IBM is one of the frontiers for using the natural properties of quantum particles to process the information on an enterprise scale. With constant advances in quantum information processing, the company is using newly found discoveries to double the size of its quantum processors. Using quantum properties instead of the conventional on/off switching of bits in the regular processors, quantum processors can process the information on a much larger scale. Last year, IBM unveiled the Eagle quantum processor with 127 qubits. This year, the company is bringing in 433 qubits to the table to power the next generation of enterprise and data center infrastructure.

Called IBM Osprey, it features IBM's 433 qubits cooled to cryogenic temperatures and in a controlled environment. While the computational power of the processor seems to be rather impressive, it is still a noisy quantum implementation that is sensitive to outside noise and requires exceptionally low temperatures to operate, such as -273 Degrees Celcius. To combat some of those obstacles, Osprey adds multi-level wiring to provide flexibility for signal routing and device layout while also adding integrated filtering to reduce noise and improve stability. Concurrently, IBM developed new signal delivery wiring that is 70% cheaper and produces the same result, driving up the ability to commercialize this design. For performance, IBM managed to increase quantum volume four times from 128 to 512 and a 10x improvement in Driving quantum performance from 1.4k to 15k Circuit Layer Operations Per Second (CLOPS).

Today, at Linley Fall Processor Conference 2022, Andes Technology, a leading provider of high efficiency, low power 32/64-bit RISC-V processor cores and founding premier member of RISC-V International, reveals its top-of-the-line AndesCore AX60 series of power and area efficient out-of-order 64-bit processors. The family of processors are intended to run heavy-duty OS and applications with compute intensive requirements such as advanced driver-assistance systems (ADAS), artificial intelligence (AI), augmented/virtual reality (AR/VR), datacenter accelerators, 5G infrastructure, high-speed networking, and enterprise storage.

The first member of the AX60 series, the AX65, supports the latest RISC-V architecture extensions such as the scalar cryptography extension and bit manipulation extension. It is a 4-way superscalar with Out-of-Order (OoO) execution in a 13-stage pipeline. It fetches 4 to 8 instructions per cycle guided by highly accurate TAGE branch predictor with loop prediction to ensure fetch efficiency. It then decodes, renames and dispatches up to 4 instructions into 8 execution units, including 4 integer units, 2 full load/store units, and 2 floating-point units. Besides the load/store units, the AX65's aggressive memory subsystem also includes split 2-level TLBs with multiple concurrent table walkers and up to 64 outstanding load/store instructions.

SiFive, Inc. the founder and leader of RISC-V computing, today announced two new products that address the need for high performance and efficiency in a small size in high volume applications like wearables, smart home, industrial automation, AR/VR, and other consumer devices. The SiFive Performance P670 and P470 RISC-V processors bring unparalleled compute performance and efficiency that is significantly raising the bar for innovative designs in these high-volume markets. The modern and innovative SiFive design methodologies bring raw compute density that is a substantial advantage for SiFive Performance products and also translates into significant cost savings for customers.

"The P670 and P470 are specifically designed for, and capable of handling the most demanding workloads for wearables and other advanced consumer applications. These new products offer powerful performance and compute density for companies looking to upgrade from legacy ISAs," said Chris Jones, SiFive VP of Product. "We have optimized these new RISC-V Vector enabled products to deliver the performance and efficiency improvements the industry has long been asking for, and we are in evaluations with a number of top-tier customers. Additionally, as the upstream enablement of RISC-V has started within the Android Open Source Project, (AOSP), designers will have unrivaled choice and flexibility as they consider the positive implications with that platform for future designs."

Intel's upcoming Sapphire Rapids processors have faced multiple delays over the past few years. Built on Intel 7 manufacturing process, the CPU is supposed to bring new advances for Intel's clients and significant performance uplifts. However, TrendForce reports that the mass production of Sapphire Rapids processors will be delayed from Q4 of 2022 to the first half of 2023. The reason for this (yet another) delay is that the Sapphire Rapids MCC die is facing a meager yield on Intel 7 manufacturing technology, estimated to be at only 50-60% at the time of writing. Economically, this die-yielding percentage is not profitable for Intel since many dies are turning out to be defective.

This move will stop many OEMs and cloud service providers (CSPs) from rolling out products based on the Sapphire Rapids design and will have to delay it until next year's mass production. On the contrary, AMD is likely to reap the benefits of Intel's delay, and AMD's x86 server market share will jump from 15% in 2022 to 23% in 2023. Given that AMD ships processors with the highest core counts, many companies will opt for AMD's solutions in their data centers. With more companies being concerned by their TCO measures with rising energy costs, favors fall in the hand of single-socket servers.

AMD appears to like to play coy when it comes to new product announcements, or at least the reveal of upcoming product announcements. Just as with its November 3rd event, the company has put out a miniscule teaser for its November 10th announcement of what the company is simply calling "the unveiling of our next-gen server processors" on Twitter. The event will kick off at 10 am Pacific time and it appears there will be a live stream, as AMD is inviting people to watch the event online. It's highly likely that we're talking about new EPYC parts here, as the event is called "together we advance_data centers".

Yesterday Intel announced its 13th generation Raptor Lake processor lineup. The top-of-the-line model, Core i9-13900KS, features eight P-cores and 16 E-cores for a total of 24 cores in the SoC. However, that may not represent the maximum for Raptor Lake, as there appears to be another segment equipped with a Raptor Lake processor with 34 cores. According to findings of Tom's Hardware, the Intel Innovation event in San Jose had a surprise for everyone, as there was a booth to display Raptor Lake silicon wafers. After closer examination, the wafer had cutouts for dies that contained as many as 34 cores.

With all cores being the same size, it is assumed that those are P-cores interconnected on a mesh, unlike the traditional ring bus that the rest of Raptor Lake processors use. On the back of the wafer was a label stating, "Raptor Lake-S, 34 core". This suggests that the CPU is perhaps a part of the HEDT offerings that Intel will soon update with the 13th generation designs and that the company showcased a production wafer for those SKUs. We expect to hear more about this unknown 34-core configuration sometime in the future as the new Intel Core generation begins its rollout.

AMD today introduced the Ryzen Embedded V3000 Series processors, adding the high-performance "Zen 3" core to the V-Series portfolio to deliver reliable, scalable processing performance for a wide range of storage and networking system applications. With greater CPU performance, DRAM memory transfer rate, CPU core count and I/O connectivity when compared to the AMD Ryzen Embedded V1000 series, the new AMD Ryzen Embedded V3000 Series processors deliver the performance and low-power options required for some of the most demanding 24x7 operating environments and workloads.

Now shipping to leading embedded ODMs and OEMs, AMD Ryzen Embedded V3000 processors address the growing demands of enterprise and cloud storage, as well as data center network routing, switching and firewall security features. AMD Ryzen Embedded V3000 processors can power a variety of diverse use-cases ranging from virtual hyper-converged infrastructure to advanced systems at the edge.

There have been some rumours circulating about Intel looking at increasing the pricing for its CPUs and if a screenshot from Amazon UK posted by @momomo_us on Twitter is to be believed, it looks like it'll be a significant increase in price. The Core i9-13900KF is listed with a price of £750.12, or almost US$815, admittedly including 20 percent VAT. That's a significant price increase over the Core i9-12900KF which normally retails for £679, but is currently offered for £608.99 by Amazon UK. It doesn't look better further down the stack either, with the Core i7-13700K coming in at £547.22 compared to a retail price of £409.88 for the Core i7-12700K.

The Core i7-13700KF should land at £516.58, versus £396.40 for the Core i7-12700KF. Finally the Core i5-13600KF ends up at £349.75 versus £272.99 for the Core i5-12600KF. As such, we're looking at a price increase of somewhere between around £80 and £140 depending on the SKU. These are not insignificant price increases if these are the actual retail prices we can expect when Intel launches its 13th gen Core processors in October. Hopefully we'll get some clarity next week, when Intel is said to be announcing the new CPUs. @momomo_us also provided some box art for the new processor boxes, for your viewing pleasure.

Today, Intel introduces a new processor for the essential product space: Intel Processor. The new offering will replace the Intel Pentium and Intel Celeron branding in the 2023 notebook product stack.

"Whether for work or play, the importance of the PC has only become more apparent as the torrid pace of technological development continues to shape the world. Intel is committed to driving innovation to benefit users, and our entry-level processor families have been crucial for raising the PC standard across all price points. The new Intel Processor branding will simplify our offerings so users can focus on choosing the right processor for their needs." -Josh Newman, Intel vice president and interim general manager of Mobile Client Platforms

Starting next year, AMD will move to a new model number scheme for its mobile processors and it appears that the company has decided to use the first digit to represent the model year, which should alleviate some past confusion. The second digit in the model name will represent where in the product stack the specific chip will sit and here we're potentially getting some new 6 and 8 models, although nothing guarantees that AMD will actually implement these segments into real products. The third digit represents the architecture, so a four equals Zen 4 for example.

The last digit in the model names is a new addition where AMD has sub SKUs that offer some performance advantage of the base SKU of a specific model and this digit will apparently only be represented by a 0 or a 5. Finally AMD has added a new suffix too, where C stands for Chromebook. This translates to 15-28 Watt chips that have been designed specifically for Chromebook usage. The current HX, HS and U suffix lettering will carry over, alongside the lower-case e for 9 W versions the U SKUs. AMD has also segmented it's mobile CPUs according to the chart below, to try and deliver a clearer use case for its various CPU models. The chart is pretty self explanatory, although some of the segmentation will apply to updated models of current designs, whereas others will only apply to new laptop designs. The new model numbering scheme will apply to at least 2025.

Microsoft is announcing the general availability of the latest Azure Virtual Machines featuring the Ampere Altra Arm-based processor. The new virtual machines will be generally available on September 1, and customers can now launch them in 10 Azure regions and multiple availability zones around the world. In addition, the Arm-based virtual machines can be included in Kubernetes clusters managed using Azure Kubernetes Service (AKS). This ability has been in preview and will be generally available over the coming weeks in all the regions that offer the new virtual machines.

Earlier this year, we launched the preview of the new general-purpose Dpsv5 and Dplsv5 and memory optimized Epsv5 Azure Virtual Machine series, built on the Ampere Altra processor. These new virtual machines have been engineered to efficiently run scale-out, cloud-native workloads. Since then, hundreds of customers have tested and experienced firsthand the excellent price-performance that the Arm architecture can provide for web and application servers, open-source databases, microservices, Java and.NET applications, gaming, media servers, and more. Starting today, all Azure customers can deploy these new virtual machines using the Azure portal, SDKs, API, PowerShell, and the command-line interface (CLI).

Qualcomm is a company well known for designing processors going inside a vast majority of smartphones. However, the San Diego company has been making attempts to break out of its vision to focus on smartphones and establish new markets where it could show its potential for efficient processor design. According to Bloomberg's insights, Qualcomm is planning to re-enter the server market and try again to compete in the now very diverse space. In 2014, Qualcomm announced that the company is developing an Arm ISA-based CPU that will target servers and be an excellent alternative for cloud service providers looking at efficient designs called Centriq. Later on, in November of 2017, the company announced the first CPU Centriq 2400, which had 48 custom Falkor cores, six-channel DDR4 memory, and 60 MB of L3 cache.

What happened later is that the changing management of the company slowly abandoned the project, and the Arm CPU market was a bit of a dead-end for many projects. However, in recent years, many companies began designing Arm processors, and now the market is ready for a player like Qualcomm to re-enter this space. With the acquisition of Nuvia Inc., which developed crazy fast CPU IPs under the leadership of industry veterans, these designs could soon see the light of the day. It is reported that Qualcomm is in talks with Amazon's AWS cloud division, which has agreed to take a look at Qualcomm's offerings.

The x86 CPU family has been vulnerable to many attacks in recent years. With the arrival of Spectre and Meltdown, we have seen side-channel attacks overtake both AMD and Intel designs. However, today we find out that researchers are capable of exploiting Intel's latest 10th, 11th, and 12th generation Core processors with a new CPU bug called ÆPIC Leak. Named after Advanced Programmable Interrupt Controller (APIC) that handles interrupt requests to regulate multiprocessing, the leak is claimeing to be the first "CPU bug able to architecturally disclose sensitive data." Researchers Pietro Borrello (Sapienza University of Rome), Andreas Kogler (Graz Institute of Technology), Martin Schwarzl (Graz), Moritz Lipp (Amazon Web Services), Daniel Gruss (Graz University of Technology), and Michael Schwarz (CISPA Helmholtz Center for Information Security) discovered this flaw in Intel processors.

ÆPIC Leak is the first CPU bug able to architecturally disclose sensitive data. It leverages a vulnerability in recent Intel CPUs to leak secrets from the processor itself: on most 10th, 11th and 12th generation Intel CPUs the APIC MMIO undefined range incorrectly returns stale data from the cache hierarchy. In contrast to transient execution attacks like Meltdown and Spectre, ÆPIC Leak is an architectural bug: the sensitive data gets directly disclosed without relying on any (noisy) side channel. ÆPIC Leak is like an uninitialized memory read in the CPU itself.

A privileged attacker (Administrator or root) is required to access APIC MMIO. Thus, most systems are safe from ÆPIC Leak. However, systems relying on SGX to protect data from privileged attackers would be at risk, thus, have to be patched.

AMD Ryzen Threadripper Pro 5000 series processors have been available since March in Lenovo systems. In the meantime, system integrators and OEMs got their hands on these processors and started selling systems based around them. However, today the DIY channel is equipped with these monstrous CPUs. With up to 64 cores and 128 threads of Zen3 IP, these processors can boost up to 4.5 GHz and have 128 PCIe 4.0 lanes and an eight-channel DDR4 integrated memory controller with 280 Watt TDP across all models. AMD has noted that the non-Pro Threadripper 5000 series is ceasing production in favor of these Pro models and justifying the increased price point by adding more L3 cache and more cores.

The 24C/48T Threadripper Pro 5965WX comes with a 3.8 GHz base and 4.5 GHz boost frequency with 128 MB of L3 cache, and it is priced at 2399 USD. The bigger Threadripper Pro 5975WX is equipped with 32C/64T configuration, has a 3.6 GHz base and 4.5 GHz boost speed, and carries 128 MB of L3 cache while priced at 3299 USD. The top-end Threadripper Pro 5995WX is a monstrous 64C/128T design with a base frequency of 2.7 GHz and a boost of 4.5 GHz. It has 256 MB of L3 cache and costs a staggering 6499 USD. Additionally, all of the new Ryzen Threadripper Pro 5000 series CPUs require a WRX80-based motherboard chipset, which is an additional expense of its own.

During this year's Flash Memory Summit, Phison, a company known for SSD controllers and now flash drives, demonstrated a system running AMD Ryzen 7000 series processors based on Zen 4 architecture. What is interesting about the shown specification is that the system was running an engineering sample of an upcoming Zen 4-based CPU with the latest storage technologies at impressive speeds. Using a Phison PS5026-E26 SSD controller, also called E26, the PCIe 5.0 SSD is powered by Micron's latest 232-layer TLC NAND flash. This new NAND technology will also bring greater densities to the market by promising higher endurance, higher read/write speeds, and better efficiency.

With AMD's upcoming AM5 platform, support for PCIe 5.0 SSDs is a welcome addition. And we today have some preliminary tests that show just how fast these SSDs can run. In CrystalDiskMark 8.0.4, it achieved over 10 GB/s in both read and write. We know that the E26 controller is capable of 12 GB/s speeds, so more fine-tuning is needed. Being an early sample, we expect final specifications to be better. The system is powered by an engineering sample of a six-core, twelve-threaded Zen 4 CPU running at unknown clocks, codenamed 100-000000593-20_Y. We can expect to see more of this technology once AMD's AM5 platform lands and Phison-powered SSDs hit the shelves in September.

TikTok's parent company ByteDance has recently begun hiring chip designers to help develop specialized processors for fields where they haven't been able to find existing suppliers. The company is looking to design chips that are optimized for hosting their video, information, and entertainment apps without any plans to sell these processors to other companies. This latest announcement follows various other Chinese companies such as Alibaba and Baidu in developing custom processors to decrease their reliance on foreign companies and improve performance in specific tasks. The initial job listings only include 31 openings for positions such as experts, specialists, and interns with more staff likely required in the future.

ASRock has released UEFI/BIOS updates for at least 47 of its 600-series chipset based motherboards, which will add support for the next generation of CPUs from Intel. The new CPUs are of course Intel's 13th gen Core CPU's, codenamed Raptor Lake, even though ASRock doesn't specifically mention this anywhere in the text on its portal site. We're expecting to see similar announcements from the other motherboard makers in due time. ASRock doesn't go into any kind of details as to which CPUs are supported and the company doesn't appear to have updated its CPU support lists yet, which is a shame, but not entirely unexpected, since the Raptor Lake CPUs aren't expected to launch until later this year.

However, ASRock has implemented what the company calls Auto Driver Installer or ADI in this UEFI/BIOS update for the boards and this is likely to be an unpopular addition, as it means drivers will be automatically be downloaded and installed if the system is connected to the internet. Presumably there will be an option to disable this feature, but it appears to be enabled by default, which has proven to be an unpopular option when other companies have done it. Admittedly it could be a handy feature during a new build or OS reinstall, but it's also a potential attack vector for malware.

Hewlett Packard Enterprise (NYSE: HPE) today announced that it is the first major server provider to deliver a new line of cloud-native compute solutions using processors from Ampere. The new HPE solutions provide service providers and enterprises embracing cloud-native development with an agile, extensible, and trusted compute foundation to drive innovation.

Available in Q3 2022, the new HPE ProLiant RL300 Gen11 server is the first in a series of HPE ProLiant RL Gen11 servers that deliver next-generation compute performance with higher power efficiency using Ampere Altra and Ampere Altra Max cloud-native processors.

Intel is set to launch its 13th generation Raptor Lake processor lineup for desktop users sometime in September or October. However, the market is already supplied with early-stage engineering samples of Raptor Lake-S SKUs used for testing and software optimization. Today, we have the first listing of the upcoming flagship Intel Core i9-13900K processor with eight P-cores and 16 E-Cores on the CPU. The anonymous seller claims that the CPU is working with ASUS Z690 ROG Apex motherboards, boots up, and can be overclocked, which means that this is one of the newer engineering sample revisions. The sample was listed for 2850 Chinese Yuan, translating to about 426 USD. This price should be close to the final MSRP, and the CPU is already sold.

What is interesting is the appearance of this CPU on the black market way ahead of the launch. We can expect to see more details emerge as we get closer to the launch time later this year.

AMD is preparing to update its mobile sector with the latest IP in the form of Zen4 CPU cores and RDNA3 graphics. According to Red Gaming Tech, we have specifications of upcoming processor families. First, we have AMD Dragon Range mobile processors representing a downsized Raphael design for laptops. Carrying Zen4 CPU cores and RDNA2 integrated graphics, these processors are meant to power high-performance laptops with up to 16 cores and 32 threads. Being a direct competitor to Intel's Alder Lake-HX, these processors also carry an interesting naming convention. The available SKUs include AMD Ryzen 5 7600HX, Ryzen 7 7800HX, Ryzen 9 7900HX, and Ryzen 9 7980HX design with a massive 16-core configuration. These CPUs are envisioned to run along with more powerful dedicated graphics, with clock speeds of 4.8-5.0+ GHz.

Next, we have AMD Phoenix processors, which take Dragon Range's design to a higher level thanks to the newer graphics IP. Having Zen4 cores, Phoenix processors carry upgraded RDNA3 graphics chips to provide a performance level similar to NVIDIA's GeForce RTX 3060 Max-Q SKU, all in one package. These APUs will come in four initial configurations: Ryzen 5 7600HS, Ryzen 7 7800HS, Ryzen 9 7900HS, and Ryzen 9 7980HS. While maxing out at eight cores, these APUs will compensate with additional GPU compute units with a modular chiplet design. AMD Phoenix is set to become AMD's first chiplet design launching for the laptop market, and we can expect more details as we approach the launch date.

Imagination Technologies announces IMG RTXM-2200, its first real-time embedded RISC-V CPU, a highly scalable, feature-rich, 32-bit embedded solution with a flexible design for a wide range of high-volume devices. IMG RTXM-2200 is one of the first commercial cores in Imagination's Catapult CPU family, previously announced in December 2021. Accelerating the expansion of its RISC-V offering, Imagination's IMG RTXM-2200 can be integrated into complex SoCs for a range of applications including networking solutions, packet management, storage controllers, and sensor management for AI cameras and smart metering. Together with its market-leading GPU and AI accelerator IP, Imagination's new CPU cores offer customers access to innovative heterogeneous solutions.

This real-time embedded core features up to 128 KB of tightly coupled memories (both instruction and data) for deterministic response and Level 1 cache sizes of up to 128 KB for robust performance. The new CPU offers a range of floating-point formats including single-precision and bfloat16. The latter enables manufacturers to deploy AI applications through this core without the need for an additional chip. This reduces silicon area, for a cost-effective and optimised design in AI cameras and smart metering applications.

SiFive Inc., the founder and leader of RISC-V computing, today announced the release of the latest version of its SiFive Intelligence X280 processor, which introduces significant new features including scalability up to a 16-core cache-coherent complex, WorldGuard trusted protection, and a new interface allowing for seamless integration between the X280 vector unit and customer-designed external AI accelerators or other coprocessors, called VCIX (Vector Coprocessor Interface eXtension). Collectively, these enhanced features deliver unmatched scalability, security, and interoperability to the SiFive X280, the most widely adopted implementation of the RISC-V Vector extension. This latest version of the X280 is a powerful solution for those looking for alternatives to legacy SIMD-style architectures.

Publicly available since April 2021, the SiFive Intelligence X280 has seen rapid adoption as customers gravitate towards its unique combination of performance, power efficiency, and an intuitive programming model. The X280 has claimed double-digit design wins in the past six months alone, in a wide variety of data-driven applications, including AI inference, image processing, datacenter acceleration, and automotive use cases.

Super Micro Computer, Inc., a global leader in enterprise computing, storage, networking, and green computing technology, is announcing the global availability of a wide range of systems for edge computing, including the recently announced SuperEdge and a range of Intel Xeon D processor-based systems, with up to 20 cores, 25 GbE networking built-in, and a temperature operating range from -40° C to 85° C. These systems are optimized for the Intelligent Edge, where responsive systems that reduce latency are required. In addition, locating powerful AI systems closer to where data is generated reduces network traffic and lowers response time.

"We are pleased to be able to deliver our high-volume optimized edge systems worldwide due to our expanded factories and capacity," said Charles Liang, president, and CEO of Supermicro. "Our latest systems are designed for harsh conditions with the highest performing CPUs and GPUs that are available. Supermicro has the unique ability to quickly deliver industry-optimized solutions from the edge to the data center by using our Building Block Solution approach. We are also committed to lessening our servers' carbon footprint, resulting in fewer emissions and a greener planet."

Intel's high-end desktop (HEDT), usually reserved for workstation and enterprise applications, is due for an update, and the company is readying an entire family of updated products. Today, we found a leak of what appears to be an Intel Sapphire Rapids design made for desktops. Called Xeon W5-3433, the CPU appears in the SiSoftware Sandra benchmark database. It carries a configuration of 16 cores and 32 threads and is equipped with 32 MB of L2 cache and 45 MB of L3 cache. Having 2 MB of L2 cache per core suggests that the design is not an Alder Lake variation. This specific SKU is clocked at 1.99 GHz, meaning an early engineering sample.

The Sapphire Rapids HEDT platform is codenamed FishHawk Falls. Intel is supposed to offer Alder Lake-X processors with higher core counts and the FishHawk Falls. Both will be running on the same W790 chipset; however, the Sapphire Rapids implementation will carry more cores in a Xeon package designed for professionals. There was an Ice Lake-X Xeon processor called Xeon W-3335 with 16 cores and 32 threads, meaning that the leaked Xeon W5-3433 is its direct successor.

Intel is preparing to launch its 13th generation of desktop processors codenamed Raptor Lake. Succeeding Alder Lake, the 13th gen design will implement up to eight P-cores with 16 E-cores manufactured on Intel's improved 7+ technology node. Today, we got a performance preview from SiSoftware that has collected SiSoftware Sandra database scores of Intel Core i9-13900 Raptor Lake-S processor. They present an overview of a few benchmarks. Firstly, the SoC features 36 MB of unified L3 cache versus 30 MB in Alder Lake. With DDR5 memory running up to 5600 MT/s and PCIe 5.0, the SoC features the latest IO and memory standards. The big P-cores now lack AVX-512 and feature 2 MB of L2 cache per core. We see 4 MB of L2 cache for a cluster of small E-cores. An exciting addition to E-cores is the AVX/AVX2 support, which is a first for Atom cores.

Regarding testing, the author has collected a few tests that seemed appropriate to compare to the equivalent Alder Lake model. Starting with ALU/FPU tests that benchmark basic arithmetic tasks, Raptor Lake delivered 33% to 50% improvement over Alder Lake. The Raptor Lake design achieved this with 3.7 GHz P-Core and 2.76 GHz E-Core frequency. In vectorized and SIMD tests, the 13th gen design showed only 5% to 8% improvement over the previous generation. For more benchmarks and accurate results, we have to wait for TechPowerUp's test, which will be coming on the release day.