ADATA Technology, a leading manufacturer of high-performance DRAM modules and NAND Flash products, will unveil its extreme performance XPG line: new SSDs (Solid State Drives) and DDR4 memory module solutions, the new Apple series of products, Type-C mobile accessories and ruggedized products. Come witness history at ADATA's "Aspire, Empower, Transform" theme on show June 2-6 at COMPUTEX TAIPEI 2015, Taipei World Trade Center, in Nangang Exhibition Hall 1F Booth #J0806.

ADATA will flaunt its extreme performance XPG line of products, including the winner of the Taiwan Excellence Gold Award, the XPG Z1 DDR4 Gaming DRAM. Never satisfied with staying in one place, ADATA's newest XPG Z2 is now set to break another world record at 4034 MHz in the DDR4 gaming memory class. ADATA will also show the latest SX930 gaming SSDs featuring SLC cache technology and premier MLC flash that boost overall speed and stability. To give visitors an extremely fast and playful gaming experience, ADATA will hold a Special Force 2 Challenge game in its XPG display zone and will give away SSD and DRAM prizes every day.

One of ASRock's prime attractions at this year's Computex, apart from its socket LGA1151 motherboards, will be a fanless compact desktop, the BeeBox. Driven by 14 nm Intel "Braswell" Celeron N3000 series SoC, the BeeBox will pack in 2 GB or 4 GB of DDR3L-1600 memory (expandable to 8 GB using two SO-DIMM slots), 32 GB to 128 GB mSATA SSD storage, and connectivity that includes 802.11 ac WLAN, gigabit Ethernet, Bluetooth 4.0, four USB 3.0 ports (including one type-C port), and display outputs that include HDMI and DisplayPort. Measuring 110 mm x 46 mm x 118.5 mm, the BeeBox will be complete quiet, including its brick-type power supply.

Giada, a brand of Shenzhen Jiehe Technology Development, Co., Ltd, today announces the ultra compact i200 Mini-PC. Designed for thin client, digital signage, enterprise and industrial applications, the i200, with dimensions of 5.12" x 5.06" x 1.02", offers PC-level performance and full featured connectivity at low power consumption levels.

With its ability to run 24/7, the i200 is ideal for many applications in the thin client, enterprise and industrial fields. The full metal casing provides excellent heat dissipation while in operation as well as robust protection from harsh working environments.

They've done it! After building the first LGA2011v3 motherboard in the mini-ITX form-factor, letting you cram up to 8 "Haswell" cores into a lunchbox-sized PC, albeit having to make do with just dual-channel memory; ASRock developed the first mini-ITX motherboard with not just LGA2011v3, but also its full quad-channel memory interface, called the EPC612D4I. There's just one rider, which shouldn't really be a dealbreaker - this is a server-grade motherboard, and is bound to be expensive.

The EPC612D4I achieves its quad-channel memory chops by using smaller DDR4 SO-DIMM slots instead of standard-sized DIMM slots. Availability of aftermarket DDR4 SO-DIMM memory is close to non-existent, but that could change with 6th Generation Core processor notebooks hitting the shelves by Holiday 2015. As an enterprise board, it also supports Xeon E5-1600 V3 and E5-2600 V3 processors.

MSI, world leading in motherboard design, debuts the first Intel Braswell based Mini-ITX ECO motherboards; the MSI N3050I ECO, N3150I ECO and N3700I ECO. With a rich feature set and all new onboard 14nm Dual & Quad Core Intel Celeron and Pentium Processor with next generation Intel HD graphics up to 2x faster, the new passively cooled MSI Braswell ECO motherboards are the perfect solution for HTPC or industrial devices. MSI's revolutionary power-saving design featured on its new ECO series motherboards, together with Intel's newly designed ultra-low power consuming SoC using only up to 6W, make these motherboards the next step in efficiency. Featuring a fully passive cooling solution, the new Braswell based ECO motherboards run cool, silent & efficient.

With 4K-ready media center PCs upon us, Intel decided to equip one of its next-gen NUC (next unit of computing) desktops with one of its most powerful integrated graphics solutions, which can either accelerate 4K video, 1080p to 4K upscaling GPU algorithms (think MadVR), or make for a reasonably fast 720p or 900p gaming machine. The NUC5i7RYH from Intel features a Core i5-5557U processor, which integrates Iris 6100 Graphics. Based on the "Broadwell-GT3" silicon, Iris 6100 offers 48 execution units, between 300 and 1100 MHz GPU core frequency, and an L4 eDRAM cache. A passive cooling solution deals with this 28W TDP chip. Other specs include two DDR3-1866 SO-DIMM slots, supporting up to 16 GB of memory, HDMI 1.4a and DisplayPort 1.2 display-outputs, four USB 3.0 ports, including one high-current port.

Following the introduction of the XH97V and SH97R6 barebone PC models that have been prepared for the fifth generation of Intel Core processors, Shuttle today introduces a new member to the product family - the DS57U. This is the company's first barebone PC with a built-in Broadwell processor. As a successor to the DS47 and DS437 models, the DS57U also belongs to the 1 litre PC class. The DS57U is delivered as a barebone PC and includes the case, motherboard, cooling system and power supply unit as its core components as standard.

The system is powered by a pre-installed Intel Celeron 3205U dual-core processor (2x 1.5 GHz), which also is part of the delivery. The 14-nm architecture and power consumption of less than 15 W promise low energy costs together with improved performance. The completely fanless DS57U not only works remarkably quietly, it is almost maintenance-free, as the passive cooling ensures that no dust is sucked into the machine.

Transcend Information, Inc. (Transcend), a leading manufacturer of industrial-grade products, is proud to announce the launch of the DDR4 memory module series. The series includes DDR4 2133 MHz UDIMMs, RDIMMs, ECC-DIMMs and ECC SO-DIMMs, which are fully compatible with the latest Intel Xeon E5-2600 v3 server family processor, Haswell-E CPU with X99 chipset and micro servers. Transcend's DDR4 series boasts superior performance, 1.2V ultra-low power consumption, and increased reliability. All these features make it perfect for cloud computing, virtualization, and high-performance computing technologies.

Transcend's DDR4 memory modules are constructed with top-quality DRAM chips that deliver stable performance and durability. With advanced DDR4 technologies, Transcend's DDR4 memory modules utilize higher density components, allowing capacity options ranging from 4GB to 32GB. Offering high speed transmission of 2133MHz and up to 17GB/s of memory bandwidth, Transcend's DDR4 DIMMs comprehensively promote the system performance.

SMART Modular Technologies, Inc., a leading designer, manufacturer and supplier of specialty memory and storage solutions, including memory modules, flash memory cards and other memory and solid state storage products, has announced today the launch of its DDR4 Mini-DIMM, one of the industry's first Mini-DIMM form factor utilizing next generation DDR4 technology.

SMART's initial lineup of DDR4-2133 Mini-DIMMs includes 8GB and 16GB VLP Mini-UDIMM along with 8GB and 16GB standard height Mini-RDIMMs, all of which comply with JEDEC 288-pin form factor and pin-out standards. Today, Mini-DIMMs are widely used across many application segments including networking, telecom, industrial, computing and storage by OEMs who are looking to save board space or source as an alternative to SO-DIMMs. The attractiveness of Mini-DIMMs is that they are versatile; it's a small form factor offered in high densities operating at high data transfer rates. For OEMs currently using DDR3 Mini-DIMMs, SMART is pleased to offer a migration path to DDR4.

ASUSTOR Inc., a leading innovator and provider of network storage solutions, has announced the launch of 4 new NAS devices primarily aimed at prosumers and small to medium business users. These new high capacity tower models consist of the AS5008T, AS5010T, AS5108T and AS5110T. All new models feature flexible hardware expandability, the ability to quickly upgrade the built-in memory to a maximum of 8GB and are equipped with 4 high speed gigabit Ethernet ports which allow business users to conveniently adjust their network bandwidth usage. Additionally, all models come equipped with 3 USB 3.0 ports, 2 USB 2.0 ports and 2 eSATA ports allowing users to maximize the use of peripheral equipment and providing users with a cost-effective and reliable enterprise-class cloud storage server.

The AS5008T and AS5010T models are powered by the latest Intel Celeron 2.41GHz dual-core processors and 1GB of SO-DIMM DDR3L memory while the AS5108T and AS5110T models come equipped with the latest Intel Celeron 2.0 GHz quad-core processors and 2GB of SO-DIMM DDR3L memory. All models also support hard drive hot swapping and the creation of RAID volumes (Single, JBOD, RAID 1/5/6/10 + Hot Spare) providing secure protection for all system data. The AS5108T and AS5110T also feature LCD panels with configuration keys that allow users to execute system initialization and quickly view basic system information. Additionally, the AS5108T and AS5110T feature disk tray locks in order to help users avoid accidentally pushing disk tray buttons and releasing hard disks during operation. The lock's flat-head design ensures that users will not need any special keys or tools to unlock it, only a simple flat-head screw driver. Users can now rest assured with this additional layer of security for their data.

Shuttle today rolls out its new All-in-One PC Barebone X50V4. Passive cooling promises whisper-quiet operation with lower maintenance requirements, a frugal Intel Celeron processor ensures even better performance. Now entering the fourth generation since its original launch in 2009, Shuttle's X50 All-in-One PC series features the proven 15.6 inch (39.6 cm) format, which is especially requested by the B2B sector of the market. As well as offering maximum expandability, it is also particularly quiet and durable thanks to the machine's fanless design.

In contrast to its Atom-based predecessor models, the X50V4 now comes fitted with an Intel Celeron 2957U dual-core processor clocked at 1.4 GHz per core. The processor cores are extremely frugal with a thermal design power of just 15 W. With a depth of 42 mm, the case provides space for a 2.5" hard disk or SSD and an mSATA module, and is for the first time able to accommodate up to 8 GB of DDR3L SO-DIMM memory. With a suitable SSD installed, the X50V4 is approved for continuous operation.

Crucial, a leading global brand of memory and storage upgrades, today announced new Crucial DDR4 SODIMMs, designed to enhance next-generation laptop performance. The new DDR4 modules are more than 30 percent faster than their DDR3 equivalents with speeds of 2133 MT/s, enabling systems to load applications faster and run demanding programs without lag.

Operating at 1.2V compared to 1.5V for standard DDR3 memory, Crucial DDR4 SODIMMs consume 20 percent less voltage than standard DDR3 technology. The reduction in voltage combined with other DDR4 efficiency features leads to an overall power reduction of up to 40 percent, which helps extend battery life. Additionally, Crucial DDR4 SODIMMs increase memory bandwidth by more than 30 percent, allowing systems to handle more data at once.

ASUSTOR Inc., a leading innovator and provider of network storage solutions, has announced the launch of its 50T and 51T series NAS devices consisting of four new comprehensive high performance NAS models. These new models include the AS5002T, AS5004T, AS5102T and AS5104T. The models come equipped with the latest Intel Celeron 2.41 GHz dual-core processors and Intel Celeron 2.00 GHz quad-core processors respectively, along with 1 GB and 2 GB of SO-DIMM DDR3L memory which is expandable to a maximum of 8 GB.

All new devices come with a wealth of powerful features including an automatic burst function that allows the CPU to increase its frequency for additional power when needed and a CPU floating-point unit for added computing power. Additionally, 50T and 51T series devices feature the quickest memory installation and expansion in the industry along with one-click installation for multimedia Apps, smart fans that automatically regulate the system temperature for stable operation and ASUSTOR's exclusive automatic smart system sleep mode (S3) and instant wake.

Intel's next-generation NUC (next unit of computing) compact desktop, believed to be based on the company's Core "Broadwell" processor, was spotted on the company website. Pictures reveal that the next NUC could be pocketable, yet have the computing power of a full-blown desktop. The NUC system board features some of the newer connectivity, such as DDR3L SO-DIMM slots, M.2 slots, an mPCIe slot, an additional SATA 6 Gb/s port, and processors from the Core i3 and Core i5-5000 series. Intel could unveil the next-gen NUC in January 2015, likely at CES 2015.

KINGMAX, a leading memory brand, showcased its DDR4 memory module during COMPUTEX Taipei, held in June 2014. After a period of integration, KINGMAX now officially announces its DDR4 application solution has entered mass production. In response to market trends, four types of memory clock speeds have been launched: 1866/2133/2400/3200MHz, with speeds that meet 14.9GB/s to 25.6GB/s requirements, and have exceptionally high transmission efficiency. With the setting of memory standards for the next-generation DDR4 RAM by JEDEC, many companies have taken a wait-and-see approach for the right opportunity. With the launch of Intel's Haswell-E processor platform, which supports DDR4, it is believed that computer products with DDR4 will gradually appear in the market, triggering a rapid increase in a spectacular rise in usage of DDR4 in 2015.

The transition between DDR2 and DDR3 system memory types was slower than the one between DDR and DDR2. DDR3 made its mainstream debut with Intel's X38 and P35 Express platforms, at a time when the memory controller was still within the domain of a motherboard chipset, at least in Intel's case. The P35 supported both DDR2 and DDR3 memory types, and motherboard manufacturers made high-end products based on each of the two memory types, with some even supporting both.

Higher module prices posed a real, and higher latencies, posed a less real set of drawbacks to the initial adoption of DDR3. Those, coupled with the limited system bus bandwidth, to take advantage of DDR3. DDR3 only really took off with Nehalem, Intel's first processor with an integrated memory controller (IMC). An IMC, again in Intel's case, meant that the CPU came with memory I/O pins, and could only support one memory type - DDR3. Since then, DDR3 proliferated to the mainstream. Will the story repeat itself during the transition between DDR3 and the new DDR4 memory introduced alongside Intel's Core i7 "Haswell-E" HEDT platform? Not exactly.

Shuttle Computer Handels GmbH, the European subsidiary of Shuttle Inc., one of the leading developers and manufacturers of compact PC solutions, such as the world-renowned XPC Mini PC Barebones, today introduces two new 3-litre models for fourth-generation Intel Core processors. The XH81 and the XH81V are available on the European market with immediate effect. The Shuttle Barebones XH81 and XH81V are based on an Intel H81 Express Chipset and designed for current Intel processors for socket LGA1150 up to a maximum TDP of 65 W. Two SO-DIMM slots can be equipped with up to 16 GB of DDR3 memory. An efficient heatpipe cooling with two 60 mm fans channels waste heat directly to the outside. An external 90 W power supply is present to drive the system.

The flat case barely measuring 24 x 20 x 7.2 cm (DWH) can be equipped with up to three drives. Installation options for 3x 2.5" HDD/SSD drives or alternatively 2x 2.5" HDD/SSD drives plus an optical slimline drive are available. A 3.5" drive can also be installed using the PHD4 accessory which is sold separately. 3x SATA 6 Gbit/s and 1x SATA 3 Gbit/s are available. There are also two Mini-PCIe 2.0 slots inside which can be used for expansion cards, e.g. for a WLAN or an mSATA SSD drive. Neither the Shuttle Barebone XH81 nor the XH81V skimps when it comes to connections - with DisplayPort, HDMI, USB 3.0 Gigabit LAN, RS 232 and 5.1 Audio, for example, high connectivity can be found on the front and the back panel.

ASRock rolled out the H81TM-ITX R2.0 thin mini-ITX motherboard for SFF PCs and AIO desktops. The socket LGA1150 motherboard is based on Intel's entry-level H81 Express chipset, and draws power from an external 2-pin DC power source. It features a 3-phase CPU VRM, a PCI-Express 2.0 x4 slot, apart from an mPCIe; two SATA 3 Gb/s ports, and two DDR3 SO-DIMM slots. Connectivity includes DVI and HDMI display outputs; two USB 3.0 ports, gigabit Ethernet, stereo HD audio, and a couple of USB 2.0/1.1 ports.

ASRock unveiled a pair of new motherboards based on Intel's new Pentium J2900 quad-core "Bay Trail" SoC. These include the Q2900-ITX (mini-ITX) and the Q2900M (micro-ATX). Both feature the 10W J2900 chips cooled by a fan-less chunky aluminium heatsink. The J2900 features four cores, nominal clock speeds of 2.40 GHz, with 2.66 GHz Turbo Boost, 2 MB of cache, 688-896 MHz Intel HD Graphics, and a dual-channel DDR3 memory controller.

The Q2900-ITX offers two DDR3 SO-DIMM slots, a single PCI-Express 2.0 x1, a miniPCIe 2.0, two-each of SATA 6 Gb/s and SATA 3 Gb/s ports, four USB 3.0 ports, display outputs that include DVI, D-Sub, and HDMI; 8-channel HD audio, and gigabit Ethernet. The Q2900M, on the other hand, features much of the same features, except full-size DIMM slots, an additional PCI-Express 2.0 x16 and PCIe 2.0 x1 slots; and 6-channel HD audio instead of 8-channel.

ADATA Technology Co., Ltd., will be displaying a complete industrial, commercial and server grade storage solutions, which includes customizable ISSS312 SSD, wide temperature industrial storage and latest DDR4 server DIMMs at Flash Memory Summit. Starting from August 5th to 7th, ADATA invite you to experience the variety of fascinating innovations at booth #908, Santa Clara Convention Center, CA.

ADATA ISSS312 2.5 inch SATA III 6Gbps Solid State Drives (SSD) use the best quality hardware components and come with the most comprehensive internal support software. The product complies with JEDEC specifications, features a low-power design and is intended for industrial applications. Equipped with the capability of developing software, firmware and hardware, ADATA is dedicated to customize industrial products. Customers can request to customize a fixed BOM and firmware which ensure ADATA's products are stable and compatible.

MSI rolled out its third mobile workstation after the GT series and WS series, the WT series. Styled much like MSI's Gaming series notebooks, the WT series comes in four models, the WT70-20K, the WT70-20L, the WT60-20K 3K IPS, and the WT60-20J. The WT70 duo feature 17.3-inch full-HD (1920 x 1080 pixels) displays, while the WT60 ones feature 15.6-inch displays. A stand-out here is the WT60-20K 3K IPS, which features a 15.6-inch 3K (2880 x 1620 pixels) IPS display. The WT60-20J, on the other hand, features full-HD. All four feature bodies that are clearly inspired from the Gaming series notebooks, featuring illuminated keyboards.

All four models offer 4th generation Intel Core i7 "Haswell" processors, up to 32 GB (four DDR3 SO-DIMM slots) of memory, NVIDIA Quadro K3100M graphics with 4 GB memory on the WT70-20K and WT60-20K 3K IPS; Quadro K4100M graphics with 4 GB memory on the WT70-20L, and Quadro K2100M graphics with 2 GB memory on the WT60-20J. All four offer MSI SuperRAID SSD combinations of 3x 64 GB and 3x 128 GB, and storage HDD options of 750 GB and 1 TB. All four also offer Killer K2000 NIC (which can be used by Qualcomm drivers), and 802.11 ac WLAN. Measuring 428 x 288 x 55 mm (WxHxD), the WT70-20K and WT70-20L weigh 3.9 kg; the WT60-20K 3K IPS and WT60-20J measure 395 mm x 267mm x 55 mm, weighing 3.5 kg.

Super Talent Technology, a leading manufacturer of NAND Flash storage solutions, updates DDR3 SO-DIMM modules.

The updated W160SB4GSL and W160SB8GSL SO-DIMM modules have a lower power draw of 1.35V which allows laptop battery life to be extended. Lower power usage results in less heat generated in a scenario where heat dissipation may not be optimal due to the enclosure of laptops.

I'M Intelligent Memory, a Hong Kong based fabless DRAM manufacturer, announces availability of the world's first 8 Gigabit (Gb) DDR3 components with a single chip-select, doubling the amount of memory per chip compared to other DDR3 DRAM devices on the market. Based on these new 8 Gb components, I'M is also introducing the first 16 Gigabyte (GB) DDR3 UDIMM and SO-DIMM memory modules with optional ECC error-correction.

The JEDEC specification JESD79-3 has always allowed an 8 Gb density for DDR3 memory devices. While most DRAM manufactures are waiting for a 2x nm process to fit such high memory capacity into a single DRAM IC package, I'M has developed its own a revolutionary way to manufacture 8 Gb DDR3 components with single chip-select utilizing existing 30 nm manufacturing technologies.

ADATA Technology Co., Ltd., is honorably invited by Intel as a strategic partner to the Grantley New Platform Workshop. During the 4 day event taking place on June 24th & 25th in Hillsboro, Oregon and July 9th & 10th in Hudson, Massachusetts, ADATA will proudly demonstrate the latest DDR4 server DIMMs, DDR3 LR-DIMMs, and complete product line of 2.5" SSDs and PCIe SSDs. One of the primary showcases will be server grade DDR4 R-DIMMs supporting the latest Intel Xeon processor E5-2600 v3 series with the features of up to 16 GB density, 1.2V low power consumption, and maximized 2133 MHz high speed transmission. ADATA's DDR4 product line includes DDR4 RDIMMs, VLP R-DIMMs, LR-DIMMs, and ECC SO-DIMMs.

In-memory computing stores data on memory chips rather than hard drives removes any performance bottleneck caused by traditional storage. ADATA DDR3 LR-DIMMs 64GB and R-DIMMs 32GB (with Invensas DFD technology) support In-memory computing with high capacity and outstanding performance. In Intel New Platform Workshop, ADATA will demonstrate DDR3 LR-DIMMs, which deliver up to 64GB capacity for Intel Xeon processor E5 V2 family-based servers, and increase total memory capacity by up to 1.5 TB to fulfill In-Memory Computing application.

French tech publication 01net noticed something odd about the ZBOX CI540 from ZOTAC it was reviewing. Even for a fan-less compact desktop, its Core i5-4210Y dual-core chip was idling around 80°C. The reviewer then opened it up to find that ZOTAC left the protective plastic film on the thermal pad which conducts heat from the CPU to the body intact. Temperatures dropped with that film peeled. The kicker? Reaching for that thermal pad voids your product warranty.

Even if the ZBOX CI540 is a barebones unit, in which you drop in your own 2.5-inch HDD/SSD and SO-DIMM memory, requiring you to unscrew its body; the storage and memory compartments are located on the reverse side of the motherboard. You're not supposed to unscrew the motherboard to reveal its obverse (front) side, as there's nothing for you to "upgrade" there. The CPU is in the BGA (ball-grid array) package, and hardwired to the motherboard. The screws that let you reveal the front side are capped with warranty seals. We're not sure if it's a one-off bad piece 01net got, or an entire batch hit by one lazy hand on the production line.Update Jun 24: We received following statement from ZOTAC:
ZOTAC has found the plastic film to be isolated to preproduction units. These preproduction units were only used for press sampling and are not representative of final units shipping to retail. However, the plastic film has very little impact on the cooling capabilities of our passive ZBOX C-series nano chassis since the cooling fins that are responsible for the majority of the heat dissipation duties is below the thermal pad. The thermal pad is only used to transfer heat to the secondary heat dissipation plate integrated into the chassis for added cooling capabilities.

Nevertheless, the temperatures observed while testing under load with the erroneous plastic film still in place is still within the thermal guidelines of Intel's 100°C maximum T Junction and does not cause instability. Temperatures observed by users can vary greatly depending on room temperature and system placement since the ZBOX CI540 nano is passive cooled. We apologize for the error but assure our mass production units are not affected.