCIe 5.0. Another key feature is FEC or low-latency forward error correction, as this was implemented to maintain data integrity. PCIe 6.0 is expected to be backwards compatible with all previous versions of PCIe. The final PCIe 6.0 spec isn't likely to be finalised until early next year, based on previous standards, although the original plan was to finish ratifying the spec this year.

XPG, a fast-growing provider of systems, components, and peripherals for Gamers, Esports Pros, and Tech Enthusiasts, today announces the latest evolution of its XENIA 15 KC gaming notebook platform, following the success of a series of collaborations between XPG and Intel. The all-new XENIA 15 KC comes equipped with an 11th Gen Intel i7 H CPU, an NVIDIA RTX 30 series GPU, and XPG's own hand selected memory and SSD.

Designed in collaboration with Intel, the new XPG XENIA 15 KC takes full advantage of the latest 11th Gen Intel i7-11800H processor, NVIDIA RTX 3070 graphics, and top of the line XPG memory and SSD, to deliver top of the line benchmarks, close to or even outpacing higher spec systems in gaming performance and pixel-perfect productivity. To strike a satisfying balance between fast-paced action and rich, detailed visuals, a spacious 15.6-inch QHD (2560 x 1440) 165 Hz IPS panel delivers the best of both worlds, perfectly tailored for its performance envelope. What's more, it achieves 100% sRGB color coverage for accurate color reproduction for content creation.

According to a recent report, it is estimated that more than 50 million people across the globe self-identified as having a career in the cultural and creative industries. With the everchanging definition of "creator" in a technology-driven world, this title now reaches beyond graphic designers and videographers to include content creators, UI/UX designers, artists and illustrators, entrepreneurs and freelancers, engineers, architects, grad students and more.

When crunching large amounts of data on their next passion project, access to fast and reliable storage solutions can greatly improve a creator's workflow, giving them peace of mind and allowing them to stay in the creative moment. With intense workload demands, today's creative professionals need technology that empowers their creativity without stress over losing their brilliant work, project bottlenecks or slow storage speeds.

MediaTek today unveiled its new Filogic connectivity family with the introduction of the Filogic 830 Wi-Fi 6/6E system-on-chip (SoC) and Filogic 630 Wi-Fi 6E network interface card (NIC) solutions. MediaTek's new Filogic series of high-performance Wi-Fi 6/6E chipsets provide reliable connectivity, high computation capabilities and a rich set of features in highly integrated, power-efficient designs.

"The MediaTek Filogic series ushers in a new era of smart Wi-Fi solutions with extreme speeds, low latency and superb power efficiency for seamless, always connected experiences," said Alan Hsu, Corporate Vice President & General Manager, Intelligent Connectivity at MediaTek. "These new chipsets provide best-in-class features with highly integrated designs for the next generation of premium broadband, enterprise and retail Wi-Fi solutions."

At the COMPUTEX 2021 Virtual Expo in May, TEAMGROUP presented the core value underlying its new products in 2021: "Chill the Heat, Feel the Speed, Make it Big", representing cooling, DDR5, and large capacity, the three major focuses TEAMGROUP builds its new products and design concepts around. Tonight at 10 PM (GMT+8), everyone is sincerely invited to the TEAMGROUP Online Launch Event 2021 via official website, Facebook Page, and YouTube channel as it again takes the three focuses to the next level with its powerful new technical capabilities and innovative technologies. To celebrate the event with the world, TEAMGROUP will give away a Gaming Desktop PC and other prizes worth up to $7,000 USD. Make sure to stay tuned for the TEAMGROUP Online Launch Event 2021.

In recent years, TEAMGROUP has been focusing on developing diverse cooling solutions and applying unique materials to the SSD of the Gaming product line, T-FORCE. Inspired by the four natural elements of wind, fire, water, and earth, TEAMGROUP has utilized four exclusive components of cooling to T-FORCE gaming products. The wind element can be found in TEAMGROUP's CARDEA A440 Pro M.2 PCIe SSD as further improvements are made on existing aluminium fin thermal conductivity technology for fluid ventilation and more effective cooling performance. The impressive read/write speeds of the CARDEA A440 Pro are also approaching the defined maximum speeds for Gen4 x4 by PCI-SIG at an outstanding 7,400/7,000 MB/s.

be quiet!, the German manufacturer for premium PC components, is proud to announce that its MC1 M.2 SSD cooler is a perfect match for the brand-new PlayStation 5 SSD expansion capabilities.

For those running out of storage space on the built-in solid-state drive of the PlayStation 5, Sony has recently released a firmware update that unlocks the M.2 SSD expansion slot, allowing users to add an additional solid-state drive to the console. These drives can run very hot, which could cause SSD throttling, prompting Sony to recommend only using M.2 SSDs with a heatsink. be quiet! offers gamers the ideal solution with its MC1 cooler, which is compatible with any single-sided or double-sided 2280 M.2 SSD that does not feature a built-in heatsink. It is also one of the only M.2 SSD coolers on the market compact enough to perfectly fit inside the expansion slot of the PlayStation 5 and able to cool double-sided SSDs, protecting the memory modules on both sides of the PCB from overheating. The result is much lower and safer SSD temperatures, which translates into trouble-free gaming sessions and an increased lifespan of the drive.

Today, we got ahold of the first picture showing Intel's upcoming Z690 chipset, the highest-end chipset offering for the Alder Lake lineup of processors. From previous leaks, we have concluded that Intel has enabled the Z690 chipset to be a very powerful offering. Featuring support for running either DDR4 or DDR5 memory, the Z690 chipset will allow motherboard AIBs to offer motherboards with both the new and current DDR standards, easing the transition to the new DDR5 memory. As far as PCIe connectivity, this high-end chipset produces 12 PCIe Gen5 lanes, along with 16 PCIe Gen3 lanes. This is, of course, just an addition to the 16 PCIe Gen5 lanes that the Alder Lake processor provides, enabling a wide portfolio of PCIe lanes for connecting SSDs and graphics cards.

Below, you can see the Z690 chipset image (热心市民描边怪 image), compared to the Z590 (AnandTech image) chipset, where there is a clear difference in size. The new Z690 chipset seems quite a lot bigger, and that is really not a surprise given the new technology stack that it brings.

[Editor's note: We have published the review of HYTE Revolt 3 Case here.]

HYTE, the new PC components and lifestyle brand of iBUYPOWER, a leading manufacturer of high-performance custom gaming PCs, today released its premier product, the Revolt 3 Mini-ITX PC case. Previously announced during CES 2021 as the Revolt 3 MK3, the Revolt 3 was designed with careful consideration for DIY PC enthusiasts, gamers, and creators alike.

"iBUYPOWER is excited to introduce its new sub-brand, HYTE, to our community with its very first product, the Revolt 3" said Darren Su, Executive Vice President of iBUYPOWER. "With over 20 years of experience as a systems integrator we felt like we had a unique perspective to bring to the table when developing PC Components. We approached the Revolt 3 with the goal of designing a case with the freedom and flexibility that would allow the use of a wide range of components without imposing performance restrictions based on the size of the case."

The first desktop processors to implement AMD's "Zen 4" microarchitecture will feature integrated graphics as standard across the lineup, according to a Chips and Cheese report citing leaked AMD design documents. Currently, most of the Socket AM4 desktop processor lineup lacks integrated graphics, and specialized "G" SKUs with integrated graphics dot it. These SKUs almost always come with compromises in CPU performance or PCIe I/O. With its 5 nm "Raphael" Socket AM5 desktop processor, AMD is planning to change this, in a bid to match up to Intel on the universality of integrated graphics.

Built in the 5 nm silicon fabrication process, the "Raphael" silicon combines "Zen 4" CPU cores along with an iGPU based on the RDNA2 graphics architecture. This would be the first time AMD updated the SIMD architecture of its Ryzen iGPUs since 2017. The RDNA2-based iGPU will come with a more advanced DCN (Display CoreNext) component than current RDNA2-based discrete GPUs, with some SKUs even featuring DisplayPort 2.0 support, besides HDMI 2.1. By the time "Raphael" is out (2022-23), it is expected that USB4 type-C would gain popularity, and mainstream motherboards as well as pre-built desktops could ship with USB4 with DisplayPort 2.0 passthrough. AMD relies on a discrete USB4 controller with PCI-Express 4.0 x4 wiring, for its first Socket AM5 platform.

Ever since the emergence of PCs, hard disks have become the most prevalent type of storage device. To accelerate the overall data flow of PCs, increase the storage throughput, and further enhance data security of the hard disks, disk arrays were invented. Information and data security is critical for both individuals and enterprises. The safety of DVRs, computer system disks, monitoring servers, banking systems, warehouses and other data and files can determine whether or not an institution survives. Therefore, the safety performance of SSD is a major focal point.

To meet the demand for SSD security and reliability, the FORESEE, an industry brand of Longsys, SSD R&D team launched the P709 PCIe SSD, which, empowered by the TCG-OPAL 2.0 and Pyrite 2.0 encryption functions, ensures data security and avoids data leakage. In addition to the encryption functions, the capacity combination, power consumption and read/write performance of this product can hold its own against the mainstream market standard. When it comes to compatibility, the FORESEE P709 PCIe SSD has been certified by Intel Modern Standby and UNH-IOL thanks to its excellent low-power performance. Not only does it significantly prolong the battery life of terminal devices, it also ensures product stability by balancing speed and temperatures during continuous operation through the use of temperature control algorithms.

While the server industry transitions to the latest generation of processors based on the x86 platform, the Intel Ice Lake and AMD Milan CPUs entered mass production earlier this year and were shipped to certain customers, such as North American CSPs and telecommunication companies, at a low volume in 1Q21, according to TrendForce's latest investigations. These processors are expected to begin seeing widespread adoption in the server market in 3Q21. TrendForce believes that Ice Lake represents a step-up in computing performance from the previous generation due to its higher scalability and support for more memory channels. On the other hand, the new normal that emerged in the post-pandemic era is expected to drive clients in the server sector to partially migrate to the Ice Lake platform, whose share in the server market is expected to surpass 30% in 4Q21.

ATP Electronics, a global leader in specialized storage and memory solutions, has announced that its A600Sc Series serial ATA solid state drives (SATA SSDs) have been successfully qualified for compatibility and interoperability with Adaptec Smart Storage PCIe Gen 4 Tri-Mode SmartRAID 3200, SmartHBA 2200, and HBA 1200 Smart Storage adapters.

Designed for storage platforms in next-generation data centers, the Adaptec PCIe Gen 4 SAS/SATA/NVMe HBA and RAID tri-mode adapters deliver significantly higher performance through PCIe Gen 4 x16 CPU interfaces as well as SAS and SATA storage. The new offerings simplify integration and provide flexibility to aggregate diverse storage devices with Microchip's proven security and manageability features for the most demanding server storage applications.

Intel today launched its newest generation Intel Xeon W-3300 processors, available today from its system integrator partners. Built for advanced workstation professionals, Intel Xeon W-3300 processors offer uncompromised performance, expanded platform capabilities, and enterprise-grade security and reliability in a single-socket solution.

Intel Xeon W-3300 processors are intelligently engineered to push the boundaries of performance, with a new processor core architecture that transforms for what expert workstation users can accomplish on a workstation.

The Intel Xeon W-3300 processors are designed for next-gen professional applications with heavily threaded, input/output-intensive workloads. Use cases stretch across artificial intelligence (AI), architecture, engineering, construction (AEC), and media and entertainment (M&E). With a new processor core architecture to transform efficiency and advanced technologies to support data integrity, Intel Xeon W-3300 processors are equipped to deliver uncompromising workstation performance.

The ramp-up of the Intel Ice Lake and AMD Milan processors is expected to not only propel growths in server shipment for two consecutive quarters from 2Q21 to 3Q21, but also drive up the share of high-density products in North American hyperscalers' enterprise SSD purchases, according to TrendForce's latest investigations. In China, procurement activities by domestic hyperscalers Alibaba and ByteDance are expected to increase on a quarterly basis as well. With the labor force gradually returning to physical offices, enterprises are now placing an increasing number of IT equipment orders, including servers, compared to 1H21. Hence, global enterprise SSD procurement capacity is expected to increase by 7% QoQ in 3Q21. Ongoing shortages in foundry capacities, however, have led to the supply of SSD components lagging behind demand. At the same time, enterprise SSD suppliers are aggressively raising the share of large-density products in their offerings in an attempt to optimize their product lines' profitability. Taking account of these factors, TrendForce expects contract prices of enterprise SSDs to undergo a staggering 15% QoQ increase for 3Q21.

To meet the market demand for large-capacity data storage, TEAMGROUP today announced two high-performance, huge-capacity storage products: the TEAMGROUP MP34Q M.2 PCIe SSD, which utilizes QLC Flash and the PCIe Gen3x4 interface and comes with capacities up to 8 TB; and the HIGH ENDURANCE CARD designed for high-resolution surveillance systems. Whether it is for computer equipment or security systems used at home or a business, TEAMGROUP provides reliable upgrade solutions for those who seek the best performance and stability.

Today the company announced the TEAMGROUP MP34Q M.2 PCIe SSD, which utilizes QLC Flash and the PCIe Gen3x4 interface. It also supports NVMe 1.3 and the Dual Cache technologies: SLC Caching and DRAM Cache Buffer. The MP34Q M.2 PCIe SSD offers a massive capacity of up to 8 TB, excellent read/write speeds of up to 3,400/3,000 MB/s, and an official five-year warranty with purchase, so consumers can buy and upgrade with confidence.

The recent wave of COVID-19 outbreaks in India has weakened sales of retail storage products such as memory cards and USB drives, according to TrendForce's latest investigations. However, demand remains fairly strong in the main application segments due to the arrival of the traditional peak season and the growth in the procurement related to data centers. Hence, the sufficiency ratio of the entire market has declined further. NAND Flash suppliers have kept their inventories at a healthy level thanks to clients' stock-up activities during the past several quarters. Moreover, the ongoing shortage of NAND Flash controller ICs continues to affect the production of finished storage products. Taking account of these demand-side and supply-side factors, TrendForce forecasts that contract prices of NAND Flash products will rise marginally for 3Q21, with QoQ increases in the range of 5-10%.

Xilinx, Inc., the leader in adaptive computing, today introduced the Versal HBM adaptive compute acceleration platform (ACAP), the newest series in the Versal portfolio. The Versal HBM series enables the convergence of fast memory, secure connectivity, and adaptable compute in a single platform. Versal HBM ACAPs integrate the most advanced HBM2E DRAM, providing 820 GB/s of throughput and 32 GB of capacity for 8X more memory bandwidth and 63% lower power than DDR5 implementations. The Versal HBM series is architected to keep up with the higher memory needs of the most compute intensive, memory bound applications for data center, wired networking, test and measurement, and aerospace and defense.

"Many real-time, high-performance applications are critically bottlenecked by memory bandwidth and operate at the edge of their power and thermal limits," said Sumit Shah, senior director, Product Management and Marketing at Xilinx. "The Versal HBM series eliminates those bottlenecks to provide our customers with a solution that delivers significantly higher performance and reduced system power, latency, form factor, and total cost of ownership for data center and network operators."

The LattePanda Alpha, based on Intel Core m3-8100Y, is a Dual-Core 1.10 GHz CPU that bursts up to 3.40 GHz. Integrated Intel UHD Graphics 615 into the processor, the LattePanda Alpha delivers enhanced media conversion, fast frame rates, and 4K Ultra HD (UHD) video. All of this computing power dissipates only 8 W power, which is the perfect choice for users who need a small, portable, and light SBC for their powerful DIY handheld. And, given its incredibly small size, the LattePanda Alpha can be easily hidden, functioning as the secretly powerful brains behind users coolest project.

Intel's Lisa Spelman, corporate vice president and general manager of the Xeon and Memory Group at Intel Corporation, has yesterday published a blog post talking about Intel's next-generation server platform codenamed Sapphire Rapids. The SPR platform is Intel's biggest step-up in the server processor space, and it is the exact CPU that will power the Aurora exascale supercomputer. Besides improvements to the CPU microarchitecture, the platform itself is bringing many benefits with it as well. It will use the latest industry protocols like DDR5 and PCIe 5.0. This is making a strong combination designed even for exascale supercomputers to be powered by this processor. However, the availability of this CPU was a bit of a mystery until yesterday. Below, you can see the quote from Ms. Lisa Spelman about the availability of said processors.

Lisa SpelmanDemand for Sapphire Rapids continues to grow as customers learn more about the benefits of the platform. Given the breadth of enhancements in Sapphire Rapids, we are incorporating additional validation time prior to the production release, which will streamline the deployment process for our customers and partners. Based on this, we now expect Sapphire Rapids to be in production in the first quarter of 2022, with ramp beginning in the second quarter of 2022.

Qualcomm Technologies, Inc. today announced the expansion of its 5G RAN Platforms portfolio with the addition of the Qualcomm 5G DU X100 Accelerator Card. The Qualcomm 5G DU X100 is designed to enable operators and infrastructure vendors the ability to readily reap the benefits of high performance, low latency, and power efficient 5G, while accelerating the cellular ecosystem's transition towards virtualized radio access networks.

The Qualcomm 5G DU X100 is a PCIe inline accelerator card with concurrent Sub-6 GHz and mmWave baseband support which is designed to simplify 5G deployments by offering a turnkey solution for ease of deployment with O-RAN fronthaul and 5G NR layer 1 High (L1 High) processing. The PCIe card is designed to seamlessly plug into standard Commercial-Off-The-Shelf (COTS) servers to offload CPUs from latency-sensitive and compute-intensive 5G baseband functions such as demodulation, beamforming, channel coding, and Massive MIMO computation needed for high-capacity deployments. For use in public or private networks, this accelerator card aims to give carriers the ability to increase overall network capacity and fully realize the transformative potential of 5G.

During this year's ISC 2021 event, as a part of the company's exhibition portfolio, NVIDIA has decided to launch an updated version of the A100 accelerator. A couple of months ago, in November, NVIDIA launched an 80 GB HBM2E version of the A100 accelerator, on the SXM2 proprietary form-factor. Today, we are getting the same upgraded GPU in the more standard dual-slot PCIe type of card. Featuring a GA100 GPU built on TSMC's 7 nm process, this SKU has 6192 CUDA cores present. To pair with the beefy amount of computing, the GPU needs appropriate memory. This time, there is as much as 80 GB of HBM2E memory. The memory achieves a bandwidth of 2039 GB/s, with memory dies running at an effective speed of 3186 Gbps. An important note is that the TDP of the GPU has been lowered to 250 Watts, compared to the 400 Watt SXM2 solution.

To pair with the new upgrade, NVIDIA made another announcement today and that is an enterprise version of Microsoft's DirectStorage, called NVIDIA GPUDirect Storage. It represents a way of allowing applications to access the massive memory pool built on the GPU, with 80 GB of super-fast HBM2E memory.

NVIDIA today announced it is turbocharging the NVIDIA HGX AI supercomputing platform with new technologies that fuse AI with high performance computing, making supercomputing more useful to a growing number of industries.

To accelerate the new era of industrial AI and HPC, NVIDIA has added three key technologies to its HGX platform: the NVIDIA A100 80 GB PCIe GPU, NVIDIA NDR 400G InfiniBand networking, and NVIDIA Magnum IO GPUDirect Storage software. Together, they provide the extreme performance to enable industrial HPC innovation.