The leading global motherboard, graphics card and mini PC manufacturer, ASRock, announces X570 Phantom Gaming-ITX/TB3 receives the Thunderbolt Host certification from Intel. It is the first Thunderbolt Certified AMD motherboard.

X570 Phantom Gaming-ITX/TB3 is the high-end Mini-ITX model in the ASRock X570 series motherboard which supports AMD Ryzen 2000 and 3000 series processors with AM4 socket. It is equipped with 10 power phase design (Dr.MOS) which provides completely smooth power delivery to the CPU to offer unmatched overclocking capabilities, and enhanced performance with the lowest temperature for advanced gamers. The key feature of this motherboard, Thunderbolt 3 technology, enables lightning-fast data bandwidth up to 40 Gbps, and can also provide both data and video transmission. Meanwhile, X570 Phantom Gaming-ITX/TB3 can connect up to six Thunderbolt 3 devices such as graphics card, hard disk or monitor simultaneously by means of Daisy Chain technology.

Intel Wednesday rolled out its NUC 8 Pro "Provo Canyon" line of compact desktops targeted at businesses. These NUCs are fit for enterprise client desktop role as some of the models feature Intel vPro, and are powered by 8th generation Core "Whiskey Lake-U" processors. Leading the pack is the NUC8v7PN, powered by a Core i7-8665U processor, followed by the NUC8v5PN powered by Core i5-8365U, and the NUC8i3PN, powered by Core i3-8145U. The NUC8v7PN and NUC8v5PN offer Intel vPro support. All three come in two chassis types, H and K. The H chassis features a 2.5-inch drive bay with SATA 6 Gbps interface, and measures 117 mm x 112 mm x 53 mm, while the compact K chassis lacks the 2.5-inch drive bay, and is 37 mm tall. The three are also available in bare board form-factors, so you can use your own NUC-compatible cases.

Connectivity features common to all three are dual HDMI 2.0b (HDCP 2.2) ports with in-built CEC; two DDR4 SO-DIMM slots supporting up to 32 GB of dual-channel memory; one Thunderbolt 3 (40 Gbps) port at the rear panel that includes DisplayPort 1.3 and USB 3.1 gen 2 wiring; and four USB type-A ports, from which three are USB 3.1 gen 2, and one USB 2.0. Networking connectivity includes 802.11ac through an Intel Wireless AC-9560 vPro WLAN card (NUC8v7PN and NUC8v5PN only) or Wireless AC-9560 (NUC8i3PN), and one 1 GbE interface driven by Intel i219-LM controller. The audio is completely HDMI-based, there are no analog jacks. The three are certified for Windows 10 IoT Enterprise and Windows Server 2019.

TerraMaster, a professional brand that specializes in providing innovative storage products, including network attached storage and direct attached storage, is proud to share with content creators and multimedia professionals its lineup of Thunderbolt 3-equipped, direct-attached storage solutions for faster video and data access. Utilizing the power of Thunderbolt 3 which allows 40 Gbps of data transfer, the TerraMaster TD Thunderbolt 3 is a plug-and-play solution for personal usage all the way to small production needs. Perfect for Mac Pro media professionals and compatible devices which needs large storage but high-speed access in a portable package.

Thunderbolt 3 is the latest generation of connectivity technology that utilizes 40 Gbps of bandwidth to connect directly with the computer. Thunderbolt technology also allows connecting multiple devices simultaneously via daisy chain allowing you to scale or interconnect your Thunderbolt devices from just one source. The TerraMaster D2 Thunderbolt 3 is a 2-bay drive supporting professional grade RAID0 or RAID1 for your choice of improved performance or data redundancy.

At this year's CES, Razer presented its Tomahawk gaming desktop based on Intel's Compute Element - an all in one solution that packs CPU, RAM, and storage on the same PCB. The Tomahawk presents a complete solution, meaning that it is a pre-built PC that you can spec out to your liking. Available with up to Intel 9th generation Core i9, 64 GB of RAM and NVIDIA's GeForce RTX 2080 graphics card, the Tomahawk is marketed as a powerful small form factor gaming PC.

When it comes to connectivity options, the Tomahawk is featuring all of the ports that are available on Ghost Canyon NUC 9, meaning two Thunderbolt 3 ports, six USB-A ports, one HDMI and two LAN ports, plus video output from the graphics card. On the PCB than connects the Compute Element and the GPU, there is also one PCIe 3.0 M.2 NVMe SSD slot available. Razer also announced that they will make this case available on its own to please all the DIYers, and it will be called the Tomahawk N1. For now, however, it is a pre-built only.

TERRAMASTER is democratizing 10 GbE in the consumer NAS space through aggressive cost-optimization. For small businesses, 1 GbE is no longer an acceptable network bandwidth in which multiple desktops are working on shared resources. The new F5-422 from TERRAMASTER is a 5-bay small-business NAS with a fat 10 GbE pipe, which enables data transfer-rates of up to 670 MB/s to your local network. It also features two additional 1 GbE ports with link-aggregation as a fallback. Its caddies are designed to support both 3.5-inch and 2.5-inch SATA drives, without the need for adapters.

Under the hood, the F5-422 is powered by an Intel "Apollo Lake" quad-core x64 SoC (likely the Celeron J3455), running at 1.50 GHz, with 4 GB of memory that's expandable to 8 GB. The NAS supports 80 TB of total storage, or up to 16 TB per disk. It uses an aluminium alloy body with a noise-optimized single fan. TERRAMASTER's TOS 4.1 software provides a browser-based UX for the NAS. The F5-422 is priced at $600. Next up, is a new family of RAID DAS (disk-attached storage) solutions featuring Thunderbolt 3 (40 Gbps), targeting creative professionals working on large data-sets that need to be redundant and secured. TERRAMASTER's DAS lineup is based on a common hardware platform that features up to 1,600 MB/s of throughput, and supports up to 128 TB of aggregate storage. Models range from 2-bay, to 4-bay, 5-bay, and large 8-bay towers. These units feature aluminium-alloy bodies with grab-handles on top and 1 or 2 low-noise fans, depending on the model.

ADATA made its biggest product portfolio expansion this year with the introduction of new product lines: gaming monitors, gaming notebooks, and compact gaming desktops. To begin with, we caught the XPG Photon, a 27-inch 4K Ultra HD gaming monitor that also has some creator-friendly features such as 95% or above DCI-P3 coverage, and implementations of Burst Refresh and Vivid Color from PixelDisplay. Gamers get not just 4K UHD resolution put out by an eye-pleasing IPS panel, but also 144 Hz refresh-rate at 4K UHD. At the flick of a toggle, the monitor can also be transformed to Full HD (1920 x 1080) at 240 Hz and 600 nits brightness. The panel supports up to 1,500 nits brightness. There's no mention of localized dimming zones, and we didn't spy DisplayHDR logos anywhere. Behind, the monitor features a triangular RGB LED lighting element that can double-up as ambient light. The stand is quite another thing: a proper studio armature with a bench clamp that allows rotation and tilting along both axes, besides height adjustment.

Next up, are the XPG Xenia line of gaming notebooks in the 15.6-inch and 13-inch form-factors. Under the hood are 9th generation Core-H processors with options ranging all the way up to Core i7-9750H, graphics options that include RTX 2070 Max-Q and GTX 1660 Ti; a combination of ADATA's homebrew hand-sorted DDR4 SO-DIMM memory and SX8200 M.2 NVMe storage; and a mechanical keyboard with RGB lighting. All of these, crammed into a magnesium-alloy body. The 15.6-inch display is IPS Full HD with 144 Hz refresh-rate. Lastly, there's the XPG Gaia line of compact gaming desktops. One of its variants is built up to "Ghost Canyon" NUC specs; while the other is a more conventional socketed thin Mini-ITX fare. Both variants are 5-liter compact, and include ADATA XPG memory and SX8000-series M.2 NVMe SSDs. You add your own compatible graphics card (up to 20 cm length). On select variants you even get Thunderbolt 3 ports.

At the 2020 International CES, Dell unveiled its latest monitor for graphics professionals, the UltraSharp PremierColor UP2720Q. This 27-inch monitor features an in-built colorimeter for color-caliberation, besides support for CalMAN, which lets you caliberate color with an external colorimeter. The UP2720Q offers 100% Adobe RGB coverage, besides 98% DCI-P3, and 80% BT.2020. The 27-inch 4K Ulra HD (3840 x 2160 pixels) monitor also supports Thunderbolt 3, letting you daisy-chain it with other devices.

LG Electronics' new generation of Ultra monitors to be unveiled at CES 2020 is designed to dramatically improve the user experience with superior design and cutting-edge performance. A leading innovator in the premium monitor segment, LG's 2020 UltraFine, UltraGear and UltraWide models have been honored as CES Innovation Award winners.

The 2020 CES Innovation Award-winning 32-inch UltraFine "Ergo" 4K UHD monitor (model 32UN880) is an innovative ergonomic solution that delivers differentiated value. The unique LG Ergo concept brings together the three key elements of image fidelity, ergonomic design and USB-C One Cable solution for a monitor that delivers unbeatable performance, user comfort and a cleaner desk setup at home or at the office. The UltraFine 4K UHD Display Ergo inherits the stunning picture quality the UltraFine series is renowned for and more than meets the needs of most professionals thanks to its ability to produce high resolution images with excellent detail, color reproduction and color accuracy.

TerraMaster, a professional brand that specializes in providing innovative storage products, including network attached storage and direct attached storage, is proud to announce the D8 Thunderbolt 3 storage drive as part of their Thunderbolt 3 family product family. The D8 Thunderbolt 3 leverages the power of Intel Thunderbolt 3 technology to offer incredible speeds while providing large capacities as well as data integrity for demanding, professional work especially for large, mission critical productions. The TerraMaster D8 Thunderbolt 3 has an MSRP of $1,599.99.

Thunderbolt 3 offers 40 Gbps maximum bandwidth which paired with a powerful RAID controller, allows the D8 Thunderbolt 3 to reach performance of up to 1600 MB/s with traditional hard drives under RAID0 array. For maximum balance of data protection and speed, a RAID5 array can still reach 1400 MB/s with the D8 Thunderbolt 3. This allows editors working on large files such as 4K, 6K or 8K footage to strike a balance of capacity and speed and provide the flexibility to allow them to work with files faster so their creativity is not limited.

Seagate Technology, a world leader in data solutions, today added two new high-performance solutions to its industry-leading line of storage for gamers. The Seagate FireCuda 520 PCIe Gen4 x4 SSD and the FireCuda Gaming Dock featuring 4 TB of HDD storage capacity and an NVMe M.2 expansion slot for an optional ultra-fast SSD upgrade.

Built to deliver the intense speeds needed for the rigor of modern gaming, the FireCuda 520 SSD is the company's fastest solid-state drive and offers plug-and-play compatibility with all PCIe Gen4 motherboards. For laptop PC gamers looking for flexibility, the FireCuda Gaming Dock is an elite 4 TB HDD storage hub with an NVMe M.2 expansion slot for optional SSD upgrade that connects peripherals via a Thunderbolt 3 and offers a slick industrial design with LED illumination pushing your rig over the top.

Here are some of the first pictures of Intel's new generation "Frost Canyon" NUC based on the company's 10th generation Core "Comet Lake-U" SoC. The top-spec variant, NUC10i7FN, is powered by a Core i7-10710U SoC, which packs a 6-core/12-thread CPU with 12 MB L3 cache, up to 4.70 GHz Turbo Boost, UHD Graphics clocked at 1.15 GHz, and 25 W cTDP (configurable TDP). The middle variant, NUC10i5FN, is powered by the 4-core/8-thread Core i5-10210U (up to 4.20 GHz CPU Turbo Boost, UHD Graphics with up to 1.00 GHz clocks, 8 MB L3 cache, and 25 W cTDP). At the entry level is the NUC10i3FN powered by the Core i3-10110U (2-core/4-thread CPU clocked up to 4.10 GHz, 4 MB L3 cache, UHD Graphics clocked up to 1.00 GHz, and 25 W cTDP).

Physically, these 10th generation NUCs look similar to their "Coffee Lake" powered predecessors codenamed "Bean Canyon," with the exception of just one each type-C and type-A USB 3.2 front panel ports. Other connectivity includes possible Wi-Fi 6 (802.11ax WLAN), 1 GbE, HDMI 2.0, Thunderbolt 3 with DP output on the top model, and an additional pair of 10 Gbps USB 3.2 ports. Intel is likely to launch "Frost Canyon" on December 12.

Samsung Electronics today introduced Galaxy Book Flex and Galaxy Book Ion at the Samsung Developer Conference 2019 (SDC19), two premium laptops offering ultra-portable and ultra-powerful computing experiences to meet the unique needs of modern professionals for their always on-the-go lifestyles. Today's on-the-go consumers need PCs that deliver maximum productivity, while being mobile enough to take wherever you're going. Galaxy Book Flex and Galaxy Book Ion were built for that and more, offering a seamless continuity across multiple devices.

"Consumers often have to choose between mobility and high-performance hardware when choosing a laptop," said YoungGyoo Choi, Senior Vice President of, Mobile Communications Business at Samsung Electronics. "Galaxy Book Flex and Galaxy Book Ion eliminate the need to compromise by offering powerful performance with unparalleled portability and display innovation."

Razer, the leading global lifestyle brand for gamers, today announced the world's first optical keyboard designed for laptops. Razer was the first to introduce a low-profile mechanical laptop keyboard in 2016 and has now brought next-generation optical switches to the Razer Blade 15 gaming laptop. The low-profile keyboard has been designed for gaming enthusiasts who demand near instant actuation, satisfying tactile feedback, and rapid-fire inputs.

The new optical laptop switch harnesses the power of light to instantly capture key actuations. Under every key, an infrared light beam is used to detect when a key is pressed (actuation), allowing for much greater precision and speed versus conventional laptop keyboards. The result is a groundbreaking keyboard with an actuation point of only 1 mm at 55 g of actuation force with 50% more travel, allowing players to input more commands in less time in the heat of battle.

In recent years, MSI aims at motherboards in content creation market for the ever-increasing number of creators and the popularity. Together with the new launch of Intel Core X-Series processors, we are proud to introduce three new motherboards to anticipate every creator's need from high loading operation to general graphic design. For the high-end processors and X299 platform, MSI all aluminium design ensures CPU to run at full speed for the best performance. Larger heatsinks contains more surface for heat dissipation to cool down CPU while high-loading operation.

USB 3.2 Gen 2x2: Super Speed USB 20G: For all types of designers, large data and files transfer is always troublesome as it takes plenty of waiting time. All new MSI X299 motherboards support the latest USB 3.2 Gen 2x2 Super Speed USB 20G solution powered by ASMedia to meet creators' requirement. Transfer speed enhances to incredibly 4 times faster than USB 3.2 Gen1 solution so that designers can save time on backup and other essential data transfer processes. "We are pleased to have a strong and close relationship with MSI. ASMedia Technology Inc. offers the latest USB 3.2 Gen 2x2 Super Speed USB 20G solution to the market and continues working closely with top motherboard vendor MSI," said Chewei Lin, President of ASMedia.

Razer, the leading global lifestyle brand for gamers, today announced their new Razer Blade Stealth 13 with NVIDIA GeForce GTX 1650 graphics - the World's First Gaming Ultrabook. Powered by Intel's new 10th generation processor, the new Razer Blade Stealth 13 delivers true gaming performance packed into an amazingly thin 15 mm chassis weighing only 1.3 kg.

"Razer is constantly pushing the boundaries of what's possible, by designing laptops that utilize the most powerful components in the smallest chassis" says Brad Wildes, Senior Vice President of Razer's Systems Division. "We did it with our original Razer Blade, which led the trend of slim gaming systems, and now we're doing it again with our Blade Stealth, pioneering a new market for powerful, small-footprint laptops."

USB Implementers Forum (USB-IF), the support organization for the advancement and adoption of USB technology, today announced the publication of the USB4 specification, a major update to deliver the next-generation USB architecture that complements and builds upon the existing USB 3.2 and USB 2.0 architectures. The USB4 architecture is based on the Thunderbolt protocol specification recently contributed by Intel Corporation to the USB Promoter Group. It doubles the maximum aggregate bandwidth of USB and enables multiple simultaneous data and display protocols.

The development of the USB4 specification was first announced in March 2019 by the USB Promoter Group. It is now officially published by USB-IF and available for download here.

IFA is the largest consumer tech show in Europe and we expect to see significant news from 4K and OLED TVs to wearables to smartphones. We'll be showcasing our latest PCs, of course, as the move to thin and light continues across the industry. It's not only about smaller form factors though - consumers want adaptive, always connected, high-performing, and flawlessly designed PCs. Dell continues to set the bar for the PC industry.

Ahead of IFA, we're expanding our consumer portfolio with brand new form factors and the addition of new 10th Gen Intel Core processors to our current XPS and Inspiron portfolio, delivering performance gains needed for compute intensive, demanding multi-thread workloads, while still handling 4K content efficiently. And in doing so, giving our customers heavyweight performance in thin, light and portable designs — the best of both worlds.

Intel is working on its next generation gaming-grade NUC, codenamed "Phantom Canyon." When it comes out some time in 2020-21, it will feature Intel's 10 nm+ "Tiger Lake" SoC. Intel detailed this and more in a leaked presentation to industry partners. It describes the launch of of the company's "Ghost Canyon" NUC in Fall 2019 to succeed the current "Hades Canyon" gaming NUC. This box features a Core i9-9980HK processor and discrete graphics options. It will be succeeded in 2020-21 (late 2020 or sometime 2021), by the "Phantom Canyon" NUC that's in development.

The "Phantom Canyon" NUC is powered by a 28 W 10 nm+ "Tiger Lake-U" SoC that features PCI-Express gen 4. The package also implements Intel's "Gen 12" graphics processor that's derived from the Xe architecture it's currently working on, according to Chinese publication PTTWeb. The NUC will also feature discrete graphics options in the price-range of the current GTX 1660 Ti and RTX 2060 ($299 to $349). In related news, we see subtle hints that Intel will give its chipset bus a major update in future generations of its desktop and mobile platforms. Apparently, future platforms could feature DMI spread over 8 lanes as opposed to 4 on current platforms, besides the update to PCIe gen 4. This quadrupling in bandwidth compared to DMI 3.0 (PCIe 3.0 x4) is necessitated by the growth in bandwidth-hungry devices such as NVMe SSDs, external Thunderbolt 3 graphics cards, USB 3.2 flash drives, etc.

Today, Intel officially launched 11 new, highly integrated 10th Gen Intel Core processors designed for remarkably sleek 2 in 1s and laptops. The processors bring high-performance artificial intelligence (AI) to the PC at scale, feature new Intel Iris Plus graphics for stunning entertainment and enable the best connectivity with Intel Wi-Fi 6 (Gig+) and Thunderbolt 3. Systems are expected from PC manufacturers for the holiday season.

"These 10th Gen Intel Core processors shift the paradigm for what it means to deliver leadership in mobile PC platforms. With broad-scale AI for the first time on PCs, an all-new graphics architecture, best-in-class Wi-Fi 6 (Gig+) and Thunderbolt 3 - all integrated onto the SoC, thanks to Intel's 10nm process technology and architecture design - we're opening the door to an entirely new range of experiences and innovations for the laptop."
-Chris Walker, Intel corporate vice president and general manager of Mobility Client Platforms in the Client Computing Group

AnandTech, who spoke with the USB Promoter Group at Computex, have shared that the new protocol is expected to manifest in physical, consumer products by the end of 2020. The specification for the next-generation bus is currently on version 0.7, with the USB Promoter Group expecting it to be finalized by this Summer. Then it's just a matter of manufacturers developing new products powered by the latest protocol.

USB 4.0 borrows heavily from Intel's thunderbolt 3 technology - which, if you'll remember, was made available as an open specification very recently. Intel's contribution of the Thunderbolt 3 protocol will enable USB 4.0 to achieve speeds of up to 40 Gbps with multiple data and display protocols being able to share available bandwidth. Additionally, USB 4.0 will make use of USB Type-C's interface, ensuring backwards compatibility not only with it, but also USB 2.0, USB 3.0 and Thunderbolt 3. Due to the many improvements in data transfer speeds and ability to stream multiple data and display protocols, the USB Promoter Group is looking at the possibility of changing USB's trademark logo for the next generation interface, alongside a revised branding scheme.

AMD X570 is the company's first in-house design desktop motherboard chipset for the AM4 platform. The company sourced earlier generations of chipset from ASMedia. A chipset in context of the AM4 platform only serves to expand I/O connectivity, since an AM4 processor is a full-fledged SoC, with an integrated southbridge that puts out SATA and USB ports directly from the CPU socket, in addition to LPCIO (ISA), HD audio bus, and SPI to interface with the firmware ROM chip. The X470 "Promontory Low Power" chipset runs really cool, with a maximum TDP of 5 Watts, and the ability to lower power to get its TDP down to 3W. The X570, on the other hand, has a TDP of "at least 15 Watts." A majority of the X570 motherboards we've seen at Computex 2019 had active fan-heatsinks over the chipset. We may now have a possible explanation for this - there are just too many things on the chipset.

According to AMD, the X570 chipset by itself can be made to put out a staggering twelve SATA 6 Gbps ports (not counting the two ports put out by the AM4 SoC). A possible rationale behind this may have been to enable motherboard designers to equip every M.2 slot on the motherboard with SATA wiring in addition to PCIe, without needing switches that reroute SATA connection from one of the physical ports. It's also possible that AMD encouraged motherboard designers to not wire out SATA ports from the AM4 SoC as physical ports to save costs on switches, and dedicate one of them to the M.2 slot wired to the SoC. With the two SATA ports from the SoC out of the equation, and every other M.2 slot getting a direct SATA connection from the chipset, motherboard designers can wire out the remaining SATA ports as physical ports, without spending money on switches, or worrying about customer complaints on one of their drives not working due to automatic switching. This is an extreme solution to a rather simple problem.

Apple today introduced the all-new Mac Pro, a completely redesigned, breakthrough workstation for pros who push the limits of what a Mac can do, and unveiled Apple Pro Display XDR, the world's best pro display. Designed for maximum performance, expansion and configurability, the all-new Mac Pro features workstation-class Xeon processors up to 28 cores, a high-performance memory system with a massive 1.5TB capacity, eight PCIe expansion slots and a graphics architecture featuring the world's most powerful graphics card. It also introduces Apple Afterburner, a game-changing accelerator card that enables playback of three streams of 8K ProRes RAW video simultaneously.

Pro Display XDR features a massive 32-inch Retina 6K display with gorgeous P3 wide and 10-bit color, an extreme 1,600 nits of peak brightness, an incredible 1,000,000:1 contrast ratio and a superwide viewing angle, all at a breakthrough price point. Together, the new Mac Pro and Pro Display XDR are the most powerful tools Apple has ever put in the hands of pro customers and will change pro workflows forever.

At Computex 2019, we spotted three new socket LGA2066 motherboards from GIGABYTE, and several other manufacturers. At its Computex 2019 keynote, Intel announced that in Q3 2019, the company is launching new Core X series HEDT processor models "for creators." When combined with the handful new LGA2066 motherboard models we've spotted, it becomes highly likely that the processors Intel is launching this Fall could be LGA2066-compatible. Without further ado, the X299G Aorus Master, the X299G Aorus Xtreme Waterforce, and the X299G Designare 10G.

The X299G Aorus Master is different from the X299 Aorus Master launched last November, and the X299G Designare 10G is different from the X299 Designare EX launched way back in 2017. The X299G Aorus Xtreme Waterforce is the first "Xtreme" sub-branded LGA2066 product. What's common to these three boards is out-of-the-box support for the upcoming HEDT processor models, besides 9th generation "Skylake-X" Refresh processors, and the original "Skylake-X" chips.

ASRock is ready with its own mini-ITX motherboard based on the AMD X570 chipset, the X570 Phantom Gaming-ITX TB3. This tiny powerhouse one-ups other mini-ITX motherboards in its category by offering 40 Gbps Thunderbolt 3 connectivity over USB type-C, in addition to USB 3.2. This Thunderbolt port also includes a DP pass-through from your discrete graphics card.

Expansion includes one PCI-Express 4.0 x16. Storage connectivity includes one M.2-2280 with PCI-Express 4.0 x4 and SATA 6 Gbps connectivity; and four SATA 6 Gbps ports. Networking options include 2.4 Gbps 802.11ax WLAN, Bluetooth 5.0, and 1 GbE driven by Intel i211-AT. The board pulls power from a combination of 24-pin ATX and 8-pin EPS connectors, conditioning it for the SoC with a 6+2 phase VRM. A chunky fan-heatsink cools the chipset, shedding some of its heat to the enlarged VRM heatsink cloaked under the I/O shroud.

ASRock will be showing the world's first Thin Mini-ITX form factor - RX570TM-ITX/TBT graphics card, which adapts with AMD Radeon RX570 graphics card and supports Intel Thunderbolt 3 technology. The RX570TM-ITX/TBT graphics card is not only the first graphics card with a Thunderbolt 3 Type-C interface which supports 40Gb/s transfer rate and power delivery, but it also features 4 USB 3.1 Gen1 ports, Gigabit Ethernet, and SATA 6Gb/s interface.
The RX570TM-ITX/TBT graphics card is based on the Thin Mini-ITX concept. With this graphics card, All-in-One PC manufacturers can develop their own Thunderbolt monitors with 3D performance and power charging with less effort. Moreover, it would be able to fit in a mini ITX chassis. By connecting a notebook through Thunderbolt 3 Type-C interface, it helps to increase the notebook's 3D computing power and charge the notebook at the same time.