For those of you that are eagerly awaiting the Ryzen 7000-series CPUs, details of the potential pricing has appeared over at Canadian e-tailer DirectDial. @momomo_us was first to post the details on Twitter, but didn't provide any details of who the e-tailer was, but some sleuthing using the AMD ordering codes soon brought us to DirectDial. The company has listed the all four expected CPU models with pricing and it appears that AMD has decided to stop providing coolers entirely, as none of the four upcoming CPUs appear to be available with a cooler in the box. All the model names ending WOF are retail packaged CPUs and the ones missing WOF at the end of the product number are tray CPUs from what we can tell.

As for the pricing, the Ryzen 5 7600X is listed at CA$435 or about US$340, with the Ryzen 7 7700X coming in at CA$631 or US$494. The Ryzen 9 7900X is CA$798/US$625 and finally the Ryzen 9 7950X is a steep CA$1158/US$907. @momomo_us also found some tray pricing from a different retailer and these CPUs are priced a few bucks cheaper, but we were unable to locate who the retailer is. Note that electronics and computer parts appear to be priced a fair bit higher in Canada than the US on average. As such, these prices should only be taken as an indication of what the retail price in Canada might end up being and not what the actual MSRP will land at, when AMD decides to launch these CPUs. Currently the retail date is expected to be on the 15th of September.

Update 10:49 UTC: The tray CPU retailer is PC-Canada.

It's pretty clear that we're getting very close to the launch of AMD's AM5 platform and the Ryzen 7000-series CPUs, with spec details and even pricing brackets tipping up online. Wccftech has posted what the publication believes will be the lineup we can expect to launch in just over a month's time, if rumours are to be believed. The base model is said to be the Ryzen 5 7600X, which the site claims will have a base clock of 4.7 GHz and a boost clock of 5.3 GHz. There's no change in processor core or thread count compared to the current Ryzen 5 5600X, but the L2 cache appears to have doubled, for a total of 38 MB of cache. This is followed by the Ryzen 7 7700X, which starts out a tad slower with a base clock of 4.5 GHz, but it has a slightly higher boost clock of 5.4 GHz. Likewise here, the core and thread count remains unchanged, while the L2 cache also gets a bump here for a total of 40 MB cache. Both these models are said to have a 105 W TDP.

The Ryzen 9 7900X is said to have a 4.7 GHz base clock and a 5.6 GHz boost clock, so a 200 MHz jump up from the Ryzen 7 7700X. This CPU has a total of 76 MB of cache. Finally the Ryzen 9 7950X is said to have the same base clock of 4.5 GHz as the Ryzen 7 7700X, but it has the highest boost clock of all the expected models at 5.7 GHz, while having a total of 80 MB cache. These two SKUs are both said to have a 170 W TDP. Price wise, from top to bottom, we might be looking at somewhere around US$700, US$600, US$300 and US$200, so it seems like AMD has adjusted its pricing downwards by around $100 on the low-end, with the Ryzen 7 part fitting the same price bracket as the Ryzen 7 5700X. The Ryzen 9 7900X seems to have had its price adjusted upwards slightly, while the Ryzen 9 7950X seems to be expected to be priced lower than its predecessors. Take these things with the right helping of scepticism for now, as things can still change before the launch.

During this year's Flash Memory Summit, Phison, a company known for SSD controllers and now flash drives, demonstrated a system running AMD Ryzen 7000 series processors based on Zen 4 architecture. What is interesting about the shown specification is that the system was running an engineering sample of an upcoming Zen 4-based CPU with the latest storage technologies at impressive speeds. Using a Phison PS5026-E26 SSD controller, also called E26, the PCIe 5.0 SSD is powered by Micron's latest 232-layer TLC NAND flash. This new NAND technology will also bring greater densities to the market by promising higher endurance, higher read/write speeds, and better efficiency.

With AMD's upcoming AM5 platform, support for PCIe 5.0 SSDs is a welcome addition. And we today have some preliminary tests that show just how fast these SSDs can run. In CrystalDiskMark 8.0.4, it achieved over 10 GB/s in both read and write. We know that the E26 controller is capable of 12 GB/s speeds, so more fine-tuning is needed. Being an early sample, we expect final specifications to be better. The system is powered by an engineering sample of a six-core, twelve-threaded Zen 4 CPU running at unknown clocks, codenamed 100-000000593-20_Y. We can expect to see more of this technology once AMD's AM5 platform lands and Phison-powered SSDs hit the shelves in September.

GPD have recently unveiled the pricing for their upcoming 10.1" Win Max 2 handheld gaming PC with the entry level model coming in at 899 USD. The GPD Win Max 2 comes equipped with either an AMD Ryzen 7 6800U or Intel Core i5-1260P processor paired with 16/32 GB of LPDDR5 memory and a 1 TB PCIe 4.0 NVMe SSD. The device features a 2560×1600 10.1" IPS touchscreen with a peak brightness of 400 nits along with a backlit QWERTY keyboard and dual hall effect sensor analogue sticks. The Win Max 2 includes WiFi 6 and Bluetooth 5.2 as standard with an optional 4G LTE modem available for an additional 79 USD in addition to USB4/Thunderbolt 4 ports and a spare internal M.2 slot.

The device is equipped with a 67 Wh battery that supports USB Power Delivery up to 100 W alongside active cooling with double heat pipes. The 899 USD Indiegogo model is limited to 50 units and features the Ryzen 7 6800U, 16 GB RAM, and a 128 GB SSD while the base retail model will regularly cost 1159 USD and features an upgraded 1 TB SSD. The base model is also available with the Intel Core i5-1260P for the same price. The onboard memory can be increased to 32 GB for an additional 200 USD and the storage to 2 TB for a further 100 USD while a customized M.2 2230 1 TB SSD is offered for an additional 139 USD.

AMD is preparing to update its mobile sector with the latest IP in the form of Zen4 CPU cores and RDNA3 graphics. According to Red Gaming Tech, we have specifications of upcoming processor families. First, we have AMD Dragon Range mobile processors representing a downsized Raphael design for laptops. Carrying Zen4 CPU cores and RDNA2 integrated graphics, these processors are meant to power high-performance laptops with up to 16 cores and 32 threads. Being a direct competitor to Intel's Alder Lake-HX, these processors also carry an interesting naming convention. The available SKUs include AMD Ryzen 5 7600HX, Ryzen 7 7800HX, Ryzen 9 7900HX, and Ryzen 9 7980HX design with a massive 16-core configuration. These CPUs are envisioned to run along with more powerful dedicated graphics, with clock speeds of 4.8-5.0+ GHz.

Next, we have AMD Phoenix processors, which take Dragon Range's design to a higher level thanks to the newer graphics IP. Having Zen4 cores, Phoenix processors carry upgraded RDNA3 graphics chips to provide a performance level similar to NVIDIA's GeForce RTX 3060 Max-Q SKU, all in one package. These APUs will come in four initial configurations: Ryzen 5 7600HS, Ryzen 7 7800HS, Ryzen 9 7900HS, and Ryzen 9 7980HS. While maxing out at eight cores, these APUs will compensate with additional GPU compute units with a modular chiplet design. AMD Phoenix is set to become AMD's first chiplet design launching for the laptop market, and we can expect more details as we approach the launch date.

As Computex 2022 is largely an online event, MSI announced its upcoming AMD X670 and X670E boards shortly after AMD's keynote earlier today. Although the official press release didn't go into too many details, VideoCardz got their hands on more detailed information from MSI, which also brings some additional clarity to the platform as a whole. The most interesting slide is the one that lists the AM5 CPU's as having 28 PCIe 5.0 lanes, rather than the 24 PCIe lanes AMD mentioned in its presentation. This makes sense based on the fact that some X670/E boards have multiple PCIe 5.0 M.2 slots for NVMe drives. MSI's X670E Godlike and X670E Ace even feature three PCIe 5.0 x16 slots, although it's likely that this is in a x8/x8/x4 configuration, as these boards only have a single PCIe 5.0 M.2 slot. The same slide also mentions that all Raphael based CPUs will have support for HDMI 2.1 as well as DisplayPort 2.0, which will also work over USB Type-C Alt Mode. Interestingly it seems like not all AM5 CPUs will support DisplayPort 2.0, based on a footnote from MSI.

Other interesting titbits include a minimum CMOS chip size of 32 MB, which hopefully means we won't be seeing a repeat of the issue that the AM4 platform had, where AMD ran out of space for the AGESA, which led to multiple UEFI versions depending on the CPU used with the board. As far as MSI specific features goes, at least the high-end models will be getting eight to 10 layer PCBs and MSI will offer up to 24+2 power phases with improved heatsinks. MSI is also promising 60 W USB PD support for the front USB-C header. Just like ASUS, MSI will also offer an add-in card for more M.2 NVMe drives and MSI calls it the Xpander-Z Gen5 Dual. A common feature among all four boards is that they'll feature AMD's RZ616 WiFi 6E module, which is technically a MediaTek solution.

Acer today announced its refreshed range of TravelMate business laptops for SMB (Small- and Medium- Sized Businesses) and hybrid workers, offering them a wider choice of mobility and performance. Each of the durable Acer TravelMate P4, TravelMate Spin P4 and TravelMate P2 laptops offer workers at the office, home or on the move a highly refined experience with larger touchpads and quieter key presses with a comfortable 1.55 mm travel distance. These durable laptops are designed to deliver powerful performance throughout the work day, enhanced security, advanced connectivity and military-grade durability. They are engineered to handle real life situations such as being bumped through an airport security checkpoint or accidentally dropped, and meet MIL-STD 810H specifications, meaning they can withstand drops, humidity and water spills.

The Acer TravelMate P2, TravelMate P4, and TravelMate Spin P4 laptops provide business-grade security and productivity. These Microsoft Secured-core PCs deliver advanced security down to the firmware level. A SecureBio fingerprint reader and IR camera with a privacy shutter support Windows Hello for secure logins. All models offer advanced connectivity with Wi-Fi 6 to ensure a smoother wireless experience, and optional LTE support so business travelers can enjoy immediate connectivity to local networks.

ASRock Industrial announces the 4X4 BOX-5000 Series Mini PCs 4X4 BOX-5800U, 4X4 BOX-5600U, and 4X4 BOX-5400U, with enhancement powered by AMD Zen 3 Ryzen 5000 U-Series APUs- Ryzen 7 5800U, Ryzen 5 5600U, and Ryzen 3 5400U up to 8 cores/16 threads to energize performance, energy efficiency, and lower latency. Featuring a powerful yet compact design, the 4X4 BOX-5000 Series supports quad display outputs up to 4K with AMD Radeon Graphics for the enhanced visual experience. The Series also includes dual LAN ports up to 2.5 Gigabit with one DASH function and Wi-Fi 6E support of 6 GHz band for real-time connections. Moreover, it can uphold one M.2 Key M, one SATA 3.0 for storage, and five USB ports (three USB 3.2 Gen 2, two USB 2.0) for ultra-connectivity. The energized features make it the world's most advanced core for a wide range of home and business applications such as gaming, content creation, working from home, KIOSK, digital signage, and many more.

With AMD Ryzen 5000U Series Processors- Zen 3 Core Architecture, the 4X4 BOX-5000 Series Mini PCs deliver energized performance and reduced latency with up to 17% single-thread and multi-thread performance compared to Zen 2 along with improved graphics capabilities with AMD Radeon Graphics. Spanning from the flagship 4X4 BOX-5800U, 4X4 BOX-5600U, and 4X4 BOX-5400U, the new Series is powered by AMD Ryzen 7 5800U, Ryzen 5 5600U, Ryzen 3 5400U to increase power efficiency with lower power consumption- 6.7 W at idle. The 4X4 BOX-5000 Series also supports dual-channel DDR4 3200 MHz SO-DIMM memory up to 64 GB for uncompromised multitask computing capabilities.

AMD's Spring 2022 desktop processor product-stack went live (for the most part). AMD had announced as many as seven new Socket AM4 processor models on March 15. Six of these go on sale today, while the Ryzen 7 5800X3D hits the shelves on April 20. Among the models going on sale today are the Ryzen 7 5700X, an 8-core/16-thread part positioned a notch below the 5800X, and priced at $299; the Ryzen 5 5600 (non-X), a 6-core/12-thread part that's slightly a down-clocked 5600X priced at $199; the Ryzen 5 5500, which is essentially a 5600G "Cezanne" 6-core/12-thread APU with its iGPU disabled and clocked lower; at $159; and a trio of cost-effective Ryzen 4000 series parts based on the Renoir silicon and "Zen 2" architecture, priced under the $150-mark. As of this writing, we see most of these SKUs on sale with US retailer Newegg.

AMD is slowly preparing to transition its consumer base into a new platform and processor architecture with the launch of Ryzen 7000 series processors codenamed Raphael. Based on the new AM5 LGA socket, these processors will come with up to 16 cores and 32 threads at the top-end configurations. Thanks to the latest round of rumors, we managed to find out just what TDP rating two SKUs will carry. According to a well-known leaker @graymon55, AMD is rating the 12-core SKU with a TDP of 105 Watts. On the other hand, the top-end 16-core 7000 series SKU replacing the current Ryzen 9 5950X will carry a large TDP of 170 Watts.

The 170 Watt TDP configuration will likely require better cooling efforts. AMD will probably advise users to invest in better cooling solutions, such as AIO liquid coolers or giant air coolers.

According to yet another leak, it would appear that AMD is planning to release no less than four new CPUs in its Ryzen 5000-series this month, with the obvious headline product being the already announced Ryzen 7 5800X3D. However, details of a further three CPUs have turned up on Twitter and it looks like AMD is planning to go head to head with Intel, if the rumoured price brackets are indeed correct. The expected three new CPUs are the Ryzen 7 5700X, Ryzen 5 5600 and Ryzen 5 5500.

The Ryzen 7 5700X is as expected an eight core, 16 thread CPU that is said to be cheaper than an Intel Core i5-12600KF, which means an MSRP around the US$250-270 mark. The six core, twelve thread Ryzen 5 5600 on the other hand, is said to be cheaper than the Core i5-12400, so it should get a sub US$200 MSRP. Finally the six core, six thread Ryzen 5 5500, is said to land at the same price point as the Core i3-12100, pointing at a US$130 MSRP. Unfortunately, no indication of pricing for the Ryzen 7 5800X3D was given, but based on the fact that AMD seems to be dropping the pricing of its current Ryzen 5000-series of processors in the US market, it'll hopefully get a competitive price point.

AMD (NASDAQ:AMD) today announced revenue for the fourth quarter of 2021 of $4.8 billion, operating income of $1.2 billion, net income of $974 million and diluted earnings per share of $0.80. On a non-GAAP basis, operating income was $1.3 billion, net income was $1.1 billion and diluted earnings per share was $0.92. For full year 2021, the company reported revenue of $16.4 billion, operating income of $3.6 billion, net income of $3.2 billion and diluted earnings per share of $2.57. On a non-GAAP basis, operating income was $4.1 billion, net income was $3.4 billion and diluted earnings per share was $2.79.

"2021 was an outstanding year for AMD with record annual revenue and profitability," said AMD President and CEO Dr. Lisa Su. "Each of our businesses performed extremely well, with data center revenue doubling year-over-year driven by growing adoption of AMD EPYC processors across cloud and enterprise customers. We expect another year of significant growth in 2022 as we ramp our current portfolio and launch our next generation of PC, gaming and data center products."

Today Lenovo announced new additions to its broad education portfolio designed to enhance learning efficiencies in a new age for education. The new devices are purpose-built to meet the needs of modern in-person and distance-learning. The all-new Lenovo 10w Tablet running Windows 11 is powered by the Snapdragon 7c compute platform to enable an Always On, Always Connected computing experience, balancing the power and performance students expect and the mobile computing experiences they need to help them succeed in modernized learning. The new Lenovo 13w Yoga offers the flexibility of a convertible device with AMD Ryzen 5000 U-Series processors for mobile up to an AMD Ryzen 7 processor, and can include options to boost teacher and student engagement, device protection and improved connectivity.

According to UNESCO, more than 1.5 billion students have been impacted by the pandemic and many countries have been affected by extended school closures. Although classes are thankfully reopening, many continue to endure disrupted agendas and at the time of writing more than 35 million learners are still unable to benefit from classroom instruction. The longer-term focus needs to be on learning recovery and returning the trajectory beyond pre-Covid levels. A recent UNESCO report points out that we collectively have an opportunity to reinvent education to be more resilient, equitable and efficient in delivering learning for all. Institutions need to invest in structured learning programs that provide access to technology that can amplify classroom-based experiences. The tools need to be dynamic to support distance learning solutions and computer-assisted learning to help maximize education continuity. As a technology provider, Lenovo is committed to partnering with customers to develop and deliver innovative solutions to enhance learning today and into the future.

AMD's Ryzen 7000 series of desktop processors based on the novel Zen 4 core architecture are scheduled to arrive in the second half of 2022. While we are not sure just how big the architectural differences will be going from Zen 3 (with or without 3D V-cache) to the new Zen 4 core, we have some leaked information that confirms the existence of two SKUs that reveal additional details about the processor configuration. In the MilkyWay@Home project, aiming to create a model of the Milky Way galaxy by utilizing countless PCs across the globe, we found two next-generation Ryzen 7000 SKUs. The MilkyWay@Home project isn't a benchmark. However, it is a valuable reference where the next generation processors appeared.

First in line is the 100-000000666-21_N CPU, a codename for an eight-core, sixteen-threaded design. This model should correspond to the AMD Ryzen 7 7800X CPU, a successor to the Ryzen 7 5800X model. Next in line is the 100-000000665-21_N CPU with 16 cores and 32 threads, a successor to the Ryzen 9 5950X named Ryzen 9 7950X. One important thing to note is that these new CPUs feature different level two (L2) cache configurations. With the previous generation 5000 series "Vermeer" processors, the L2 cache was locked at 512 KB per core. However, according to today's leak, the upgraded Zen 4 IP will bring 1024 KB of L2 cache per core, doubling the cache size at one of the fastest levels.

From its inception, Lenovo Legion wanted to make the modern gaming experience immersive, as well as more inclusive. At CES 2022, Lenovo Legion once again delivers on its pursuit of unyielding play and productivity to gamers of every generation and content creators, who can now all universally enjoy premium entertainment and play from home battle stations, dorms, esports arenas - or practically anywhere, and look good doing it too.

Lenovo's first batch of 2022 battle-ready PCs, monitors, accessories and gamer-focused software and services unveiled today, which include the powerful 16-inch Lenovo Legion 5i Pro and Lenovo Legion 5 Pro laptops and the polished 15-inch Lenovo Legion 5i and Lenovo Legion 5 laptops. The new gaming laptops come available with Windows 11 gaming performance, next-gen AMD Ryzen processors, or latest 12th Gen Intel Core processors and up to latest fully powered NVIDIA GeForce RTX Laptop GPUs. Inspired by gamer research, these new devices celebrate 'magical minimalism' design and denote a leap towards a contemporary aesthetic with purposeful detailing like an uncluttered wordmark, expressive venting, and immersive lighting. A top-placed camera bump with eShutter kill switch and rear port protection convey a sleek look of power and performance that helps to create a more inclusive experience focused on player enjoyment and winning, not labels. Paired with exclusives beloved by Legion fans such as the advanced thermals of next-level Legion Coldfront 4.0, the hair-trigger speeds and improved ergonomics of Legion TrueStrike keyboard, and optimized tuning via Lenovo Vantage for gaming.

If you've been waiting for more details about AMD's next mobile platform, then you're in luck, as the motherload has dropped today, with lots of details about the new Rembrandt APU's that are launching next year. Not only has a picture of the first motherboard, with adhering laptop showed up, but we also have a mostly complete block diagram and a list of expected SKU's, even though not all SKU models are revealed as yet.

AMD's Rembrandt APU will be its first APU with PCIe 4.0 support, which in itself might not be worth the wait, but if paired with the right GPU, this might help increase the performance somewhat compared to the previous generation of APUs from AMD. The bigger news is USB4 support, plus a new GPU which we so far don't know too much about, but it's speculated that it'll be called Radeon RX 680M and should offer 12 compute units. DDR5 memory support is also expected, so Rembrandt clearly has a new memory controller, since the APU is still based on the Zen 3 architecture.

Minisforum today announced their EliteMini X500, which is the upgraded version of their X400 mini PC, to provide ultimate performance and work flexibility with AMD Ryzen 7 5700G processor and Radeon Graphics. X500 is a multi-purpose mini computer designed for use in a variety of solutions, such as a home office, media center/HTPC, printer management PC, digital signage, or mass-deployment enterprise IT solution.

The 65 W eight-core 16-thread Ryzen 7 5700G comes with a 3.8 GHz base and a 4.6 GHz boost clock, 16 MB of L3 cache, and eight Radeon RX Vega CUs that operate at 2.0 GHz. As with all Zen 3 processors, the Ryzen 5000G chips step up from DDR4-2933 to DDR4-3200 interface, which will help boost gaming performance with the integrated GPU.

AMD seems to be preparing a chipset refresh, and this time, it is coming straight from the top-end market. When the company launched its high-end X570 chipset, it brought the PCIe 4.0 support, which many praised due to its capability to handle much faster NVMe drives. However, it seems like the company is not satisfied with that and it needs to release an updated chipset version called X570S. According to a popular hardware leaker, TUM_APISAK, we have discovered that GIGABYTE is preparing X570S Aorus Pro AX motherboard that will use the refreshed chipset. GIGABYTE already listed several Eurasian Economic Commission (EEC) listings, so the new chipset is sure to hit the market, just at an unknown time.

The S denotes the word silent, meaning that these updated chipsets are capable of working with passive cooling and possibly having a lower TDP compared to 11 and 15 Watts of the X570 chipsets for consumer and enterprise motherboards, respectively. The test was conducted using AMD's newly announced Ryzen 7 5700G processor. The 5000-series of APUs are so far limited to OEMs, so one would guess that GIGABYTE itself made the leak by using a public entry of CPU-Z validation.

AMD has today decided to launch the next generation of Accelerated Processing Units (APUs), now in form of the 5000G lineup codenamed Cezanne. The APUs are getting launched as OEM-exclusive products for now, which means that only manufacturers like Dell, HP, Lenovo, etc. can have access to them. AMD is set to announce these processors for wider masses, such as consumer DIYers, later this year. So you must be wondering what is new about the 5000G APUs. For starters, the new APUs feature AMD's improved Zen 3 core with a notable IPC boost over Zen 2 found in last generation 4000G APUs. When it comes to graphics, the new APUs feature anywhere from 6-8 GPU cores, based on the Vega architecture.

When it comes to the available models, AMD lists six SKUs, all differentiating in CPU/GPU core count, TDP, and frequency. There are three regular SKUs, with their power-efficient variants. The regular SKUs are AMD Ryzen 7 5700G, Ryzen 5 5600G, and Ryzen 3 5300G. They are normal SKUs that have a TDP of 65 Watts, meaning a higher base frequency needing a more adequate cooling solution. However, as there are regular SKUs, there are also power-efficient, TDP-constrained models present. Called the AMD Ryzen 7 5700GE, Ryzen 5 5600GE, and Ryzen 3 5300GE, these models bring the TDP down to 35 Watts and reduce base frequency by a couple of hundreds of MHz.

AMD has quietly launched two new Zen 3 processors for the OEM market with the Ryzen 9 5900 and Ryzen 7 5800. The Ryzen 9 5900 is a 12 core 24 thread processor with a base clock of 3.0 GHz and a max boost clock of 4.7 GHz along with a TDP of 65 W. The clock speeds were lowered due to the 65 W TDP with a base clock is 700 MHz lower than the 5900X while the boost clock is only 100 MHz slower. The Ryzen 7 5800 is an 8 core 16 thread processor with a base clock of 3.4 GHz and a boost clock of 4.6 GHz along with a TDP of 65 W. The base clock is reduced by 400 MHz and the boost clock by 100 MHz compared to the 105 W TDP 5800X. The Ryzen 9 5900 is only ~5% slower than the Ryzen 9 5900X despite a 61.5% lower TDP and reduced clock speeds according to UserBenchmark results. These new processors are now shipping in systems from various integrators such as the Alienware Aurora Ryzen Edition.

We have received various leaks and benchmarks for AMD's upcoming Ryzen 5000G processors, these were all from engineering samples but we now have our first look at the retail 5700G. The AMD Ryzen 7 5700G features the model number 100-000000263 attributed to earlier rumors and has been tested in CPU-Z scoring 631 points in single-threaded performance along with 6782 points in multi-threaded, and in Cinebench R20 it scored 6040 points. The integrated Vega graphics lack any official drivers but GPU-Z reports a Vega 8 processor with 12 Streaming Multiprocessors and a base clock of 2 GHz. AMD is yet to officially announce any Ryzen 5000G processors so it is unclear how far away their launch is and whether or not they will be made available to the DIY market.

MonsterLabo, the maker of fanless PC cases designed for gaming with zero noise, has today tested its upcoming flagship offering in the case lineup. Called The Beast, the case is designed to handle high-end hardware with large TDPs and dissipate all that heat without any moving parts. Using only big heatsinks and heat pipes to transfer the heat to the big heatsink area. In a completely fanless configuration, the case can absorb and dissipate a CPU TDP of 150 Watts and a GPU TPD with 250 Watts. However, when equipped with two 140 mm fans running below 500 RPM, it can accommodate a 250 W CPU, and 320 W GPU. MonsterLabo has tested the fully fanless configuration, which was equipped with AMD Ryzen 7 3800XT processor, paired with NVIDIA's latest GeForce RTX 3080 Ampere graphics card.

There were no fans present in the system to help move the heat away, and the PC was being stress-tested using Microsoft's Flight Simulator. The company has posted a chart of CPU and GPU temperatures over time, where we see that the GPU has managed to hit about 75 degrees Celsius at one point. The CPU has remained a bit cooler, where the CPU package hit just above the 70-degree mark. Overall, the case is more than capable of cooling the hardware it was equipped with. By adding two slow-spinning fans, the temperatures would get even lower, however, that is no longer a fanless system. MonsterLabo's The Beast is expected to get shipped in Q3 of this year when reviewers will get their hands on it and test it for themselves. You can watch the videos in MonsterLabo's blog post here.

AMD is slowly preparing the launch of its next-generation Ryzen Pro 5000 series of APUs designed for desktop applications. The biggest difference over the previous generation Renoir 4000 series is that this generation is now offering a major improvement in microarchitecture. Using Zen 3 core at its base, the Cezanne processor lineup is supposed to integrate all of the IPC improvements and bring them to the world of APUs. Doubling the level three (L3) cache capacity from 8 MB to 16 MB, Zen 3 cores are paired with a good amount of cache to improve performance.

Thanks to a user from Chiphell forums, we have the first details about AMD Ryzen 7 Pro 5750G APU. The new generation design is bringing a big improvement with clock speeds. Having a base frequency of 3.8 GHz, the Zen 3 based design now goes up to 4.75 GHz, representing a 350 MHz increase over the past generation Ryzen 7 Pro 4750G APU. For more details, we have to wait for the official announcement.

Today, AMD (NASDAQ: AMD) announced the full portfolio of AMD Ryzen 5000 Series Mobile Processors, bringing the highly-efficient and extremely powerful "Zen 3" core architecture to the laptop market. New AMD Ryzen 5000 Series Mobile Processors provide unprecedented levels of performance and incredible battery life for gamers, creators, and professionals. New laptops powered by Ryzen 5000 Series Mobile processors will be available from major PC manufacturers including ASUS, HP and Lenovo, starting in Q1 2021. Expanding its leadership client computing product portfolio featuring the "Zen 3" core, AMD also announced the AMD Ryzen PRO 5000 Series Mobile Processors, delivering enterprise-grade security and seamless manageability to commercial users. Throughout the course of 2021, AMD expects a broad portfolio of more than 150 consumer and commercial notebooks based on the Ryzen 5000 Series Mobile Processors.

"As the PC becomes an even more essential part of how we work, play and connect, users demand more performance, security and connectivity," said Saeid Moshkelani, senior vice president and general manager, Client business unit, AMD. "The new AMD Ryzen 5000 Series Desktop and Mobile Processors bring the best innovation AMD has to offer to consumers and professionals as we continue our commitment to delivering best-in-class experiences with instant responsiveness, incredible battery life and fantastic designs. With our PC partners, we are delivering top-quality performance and no-compromise solutions alongside our record-breaking growth in the notebook and desktop space in the previous year."

AMD has recently submitted two new Ryzen 5000 series CPUs to the USB Implementers Forum for compliance. The first listing for a Ryzen 9 5980HX is a new SKU which we haven't seen before which would be positioned above the 5900HX, 5900H, and 5900HS. It is unclear what this processor will offer whether it be higher clocks, more cores, or something else. These new Zen 3 Cezanne Ryzen 5000H mobile processors are expected to be announced by AMD next week.

The second processor submitted by AMD is the Ryzen 7 5700G which appears to be a desktop Zen 3 Cezanne APU. The processor is likely to feature 8 cores and 16 threads, but clock speeds are GPU specifications are unknown. The current generation Ryzen 4000G series is only available to OEMs and was not released to the DIY market. This new desktop APU will be a significant step up from the quad-core Ryzen 5 3400G which is the fastest APU available from AMD in the DIY market.