Blackmagic Design today announced DeckLink Mini Monitor HD and DeckLink Mini Recorder HD, new models of PCIe capture and playback solutions featuring 3G-SDI and HDMI connections. These updated models of the popular DeckLink Mini cards support video formats up to 1080p60 and 2Kp60 DCI, and are designed to work with advanced color spaces such Rec. 2020 for deep color and higher dynamic range. The new DeckLink Mini HD models are also lower cost. DeckLink Mini Monitor HD and DeckLink Mini Recorder HD are available now from Blackmagic Design resellers worldwide for US$129 each.

DeckLink Mini Recorder HD and DeckLink Mini Monitor HD feature advanced high quality video technology that supports uncompressed and compressed capture and playback at the highest 10-bit SD and HD quality. Both models support broadcast quality 10-bit YUV and 12-bit RGB 4:4:4 for pixel perfect capture and playback so customers get breathtaking image quality and detail. Replacing the previous 1.5G-SDI models, the update to 3G-SDI has allowed more features to be added such as support for video formats up to 1080p60 and 2Kp60 DCI, wider color spaces including Rec. 2020, as well as support for RGB video formats.

Inspur Information, a leading IT infrastructure solutions provider, is rolling out full-stack liquid-cooled products, with cold plate liquid-cooling technology being available in all of its products including general-purpose servers, high-density servers, rack servers, and AI servers. This is another major step in Inspur Information's march towards being carbon neutral following its unveiling of Asia's largest development and manufacturing facility for liquid-cooled data centers.

As Green, low-carbon and sustainable development has become the international consensus, nearly 130 countries and regions around the world have set the goal of being carbon neutral. In 2022, with "All in Liquid-Cooling" incorporated into its strategy, Inspur Information has incorporated cold plate liquid-cooling technology into all of its products (general-purpose servers, high-density servers, rack servers, and AI servers), which can be fully customized for a diverse array of scenarios.

Intel is preparing to launch its next-generation desktop platform codenamed Rocket Lake-S. According to the presentation held by Intel today in Shenzen, China, we have official information regarding some of the platform features that Raptor Lake is bringing. Starting with memory support, Raptor Lake is still carrying the transitional DDR4 and DDR5 support, as the full swing towards DDR5 is still in progress. Unlike the previous generation Alder Lake, which brought DDR5-4800 support, Raptor Lake's integrated memory controller can drive DDR5 modules with a 5600 MT/s configuration. As DDR4 support remains, it is limited to 3200 MT/s speed.

Interesting information from the leaked slide points out that support for CPU-attached NVMe storage remains PCIe Gen4. While AMD will provide an AM5 socket with CPU-attached NMVe storage on PCIe Gen5 protocol, Intel is taking a step back and holding on to Gen4. The CPU is outputting 16 PCIe Gen5 lanes on its own. Motherboard vendors for the upcoming 700-series boards for Raptor Lake can still provide a PCIe Gen5 NVMe slot; however, it will have to subtract eight Gen5 lanes from the PCI Express Graphics (PEG) slot and route them to NVMe storage. As our testing shows, this will affect GPU's performance by a few percent. AMD's upcoming AM5 platform has no such issues, as the CPU provides both the PEG and CPU-attached NVMe storage with sufficient PCIe Gen5 bandwidth.

PCI-SIG today announced that the PCI Express (PCIe ) 7.0 specification will double the data rate to 128 GT/s and is targeted for release to members in 2025. "For 30 years the guiding principle of PCI-SIG has been, 'If we build it, they will come,'" observed Nathan Brookwood, Research Fellow at Insight 64. "Early parallel versions of PCI technology accommodated speeds of hundreds of megabytes/second, well matched to the graphics, storage and networking demands of the 1990s.

In 2003, PCI-SIG evolved to a serial design that supported speeds of gigabytes/second to accommodate faster solid-state disks and 100MbE Ethernet. Almost like clockwork, PCI-SIG has doubled PCIe specification bandwidth every three years to meet the challenges of emerging applications and markets. Today's announcement of PCI-SIG's plan to double the channel's speed to 512 GB/s (bi-directionally) puts it on track to double PCIe specification performance for another 3-year cycle."

Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that its PHY and Controller IP for the PCI Express (PCIe ) 5.0 specification in the TSMC N7, N6 and N5 process technologies have passed certification tests from PCI-SIG at the industry's first event for PCIe 5.0 specification compliance held in April. The Cadence solutions were tested to their full potential and complied with the full speed of 32GT/s for PCIe 5.0 technology. The compliance program provides designers with testing procedures to assess that the PCIe 5.0 interfaces on their system-on-chip (SoC) designs will operate as expected.

The Cadence IP for PCIe 5.0 technology consists of a PHY, companion controller and Verification IP (VIP) targeted at SoC designs for very high-bandwidth hyperscale computing, networking and storage applications. With Cadence's PHY and Controller Subsystem for PCIe 5.0 architecture, customers can design extremely power-efficient SoCs while accelerating time to market.

Sharkoon Technologies is an international supplier of high-quality, high-performance PC components and peripherals. With the launch of the Vertical Graphics Card Kit 4.0, the Angled Graphics Card Kit 4.0 and the Compact VGCK 4.0, Sharkoon has now widened its range of kits for the vertical installation of graphics cards. All three kits correspond functionally to the previous models, but now with the PCIe-4.0 standard, they are designed for the latest graphics cards and mainboards and perform with transmission rates of up to 252 Gigabits per second.

The graphics card kits allow graphics cards to be installed vertically in compatible PC cases, which provides an even more pleasing result for the presentation of the cards' illuminated elements. The Vertical Graphics Card Kit 4.0 is currently compatible with the ELITE SHARK CA200, ELITE SHARK CA300 and the TG7M RGB cases. The Angled Graphics Card Kit 4.0 fits perfectly into the special configuration of the REV300 case. The Compact VGCK 4.0, on the other hand, covers the micro-ATX cases of the MS-Y and MS-Z series. Further PC cases should be added to this lineup in the future.

Drive docks can be extremely handy, especially the kind with support for two drives, as they generally allow you to duplicate your data quickly and easily. However, with a move towards M.2 drives, SATA based docks are slowly becoming less useful. Akasa has launched a solution to that problem with its new DuoDock MX, which accepts a pair of M.2 NVMe drives. The dock itself looks like a miniature drive dock with the addition of a cup-shaped lid that helps protect the drives from being touched during use. The front is host to a range of LEDs and a drive clone button, whereas around the back there's a power switch, a power connector and a USB Type-C port.

The only real downside is that Akasa has gone with a 10 Gbps PCIe to USB 3.2 bridge chip, which means that the data connection to a PC would be fairly slow by today's standards. Presumably the reason for this is to prevent the need of using some kind of heatsink on the M.2 drives, as most 20 Gbps NVMe to USB 3.2 solutions tend to require heatsinks. That said, Akasa has equipped the DuoDock MX with what the company calls an ultra-thin fan, although a picture on the company website suggests it's a small blower fan. Price-wise it's not what you'd call a bargain at £98 or around US$120, although that price includes British VAT.

Researchers from Università di Bologna and CINECA, the largest supercomputing center in Italy, have been playing with the concept of developing a RISC-V supercomputer. The team has laid the grounds for the first-ever implementation that demonstrates the capability of the relatively novel ISA to run high-performance computing. To create a supercomputer, you need pieces of hardware that seem like Lego building blocks. Those are called clusters, made from a motherboard, processor, memory, and storage. Italian researchers decided to try and use something different than Intel/AMD solution to the problem and use a processor based on RISC-V ISA. Using SiFive's Freedom U740 SoC as the base, researchers named their RISC-V cluster "Monte Cimone."

Monte Cimone features four dual-board servers, each in a 1U form factor. Each board has a SiFive's Freedom U740 SoC with four U74 cores running up to 1.4 GHz and one S7 management core. In total, eight nodes combine for a total of 32 RISC-V cores. Paired with 16 GB of 64-bit DDR4 memory operating at 1866s MT/s, PCIe Gen 3 x8 bus running at 7.8 GB/s, one gigabit Ethernet port, USB 3.2 Gen 1 interfaces, the system is powered by two 250 Watt PSUs to support future expansion and addition of accelerator cards.

Intel is preparing to launch its 13th generation of desktop processors codenamed Raptor Lake. Succeeding Alder Lake, the 13th gen design will implement up to eight P-cores with 16 E-cores manufactured on Intel's improved 7+ technology node. Today, we got a performance preview from SiSoftware that has collected SiSoftware Sandra database scores of Intel Core i9-13900 Raptor Lake-S processor. They present an overview of a few benchmarks. Firstly, the SoC features 36 MB of unified L3 cache versus 30 MB in Alder Lake. With DDR5 memory running up to 5600 MT/s and PCIe 5.0, the SoC features the latest IO and memory standards. The big P-cores now lack AVX-512 and feature 2 MB of L2 cache per core. We see 4 MB of L2 cache for a cluster of small E-cores. An exciting addition to E-cores is the AVX/AVX2 support, which is a first for Atom cores.

Regarding testing, the author has collected a few tests that seemed appropriate to compare to the equivalent Alder Lake model. Starting with ALU/FPU tests that benchmark basic arithmetic tasks, Raptor Lake delivered 33% to 50% improvement over Alder Lake. The Raptor Lake design achieved this with 3.7 GHz P-Core and 2.76 GHz E-Core frequency. In vectorized and SIMD tests, the 13th gen design showed only 5% to 8% improvement over the previous generation. For more benchmarks and accurate results, we have to wait for TechPowerUp's test, which will be coming on the release day.

There has been a fair bit of confusion about AMD's upcoming AM5 platform when it comes to connectivity and we're going to break things down and explain what the difference is between the B650 and X670 boards. We're also going to cover the processor connectivity, since that's an integral part of any motherboard these days. All the information in this article is based on what we've been told by various sources during Computex.

According to TrendForce research, North American data centers saw an improvement in components supply after February, driving a recovery in purchase order volume. As Server brands returned to normal in-office work following the pandemic, the increase in capital expenditures on related information equipment has also boosted order growth. The addition of Kioxia's raw material contamination incident led to an increase in the pricing of certain rush orders, pushing up overall Enterprise SSD revenue in 1Q22 to US$5.58 billion, or 14.1% growth QoQ.

According to TrendForce, Samsung and SK hynix (including Solidigm) were the top two players in 1Q22. At the beginning of the year, demand from hyperscale data centers resulted in high inventory levels due to component mismatches, leading Samsung's order growth missing expectations. However, as repercussions from the WDC and Kioxia contamination incident hit NAND Flash production capacity in 1Q22, server customers quickly turned to Samsung for additional orders, driving the company's 1Q22 revenue to US$2.77 billion, up 14.8% QoQ.

Many companies, including Intel and AMD, have stopped product shipments to Russia amidst the war in Ukraine in the past few months. This has left the Russian state without any new processors from the two prominent x86 designers, thus slowing down the country's technological progress. To overcome this issue, it seems like the solution is embedded in the Chinese Zhaoxin x86 CPUs. According to the latest report from Habr, a motherboard designer called Dannie is embedding Chinese Zhaoxin x86 CPUs into motherboards to provide the motherland with an x86-capable processor. More precisely, the company had designed a BX-Z60A micro-ATX motherboard that embeds Zhaoxin's KaiXian KX-6640MA SoC with eight cores based on LuJiaZui microarchitecture. The SoC is clocked at a frequency range of 2.1-2.7 GHz, carries 4 MB of L2 cache, 16 lanes of PCIe 3.0, and has integrated graphics, all in a 25 Watt TDP.

As far as the motherboard is concerned, it supports two DDR4 memory slots, two PCIe x16 connectors, M.2-2280 and M.2-2230 slots, and three SATA III connectors for storage. For I/O you have USB ports, DisplayPort, HDMI, VGA/D-Sub, GbE, 3.5-mm audio, and additional PS/2 ports. This is a pretty decent selection; however, we don't know the pricing structure. A motherboard with KaiXian KX-6640MA SoC like this is certainly not cheap, so we are left to wonder if this will help Russian users deal with the newly imposed restriction on importing US tech.

AMD is preparing to launch its highly-anticipated AM5 socket for the next generation of motherboards. And today, thanks to the sources over at Tom's Hardware, we have information regarding memory support for B650 and X670 motherboards. According to the report, both B650 and X670 chipsets will limit the user's memory option to the latest DDR5 memory standard, making it impossible for users with already existing DDR4 memory to perform a seamless upgrade to a new platform. So far, we don't have a lot of details about Zen4's integrated memory controller, and we can't be certain if it supports DDR5 only or carries legacy DDR4 support. However, it seems like B650 and X670 motherboards will have no plans to enable the DDR4 standard memory usage.

Additionally, the report confirms that the B650 chipset is connected to the AM5 socket via PCIe 4.0 x4 connection and has eight lanes of PCIe 4.0 (four of which are for M.2 SSD), four SATA, and lots of USB ports. Documents suggest that the chipset-socket connection is available using PCIe 5.0 for some AM5 processors, so we have to wait and see how it works. As far as high-end X670 is concerned, this chipset is a combination of two chipset dies, presumably a combination of two B650 modules. This doesn't work as the older north/southbridge type of a solution but rather doubled connectivity of a single B650 chipset. We have to wait for the official launch to confirm this information.

The dust from Red Dot Design Award 2022 starts to settle. MSI, a world-leading brand in gaming, content creation and commercial hardware, announced that they earn another three prizes in the prestigious iF DESIGN AWARD in Gaming Hardware/VR/AR category. "To be recognized by the prestigious Red Dot Product Design Awards for our relentless pursuit of innovative design is truly an honor and is also the best encouragement to MSI's design teams. MSI's design capability to commit "Tech meets Aesthetic" is unquestionable. We're continuing to deliver cutting-edge design for all customers," said Sam Chern, MSI Marketing Vice President.

This year, the winning products are the top-tier Stealth GS77 gaming laptop, MEG Z690 GODLIKE, and MPG Z690 FORCE WIFI motherboards. The iF DESIGN AWARD is recognized as an arbiter of quality for exceptional design and is one of the most celebrated design competitions in the world. Being awarded is definitely a seal of outstanding quality for MSI's product design quality. "We are honored to be acknowledged by iF DESIGN jurors, which is a further testament to our commitment to making our products with design quality, functionality, and innovation in mind. We're continuing to deliver edgy design for gamers and content creators, " says Sam Chern, MSI Marketing Vice President.

For many years, TEAMGROUP has been developing high-quality products for industrial use and automation applications. In response to the growing market for 5G applications, the company this year is focusing on the new market demands of 5G infrastructure, AloT edge computing, and autonomous driving, as well as in-vehicle computing and environmental safety control applications. Today, TEAMGROUP is announcing its 745 SSD Series, which features the 5th generation BiCS NAND flash memory. It's a comprehensive industrial solution that comes with high capacities, low latencies, and high durability for the various application of industrial market.

The TEAMGROUP 745 SSD Series uses the new 112-layer 3D TLC and the latest 5th generation BiCS NAND flash memory, giving it approximately 40% more capacity and 50% better I/O performance than BiCS4 SSDs. This makes it fully suitable for the high-capacity, low-latency transmission requirements of edge computing. To meet the needs of a wide range of industrial applications, the 745 SSD Series is available in a variety of form factors with mainstream specifications, including models with SATA and PCIe Gen3x4 interfaces and capacities from 128 GB to 2 TB, offering the industry a variety of professional options. The 745 SSD Series is also equipped with SLC cache technology, which improves SSD read and write efficiency and supports high AI load for smart manufacturing and autonomous driving, while the AES 256-bit encryption prevents data security concerns and ensures safety and stability of the SSD.

AMD is slowly gearing up to launch the latest 7000 series Ryzen processors codenamed "Raphael." Thanks to the famous hardware leaker @9550pro on Twitter, we have evidence of B650 motherboards for the next-generation hardware. According to the image posted by the leaker, it appears like AMD's Ryzen 7000 series Raphael processor is running on MSI's MAG B650 motherboard at a very high voltage of 1.5 Volts VCore. While we don't know the exact SKU running here, we see a note referring to it as an Engineering Sample, meaning that this is not a final product. It is expected to see the new AM5 platform make a debut alongside DDR5 and PCIe 5.0 technology, so we have to wonder what the B650 chipset can support.

Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, today introduced the first clock buffers and multiplexers that meet stringent PCIe Gen6 specifications. Renesas, the industry's undisputed leader in timing solutions, is offering 11 new clock buffers and 4 new multiplexers. The new devices, which also support and provide extra margin for PCIe Gen5 implementations, complement Renesas' low-jitter 9SQ440, 9FGV1002 and 9FGV1006 clock generators to offer customers a complete PCIe Gen6 timing solution for data center/cloud computing, networking and high-speed industrial applications. The PCIe Gen6 standard supports extremely high data rates of 64 GT/s while requiring very low clock jitter performance of less than 100fs RMS. Renesas' new RC190xx clock buffers and RC192xx multiplexers have PCIe Gen6 additive jitter specs of only 4fs RMS, making them virtually noiseless, and thereby future-proofing customer designs for the next generation of industry standards.

"PCIe Gen6 timing will be at the heart of new equipment in data centers, high-speed networking and other applications," said Zaher Baidas, Vice President of the Timing Products Division at Renesas. "As we have done for preceding generations, Renesas is providing customers with the first timing solution to enable these new, higher-performance systems. Our customers know that we have the technical expertise and market knowledge to ensure that their products will be able to meet future requirements as well." "By delivering the first discrete timing solution for PCIe Gen6, Renesas is enabling customers to develop the next-generation of high-performance systems," said Rich Wawrzyniak, Principal Analyst for Semico Research. "It will be interesting to see the innovative implementations that result from this new capability, especially when considering how solutions for the emerging Chiplet market are starting to evolve, with the need for increasing speed and bandwidth as an underlying constant."

HotHardware did a video interview with Intel Fellow Tom Petersen, who briefly teased a prototype Intel Arc "Alchemist" graphics card with three 8-pin PCIe power connectors, for a total power input capability of 450 W. This does not necessarily mean that a finished product will ship with three connectors; as prototype motherboards and graphics cards are known to feature various redundant connectivity and power-input options for product developers to test capabilities. The three connectors are spaced far apart from each other, so it's likely that the board tests various combinations of power inputs. One of the three could even be a 224 W EPS instead of a 150 W PCIe. The Arc "Alchemist" 7-series desktop board that maxes out the DG2-512 silicon, has been grinding through the rumor mill for quite some time now, including PCB pictures, showing two 8-pin PCIe power connectors.

Fungible, Inc., the composable infrastructure company, today announced a new product offering, Fungible GPU-Connect (FGC ), an innovative solution engineered to revolutionize how data processing power is accessed in enterprise and service provider infrastructures. Fungible GPU-Connect solves the challenges caused by the growing demand for AI/ML, especially in Edge Data Centers with stranded and underutilized GPUs. FGC leverages the Fungible DPU to dynamically compose GPU and CPU resources across an Ethernet network. This provides significant economic benefits and agility to organizations that provision, allocate, and manage expensive GPU resources. For the first time, organizations can create a GPU-powered infrastructure free from the physical limitations of PCIe.

FGC allows data centers to centralize their existing GPU assets into a single resource pool to be attached to servers on demand. Instead of dedicated GPUs sitting idle most of the time, data centers can provide new users with access to the GPU pool, making greater use of existing assets. This disaggregated solution also removes the constraints of having GPUs and CPUs physically co-located. They can be located anywhere within the same data center, eliminating the stranding of expensive GPU resources. The Fungible DPU creates a secure, virtual PCIe connection between the GPU and the server that is transparent to the server and to applications - no special software or drivers are needed. This connection is managed in hardware by the DPU, ensuring a high-performance and low latency connection. This transparency means FGC can be easily retrofitted into existing environments, and can scale with growing demand, ensuring GPUs are always available when they are needed.

Keysight Technologies, Inc., a leading technology company that delivers advanced design and validation solutions to help accelerate innovation to connect and secure the world, announced an end-to-end PCIe test solution for digital development and senior engineers that enable the simulation, pathfinding, characterization, validation and compliance testing of PCIe designs. The rapid increase of AI (artificial intelligence) related workloads in data centers and edge computing demand new compute designs. Data center system designers are challenged to provide new higher speed devices within reduced design cycles. New PCIe devices will need to keep up with Ethernet network interfaces in data centers and the emergence of CXL (compute express link).

To maintain performance goals and prepare for the PCIe 6.0 move to pulse amplitude modulation 4-level (PAM4), customers need a smooth transition from PCIe 5.0 to 6.0, where the integrity of PCIe measurements are backed by leading-edge tools and comply with PCIe specifications. With shrinking design cycles, end-to-end solutions from simulation to validation through the layers of the stack are required. Keysight provides a comprehensive physical layer test solution, approved by the Peripheral Component Interconnect Special Interest Group (PCI-SIG) to test transmitters and receivers for all generations of the PCIe specification, which is currently supported by the PCI-SIG integrators list. To reflect the increasing time to market pressure for design engineers, Keysight extends the portfolio to cover PCIe protocol, making it the first end-to-end solution from simulation to full stack validation.

Today SK hynix and Solidigm jointly introduced their first collaborative product, a new enterprise solid-state drive (eSSD), P5530. This limited release product highlights the emerging partnership between SK hynix and Solidigm, which formed three months ago when SK hynix acquired Intel's NAND and SSD business. The P5530 combines SK hynix's 128-layer 4D NAND flash with Solidigm's SSD controller and firmware supporting a PCIe Gen 4 interface. The product is offered in 1 TB, 2 TB, and 4 TB capacity options. SK hynix and Solidigm worked together to optimize performance with specific data center use cases and targeted deployments in mind.

Since the launch of Solidigm, the companies have partnered to forge a forward-moving strategy and co-develop products while reinforcing common values across the companies. Through the ongoing partnership and collaboration with Solidigm, SK hynix expects to enhance its NAND flash business competitiveness to the same extent as its DRAM business.

"With in-time demonstration of the collaborative product based on the combined competence of SK hynix and Solidigm, we aim to not only enhance our NAND flash business competitiveness but also speed up our "Inside America" strategy," said Kevin (Jongwon) Noh, President and Chief Marketing Officer (CMO) at SK hynix. "SK hynix and Solidigm will continue to partner in order to optimize both companies' operations to create greater synergies."

AMD today announced a new addition to the Instinct MI200 family of accelerators. Officially titled Instinct MI210 accelerator, AMD tries to bring exascale-class technologies to mainstream HPC and AI customers with this model. Based on CDNA2 compute architecture built for heavy HPC and AI workloads, the card features 104 compute units (CUs), totaling 6656 Streaming Processors (SPs). With a peak engine clock of 1700 MHz, the card can output 181 TeraFLOPs of FP16 half-precision peak compute, 22.6 TeraFLOPs peak FP32 single-precision, and 22.6 TFLOPs peak FP62 double-precision compute. For single-precision matrix (FP32) compute, the card can deliver a peak of 45.3 TFLOPs. The INT4/INT8 precision settings provide 181 TOPs, while MI210 can compute the bfloat16 precision format with 181 TeraFLOPs at peak.

The card uses a 4096-bit memory interface connecting 64 GBs of HMB2e to the compute silicon. The total memory bandwidth is 1638.4 GB/s, while memory modules run at a 1.6 GHz frequency. It is important to note that the ECC is supported on the entire chip. AMD provides an Instinct MI210 accelerator as a PCIe solution, based on a PCIe 4.0 standard. The card is rated for a TDP of 300 Watts and is cooled passively. There are three infinity fabric links enabled, and the maximum bandwidth of the infinity fabric link is 100 GB/s. Pricing is unknown; however, availability is March 22nd, which is the immediate launch date.

AMD places this card directly aiming at NVIDIA A100 80 GB accelerator as far as the targeted segment, with emphasis on half-precision and INT4/INT8 heavy applications.

Intel's Arc discrete lineup of graphics card are set to hit the notebook/laptop segment first, and today's discovery is no different. BHPhotoVideo, one of the largest US tech retailers, has posted a listing of Samsung's Galaxy Book2 Pro laptop, spotting Intel's Arc discrete graphics solution. According to the listing, this model was spotting an undisclosed Intel Arc Graphics, 2.1 GHz 12-core CPU, 16 GB of LPDDR5-6400 memory, 512 GB of NVMe PCIe Gen4 storage, 15.6-inch 1080p AMOLED display, WiFi-6E, and came in just 1.13 KG body weight. All of this is packed at 1349.99 USD, which is an early sign of the structure of laptop prices carrying Intel's Arc GPUs.

BHPhotoVideo has now taken down the website listing; however, we still have evidence thanks to the leaker, which you can see below. For more information regarding the exact SKU and more Arc Alchemist data, we have to wait for the March 30th launch.

ASRock Industrial launches a new range of industrial motherboards powered by 12th Gen Intel Core Processors (Alder Lake-S) with up to 16 cores and 24 threads, supporting the new Intel 600 Series W680, Q670, and H610 chipsets. Featuring high computing power with performance hybrid architecture and enhanced AI capabilities, rich IOs and expansions for up to quad displays 4K@60 Hz, USB 3.2 Gen2x2 (20 Gbit/s), triple Intel 2.5 GbE LANs with real-time TSN, multi M.2 Key M, ECC memory, plus TPM 2.0, and wide voltage support. The new series covers comprehensive form factors, including industrial Mini-ITX, Micro-ATX, and ATX motherboards for diverse applications, such as factory automation, kiosks, digital signage, smart cities, medical, and Edge AIoT applications.

AAEON, experts in white box solution and network appliance manufacturing, have once again partnered with flexiWAN, a leading provider of open-source SASE and SD-WAN software. Part of this partnership has prompted the certification of the FWS-2280, allowing customers access to a wider range of deployment options.

Powered by the latest Intel Atom x6000E Processor (formerly Elkhart Lake), the FWS-2280 was designed to give the option of fast, accurate connections across SD-WAN and SASE networks, while also powering an entry-level firewall, making it an excellent companion for SMEs hoping to protect their networks. This solid base also allows the FWS-2280 to run applications such as uCPE; SD-WAN, VPN, SMB, UTM, and Firewall.