Montage Technology, a leading data processing and interconnect IC company, today announced that it has taken the lead in the trial production of 1st-generation DDR5 Clock Driver (CKD) chips for next-generation client memory. This new product aims to enhance the speed and stability of memory data access to match the ever-increasing CPU operating speed and performance.

Previously, clock driver functionality was integrated into the Registering Clock Driver (RCD) chips used on server RDIMM or LRDIMM modules, not deployed to the PCs. In the DDR5 era, as data rates climb 6400 MT/s and above, the clock driver has emerged as an indispensable component for client memory.

QNAP Systems, Inc., a leading computing, networking, and storage solution innovator, today introduced the TS-h3077AFU, a highly reliable 30-bay SATA 6 Gb/s all-flash SSD NAS with a ZFS-based operating system, cutting-edge AMD Ryzen Embedded 7000 Series processors and integrated AMD Radeon Graphics. With up to 1.6M/1.2M iSCSI 4K random read/write IOPS, DDR5 RAM, built-in dual-port 10/2.5 GbE, upgradability to 100 GbE, PCIe Gen 4 expandability, and scalability to petabyte-scale storage, the TS-h3077AFU meets uncompromising performance demands in 4K/8K video workflows, storage centers, and virtualization. The QuTS hero operating system also features ZFS data reduction and SSD optimization, ensuring the utmost performance, lifespan, and efficiency from all-flash investments.

"The TS-h3077AFU redefines the landscape of storage solutions, offering not just capacity but also efficiency and performance for the most demanding business environments. Its capabilities in graphics processing, connectivity, and reliability, provided by the powerful AMD Ryzen Embedded 7000 Series Processor, position it as a game-changer in the industry," said Meiji Chang, General Manager of QNAP.

TYAN, an industry leader in server platform design and a subsidiary of MiTAC Computing Technology Corporation, debuts its new server line-up for 4th Gen AMD EPYC & AMD Ryzen Processors at SC23, Booth #1917, in the Colorado Convention Center, Denver, CO, November 13-16.

AMD EPYC 9004 processor features leadership performance and is optimized for a wide range of HPC, cloud-native computing and Generative AI workloads
TYAN offers server platforms supporting the AMD EPYC 9004 processors that provide up to 128 Zen 4C cores and 256 MB of L3 Cache for dynamic cloud-native applications with high performance, density, energy efficiency, and compatibility.

In order to meet the evolving needs of Netcom data center computing, global memory provider TEAMGROUP is proud to introduce the new DDR5 VLP ECC U-DIMM normal and wide temperature (-40° to +85°C) memory module. It features DDR5 high performance, high frequencies, and large-capacity industrial ICs. Designed to have an extremely low profile for greater performance and more compact hardware configurations, the U-DIMM provides users with better performance and reliability than ever before.

Team Group's DDR5 VLP ECC U-DIMM memory modules come in frequencies up to 4800 MHz and 5600 MHz to ensure fast data processing and enhance computing performance. The memory is also offered in a wide range of capacity options, from 16 GB to 48 GB, allowing users to select the most suitable capacity kit for their platform's workload and computing needs. This module comes in an ultra-low-profile design, with a board height of only 0.738 inches, half of the normal modules. This allows it to meet the hardware configuration requirements of blade servers and helps maximize space for the user's configuration of components, and achieves higher server density.

Kingston Technology Company, Inc., a world leader in memory products and technology solutions, today announced the release of its 32 GB and 16 GB Server Premier DDR5 5600MT/s and 5200MT/s ECC Unbuffered DIMMs and ECC SODIMMs.

Server Premier UDIMM and ECC SODIMMs
For over 35 years Kingston has been the memory brand trusted by leading server manufacturers and the world's largest data centers. Server Premier is Kingston's industry standard server class memory solution sold by specification for use in white-box systems, and is Intel platform validated and qualified by leading motherboard/system manufacturers. Featuring a locked BOM (Bill of Materials) to provide a consistent brand and revision of primary components (including DRAM, PMIC, SPD hub, thermal sensors, and PCB), all Kingston server memory solutions are 100% tested and undergo a rigorous dynamic burn-in process designed to catch early-life failures at the factory.

Innodisk has the right idea about how to do PCIe Gen 5 NVMe SSDs—to ditch the M.2 form-factor, and make them PCIe add-in cards. This would remove the need for cartoonishly disproportionate cooling solutions with high-pitched 20 mm fans; and rather allow SSD designers to use cooling solutions resembling those of graphics cards. Gen 5 NVMe controllers have a TDP of around 15 W, or roughly similar to that of a motherboard chipset. The M.2-2280 form-factor is tiny for the deployment of a sufficiently large heatsink, and so SSD designers are resorting to active cooling, using 20 mm fans that don't sound pleasant. Most single-slot VGA cooling solutions can make short work of 15 W of heat while being much quieter, some even fanless.

The Innodisk 5TG-P AIC SSD uses a PCIe Gen 5 + NVMe 2.0 SSD controller with a large passive heatsink, a PCI-Express 5.0 x4 host interface, and 32 TB of capacity. The drive runs entirely on slot power, and besides the 3D TLC NAND flash, uses a large DDR4 DRAM cache. The company claims sequential transfer speeds of up to 13 GB/s in either direction. Innodisk is targeting the PCIe 5TG-P at workstation and HEDT use-cases. The company is building them in server-relevant form-factors such as U.2 and E.1S. A CDM screenshot shows 13.62 GB/s sequential reads, with 11.55 GB/s sequential writes.

Anacomda, a Taiwanese memory, storage, and accessories maker, had a booth at Computex 2023, where the company presented the new DDR5 memory kits with speeds ranging up to 7000 MHz. Starting off, we have the model called "Standard," which is just a standard DDR5 UDIMM memory kit available as 8 and 16 GB DIMM, in 2x 8 GB and 2x 16 GB capacities. Running at 4800 MHz, the standard kit has a CAS latency of 40, with a running voltage set to 1.1 Volts. Next is the KingSnake Overclocking UDIMM, which is, as the name suggests, a kit optimized for overclocking. Available in frequencies of 5600/6000/6200/7000 MHz, these memory modules run at 1.25 or 1.45 Volts at CAS latencies of 40 and 36. They also come in 16 GB and 32 GB capacities.

Last but not least, there is an ET (EryxTataricus) unbuffered UDIMM kit that is basically an RGB version of KingSnake, with all the same features except the inclusion of RGB lighting capable of syncing with all modern motherboard RGB software.

TYAN, an industry-leading server platform design manufacturer and a subsidiary of MiTAC Computing Technology Corporation, will be showcasing its latest HPC, cloud and storage platforms at Computex 2023, Booth #M0701a in Taipei, Taiwan from May 30 to June 2. These platforms are powered by AMD EPYC 9004 Series processors, which offer superior energy efficiency and are designed to enhance data center computing performance.

"As businesses increasingly prioritize sustainability in their operations, data centers - which serve as the computational core of an organization - offer a significant opportunity to improve efficiency and support ambitious sustainability targets," said Eric Kuo, Vice President of the Server Infrastructure Business Unit at MiTAC Computing Technology Corporation. "TYAN's server platforms powered by 4th Gen AMD EPYC processor enable IT organizations to achieve high performance while remaining cost-effective and contributing to environmental sustainability."

Last year, Crucial canned its Ballistix brand of gaming focused memory, but it seems like the company still wants to offer its customers a more premium product, as Crucial has just introduced its new Pro series of memory products. Crucial will offer its new Pro series in both DDR5 and DDR4 flavours at either DDR5-5600 or DDR4-3200 speeds. It should be noted that the DDR4 modules still rely on a green PCB, while the DDR5 modules get the same black PCB as Crucial's regular DDR5 modules. Beyond the heatsink, there isn't much that differs between the Pro series and Crucial's regular modules, but there is one thing that might matter to potential buyers.

Crucial has added support for AMD EXPO and Intel XMP 3.0 to its Pro series of modules. In the case of AMD EXPO this only applies to DDR5 modules, whereas the DDR4 modules support Intel XMP 2.0, in this case a feature its standard DDR4 modules lack. This should make it easier for end users to take advantage of the extra performance offered by some of these modules. That said, as Crucial has stuck to JEDEC timings, taking the Pro DDR5-5600 UDIMM kit as an example, you end up with timings of 46-46-45-45 at 1.1 Volts, where competing products have timings in the range of 36-36-36-36, although usually at 1.25 Volts or higher. Even as far as JEDEC timing goes, Crucial has chosen the middle ground for DDR5 5600, as there is a timing option from JEDEC that supports 40-40-40-40, which would make more sense for a more premium product. Price wise, a 32 GB kit with two 16 GB modules of DD5-5600 modules carries an $11 price premium over Crucials standard modules, with a retail price of US$114.99 versus US$103.99, but there are better options out there at this price point.

QNAP Systems, Inc., a leading computing, networking, and storage solution innovator, today introduced the high-capacity TS-1655 tower 2.5 GbE NAS that can accommodate twelve 3.5-inch hard drives and four 2.5-inch solid-state drives. Designed with a hybrid storage architecture that balances performance and cost, the TS-1655 integrates 8-core computing power, 2.5 GbE high speed and PCIe expansion to improve business efficiency for cross-team file sharing, collaboration, backup and disaster recovery, and virtualization.

"The TS-1655 strikes a cost-performance balance with the HDD/SSD hybrid storage design, while also supporting RAID 50/60 that provides high-capacity NAS users with higher data protection and optimum storage space utilization," said Andy Chuang, Product Manager of QNAP, adding "Moreover, its SSD-focused design includes built-in M.2 NVMe PCIe slots and dedicated 2.5-inch SSD bays to drive performance-demanding business applications while enabling tiered storage for maximized cost-efficiency."

Tachyum today announced that the IP components -DDR5 RAM controller and high-performance, low-power DSP-based PHY - incorporated into the Prodigy Universal Processor have allowed it to achieve speeds of 6400 MT/s at nominal voltage for Prodigy chip which provides headroom for expected speeds of up to, or even over, 7200 MT/s.

The critical components supplied by a global leader in high-speed DDR DRAM controllers and DDR DRAM PHYs for the world's technology infrastructure, have enabled Tachyum engineers to integrate its IP into Prodigy less than 7 months after entering into a technology partnership. The quality of this IP and the support provided by working closely with Tachyum engineers have allowed the company to close DDR5 timings in record time.

SMART Modular Technologies, Inc. ("SMART"), a division of SGH and a global leader in memory solutions, solid-state drives and hybrid storage products today announced the addition of new DDR5 16 GB and 32 GB Very Low Profile Error-Correction Code Unbuffered Dual In-Line Memory Modules (VLP ECC UDIMM) to its lineup of blade memory VLP module products.

SMART's new DuraMemory DDR5 VLP ECC UDIMMs are designed for 1U blade servers and blade enclosure systems used in networking, telecom, compute and storage applications that are optimized to minimize space and power. DDR5 VLP ECC UDIMMs are designed to meet height, density, power, and performance specifications needed to enable the next generation of memory applications.

Montage Technology, a leading data processing and interconnect IC design company, today announced that it is delivering the world's first Gen1 DDR5 Clock Driver (CKD or DDR5CK01) samples to the top DRAM memory vendors for their development of memory modules used in new-generation desktop and notebook computers.

For a long time, the clock driver functions have been integrated onto the register clock driver (RCD) device, which is used in the server platforms, rather than the PC computers. With the boost of the DDR5 data rate, the frequency of the clock signal becomes higher and higher, and the signal integrity issue of the clock becomes more and more challenging. As the DDR5 data rate reaches 6400MT/s and above, the memory modules such as UDIMMs and SODIMMs used in desktop and notebook computers, will need an on-DIMM clock driver to buffer and re-drive the clock signal of the memory modules, to meet the signal integrity and reliability requirement of the high-speed clock signal.

Rambus Inc., a premier chip and silicon IP provider making data faster and safer, today announced the expansion of its DDR5 memory interface chip portfolio with the addition of the Rambus SPD (Serial Presence Detect) Hub and Temperature Sensor, complementing the industry-leading Rambus Registering Clock Driver (RCD). DDR5 achieves greater memory bandwidth and capacity by employing a new module architecture with an expanded chipset. The SPD Hub and Temperature Sensors improve DDR5 Dual Inline Memory Module (DIMM) system management and thermal control to deliver higher performance within the desired power envelope for servers, desktops and laptops.

"The new performance levels of DDR5 memory place an increased premium on signal integrity and thermal management for server and client DIMMs," said Sean Fan, chief operating officer at Rambus. "With over 30 years of memory subsystem design experience, Rambus is ideally positioned to deliver DDR5 chipset solutions which enable breakthrough bandwidth and capacity for advanced computing systems."

Silicon Power (SP) releases its first line of memory modules featuring the all-new, next-gen DDR5 technology. Designed for gaming, the XPOWER Zenith DDR5 UDIMM module is available in both RGB and non-RGB forms. Experience even faster frequencies, greater capacities, and lower voltages with the latest release in our Zenith Series, the XPOWER Zenith DDR5 UDIMM module. Take your gaming abilities to new high scores with turbo speeds ranging from 5200 MHz to 6000 MHz. It's available in 8 GB, 16 GB, and 32 GB module densities with double the banks and double the burst length compared to DDR4 to give hardcore gamers and overclockers the power to harness DDR5's game-changing performance.

Sabrent Rocket 8 GB, 16 GB, and 32 GB DDR5-UDIMM's 4800 MHz Memory Modules for PC's. It seems like DDR4 has ruled the roost forever. Finally, new motherboards and architectures have allowed memory to grow wings with the advent of DDR5. Improved clock speeds promise up to twice the bandwidth of DDR4, all with lower voltage for better efficiency. To further help with that last bit, DDR5 has on-board power management to reduce motherboard cost and complexity. Sabrent's new DDR5 kits simply plug and play, install your memory kits of choice, enter the BIOS and hit AUTO, and reboot. For those that want to OC these kits, there is plenty of headroom to advance speeds if you want.

Reliability has also been improved by the introduction of on-die error-correction technology. Memory availability is improved by splitting the internal 64-bit (72-bit with ECC) channel into two independent, 32-bit channels (40-bit with ECC) and the addition of the same bank refresh. Combined with other features, including those that allow for up to four times the module capacity with consumer DRAM, DDR5 ensures your multi-core CPU won't be memory starved.

ADATA Technology, a leading manufacturer of high-performance DRAM modules, NAND Flash products, and mobile accessories has today launched new industrial-grade Registered DIMM (R-DIMM) DDR5 memory modules. This completes a full suite of industrial-grade DDR5 including U-DIMM, SO-DIMM and now R-DIMM modules designed for the latest Intel 12th Generation processors, and future DDR5 platforms.

ADATA industrial-grade R-DIMM DDR5 memory modules are suitable for a wide range of applications, including 5G backhaul equipment, AIoT, High-Performance Computing, Server, Data Center, Edge Computing, Networking, Surveillance and more. DDR5 is expected to account for 90% of the global memory market by 2026, and ADATA's DDR5 memory is ready to support the growing demand for reliable, high bandwidth memory.

Silicon Power (SP) releases its newest UDIMM memory module with the latest, groundbreaking DDR5 technology. Read on to learn why it's time to ditch your DDR4 module and make the upgrade. Taking speed, capacity, and reliability even further, the cutting-edge technology of this DDR5 module gives that next-level edge for your system's performance. With aggressive speeds of 4800 MHz, it's 1.5x faster than standard 3200 MHz DDR4 to provide multi-core CPUs with extreme responsiveness and the power to multi-task seamlessly.

Even with all of its extra power, this DDR5 module improves upon its predecessor with on-module voltage regulation. A power management integrated circuit (PMIC) reduces the burden on the motherboard control and results in a lower voltage of 1.1 V versus 1.2 V for DDR4 for even less power consumption.

Kingston Technology Company, Inc., a world leader in memory products and technology solutions, today announced its forthcoming DDR5 UDIMMS have received Intel Platform Validation. This marks the first and arguably most important milestone in validating compatibility between Kingston DDR5 memory solutions and Intel platforms utilizing DDR5.

Kingston's introductory portfolio of DDR5 memory will be the first in a series of high performance, low to high capacity, multiple form factor solutions in support of DDR5 based platforms debuting over the next year. After developing the next generation of DDR memory, Kingston is providing over 10,000 DDR5 UDIMM samples to major motherboard manufacturers and technology partners in support of the platform launch. By supporting partners early, Kingston is doing its part to lay the foundation for a successful product launch.

At this year's Hot chips 33 conference, Samsung has presented its works on the upcoming DDR5 memory standard. The company has managed to achieve a lot of new developments, as the newer standard pairs with new technologies to deliver higher speeds and better capacity. The Korean company designed its DDR5 modules as 8-high (8H) stacked TSV (through silicon via) dies. In the previous DDR4 implementations, Samsung used 4-high (4H) stacked TSV dies, which are actually thicker than the latest 8-high implementations. To achieve the new thin design, Samsung has used thin wafer handling techniques, which resulted in a 40% reduction in gab between stacked dies. The new 8H DDR5 modules are only 1.0 mm thick, compared to the 1.2 mm of the older 4H modules.

When it comes to performance, Samsung expects the new DDR5 modules to deliver big. Running at 7.2 Gbps speeds, the Samsung-made RDIMM/LRDIMM modules can reach up to 512 GB in capacity. This is, of course, limited to the server/enterprise market. Regular consumers/PC users can expect to have UDIMMs with up to 64 GB of capacity. The aforementioned 7.2 Gbps speed is achieved at the specified 1.1 Volts of power, meaning that Samsung's implementation is very efficient. According to some estimations made by the company, the DDR5 crossover for the mainstream market is not expected before 2023/2024, meaning that there is still a lot of time for memory makers to refine their DDR5 products.

Lexar, a leading global brand of flash memory solutions, is proud to announce the new HADES product line of Gaming DRAM products. This is our introduction into the gaming DRAM category as Lexar expands its product portfolio. The new Lexar HADES RGB DDR4 3600/3200 Desktop Memory is for gamers looking for next-level performance and an enhanced gaming experience with customizable RGB lighting. The Lexar HADES OC DDR4 3600/3200 Desktop Memory is the perfect upgrade for gamers and content creators who want optimized performance and a next-level gaming experience or for intensive workloads.

The HADES RGB DDR4 overclocked memory allows you to level-up your gaming experience without slow-downs. And with its RGB lighting effects, the HADES RGB DDR4 memory enhances your gameplay with vibrant colors of RGB lighting effects. The RGB customization creates a lively atmosphere rendering your gameplay more realistic, and adds a touch of style to your gaming setups. It also features Lexar RGB Sync, a powerful lighting control software which allows you to customize and synchronize your lighting effects by setting color, intensity, and speed while allowing you to save your lighting effects for later use. The Lexar HADES RGB DDR4 3600/3200 is also compatible with ASUS Aura Sync, GIGABYTE RGB Fusion 2.0, MSI Mystic Light, ASRock Polychrome SYNC.

As a global memory leader with a long-term focus on industrial applications, TEAMGROUP has recognized the tremendous processing needs of the HPC market. To meet the demand for industrial memory can handle sustained high-speed data transmission with low latency, TEAMGROUP has utilized the in-house developed and patent-protected TRUST+ wide temperature technology to provide customers with high stability, durability and wide temperature industrial memory.

Applications for the first DDR5 UDIMM and SODIMM industrial wide temperature memory products include usage in edge computing, Internet of Vehicles, servers, AI, and embedded systems. In response to the stringent demands of efficient computing in the industrial control market, TEAMGROUP has been ready to launch the standard temperature DDR5 IST (TC: 0~85℃) memory series and the wide temperature DDR5 IWT (TA: -40~85℃) memory series. The latter features exclusive "Graphene-coated copper heatsink Technology" (U.S. Utility Patent US 11,051,392 B2), which helps maintain a case temperature (TC) of 85~86℃ under an ambient temperature (TA) of 85℃, ensuring low-latency high-speed computing. Without the heatsink, case temperatures (TC) can reach up to 89~90℃ or more, impairing the high performance of DDR5 and significantly reducing the life span of ICs.

TEAMGROUP's T-CREATE brand, which gives creators around the world the tools to express their creativity and inspiration, has updated its product lines again with today's launch of the EXPERT DDR4 OC10L desktop memory, CLASSIC PCIe 4.0 SSD, and CLASSIC DDR4 10L laptop memory. T-CREATE continues to launch diverse new products with improved specifications, producing powerful hardware to meet the needs of creators.

The T-CREATE EXPERT DESKTOP DDR4 OC10L not only has up to 32 GB of capacity per module but also an overclocking feature that automatically increases its frequency to 3600 MHz, providing worry-free overclocking with stable, high-frequency performance. It comes in a titanium grey finish that exudes the tasteful minimalism of the EXPERT product line. In addition, the memory uses a 10-layer PCB with a specialized anti-noise design for better processing capability, allowing creators to work on tasks simultaneously, whether it be producing animation, video editing, or converting large files. It substantially improves work efficiency and excels in multitasking during creative projects.

ASUSTOR Inc. has announced the release of the rack-mounted Lockerstor 12R Pro and Lockerstor 16R Pro equipped Intel's 9th Gen Xeon E-2224 3.40 GHz Quad-Core processor. The Lockerstor 12R Pro and 16R Pro come with 8 GB DDR4-2666 ECC UDIMM and supports a maximum of 128 GB, greatly improving computing power and system stability of virtual machines and Docker applications. In addition to the four Gigabit Ethernet ports, the Lockerstor 12R Pro and 16R Pro also provide three PCIe slots that support 10/25/40/50GbE network cards and SAS cards increasing speeds to unprecedented levels. The rich variety of I/O include six USB 3.2 Gen2 ports, of which four are Type-A and two are Type-C, and dual M.2 slots for SSD caching to enable the Lockerstor 12R Pro and 16R Pro take advantage of some of our fastest speeds ever.

The 80 Plus Platinum 550-watt dual redundant power supplies and four Gigabit Ethernet ports can be configured with failover to ensure the reliability of power supply and transmission, and also through high power conversion efficiency (up to 94%) Provide high-efficiency power supply and virtualized storage stability, allowing enterprises to control costs and protect the environment. The four Gigabit Ethernet ports combined provide up to 451 MB/s and 451 MB/s read and write speeds. The Lockerstor 12R Pro and 16R Pro support up to 192 TB and 256 TB respectively and the support for large amounts of storage space fully accommodates rapidly increasing storage needs, meeting the needs of the present and the future simultaneously.

Chenbro has launched the RB13804, a 1U rackmount server barebone designed for mission-critical, storage-focused applications for mixed deployments (Hyper-Converged Infrastructure) in Data Center and HPC Enterprise, that may either require maximum density of compute-to-storage capability or are limited by available rack space. The RB13804 is pre-integrated with an Intel Server Board S2600WFTR that supports up to two 2nd Generation Intel Xeon Scalable 'Cascade Lake' Processors, allowing cost and build flexibility in deployment.

The RB13804 is an easy-to-use barebones server solution that pre-integrates a 2-socket Intel Server Board to ensure a flexible, scalable design with mission-critical reliability. Notably, the RB13804 offers tri-mode storage with interchangeable backplane that enables universal drive bays that can switch between SAS, SATA and NVMe storage types, allowing a single server to upgrade according to the growing needs of the business.