This year ASUS will try to leave the competition far behind, by introducing a brand new motherboard concept, the Marine Cool series. The Marine Cool series design goes far ahead from current Republic of Gamers (R.O.G.) mainboard products. For starters, the new motherboard has a new back plate that utilizes "micro-porous ceramic" technology and spreads across the whole PCB. The heat-pipe system that cools the motherboard's main components is also different, compared to current shipping products. Although the cooling technology remains the same, the whole look of the system reminds of a robot armour. Finally, it looks that ASUS engineers have decided to use SO-DIMM modules to cope with current Core 2 processors (if I'm right that appears to be LGA775 socket). I know it sounds a bit crazy, but pictures don't lie. Have a look and write what you think. The ASUS Marine Cool prototype will make first appearance during this year's CeBIT 2009 in Hannover, Germany.

NVIDIA has concrete plans to take up chipset manufacturing for ULPC, and nettop platforms based on the Intel Atom processor. With its visual computing expertise and platform core logic technologies, NVIDIA hopes to cash in on the segment in need for better consumer value than what it already enjoys. VR-Zone pictured the reference design nettop PC that uses the Intel Atom processor, aided by NVIDIA's MCP79 chipset.

The chipset is monolithic, and handles the jobs of a memory controller, graphics controller, and a peripheral hub. The chipset sits on a 10-layer PCB motherboard, which gives you an idea on the component density of the MCP79. The platform supports single core and dual core Atom processors. It supports single channel DDR3 memory in speeds up to the PC3-10666 (1333 MHz), with connections to a SO-DIMM module. A GeForce 9 series integrated graphics controller provides display output through DVI-I. There is a gigabit ethernet controller, and 8-channel HD audio. The front portion of the chassis provides a larger portion of the connections, which includes the audio (including optical SPDIF), USB 2.0, and eSATA. NVIDIA will allow OEM vendors to make their own case designs housing the platform.

Kingston Technology, the independent world leader in memory products, today announced it is first to market with ultra-low latency HyperX DDR3 gaming SO-DIMMs. The new DDR3 1066MHz notebook memory modules are pre-programmed to high-performance, ultra-low latency values and built with a new metal heatspreader that further helps promote thermal conduction for added performance. Kingston's new HyperX DDR3 SO-DIMMs with model number KHX8500S3ULK2/4G come in a pair of 2GB modules (4GB total), that operate at 1066MHz using CL5-5-5-15 timings at 1.5V. The kit is available now for $228.00, backed by a lifetime warranty and free 24/7 technical support.

IN the past few months, an interesting set of Mini-ITX motherboards made it to the market. There are two primary classes of ITX boards: embedded CPU and those with CPU sockets. VIA and Intel have boards based on their small-footprint embedded processors, while others made innovative solutions with CPU sockets. The Minix-ITX, an AM2+ socket based ITX board, took it to the next level with a motherboard that fulfills most requirements of HTPC users.

Magic Pro, a Chinese company that concentrates on Asian markets has now come up with another solution based on the AMD 780G chipset. The board, MP-NC81 comes with 128 MB of Sideport memory to assist the integrated graphics processor (IGP) that's housed in the 780G chipset. The IGP supports UVD, it accelerates H.264, VC1 and MPEG2 1080p playback. It comes with SB600 southbrige which routes to four SATA II ports with RAID support. The board features a single SO-DIMM slot to hold notebook DDR2 memory. It supports AM2+ processors with TDP of up to 95W. A striking feature however, is that the board optionally ships with a wireless ethernet riser-card, much in the same way as some high-end motherboards from ASUS do. The riser card is said to support 802.11n standard.

Kingston Technology Company, the independent world leader in memory products, today announced it is first to release high performance, ultra low-latency 800MHz notebook memory. Shipping immediately in 4GB memory kits, the HyperX PC2-6400 CL4 SO-DIMMs offer the additional benefit of Serial Presence Detect (SPD) capabilities to provide performance benefits to a wider array of notebooks.

HyperX memory manufacturer Kingston is expanding its high-performance laptop memory line-up with a new set of DDR2-800 SO-DIMMs accessible in 2GB and 4GB kits. The latest offerings are backed by a lifetime warranty and have suggested price tags of $88 and $138 respectively.

• KHX6400S2LLK2/2G - 2GB 800MHz Low-Latency DDR2 (CL5-5-5-18 @ 1.8v) SO-DIMMs, kit of 2
• KHX6400S2LLK2/4G - 4GB 800MHz Low-Latency DDR2 (CL5-5-5-18 @ 1.8v) SO-DIMMs, kit of 2

Super Talent Technology today announced the immediate availability of its DDR3 SO-DIMMs. Super Talent's new 1GB DDR3-1333 SO-DIMM supports transfer rates up to 10,664 MB/sec. That equates to 66% higher bandwidth than DDR2-800 SO-DIMMs, making this the world's fastest production DDR3 SO-DIMM. In addition to the faster speed, DDR3 SO-DIMMs require only 1.5V, compared to 1.8V for DDR2, resulting in power savings of up to 20% and less heat output. This 204-pin module, part number W1333SA1GS, is available now for under $99.

Kingston Technology is taking the ordinary SO-DIMM memories one step further with the introduction of two new HyperX DDR2 matched pairs. The new 2GB and 4GB SO-DIMM kits are certified to work at 667MHz with CL4-4-4-12 timings at standard 1.8V voltage. "Kingston customers asked about higher-performance memory for current notebooks and our new 667MHz CL4 low-latency SO-DIMMs are the first in a series of new HyperX memory offerings to support this market," said Mark Tekunoff, senior technology manager, Kingston. Already prepped for sale, the 2GB and 4GB HyperX memory kits feature price tags of $84 and $132 respectively. Later this year Kingston will also introduce a 3GB kit with similar specifications.

Qimonda AG today announced that it has started to ship samples of 1GB and 2GB DDR3 SO-DIMMs (Double Data Rate 3 Small Outline Dual In-line Memory Modules) to key customers for deployment in next-generation notebook PCs. Qimonda optimized its new DDR3 SO-DIMM offerings for high power-savings in an effort to lead the industry. Power efficiency is the key value proposition of the new DDR3 memory interface in mobile computing, as it allows for extended battery life at higher performance levels for notebooks and other mobile computing applications.

G.Skill International Enterprise recently launched the new package and full product line for Apple Mac users. The products include:

• 1GB SO-DIMM DDR2-667 (PC2-5300)
• 2GB SO-DIMM DDR2-667 (PC2-5300) (one 2GB memory or 2x1GB kit)
• 3GB SO-DIMM DDR2-667 (PC2-5300) (one 1GB and one 2GB)
• 4GB SO-DIMM DDR2-667 (PC2-5300) (2x2GB kit)

All memories and kits are backed with a lifetime warranty, and should work just fine using CL5-5-5-15 timings. These modules will be available through G.Skill's authorized resellers and distributors worldwide. For more information and specifications of the new Apple series products, please visit G.Skill.

Walton Chaintech has come to the rescue of notebook owners looking to expand their system memory to make the most of Windows Vista or 64-bit software. The company has just announced the availability of is APOGEE SO-DIMM memory now in 2GB capacities. The APOGEE DDR2 667/800MHz 2GB SO-DIMM modules are based on the JEDEC standard offering low power consumption, excellent heat elimination and memory speed of 667/800MHz DDR2 which should be enough to match up with even the latest Intel Santa Rosa platforms.