After last week's launch of nano-ITX Cedartrail motherboards, J&W launched mini-ITX motherboards under its iconic Minix brand. The new motherboards are designed keeping HTPCs and compact desktops in mind. These include the Minix D2700-HD (Atom D2700, HDMI), and Minix Minix D2500-HD (Atom D2500, HDMI). Pictured below is the Minix D2700-HD.

The Minix D2700-HD runs an Atom D2700 dual-core processor clocked at 2.13 GHz, with two SO-DIMM memory slots supporting up to 4 GB of single-channel DDR3-1066 MHz memory. Its lone expansion slot is a PCI-Express 2.0 x1. The board draws power from a 2-pin DC external input, and gives out a 4-pin Molex output to power connected SATA drives. Connectivity includes dual gigabit Ethernet, two SATA 3 Gb/s, two USB 3.0, 6-channel HD audio, and display outputs that include HDMI and D-Sub. The Minix D2500-HD is driven by Atom D2500 dual-core processor clocked at 1.85 GHz, it is largely identical to its bigger sibling, except for the lack of USB 3.0, and the second Ethernet connection. Pricing and availability information is awaited.

Embedded systems and IPC maker J&W unveiled the first Atom "Cedar Trail" motherboard in the nano-ITX form-factor. The board measures just 120 x 120 mm, and is designed for embedded computing devices. It draws power from a 2-pin 12V DC input. It holds a dual-core Intel Atom D2700 (2.13 GHz) or D2500 (1.83 GHz) processor, one DDR3 SO-DIMM slot (reverse side), which supports up to 4 GB of DDR3-1066/800 MHz memory, and basic connectivity. The lone expansion slot is a mini-PCIe, designed to hold WLAN adapters.

Display outputs include D-Sub (by header), LVDS, and HDMI. Connectivity options include one SATA 3 Gb/s (AHCI), five USB 2.0 ports (three type-A connectors, two via headers), gigabit Ethernet, 6-channel HD audio over HDMI and 2-channel analog audio, RS232 Serial, SD/SDHC card reader, SIM card slot (3G option), consumer IR, and PS/2 (header). The CPU and core logic can be passively cooled. The Cedar Trail Nano-ITX board from J&W will be available to embedded systems and IPC markets, soon.

A-Tech Fabrication, a company that specializes in hand-crafted HTPCs, unveiled the HeatSync 1200 fanless HTPC. The part that makes it fanless is the chassis itself, which is made of aluminum, with fins on the sides, that dissipate heat. Copper heat pipes transfer heat from key components such as the CPU and chipset to the sides of the chassis, which takes care of the rest. Although most of the chassis is anodized black, with its front-panel, you can choose between silver and black options.

The HeatSync 1200 internally packs an Intel DH61AG thin mini-ITX motherboard, which seats an Intel Core i3-2100T dual-core 35W processor, clocked at 2.50 GHz. 4 GB Corsair Vengeance SO-DIMM memory comes standard. Also standard is the Intel SSD 310 40 GB mSATA SSD. Considering there are no mechanical hard drives, or a PSU with active-cooling (a 160W power-brick does the job), the HeatSync 1200 is literally silent. A consumer IR (CIR) receiver with Windows Media Center remote, and Windows 7 Home Premium make for the rest of it.

Remember the Colorful GTX 560 Ti iGame Kudan and how it made our readers scream "overkill"? What happens when you combine an over-the-top design, the Colorful iGame Kudan, with an equally over-the-top GPU, the NVIDIA GeForce GTX 680? You get the Colorful GTX 680 iGame Kudan, the pinnacle of air-cooling for the GeForce GTX 680.

The iGame Kudan's design methodology revolves around giving users an extremely tweakable and modular cooling solution, which can not only be modified by playing with its heatsinks, but also be re-painted to suit your style. Colorful included a pastel-set the last time around. Under the hood, the card is packed by a modular VRM. The main PCB has an 8-phase digital VRM, which can be augmented by an additional 4-phase circuit on a daughterboard, which gets attached on a modified SO-DIMM slot, which goes parallel to the plane of the PCB, on its rear. The card is said to have high out of the box clock speeds, with an even higher overclocking headroom. Colorful sells in Asia and Europe.More pictures follow.

ADATA Technology, a leading manufacturer of high-performance DRAM modules and NAND Flash application products, today launched a new line of DDR3L ECC SO-DIMM server memory modules, boasting low voltage, large densities, and rapid processing capability. They are designed and engineered especially for cloud computing solutions, and can greatly minimize the power consumption of a wide range of network systems.

A new kind of server is becoming increasingly needed for website hosting and mission critical applications. Micro-servers are a new type of server suited for the special workloads of data centers. Starting in the second half of 2009, many large data centers and information service suppliers have begun to use micro-servers. Micro-servers are taking an increasingly important role in small site dedicated hosting, lightweight web serving, and simple content delivery. Many semiconductor manufacturers have announced plans to enter the micro-server market, and are expected to release new low-power processors for use with high density servers.

Two models from Intel's Desktop Board Executive series of motherboards for office PCs got pictured and detailed by VR-Zone. These socket LGA1155 motherboards are mostly based on Intel 7-series Q77 and B75 chipsets, that provide some manageability, and data security features over the feature-set of H77. Intel has three Executive series models planned, the DQ77MK, the DQ77KB, and DB75EN. Of these, the DQ77MK and DB75EN are built in the micro-ATX form-factor, while the DQ77KB is mini-ITX.

The two micro-ATX parts use a similar PCB layout, with some features differing between the two. The DQ77MK is pictured below, it has all the features a small-business PC will ever need. Expansion slots include one each of PCI-Express x16, PCI-Express x4 (open-ended), PCI-Express x1, and legacy PCI. Storage connectivity includes six SATA (one of which is mSATA, for SSD caching). The PCH gives out four USB 3.0 ports, which are wired two each on the rear-panel and via a header to the front-panel. It uses a simple 5-phase VRM that should be enough to run LGA1155 processors. The socket is wired to four DDR3 DIMM slots supporting dual-channel memory. It has a variety of external connectivity.

Motherboard maker J&W Technology is currently preparing the arrival of its 2012 MINIX Mini HD PC, a compact (192 (L) x 60 (W) x 186 (D) mm), multimedia-ready barebone system based around Intel's Cedar Trail platform.

The 2012 MINIX can be equipped with an Atom D2550 (1.86 GHz) or D2700 (2.13 GHz) processor and has two DDR3-1066 SO-DIMM slots (supporting up to 4 GB of RAM), one 2.5-inch drive bay, onboard 5.1 channel audio, dual Broadcom Gigabit Ethernet, two USB 3.0 and five USB 2.0 ports, and both D-Sub and HDMI outputs. No word yet on pricing or availability.

While it may be working away on 7 Series motherboards, Gigabyte still has some love for the 'old' 6 Series chipsets and is preparing more products based on them. One such product is the MSH61QI, a Mini-ITX board powered by the H61 Express Chipset.

Targeting embedded markets, the MSH61QI offers support for LGA 1155 processors, and features two DDR3-1333 SO-DIMM slots, two SATA 3.0 Gbps ports, one PCI-Express x16 and two (one full size, one half size) Mini-PCIe slots, Gigabit Ethernet, two USB 3.0 ports, Line-In and SPDIF connectors, and a HDMI output. The board's availability and price tag have not been announced, yet.

ADATA Technology, a leading manufacturer of high-performance DRAM modules and NAND Flash application products, today introduced new industry-leading, single piece 8 GB DDR3-1600 high-density memory modules. Known for industry-high standards of quality control and meticulous device engineering, the new modules will meet and exceed expectations of customers who seek performance and quality in DRAM products.

With this launch ADATA is continuing its tradition as an industry leader in DRAM product line-up. These 8 GB Premier Series DDR3-1600 single piece memory modules allow users to boost system performance over the limitations of memory slot availability.

Japanese build-to-order PC specialists Lesance launched the BTO GSN721GW TYPE-GX reference 17-inch performance notebook featuring NVIDIA GeForce GT 630M graphics. At 17-inches size, the Type-GX serves as a portable desktop-replacement. Its screen packs full-HD resolution (1920 x 1080), the GeForce GT 630 driving it is backed by 1 GB of DDR3 memory. It packs 144 CUDA cores.

Other parts of the Type-GX include Intel Core i7-2670QM quad-core processor clocked at 2.20 GHz with 6 MB L3 cache, 8 GB (4 GB x2, DDR3-1333 SO-DIMM) memory, Intel 510 Series 120 GB SSD, Blu-ray ROM, wireless b/g/n and gigabit Ethernet connections, and USB 3.0 ports. The notebook measures 416 x 270 x 22 ~ 35 mm (WxDxH), weighing 2.99 kg. Windows 7 Home Premium x64 is the OS of choice. This reference configuration costs 101,980 JPY (US $1320).

Intel has, in the past, referred to its two-chip low-wattage computing solutions as "SoC" (system on a chip), keeping with that trend, it was assumed that "Centerton", an Atom-derived processor for NAS servers that the company is working on, could be a similar 2-chip solution with the tiny NM10 PCH sitting next to the CPU. It is now coming to light that Intel will design Centerton to run as a true single-chip SoC, without the PCH.

Centerton's core and uncore components, housed on the same piece of silicon, are detailed in the first picture, below. It packs two x86-64 cores. Each core has 32 KB L1I cache, 24 KB L1D cache, and 512 KB of dedicated L2 cache. There is no shared tertiary cache between the cores, however, they converge at the integrated memory controller (IMC). This IMC can control a single DDR3 memory channel, supporting 1.5V DDR3 UDIMMs with ECC support or 1.35V DDR3 SO-DIMMs, at speeds of PC3-10600 (DDR3-1333 MHz). Up to 8 GB of RAM is supported. The core can be clocked as high as 1.60 GHz. It features HyperThreading technology, enabling four logical CPUs for the OS to deal with. Any current 32-bit or 64-bit x86-capable OS should run.

Buffalo Japan unveiled new 8 GB memory modules in the 204-pin SO-DIMM and standard 240-pin DIMM form-factors. These modules pack 8 GB capacity, and stick to JEDEC DDR3-1333 MHz standards. Featured in the D3N1333 series, these modules 1024M x 64bit DIMM configuration. They achieve 1333 MHz speeds with CAS latency of 9T and DRAM voltage of 1.5V. The Buffalo Tools software comes bundled with these modules. The two are priced at 26,670 JPY, around US $341.6.

After releasing the tri-channel RAM to take "Triple-Channel" initiatives, the global leading brand Team Group Inc. presents the 8GB memory module of the Team Elite DDR3 series. The ultra memory storage item goes with the JEDEC standard, marking a turning point of the RAM market to enter the "Triple-Channel" and also the ultra big storage generation.

The new memory module of the Elite series, U-DIMM with 16 GB (8GBx2 kit) as its largest storage capacity and SO-DIMM 8GB, both uses selected DDR3 chips and passes 100% stringent testing. The item is in BGA package with stability and compatibility between memory modules and PC platforms have been greatly improved. Meanwhile, the Elite's exclusive heat spreader is helpful in cooling computing temperatures and enlarging storage to offer stability and efficiency. In addition, it features high speed, low power consumption, and high efficiency. It takes only 1.5V low voltage to function well, it lowers carbon emissions, is electricity-saving, power-saving, and environmentally friendly. All these taken together make it the best choice for your PC.

A month after debuting its Premier line of mainstream DDR3 memory modules, A-Data released new high-density 8 GB modules in the series. Available in both desktop UDIMM and notebook SO-DIMM form-factors, A-Data's new modules operate at PC3-10700 (DDR3-1333 MHz) speeds with CAS latency of 9T, and DRAM voltage of 1.5V. The new modules make use of 4 gigabit memory chips made possible in the mainstream segment by advancements in silicon fab processes. Unfortunately, the pricing isn't quite "mainstream" yet. One of these 8 GB Premier modules by A-Data could set you back by €159.90. They are backed by limited lifetime warranty.

Asian graphics card vendor Colorful is at it again with its innovative board designs. This time, the company is after a GeForce GTX 560 Ti (GF114-based) graphics card that boasts of very strong power delivery, and a few mysterious expansion options. Colorful's emphasis has always been on PCB design and choice of high-grade components. This particular card, most likely called the Colorful GTX 560 Ti iGame, is no exception to that. The PCB is particularly long (as much as a GF110-based board).

The additional length is put to use by an innovative arrangement of VRM phases in two rows of four phases. This card employs high-grade chokes with driver-MOSFETs (a component that integrates up/down MOSFETs and driver IC into a single compact package). This 8-phase VRM draws power from three 6-pin power connectors, and can deliver 300W of power to help with record-seeking overclocking feats. There are consolidated voltage measurement points to help manually measure voltages.

ZOTAC International, a leading innovator and channel manufacturer of graphics cards, motherboards and mini-PCs, today launches the latest addition to the ZBOX nano product lineup with the new ZBOX nano VD01 series - an affordable palm-sized mini-PC powered by a VIA Nano X2 processor.

The ZOTAC ZBOX nano VD01 series combines the latest VIA Nano X2 U4025 CPU and VX900H media system processor for outstanding energy-efficiency and performance. VIA Chrome9 graphics with ChromotionHD 2.0 processing enables the ZOTAC ZBOX nano VD01 series to deliver silky-smooth playback of popular high-definition video formats, including Blu-ray, MPEG2, H.264, VC-1 and streaming Internet video.

What you're looking at below is one of the first "Thin mini-ITX" motherboards sold in the retail channel. The GA-MSH61DI is designed for extremely compact mini-ITX cases, that are thinner than the rear panel of ATX/ITX form-factors, and all-in-one PCs. The board draws power from an external power brick through a 12V DC input jack, the board then gives out SATA and Molex power via cables. It seats socket LGA1155 "Sandy Bridge" Intel Core i3/i5/i7 processors with a maximum TDP of 95W.

The CPU socket is powered by a 3-phase VRM. The processor is backed by Intel H61 Express chipset. It is wired to two angled DDR3 SO-DIMM slots that can hold up to 8 GB of dual-channel DDR3-1333 MHz memory. There are no perpendicular expansion slots, but there's one mSATA slot that can hold an SSD, an mPCIe that can hold a wireless networking card, and an LVDS (low-voltage differential signaling) slot that can be used for devices such as VGA connections to LCD panels. The H61 chipset gives out two SATA 3 Gb/s ports apart from the mSATA slot.

ZOTAC International, a leading innovator and the world's largest channel manufacturer of graphics cards, motherboards and mini-PCs, today debuts the palm-sized ZBOX nano AD10 series mini-PCs. The new ZOTAC ZBOX nano AD10 series shrinks the standard ZBOX form factor and adds more home theatre PC friendly features for your digital media needs.

Powered by the AMD "Brazos" E-350 APU Platform with Discrete-Class AMD Radeon HD 6310 graphics, the ZOTAC ZBOX nano AD10 series packs plenty of performance with hardware video decode acceleration technologies for popular high-definition video formats, including Blu-ray and Adobe Flash, into a miniature 127mm x 127mm x 45mm form factor that fits in the palm of your hand.

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced that it is the first in the industry to start mass producing 32 gigabyte (GB) memory modules, essential for cloud computing and advanced server systems, using 30 nanometer (nm) class* four gigabit (Gb) DDR3 DRAM chips.

"With this module, Samsung has secured the highest level of product and solution competitiveness in the DRAM market for PC, server and mobile applications," said Wanhoon Hong, executive vice president, memory sales & marketing, Samsung Electronics. "We also plan to ship more energy-efficient 4Gb DDR3 DRAM based on 20nm-class* process technology in the second half of this year, which will significantly expand the rapidly growing market for green IT memory solutions. Moreover, we intend to keep delivering the greenest memory products with optimal performance for customers," he added.

ASUS displayed its new mini-ITX motherboard for IPC (industrial PC) market, the D27NM10-I IPC. As an IPC-ready board, it is designed for rugged industrial environments that have minimal cooling and require high uptime. The D27NM10-I IPC uses next-generation 32 nm Intel Atom "Cedar View" D2700 dual-core processor clocked at 2.13 GHz, featuring HyperTreading to yield 4 logical CPUs for the OS to deal with. The processor is wired to two DDR3 SO-DIMM slots supporting single-channel DDR3 memory. Intel NM10 is the chipset employed, it's also found on previous-generation Pine Trail platform.

A large heatsink covers both the processor and chipset, there are three 4-pin PWM fan headers on board in case a fan has to be latched on to it. The board draws power from an external DC power source over standard 2-pin DC input connector. It can also be powered by any switching power supply with a 4-pin Molex power connector. Storage connectivity includes two SATA 3 Gb/s ports. The only expansion here is an open-ended PCI-E x1, and a mini-PCI-E. There's plenty of serial connectivity, including two serial DE-9 ports on the read panel, and 3 via headers. Other connectivity includes 2-channel HD audio, dual gigabit Ethernet, display outputs that include DVI and D-Sub, and a number of USB 2.0 ports. The board uses UEFI with graphical EZ-Mode setup program.

MSI, the global leading brand in motherboards, announced the upgraded version of IM-QM67 which is powered by the 2nd generation Intel Core processor family, Intel Sandy Bridge processor, and Intel QM67 Express chipset. IM-QM67 supports multiple display outputs in a mini-ITX form factor board and utilizes Intel's 32nm process technology products to give the competitive advantage through the performance enhancements and scalability.

MSI debuts the IM-QM67 based on the Intel Core i7, Core i5 and Core i3 processors to offer lower power consumption and enhanced graphic and media performance. The IM-QM67 is equipped with dual-channel DDR3 1067/1333/1600 MHz memory up to a maximum of 16 GB in dual SO-DIMM slots and is ideally suited to applications requiring multi-tasking capabilities, high computing power. This combination of CPU, chipset and memory provides the MSI IM-QM67 with improved power efficiency and high-speed data transfer for performance-driven industrial applications, such as industrial control, automation, digital signage, kiosk, POS, gaming, ATM and medical electronic.

Team Group Inc. is going to release the new Team Mac SO-DIMM memory module at 2011 Computex Taipei. In order to provide enthusiasts with more diverse products, the Team Module series, which have garnered unbeatable public praise because of its excellent performance, will release for the first time the Team Mac memory module custom-made for Apple Mac notebook computers, developing a more professional and complete product line. Team Group Inc. employed its many years of accumulated technology research and development experience to break the space limits of notebook computers, using an extremely thin heat-sink design on the SO-DIMM modules that perfectly combines beautiful appearance with excellent performance. The feather lightweight Team Mac SO-DIMM memory module is the nova star of 2011 that will attract much attention.

Not only is the Team Mac SO-DIMM completely compatible with the Mac operating system, it has also passed Mac verifications, completely solving the troublesome compatibility problems for Mac users. Team Mac inherited Team Group's standard persistence for quality, and uses memory particles rigorously selected and tested by Team Group to guarantee optimal and excellent operating performances. In addition, Team Group provides both single channel and dual channels for the Team Mac memory modules, with capacities ranging from 2GB~8GB (4G*2 kit) to satisfy users' unlimited demand for upgrading.

The GS-AH6G3N embeds the new LGA1155 Intel platform for mobile products, with the most powerful and efficient processor and chipset for a reliable and durable business notebook. Designed for professional end users, our product includes all the most important features required by a utilization in a business environment. The GS-AH6G3N is therefore a very versatile business notebook, with the highest standard of performance and quality from GIGABYTE. It is nevertheless a stylish product, with an excellent design and ultra-thin profile, as well as a very light weight and a large power autonomy for the smoothest mobility. With its high value features, the GS-AH6G3N has everything to be the best work tool for your daily business life.

The GS-AH6G3N offers all the important features that e good business notebook should have. Probably the most critical feature, the GS-AH6G3N has a power autonomy of about 7 hours, which can be extended to 10 hours with a second battery docked in the swappable ODD bay (this bay can also dock a second HDD).

Kingston Technology Europe Ltd, an affiliate of Kingston Technology Company Inc., the independent world leader in memory products, today announced the release of new Kingston HyperX 4GB and 8GB 1600MHz SO-DIMM kits. The dual-channel, plug and play CL9 memory kits are the fastest modules on the market specifically designed to support notebooks and mobile platforms using the new 2nd Generation Intel Core Mobile Processor Family, codenamed "Huron River".

"Our latest HyperX SO-DIMMs are the best way to boost the system performance of notebook PCs, as well as mini-ITX motherboards and mobile-based systems, by replacing standard memory with high-speed, higher capacity modules," said Mark Tekunoff, Senior Technology Manager, Kingston. "With the memory's simple plug and play feature, system performance is enhanced fast and effortlessly without the need of having to manually adjust the BIOS or load overclocking profiles."

ZOTAC International, a leading innovator and the world's largest channel manufacturer of graphics cards, motherboards and mini-PCs, today unleashes the ZOTAC ZBOX AD02 series mini-PCs powered by the AMD E-350 APU platform. The ZOTAC ZBOX AD02 series delivers a premium computing experience with rich high-definition video playback capabilities and outstanding 3D visuals in a compact form factor.

The powerful AMD E-350 APU equips the ZOTAC ZBOX AD02 series with dual processor cores for lightning-fast system responsiveness and snappy multi-tasking abilities. Integrated AMD Radeon HD 6310 graphics enable compatibility with the latest Microsoft DirectX 11 titles for stunning 3D visuals on the ZOTAC ZBOX AD02 series.