Many companies, including Intel and AMD, have stopped product shipments to Russia amidst the war in Ukraine in the past few months. This has left the Russian state without any new processors from the two prominent x86 designers, thus slowing down the country's technological progress. To overcome this issue, it seems like the solution is embedded in the Chinese Zhaoxin x86 CPUs. According to the latest report from Habr, a motherboard designer called Dannie is embedding Chinese Zhaoxin x86 CPUs into motherboards to provide the motherland with an x86-capable processor. More precisely, the company had designed a BX-Z60A micro-ATX motherboard that embeds Zhaoxin's KaiXian KX-6640MA SoC with eight cores based on LuJiaZui microarchitecture. The SoC is clocked at a frequency range of 2.1-2.7 GHz, carries 4 MB of L2 cache, 16 lanes of PCIe 3.0, and has integrated graphics, all in a 25 Watt TDP.

As far as the motherboard is concerned, it supports two DDR4 memory slots, two PCIe x16 connectors, M.2-2280 and M.2-2230 slots, and three SATA III connectors for storage. For I/O you have USB ports, DisplayPort, HDMI, VGA/D-Sub, GbE, 3.5-mm audio, and additional PS/2 ports. This is a pretty decent selection; however, we don't know the pricing structure. A motherboard with KaiXian KX-6640MA SoC like this is certainly not cheap, so we are left to wonder if this will help Russian users deal with the newly imposed restriction on importing US tech.

Today at the Intel Vision conference, Habana Labs, an Intel company, announced its second-generation deep learning processors, the Habana Gaudi 2 Training and Habana Greco Inference processors. The processors are purpose-built for AI deep learning applications, implemented in 7nm technology and build upon Habana's high-efficiency architecture to provide customers with higher-performance model training and inferencing for computer vision and natural language applications in the data center. At Intel Vision, Habana Labs revealed Gaudi2's training throughput performance for the ResNet-50 computer vision model and the BERT natural language processing model delivers twice the training throughput over the Nvidia A100-80GB GPU.

"The launch of Habana's new deep learning processors is a prime example of Intel executing on its AI strategy to give customers a wide array of solution choices - from cloud to edge - addressing the growing number and complex nature of AI workloads. Gaudi2 can help Intel customers train increasingly large and complex deep learning workloads with speed and efficiency, and we're anticipating the inference efficiencies that Greco will bring."—Sandra Rivera, Intel executive vice president and general manager of the Datacenter and AI Group

AMD (NASDAQ: AMD) today announced the expansion of the AMD EPYC processor footprint within the cloud ecosystem, powering the new Oracle Cloud Infrastructure (OCI) E4 Dense instances. These new instances are part of the Oracle Cloud VMware Solution offerings, enable customers to build and run a hybrid-cloud environment for their VMware based workloads.

Based on 3rd Gen AMD EPYC processors, the new E4 Dense instances expand the AMD EPYC presence at OCI and are made to support memory and storage intense VMware workloads. The E4 Dense instances utilize the core density and performance capabilities of EPYC processors to provide customers a fast path to a cloud environment, enabling similar performance and advanced security features through enabling the AMD Secure Encrypted Virtualization (SEV) security feature for VMware workloads that they have on-premises.

AMD and the Mercedes-AMG Petronas Formula One (F1) Team today showcased how AMD EPYC processors improved aerodynamics testing capacity, contributing to the Mercedes-AMG Petronas team winning its eighth Constructors' Championship in the 2021 racing season. By using AMD EPYC processors, the team was able to achieve a 20 percent performance improvement for computational fluid dynamics (CFD) workloads that were used to model and test aerodynamic flow of their F1 car.

"We are proud to partner with the reigning Constructors' Champions, the Mercedes-AMG Petronas Formula One Team, operating at the cutting edge of racing and technology," said, Dan McNamara, senior vice president and general manager, Server Business Unit, AMD. "For F1 teams, having the most effective computational analysis of aerodynamics can mean the difference between winning and losing a race. With AMD EPYC processors, the Mercedes-AMG F1 team can iterate on vehicle design faster and more efficiently than their previous system."

Intel is slowly transitioning its data center customers to a new processor generation called Sapphire Rapids. Today, thanks to the hardware leaker Yuuki_ans we have more profound insights into the top-end 56-core Sapphire Rapids processor and its power settings. According to the leak, we have information on either Xeon Platinum 8476 or Platinum 8480 designs that are equipped with 56 cores and 112 threads. This model was running at the base frequency of 1.9 GHz and a boost frequency of 3.3 GHz. Single-core can boost to 3.7 GHz if the report is giving a correct reading. Remember that this is only an engineering sample, so the final target speeds could differ. It carries 112 MB of L2 and 105 MB of L3 cache, and this sample was running with 1 TB of DDR5 memory with CL40-39-38-76 timings.

Perhaps the most exciting finding is the power configuration of this SKU. Intel has enabled this CPU to consume 350 Watts in PL1 rating, with up to 420 Watts in PL2 performance mode. The enforced BIOS power limit rating is set at an astonishing 764 Watts, which could happen with AVX-512 enabled. Final TDP ratings are yet to be disclosed; however, these Sapphire Rapids processors are shaping to be relatively power-hungry chips.

AMD is slowly gearing up to launch the latest 7000 series Ryzen processors codenamed "Raphael." Thanks to the famous hardware leaker @9550pro on Twitter, we have evidence of B650 motherboards for the next-generation hardware. According to the image posted by the leaker, it appears like AMD's Ryzen 7000 series Raphael processor is running on MSI's MAG B650 motherboard at a very high voltage of 1.5 Volts VCore. While we don't know the exact SKU running here, we see a note referring to it as an Engineering Sample, meaning that this is not a final product. It is expected to see the new AM5 platform make a debut alongside DDR5 and PCIe 5.0 technology, so we have to wonder what the B650 chipset can support.

Polyn Technology announced today that its first Neuromorphic Analog Signal Processor (NASP) chip is packaged and evaluated, demonstrating proof of the technology's brain-mimicking architecture. It is the first Tiny AI true analog design to be used next to sensors. Polyn Technology is an innovative provider of ultra-low-power-performance NASP technology and a producer of unique Tiny AI chips and their associated IP. "This achievement validates the intensive work of our multinational team," said Aleksandr Timofeev, CEO and founder of Polyn Technology. "Our chip represents the most advanced technology bridging analog computations and the digital core. It is designed with neuroscience in mind, replicating pre-processing the primary cortical area of the human brain does at the periphery before learning at the center."

The NASP chip enables full data processing disaggregation between the sensor node and the cloud; it truly embodies the Tiny AI concept. The NASP test chip contains several neural networks. The chip is implemented in 55 nm CMOS technology. Its design proves the NASP "neuron" model as well as the scalability of the technology and efficiency of the chip design automation tools developed by Polyn. "Our first chip is created from trained neural networks by NASP Compiler and synthesis tools that generated Netlist and the silicon engineering files from the software math model simulation. We will continue to refine our technology for creation of new generation chips," said Yaakov Milstain, COO of Polyn. Polyn anticipates the chip will be available to customers in the first quarter of 2023 as its first wearables product, with a fusion of PPG and IMU sensors for the most accurate heart rate measurement along with recognition and tracking of human activity.

Here is the first picture of a next-generation AMD EPYC "Genoa" processor with its integrated heatspreader (IHS) removed. This is also possibly the first picture of a "Zen 4" CPU Complex Die (CCD). The picture reveals as many as twelve CCDs, and a large sIOD silicon. The "Zen 4" CCDs, built on the TSMC N5 (5 nm EUV) process, look visibly similar in size to the "Zen 3" CCDs built on the N7 (7 nm) process, which means the CCD's transistor count could be significantly higher, given the transistor-density gained from the 5 nm node. Besides more number-crunching machinery on the CPU core, we're hearing that AMD will increase cache sizes, particularly the dedicated L2 cache size, which is expected to be 1 MB per core, doubling from the previous generations of the "Zen" microarchitecture.

Each "Zen 4" CCD is reported to be about 8 mm² smaller in die-area than the "Zen 3" CCD, or about 10% smaller. What's interesting, though, is that the sIOD (server I/O die) is smaller in size, too, estimated to measure 397 mm², compared to the 416 mm² of the "Rome" and "Milan" sIOD. This is good reason to believe that AMD has switched over to a newer foundry process, such as the TSMC N7 (7 nm), to build the sIOD. The current-gen sIOD is built on Global Foundries 12LPP (12 nm). Supporting this theory is the fact that the "Genoa" sIOD has a 50% wider memory I/O (12-channel DDR5), 50% more IFOP ports (Infinity Fabric over package) to interconnect with the CCDs, and the mere fact that PCI-Express 5.0 and DDR5 switching fabric and SerDes (serializer/deserializers), may have higher TDP; which together compel AMD to use a smaller node such as 7 nm, for the sIOD. AMD is expected to debut the EPYC "Genoa" enterprise processors in the second half of 2022.

Today, Microsoft launches Azure Virtual Machines (VM) based on the Ampere Altra Cloud Native Processor. This marks an important milestone as developers can now take advantage of these modern high-performance VMs for their existing and greenfield applications. The Ampere Altra processor family leads in performance across a range of broadly deployed cloud workloads and is now making available the Arm architecture on Azure.

Industry leading performance and the most sustainable solution
Cloud users who have pushed the limits of legacy x86 architectures now have a high-performance compute alternative that scales up in a linear fashion and delivers predictable performance even at full utilization. For example, Ampere Altra VMs outperform equivalently sized Intel and AMD instances from the same generation by 39% and 47%, respectively.* In addition to being the high-performance choice, Ampere Altra processors are extremely power efficient, directly reducing users' overall carbon footprint.

Designing Artificial Intelligence / Machine Learning hardware accelerators takes effort from hardware engineers in conjunction with scientists working in the AI/ML area itself. A few years ago, we started seeing AI incorporated into parts of electronic design automation (EDA) software tools, helping chip designers speed up the process of creating hardware. What we were "used to" seeing AI do are just a couple of things like placement and routing. And having that automated is a huge deal. However, it looks like the power of AI for chip design is not going to stop there. Researchers at Google and UC Berkeley have made a research project that helps AI design and develop AI-tailored accelerators smaller and faster than anything humans made.

In the published paper, researchers present PRIME - a framework that created AI processors based on a database of blueprints. The PRIME framework feeds off an offline database containing accelerator designs and their corresponding performance metrics (e.g., latency, power, etc.) to design next-generation hardware accelerators. According to Google, PRIME can do so without further hardware simulation and has processors ready for use. As per the paper, PRIME improves performance upon state-of-the-art simulation-driven methods by as much as 1.2x-1.5x. It also reduces the required total simulation time by 93% and 99%, respectively. The framework is also capable of architecting accelerators for unseen applications.

Apple yesterday announced its M1 Ultra processor. It is designed to be one of the most powerful solutions ever envisioned for desktop users, and it leverages some of the already existing technologies. Essentially, the M1 Ultra chip combines two monolithic dies containing M1 Max designs. They are stitched together to create one massive chip behaving in a rather exciting way. To pair the two M1 Max dies together, Apple has designed a package called UltraFusion, which is a die-to-die interposer with more than 10,000 signals. It provides 2.5 TB/s low latency inter-processor bandwidth and enables seamless sharing of information across two dies.

What is more interesting is that this approach, called multi-chip module (MCM) design philosophy, allows the software to view these two dies as a single, unified processor. Memory is shared across a vast pool of processor cache and system memory in a single package. This approach is software agnostic and allows hardware to function efficiently with loads of bandwidth. Apple notes that no additional developer optimization is required for the new processor, and the already-existing stack of applications for M1 Max works out-of-the-box. Talking about numbers, the M1 Ultra chip has a potential main memory bandwidth of 800 GB/s, with up to 128 GB of unified system memory. We are yet to see how this design behaves as the first Mac Studio units start shipping, so we have to wait for more tests to check these claims out.

ASRock Industrial launches a new range of industrial motherboards powered by 12th Gen Intel Core Processors (Alder Lake-S) with up to 16 cores and 24 threads, supporting the new Intel 600 Series W680, Q670, and H610 chipsets. Featuring high computing power with performance hybrid architecture and enhanced AI capabilities, rich IOs and expansions for up to quad displays 4K@60 Hz, USB 3.2 Gen2x2 (20 Gbit/s), triple Intel 2.5 GbE LANs with real-time TSN, multi M.2 Key M, ECC memory, plus TPM 2.0, and wide voltage support. The new series covers comprehensive form factors, including industrial Mini-ITX, Micro-ATX, and ATX motherboards for diverse applications, such as factory automation, kiosks, digital signage, smart cities, medical, and Edge AIoT applications.

Unless you have been living under a rock, chances are you are following the news about the Russia-Ukraine war disputes. Not to get too political, we are here to report about your favorite rivals—AMD and Intel—officially stopping the delivery of processors to Russia and Belarus. Firstly, an AMD representative told PCWorld that "Based on sanctions placed on Russia by the United States and other nations, at this time AMD is suspending its sales and distribution of our products into Russia and Belarus. It is all AMD products and products we power (PCs, etc) in Russia and Belarus." Additionally, Intel posted an official quote, which you can find below.

IntelIntel condemns the invasion of Ukraine by Russia and we have suspended all shipments to customers in both Russia and Belarus. Our thoughts are with everyone who has been impacted by this war, including the people of Ukraine and the surrounding countries and all those around the world with family, friends and loved ones in the region.

"We are working to support all of our employees through this difficult situation, especially those with close ties to this region. We have launched an employee donation and matching campaign through the Intel Foundation that has already raised over $1.2 million for relief efforts, and we are proud of the work our teams in surrounding areas including Poland, Germany and Romania are doing to aid refugees. We will continue to stand with the people of Ukraine and the global community in calling for an immediate end to this war and a swift return to peace.

Today, Intel expands the 12th Gen Intel Core mobile processor lineup with the official launch of 12th Gen Intel Core P-series and U-series processors. Engineered for blazing performance and superior productivity, these 20 new mobile processors will power the next generation of thin-and-light laptops. The first devices will be available in March 2022, with more than 250 coming this year from Acer, Asus, Dell, Fujitsu, HP, Lenovo, LG, MSI, NEC, Samsung and others.

"Following our launch of the fastest mobile processor for gaming, we're now expanding our 12th Gen Intel Core processor family to deliver a massive leap forward in performance for thin-and-light laptops. From the ultra-thin form factors to enthusiast-grade performance in a sleek design, we're providing consumers and businesses with leadership performance and cutting-edge technologies."

The European High Performance Computing Joint Undertaking (EuroHPC JU) has launched 3 new research and innovation projects. The projects aim to bring the EU and its partners in the EuroHPC JU closer to developing independent microprocessor and HPC technology and advance a sovereign European HPC ecosystem. The European Processor Initiative (EPI SGA2), The European PILOT and the European Pilot for Exascale (EUPEX) are interlinked projects and an important milestone towards a more autonomous European supply chain for digital technologies and specifically HPC.

With joint investments of €140 million from the European Union (EU) and the EuroHPC JU Participating States, the three projects will carry out research and innovation activities to contribute to the overarching goal of securing European autonomy and sovereignty in HPC components and technologies, especially in anticipation of the European exascale supercomputers.

Intel's Alder Lake processors have two types of cores present, with two distinct sets of features and capabilities enabled. For example, smaller E-cores don't support the execution of AVX-512 instructions, while the bigger P-cores have support for AVX-512 instructions. So Intel has decided to remove support for it altogether not to create software errors and run into issues with executing AVX-512 code on Alder Lake processors. This happened just months before the launch of Alder Lake, making us see some initial motherboard BIOSes come with AVX-512 enabled from the box. Later on, all motherboard makers pulled the plug on it, and it is a rare sight to see support for it.

However, it seems like MSI is unhappy with the lack of AVX-512, and the company is reenabling partial support for it. According to Xaver Amberger, editor at Igor's Lab, MSI reintroduces selecting microcode version with its MEG Z690 Unify-X motherboard. There is an option for AVX-512 enablement in the menu, and it is indeed a functional one. With BIOS A22, MSI enabled AVX-512 instruction execution, and there are benchmarks to prove it works. This shows an advantage of 512-bit wide execution units of AVX-512 over something like AVX2, which offers only 256-bit wide execution units. In applications such as Y-Cruncher, AVX-512 enabled the CPU to reach higher performance targets while consuming less power.

Tachyum today announced that it was selected by the Slovak Republic to participate in the latest submission for the Important Projects of Common European Interest (IPCEI), to develop Prodigy 2 for HPC/AI. Prodigy 2 for HPC/AI will enable 1 AI Zettaflop and more than 10 DP Exaflops computers to support superhuman brain-scale computing by 2024 for under €1B. As part of this selection, Tachyum could receive a 49 million Euro grant to accelerate a second-generation of its Tachyum Prodigy processor for HPC/AI in a 3-nanometer process.

The IPCEI program can make a very important contribution to sustainable economic growth, jobs, competitiveness and resilience for industry and the economy in the European Union. IPCEI will strengthen the EU's open strategic autonomy by enabling breakthrough innovation and infrastructure projects through cross-border cooperation and with positive spill-over effects on the internal market and society as a whole.

Armed with more than 100 patents and leveraging multi-decade expertise in creating industry-leading silicon systems, Ceremorphic Inc. today announced its plans to deliver a complete silicon system that provides the performance needed for next-generation applications such as AI model training, HPC, automotive processing, drug discovery, and metaverse processing. Designed in advanced silicon geometry (TSMC 5 nm node), this new architecture was built from the ground up to solve today's high-performance computing problems in reliability, security and energy consumption to serve all performance-demanding market segments.

Ceremorphic was founded in April 2020 by industry-veteran Dr. Venkat Mattela, the Founding CEO of Redpine Signals, which sold its wireless assets to Silicon Labs, Inc. in March 2020 for $308 million. Under his leadership, the team at Redpine Signals delivered breakthrough innovations and industry-first products that led to the development of an ultra-low-power wireless solution that outperformed products from industry giants in the wireless space by as much as 26 times on energy consumption. Ceremorphic leverages its own patented multi-thread processor technology ThreadArch combined with cutting-edge new technology developed by the silicon, algorithm and software engineers currently employed by Ceremorphic. This team is leveraging its deep expertise and patented technology to design an ultra-low-power training supercomputing chip.

Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today announced its new premium mobile processor, the Exynos 2200. The Exynos 2200 is a freshly designed mobile processor with a powerful AMD RDNA 2 architecture based Samsung Xclipse graphics processing unit (GPU). With the most cutting-edge Arm -based CPU cores available in the market today and an upgraded neural processing unit (NPU), the Exynos 2200 will enable the ultimate mobile phone gaming experience, as well as enhancing the overall experience in social media apps and photography.

"Built on the most advanced 4-nanometer (nm) EUV (extreme ultraviolet lithography) process, and combined with cutting-edge mobile, GPU, and NPU technology, Samsung has crafted the Exynos 2200 to provide the finest experience for smartphone users. With the Xclipse, our new mobile GPU built with RDNA 2 graphics technology from the industry leader AMD, the Exynos 2200 will redefine mobile gaming experience, aided by enhanced graphics and AI performance," said Yongin Park, President of System LSI Business at Samsung Electronics. "As well as bringing the best mobile experience to the users, Samsung will continue its efforts to lead the journey in logic chip innovation."

Server processors tend to be one of the most profitable businesses for AMD and Intel. Thus, investment groups and analysts closely monitor happenings in the server and data center world. A report from Mizuho Securities (investment bank) Managing Director Jordan Klein states that many upcoming changes on the server processor front are coming this year. Mr. Klein cites sources over at Insupur Systems, one of the most prominent server vendors. More precisely, Dolly Wu is the VP and GM of Datacenter/Cloud at Inspur. According to the report, AMD and Intel will change their strategy in the server market going forward in 2022.

As far as AMD is concerned, the company plans to increase the pricing of its EPYC processors by 10-30%. This increase should be a bit easier on the strategic cloud customers. The report also indicates that as the demand far exceeds the supply of EPYC processors, AMD increases prices and makes a "take it or leave it" offer, resulting in most customers accepting the increased costs. Another interesting tidbit from the report was the talk about Intel. The blue team laid out its strategy to launch highly-anticipated Sapphire Rapids Xeons in Q2 of 2022. However, it will maybe get delayed to Q3 of 2022. Intel doesn't plan to increase prices to remain competitive with AMD, so the server space will see Intel fighting to regain the lost market share.

Today as part of CES 2022, Intel demonstrated advancements and momentum with Mobileye, progress toward discrete graphics leadership and the launch of the newest members of the 12th Gen Intel Core family. With these milestones, Intel furthers its commitment to enable the industry and its customers and partners to harness the technology superpowers - ubiquitous computing, cloud-to-edge infrastructure, pervasive connectivity and artificial intelligence - at the heart of the digital transformation.

During the Intel news conference, Gregory Bryant, executive vice president and general manager of the Client Computing Group, was joined by Lisa Pearce, vice president of the Visual Compute Group, and Prof. Amnon Shashua, Mobileye CEO, to share Intel's progress across multiple strategic businesses. "The Intel execution engine is back. From advancing the PC to high-performance graphics to autonomous driving solutions, Intel and Mobileye are proud to create new ecosystems and opportunities across multiple industries," Bryant said. "Together with our partners and customers, we are driving new innovation across products, platforms and services, and delivering on our vision of enabling world-changing technology that improves the lives of every person on the planet."

Razer, the leading global lifestyle brand for gamers (Hong Kong Stock Code: 1337), is kicking off 2022 with new Razer Blade gaming laptop models including the Razer Blade 14, Razer Blade 15, and Razer Blade 17. The world's fastest laptops for gamers and creators are equipped with the recently announced NVIDIA GeForce RTX 30 Series Laptop GPUs, up to an RTX 3080 Ti, making the new Blades better than ever, now shipping with Windows 11. All new Razer Blade gaming laptops now also include groundbreaking DDR5 memory, providing blistering clock speeds up to 4800 MHz, an increase in frequency by up to 50% compared to the previous generation.

"The Razer Blade series continues to be the best gaming laptop by providing desktop-class performance on-the-go," says Travis Furst, Senior Director of Razer's Systems business unit. "Additionally, we've enabled creators to work anywhere with gorgeous displays, available NVIDIA Studio drivers, and up to 14-Core CPUs. Users will have the ability to choose any model or configuration that best fits their gaming or creating needs, while getting the latest and greatest in graphics, memory and processing technology."

According to the latest round of rumors coming from tech media VideoCardz, Intel could be preparing an answer to AMD's 3D V-cache in the form of... pre-binned Core i9-12900KS? As per the report, Intel could be making a pre-binned, pre-overclocked Core i9-12900KS processor with an all-core turbo boost frequency of 5.2 GHz. This alleged clock speed will push the processor to some fantastic heights and increase the overall performance of the regular Core i9-12900K processor. With AMD's Ryzen processors with 3D V-cache incoming, Intel has prepared this solution to keep up with the increasing pressure from AMD.

So far, we don't know the specific requirements for Core i9-12900KS to reach 5.2 GHz. However, we assume that Voltage needs a big boost, making cooling and power supply requirements increase. This special edition Alder Lake design should launch around the same time frame that AMD reveals its 3D V-cache enabled Ryzen processors, so Intel doesn't let AMD steal the performance crown.

All six Intel 12th Gen Core "Alder Lake" processor models launched to date are unlocked (K or KF) SKUs, which lack a boxed cooling solution. This is expected to change early next year when Intel fleshes out the lineup with at least 10 new SKUs for the retail segment; and with "Alder Lake" marking the first major change to the mainstream desktop processor cooling mount in over a decade; Intel has the opportunity to radically change its cooling design. We got our first hint at what these could look like back in September, and we now have a clear picture of one of them.

There are three stock coolers Intel is preparing. The RH1 (high) will likely go with the top Core i9-12900 and i9-12900F parts. The RM1 (mid) could be bundled with various Core i7 and Core i5 SKUs; while the RS1 (small) could go with entry-level Core i3 SKUs. Here we have the RM1. Back in the September article, we were staring at low-resolution pictures and trying to guess what the heatsink design could look like. At the time we thought that the pointy structures into which the fan is nestled, are metallic extensions of the heatsink's fins, designed to make use of lateral bleed airflow from the fan. The new picture puts this theory to rest. Turns out, those are little more than an aesthetic touch.

Just yesterday, thanks to the Linux driver update, we found information stating that AMD's upcoming EPYC Genoa processor generation based on Zen 4 core IP will have a 12-channel memory controller. However, we didn't know how AMD engineered the memory controller of this processor generation and some of its maximum capabilities. However, there is an exciting discovery. According to the report from ComputerBase, with information exclusive to them, AMD will enable up to 12 TB of DDR5 memory spread across 12 memory channels. The processor supports DDR5-5200 memory, but when all 24 memory slots (two per channel) are populated, the DDR5 maximum speed drops to 4000 MT/s.

It is unclear why this is the case, and if any difficulties were designing the controller, so the maximum speed drops when every slot is used. One reassuring thing is that the bandwidth created by 12 memory channels should be sufficient to make up for the lost speed of DDR5 memory reduction.