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US Weighs National Security Risks of China's RISC-V Chip Development Involvement

The US government is investigating the potential national security risks associated with China's involvement in the development of open-source RISC-V chip technology. According to a letter obtained by Reuters, the Department of Commerce has informed US lawmakers that it is actively reviewing the implications of China's work in this area. RISC-V, an open instruction set architecture (ISA) created in 2014 at the University of California, Berkeley, offers an alternative to proprietary and licensed ISAs like those developed by Arm. This open-source ISA can be utilized in a wide range of applications, from AI chips and general-purpose CPUs to high-performance computing applications. Major Chinese tech giants, including Alibaba and Huawei, have already embraced RISC-V, positioning it as a new battleground in the ongoing technological rivalry between the United States and China over cutting-edge semiconductor capabilities.

In November, a group of 18 US lawmakers from both chambers of Congress urged the Biden administration to outline its strategy for preventing China from gaining a dominant position in RISC-V technology, expressing concerns about the potential impact on US national and economic security. While acknowledging the need to address potential risks, the Commerce Department noted in its letter that it must proceed cautiously to avoid unintentionally harming American companies actively participating in international RISC-V development groups. Previous attempts to restrict the transfer of 5G technology to China have created obstacles for US firms involved in global standards bodies where China is also a participant, potentially jeopardizing American leadership in the field. As the review process continues, the Commerce Department faces the delicate task of balancing national security interests with the need to maintain the competitiveness of US companies in the rapidly evolving landscape of open-source chip technologies.

ASML Could Stay in the Netherlands with Further Investments and Create 20,000 New Jobs

Last month, we covered ASML's plans to leave the Netherlands after a crisis with the Dutch government that prevented skilled immigrants from entering and working inside ASML's facilities. However, it appears that ASML has managed to strike a potential deal with the Netherlands Prime Minister Mark Rutte and his office about the company's plans to stay in the country. In an effort dubbed "Operation Beethoven," the Dutch government aimed to keep the tech giant in the country, with a deal now seemingly in place. AMSL's roadblocks and reasons for potentially leaving the Netherlands were difficulty in obtaining building permits, constraints on the electrical grid, transportation bottlenecks, and a need for supporting infrastructure like hospitals, schools, and housing. The most prominent of them was importing foreign labor in the form of highly skilled engineers and scientists needed to develop next-generation lithography machines.

According to the NLTimes, ASML now plans to potentially expand in the Brainport Industries Campus (BIC) in Eindhoven, with a creation of 20,000 new jobs in a 2.5 billion Euro investment from the Dutch government. "BIC is an interesting option for us, which we are now exploring together with the municipality of Eindhoven," noted ASML CFO Roger Dassen. Given that ASML needs to double its operations in the following decade to meet soaring demand, the company has many uncertainties. Questions of finding skilled immigrants and building infrastructure to support their needs remain the company's priority. In the Summer, the plan to support ASML's expansion will be voted in the Eindhoven City Council, which will decide the fate of ASML's stay in the Netherlands. An interesting comment from January from AMSL CEO Peter Wennik is, "Ultimately, we can only grow this company if there are enough qualified people. We prefer to do that here, but if we cannot get those people here, we will get those people in Eastern Europe or in Asia or in the United States. Then we will have to go there." The final decision still awaits.

TSMC to Introduce Location Premium for Overseas Chip Production

As a part of its Q1 earnings call discussion, one of the largest semiconductor manufacturers, TSMC, has unveiled a strategic move to charge a premium for chips manufactured at its newly established overseas fabrication plants. During an earnings call, TSMC's CEO, C.C. Wei, announced that the company will impose higher pricing for chips produced outside Taiwan to offset the higher operational costs associated with these international locations. This move aims to maintain TSMC's target gross margin of 53% amidst rising expenses such as inflation and elevated electricity costs. This decision comes as TSMC expands its global footprint with new facilities in the United States, Germany, and Japan (JAMS) to meet the increasing demand for semiconductor chips worldwide. The company's new US-based Arizona facility, known as Fab 21, has faced delays due to equipment installation issues and labor negotiations.

Chips produced at this site, utilizing TSMC's advanced N5 and N4 nodes, could cost between 20% to 30% more than those manufactured in Taiwan. TSMC's strategy to manage the cost disparities across different geographic locations involves strategic pricing, securing government support, and leveraging its manufacturing technology leadership. This approach reflects the company's commitment to maintaining its competitive edge while navigating the complexities of global semiconductor manufacturing in today's fragmented market. Introducing a location premium is expected to impact American semiconductor designers, who may need to pass these costs on to specific market segments, particularly those with lower price sensitivity, such as government-related projects. Despite these challenges, TSMC's overseas expansion underscores its adaptive strategies in the face of global economic pressures and industry demands, ensuring its continued position as a leading player in the semiconductor industry.

U.S. Updates Advanced Semiconductor Ban, Actual Impact on the Industry Will Be Insignificant

On March 29th, the United States announced another round of updates to its export controls, targeting advanced computing, supercomputers, semiconductor end-uses, and semiconductor manufacturing products. These new regulations, which took effect on April 4th, are designed to prevent certain countries and businesses from circumventing U.S. restrictions to access sensitive chip technologies and equipment. Despite these tighter controls, TrendForce believes the practical impact on the industry will be minimal.

The latest updates aim to refine the language and parameters of previous regulations, tightening the criteria for exports to Macau and D:5 countries (China, North Korea, Russia, Iran, etc.). They require a detailed examination of all technology products' Total Processing Performance (TPP) and Performance Density (PD). If a product exceeds certain computing power thresholds, it must undergo a case-by-case review. Nevertheless, a new provision, Advanced Computing Authorized (ACA), allows for specific exports and re-exports among selected countries, including the transshipment of particular products between Macau and D:5 countries.

SK hynix Signs Investment Agreement of Advanced Chip Packaging with Indiana

SK hynix Inc., the world's leading producer of High-Bandwidth Memory (HBM) chips, announced today that it will invest an estimated $3.87 billion in West Lafayette, Indiana to build an advanced packaging fabrication and R&D facility for AI products. The project, the first of its kind in the United States, is expected to drive innovation in the nation's AI supply chain, while bringing more than a thousand new jobs to the region.

The company held an investment agreement ceremony with officials from Indiana State, Purdue University, and the U.S. government at Purdue University in West Lafayette on the 3rd and officially announced the plan. At the event, officials from each party including Governor of Indiana Eric Holcomb, Senator Todd Young, Director of the White House Office of Science and Technology Policy Arati Prabhakar, Assistant Secretary of Commerce Arun Venkataraman, Secretary of Commerce State of Indiana David Rosenberg, Purdue University President Mung Chiang, Chairman of Purdue Research Foundation Mitch Daniels, Mayor of city of West Lafayette Erin Easter, Ambassador of the Republic of Korea to the United States Hyundong Cho, Consul General of the Republic of Korea in Chicago Junghan Kim, SK vice chairman Jeong Joon Yu, SK hynix CEO Kwak Noh-Jung and SK hynix Head of Package & Test Choi Woojin, participated.

Intel and Biden Admin Announce up to $8.5 Billion in Direct Funding Under the CHIPS Act

The Biden-Harris Administration announced today that Intel and the U.S. Department of Commerce have signed a non-binding preliminary memorandum of terms (PMT) for up to $8.5 billion in direct funding to Intel for commercial semiconductor projects under the CHIPS and Science Act. CHIPS Act funding aims to increase U.S. semiconductor manufacturing and research and development capabilities, especially in leading-edge semiconductors. Intel is the only American company that both designs and manufactures leading-edge logic chips. The proposed funding would help advance Intel's critical semiconductor manufacturing and research and development projects at its sites in Arizona, New Mexico, Ohio and Oregon, where the company develops and produces many of the world's most advanced chips and semiconductor packaging technologies.

"Today is a defining moment for the U.S. and Intel as we work to power the next great chapter of American semiconductor innovation," said Intel CEO Pat Gelsinger. "AI is supercharging the digital revolution and everything digital needs semiconductors. CHIPS Act support will help to ensure that Intel and the U.S. stay at the forefront of the AI era as we build a resilient and sustainable semiconductor supply chain to power our nation's future."

GOG Partners Up with Amazon's Luna Cloud Streaming Service

Soon, you'll be able to play your favorite games from GOG, like the Witcher series or Cyberpunk 2077, on multiple devices of your choice. We're teaming up with Amazon Luna cloud gaming service to give you even more ways of enjoying your titles, while still keeping our mission of DRM-free gaming. Let's dive into it and take a look at how it works!

What exactly is Amazon Luna?
It is a cloud gaming service developed and operated by Amazon. The service first launched in March 2022 in the United States, and then spread its reach to other countries last year, with availability in the USA, Canada, UK, Germany, France, Italy, and Spain. Luna works by streaming games from cloud servers and runs on Amazon's powerful cloud computing service Amazon Web Services (AWS). And what it means is that it allows its customers to enjoy gaming on the go, on the couch, or anywhere else you have an internet connection. No lengthy downloads or updates, no need for an expensive gaming PC, complicated setup, or heavy computer processing - just pure joy of running your games on a device of your choice in high-quality.

US Government to Announce Massive Grant for Intel's Arizona Facility

According to the latest report by Reuters, the US government is preparing to announce a multi-billion dollar grant for Intel's chip manufacturing operations in Arizona next week, possibly worth more than $10 billion. US President Joe Biden and Commerce Secretary Gina Raimondo will make the announcement, which is part of the 2022 CHIPS and Science Act aimed at expanding US chip production and reducing dependence on China and Taiwan manufacturing. The exact amount of the grant has yet to be confirmed, but rumors suggest it could exceed $10 billion, making it the most significant award yet under the CHIPS Act. The funding will include grants and loans to bolster Intel's competitive position and support the company's US semiconductor manufacturing expansion plans. This comes as a surprise just a day after the Pentagon reportedly refused to invest $2.5 billion in Intel as a part of a secret defense grant.

Intel has been investing significantly in its US expansion, recently opening a $3.5 billion advanced packaging facility in New Mexico, supposed to create extravagant packaging technology like Foveros and EMIB. The chipmaker is also expanding its semiconductor manufacturing capacity in Arizona, with plans to build new fabs in the state. Arizona is quickly becoming a significant hub for semiconductor manufacturing in the United States. In addition to Intel's expansion, Taiwan Semiconductor Manufacturing Company (TSMC) is also building new fabs in the state, attracting supply partners to the region. CHIPS Act has a total funding capacity of $39 billion allocated for semiconductor production and $11 billion for research and development. The Intel grant will likely cover the production part, as Team Blue has been reshaping its business units with the Intel Product and Intel Foundry segments.

Nintendo of America Sues "Yuzu Switch Emulator" Development Company

Game File reporter, Stephen Totilo, has discovered a new Nintendo-filed legal document—the Japanese multinational video game company's North American office is ready to do battle (in court) with Tropic Haze. The latter's Yuzu Switch Emulator is the focus of Nintendo's legal case—initiated on February 26, at the United States District Court for the District of Rhode Island. Totilo's social media summary of goings-on stated: "Nintendo is suing the creators of popular Switch emulator Yuzu, saying their tech illegally circumvents Nintendo's software encryption and facilitates piracy. Seeks damages for alleged violations and a shutdown of the emulator." The Dolphin Emulator—a Gamecube and Wii emulation platform—was removed from Valve's Steam store last year, following the sending of a Digital Millennium Copyright Act (DMCA) takedown order, but its development team was not pursued in US courts. The House of Mario is reportedly fiercely protective of its intellectual properties and technologies—gaining a hard-nosed reputation for engaging in plenty of legal action over decades past.

Nintendo's federal-level lawsuit alleges that Tropic Haze's Yuzu Switch Emulator played a large part in widespread illegal distribution of a 2023 flagship game title. They believe that "The Legend of Zelda: Tears of the Kingdom" was pirated over one million times in a time period prior to its official launch on Switch consoles, while Yuzu's Patreon funding almost doubled within the same cycle. Nintendo stated (through filed documentation): "With Yuzu in hand, nothing stops a user from obtaining and playing unlawful copies of virtually any game made for the Nintendo Switch, all without paying a dime to Nintendo or to any of the hundreds of other game developers and publishers making and selling games for the Nintendo Switch...In effect, Yuzu turns general computing devices into tools for massive intellectual property infringement of Nintendo and others' copyrighted works." They argue that Yuzu is capable of circumventing the Switch console's many layers of encryption—Tropic Haze's software, in their opinion, is "primarily designed" to break Switch software protections.

SemiAnalysis Spotlights Sluggish US Chip Fab Construction

Dylan Patel, of SemiAnalysis, has highlighted worrying industry trends from an October 2021 published report—the Center for Security and Emerging Technology (CSET) document explored and "(outlined) infrastructure investments and regulatory reforms that could make the United States a more attractive place to build new chipmaking capacity and ensure continued U.S. access to key inputs for semiconductor manufacturing." Citing CSET/World Fab Forecast findings, Patel expressed his dissatisfaction with the apparent lack of progress in the region: "The United States is the slowest relevant country in the world to build a fab thanks to NIMBY assholes and the garbage regulatory/permitting system." The SemiAnalysis staffer likely believes that unsuitable conditions remain in place, and continue to hinder any forward momentum—for greenfield fabrications projects, at least.

The CSET 2021 report posited that the proposed $52 billion CHIPS Act fund would not solve all USA chip industry problems—throwing a large sum of money into the pot is not always a surefire solution: "The United States' ability to expeditiously construct fabs has declined at the same time as the total number of fab projects in the United States has declined. Some of this is due to changes in the global semiconductor value chain, which has concentrated resources in Asia as foundries have risen in prominence, and countries like Taiwan, South Korea, and China have established significant market share in the industry from 1990 to 2020. However, during this same 30-year period, the time required to build a new fab in the United States increased 38 percent, rising from an average of 665 days (1.8 years) during the 1990 to 2000 time period to 918 days (2.5 years) during the 2010-2020 time period (Figure 2). At the same time, the total number of new fab projects in the United States was halved, decreasing from 55 greenfield fab projects in the 1990-2000 time period to 22 greenfield fab projects between 2010 and 2020." Intel's work-in-progress Ohio fabrication site has suffered numerous setbacks (including delayed CHIPS Act payments)—the latest news articles suggest that an opening ceremony could occur in late 2026 or early 2027. Reportedly, TSMC's Arizona facility is a frequently runs into bureaucratic and logistical headaches—putting pressure on company leadership at their Hsinchu (Taiwan) headquarters.

NVIDIA Contributes $30 Million of Tech to NAIRR Pilot Program

In a major stride toward building a shared national research infrastructure, the U.S. National Science Foundation has launched the National Artificial Intelligence Research Resource pilot program with significant support from NVIDIA. The initiative aims to broaden access to the tools needed to power responsible AI discovery and innovation. It was announced Wednesday in partnership with 10 other federal agencies as well as private-sector, nonprofit and philanthropic organizations. "The breadth of partners that have come together for this pilot underscores the urgency of developing a National AI Research Resource for the future of AI in America," said NSF Director Sethuraman Panchanathan. "By investing in AI research through the NAIRR pilot, the United States unleashes discovery and impact and bolsters its global competitiveness."

NVIDIA's commitment of $30 million in technology contributions over two years is a key factor in enlarging the scale of the pilot, fueling the potential for broader achievements and accelerating the momentum toward full-scale implementation. "The NAIRR is a vision of a national research infrastructure that will provide access to computing, data, models and software to empower researchers and communities," said Katie Antypas, director of the Office of Advanced Cyberinfrastructure at the NSF. "Our primary goals for the NAIRR pilot are to support fundamental AI research and domain-specific research applying AI, reach broader communities, particularly those currently unable to participate in the AI innovation ecosystem, and refine the design for the future full NAIRR," Antypas added.

AI Power Consumption Surge Strains US Electricity Grid, Coal-Powered Plants Make a Comeback

The artificial intelligence boom is driving a sharp rise in electricity use across the United States, catching utilities and regulators off guard. In northern Virginia's "data center alley," demand is so high that the local utility temporarily halted new data center connections in 2022. Nation-wide, electricity consumption at data centers alone could triple by 2030 to 390 TeraWatt Hours. Add in new electric vehicle battery factories, chip plants, and other clean tech manufacturing spurred by federal incentives, and demand over the next five years is forecast to rise at 1.5%—the fastest rate since the 1990s. Unable to keep pace, some utilities are scrambling to revise projections and reconsider previous plans of closing fossil fuel plants even as the Biden administration pushes for more renewable energy. Some older coal power plans will stay online, until the grid adds more power production capacity. The result could be increased emissions in the near term and risks of rolling blackouts if infrastructure continues lagging behind demand.

The situation is especially dire in Virginia, the world's largest data center hub. The state's largest utility, Dominion Energy, was forced to pause new data center connections for three months last year due to surging demand in Loudoun County. Though connections have resumed, Dominion expects load growth to almost double over the next 15 years. With data centers, EV factories, and other power-hungry tech continuing rapid expansion, experts warn the US national electricity grid is poorly equipped to handle the spike. Substantial investments in new transmission lines and generation are urgently needed to avoid businesses being turned away or blackouts in some regions. Though many tech companies aim to power operations with clean energy, factories are increasingly open to any available power source.

Forza Motorsport Updated with Daytona International Speedway

Forza Motorsport Update 4 introduces the prestigious Daytona International Speedway—a truly iconic racetrack renowned for its marvels in engineering. Meanwhile, a new Italian Challengers Featured Tour invites you to build four staples of Italy's automotive heritage! Let's dive into the details. Update 4 will be available to download on Xbox Series X|S, Windows PCs and Steam beginning on Tuesday, January 16. New events across the Career, Featured Multiplayer and Rivals will start on Thursday, January 18.

Get ready for race weekend with Daytona, new Spotlight cars and the Italian Challengers Tour
On Tuesday we'll share details about the fixes contained in Update 4. This version is focused on new content and events, and contains only minor fixes for car and track content compared to our previous updates. Work on game fixes to address top community issues is ongoing—look out for additional improvements in Update 5 and beyond.

Huawei Still Ships 5 nm TSMC Chips in its Laptops, Despite US Sanctions

According to the latest teardown from TechInsights, China's biggest technology maker, Huawei, has been shipping laptops with technology supposedly sanctioned by the United States. As the teardown shows, TechInisights has discovered that Huawei's Kirin 9006C processor is manufactured on TSMC's 5 nm semiconductor technology. Originally, the United States have imposed sanctions on Huawei back in 2020, when the government cut off Huawei's access from TSMC's advanced facilities and forbade the use of the latest nodes by Huawei's HiSilicon chip design arm. Today's findings show signs of contradiction, as the Qingyun L540 notebook that launched in December 2023 employs a Kirin 9006C chipset manufactured on a TSMC 5 nm node.

TechInsight's findings indicate that Kirin 9006C assembly and packaging occurred around the third quarter of 2020, whereas the 2020 Huawei sanctions started in the second quarter. Of course, the implication of the sanctions likely prohibited any new orders and didn't prevent Huawei from possibly stockpiling millions of chip orders in its warehouse before they took place. The Chinese giant probably made orders beforehand and is using the technology only now, with the Qingyun L540 laptop being one of the first Kirin 9006C appearances. Some online retailers also point out that the laptop complies with the latest security practices required for the government, which means that they have been in the works since the chip began the early stages of design, way before 2020. We don't know the stockpile quantity, but SMIC's domestic efforts seem insufficient to supply the Chinese market alone. The news that Huawei is still using TSMC chips made SMIC's share go for a 2% free fall on the Hong Kong stock exchange.

United States Ease Stance on NVIDIA AI Chip Exports to China

The United States is softening restrictions on the significant GPU maker NVIDIA, selling artificial intelligence chips to China. While still limiting advanced chip exports deemed strategically threatening, Commerce Secretary Gina Raimondo clarified this week that NVIDIA could supply some AI processors to Chinese commercial companies. Previously, Raimondo had sharply criticized NVIDIA for attempting to sidestep regulations on selling powerful GPUs abroad. Her comments followed rumors that NVIDIA tweaked chip designs to avoid newly imposed export controls narrowly. However, after discussions between Raimondo and NVIDIA CEO Jensen Huang, the Commerce Department says NVIDIA and other US firms will be permitted to export AI chips to China for general commercial use cases. Exports are still banned on the very highest-end GPUs that could enable China to train advanced AI models rivaling American developments.

Raimondo said NVIDIA will collaborate with the US to comply with the export rules. Huang reaffirmed the company's commitment to adherence. The clarification may ease pressures on NVIDIA, as China accounts for up to 25% of its revenue. While optimistic about recent Chinese approvals for US joint ventures, Raimondo noted frustrations linger around technology controls integral to national security. The nuanced recalibration of restrictions illustrates the balances the administration must strike between economic and security interests. As one of the first big US technology exporters impacted by tightened restrictions, NVIDIA's ability to still partly supply the valuable Chinese chip market points to a selective enforcement approach from regulators in the future.

Lenovo Files Patent Infringement Action Against ASUS with the US ITC

Lenovo (United States) Inc., part of the global technology corporation, Lenovo Group, filed a patent infringement action on November 15th with the United States International Trade Commission (ITC) against ASUSTeK Computer Inc. and ASUS Computer International (ASUS) for infringement of a variety of Lenovo's patents related to software, hardware, and connectivity across multiple ASUS products. The action is in response to ASUS's August 2023 filings in the Regional Court of Munich related to cellular technologies, where Lenovo had offered a cross-licensing deal as a solution.

Lenovo is a strong proponent of cross-licensing agreements, open and transparent negotiations, and licensing within the industry on fair, reasonable, and non-discriminatory (FRAND) terms. This is evidenced by the Group's ongoing litigation with InterDigital, where it advocated for greater transparency and less discrimination in licensing negotiations and was proven by the UK Court to be a willing licensee. The action against ASUSTeK reflects the Group's commitment to protecting its significant contributions to technology innovation and industry "firsts" over the past 39 years, building a portfolio of over 28,000 patents with a further 14,000 applications pending.

TOP500 Update: Frontier Remains No.1 With Aurora Coming in at No. 2

The 62nd edition of the TOP500 reveals that the Frontier system retains its top spot and is still the only exascale machine on the list. However, five new or upgraded systems have shaken up the Top 10.

Housed at the Oak Ridge National Laboratory (ORNL) in Tennessee, USA, Frontier leads the pack with an HPL score of 1.194 EFlop/s - unchanged from the June 2023 list. Frontier utilizes AMD EPYC 64C 2GHz processors and is based on the latest HPE Cray EX235a architecture. The system has a total of 8,699,904 combined CPU and GPU cores. Additionally, Frontier has an impressive power efficiency rating of 52.59 GFlops/watt and relies on HPE's Slingshot 11 network for data transfer.

Kioxia and Western Digital Could Announce Merger This Month

According to Kyodo News, Japanese chip manufacturer Kioxia and its U.S. counterpart Western Digital are reportedly on the verge of finalizing a merger agreement, aiming to create the world's largest producer of memory chips. The merger plan involves establishing a holding company to consolidate their operations for producing NAND flash memory chips, with the announcement reportedly coming this month. The merged entity is expected to be listed on the Nasdaq stock exchange in the United States. As the global semiconductor market contends with competitive pressures and fluctuating demand, the merger is seen as a strategic move to enhance the combined market position of both companies.

Western Digital shareholders are anticipated to hold a majority stake in the new entity, with Kioxia's shareholders, including Toshiba Corporation, owning the remaining stake. The move is poised to give the newly formed company a combined market share of 35.4 percent in NAND memory chips as of March, surpassing South Korea's Samsung, the current leader, with 34.3 percent. However, the merger's ultimate approval hinges on regulators' decisions, including those in China, as semiconductors have become increasingly integral to global economic security. Major Japanese banks, including MUFG Bank and the state-backed Development Bank of Japan, are contemplating loans of up to approximately 1.9 trillion yen (about $12.7 billion) to facilitate the merger.

RAMP-C Program on Intel 18A Adds 2 Strategic Defense Industrial Base Customers

Intel Foundry Services is onboarding two new defense industrial base (DIB) customers, Boeing and Northrop Grumman, as part of phase two of the U.S. Department of Defense (DoD)'s Rapid Assured Microelectronics Prototypes - Commercial (RAMP-C) program. In phase two of the RAMP-C program, customers will use Intel 18A process technology and industry-standard electrical design and analysis tools and intellectual property (IP) to develop, tape-out and fabricate test chips in preparation for product design tape-outs.

"We are pleased to welcome Boeing and Northrop Grumman to the RAMP-C program. Boeing and Northrop Grumman will use their industry expertise to develop and support leading-edge semiconductor solutions using Intel 18A process technology for the success of vital DoD and national security systems. Together, we will continue to bolster the domestic semiconductor supply chain and ensure that the United States maintains leadership in process technology R&D, advanced manufacturing and microelectronics systems," said Kapil Wadhera, vice president of Intel Foundry Services and general manager of Foundry Solutions Business Group.

ThundeRobot Packs a 13th Gen Core Processor and RTX 4060 in 1.7 Liter Chassis

ThundeRobot, a major player in China's laptop market, is set to release a new PC console, the MIX, which shares striking similarities with Alienware's bygone Steam Machine. The console, equipped with Intel's 13th Gen Core CPU and Nvidia's RTX 4060 GPU, is set to debut on July 21st, predominantly targeting the Chinese market. Though not as familiar a brand outside Asia, ThundeRobot enjoys a significant market share in the region as the third-largest supplier of consumer notebooks and gaming peripherals. Its product catalog rivals brands like Asus and Razer, with offerings spanning custom-branded gaming notebooks to gaming monitors, keyboards, mice, and controllers.

The upcoming MIX console boasts a compact size, nearly 60% smaller than an Xbox Series S, at only 1.7 liters. Despite the uncertainty around whether the console's RTX 4060 GPU is a mobile or desktop variant, ThundeRobot brags that it would feature one or more of Intel's new 13th Gen Raptor Lake HX-series mobile CPUs. The console's matte black finish and triangular front-right indentation echo the design of Alienware's Steam Machine, suggesting that ThundeRobot may have drawn some inspiration from the Alienware console PC. Priced at around 6000 Yuan, approximately $830, the compact yet potent MIX console is expected to launch soon in China, with no current plans for release in the United States.

IBM Study Finds That CEOs are Embracing Generative AI

A new global study by the IBM Institute for Business Value found that nearly half of CEOs surveyed identify productivity as their highest business priority—up from sixth place in 2022. They recognize technology modernization is key to achieving their productivity goals, ranking it as second highest priority. Yet, CEOs can face key barriers as they race to modernize and adopt new technologies like generative AI.

The annual CEO study, CEO decision-making in the age of AI, Act with intention, found three-quarters of CEO respondents believe that competitive advantage will depend on who has the most advanced generative AI. However, executives are also weighing potential risks or barriers of the technology such as bias, ethics and security. More than half (57%) of CEOs surveyed are concerned about data security and 48% worry about bias or data accuracy.

U.S. Administration Outlines Plan to Strengthen Semiconductor Supply Chains

Today, the U.S. Department of Commerce shared the Biden-Harris Administration's strategic vision to strengthen the semiconductor supply chain through CHIPS for America investments. To advance this vision, the Department announced a funding opportunity and application process for large semiconductor supply chain projects and will release later in the fall a separate process for smaller projects. Large semiconductor supply chain projects include materials and manufacturing equipment facility projects with capital investments equal to or exceeding $300 million, and smaller projects are below that threshold.

The announcement leads into the Biden-Harris Administration's Investing in America tour, where Secretary Raimondo and leaders in the Administration will fan across more than 20 states to highlight investments, jobs, and economic opportunity driven by President Biden's Investing in America agenda and the historic legislation he's passed in his first two years in office, including the bipartisan CHIPS and Science Act.

U.S. Government to Allow Chipmakers to Expand Facilities in China

The United States government has imposed sanctions on companies exporting their goods to China with the aim of limiting the country's technological advancements. This forced many companies to reduce their shipments of the latest technologies; however, according to the latest information from The Wall Street Journal, the Biden administration will allow companies to keep expanding their production capacities in China. As the source notes, quoting statements from government officials, the top semiconductor makers such as Samsung, SK Hynix, and TSMC, all of which have a chip production facility in China, will be allowed to expand the production capacity without any US backlash.

Of course, this does not contradict the plan of a US export-control policy, which the administration plans to continue. Alan Estevez, undersecretary of commerce for industry and security, noted last week in the industry gathering that the US plans to continue these restrictions for another year. Reportedly, all manufacturers of wafer fab equipment (WFE) from the US must acquire an export license from the Department of Commerce before exporting any tools for making either logic of memory chip indented for customers in China. Chipmakers Samsung, SK Hynix, and TSMC all received their licenses to export from October 2022 to October 2023. However, the US government now allows these companies to continue upgrading their Chinese plans beyond the renewed license expiry date of October 2024.

Frontier Remains As Sole Exaflop Machine on TOP500 List

Increasing its HPL score from 1.02 Eflop/s in November 2022 to an impressive 1.194 Eflop/s on this list, Frontier was able to improve upon its score after a stagnation between June 2022 and November 2022. Considering exascale was only a goal to aspire to just a few years ago, a roughly 17% increase here is an enormous success. Additionally, Frontier earned a score of 9.95 Eflop/s on the HLP-MxP benchmark, which measures performance for mixed-precision calculation. This is also an increase over the 7.94 EFlop/s that the system achieved on the previous list and nearly 10 times more powerful than the machine's HPL score. Frontier is based on the HPE Cray EX235a architecture and utilizes AMD EPYC 64C 2 GHz processors. It also has 8,699,904 cores and an incredible energy efficiency rating of 52.59 Gflops/watt. It also relies on gigabit ethernet for data transfer.

Legislation Introduced to Restore America's Printed Circuit Board Industry after Two Decades of Decline

The bipartisan Protecting Circuit Boards and Substrates Act of 2023 introduced by Representatives Blake Moore (R-UT-1) and Anna Eshoo (D-CA-16) finishes the job the CHIPS Act began by incentivizing investment in the domestic printed circuit board (PCB) industry. This bill is a necessary follow-on to the CHIPS Act: without a trusted, reliable domestic source of PCBs and substrates, computer chips don't connect to end use electronic devices.

Domestic PCB production shrunk over the past 20 years, falling from 30% to barely 4% of the world's supply. Ninety percent of the world's supply now comes from Asia…56% in China alone.
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