Yuri "1usmus" Bubliy, author of DRAM Calculator for Ryzen and the upcoming ClockTuner for Ryzen, revealed three pieces of juicy details on the upcoming 4th Gen AMD Ryzen "Vermeer" performance desktop processors. He predicts AMD turning up CPU core counts with this generation, including the introduction of new 10-core SKUs, possibly to one-up Intel in the multi-threaded performance front. Last we heard, AMD's upcoming "Zen 3" CCDs (chiplets) feature 8 CPU cores sharing a monolithic 32 MB slab of L3 cache. This should, in theory, allow AMD to create 10-core chips with two CCDs, each with 5 cores enabled.

Next up, are two features that should interest overclockers - which is Bubliy's main domain. The processors should support a feature called "Curve Optimizer," enabling finer-grained control over the boost algorithm, and on a per-core basis. As we understand, the "curve" in question could even be voltage/frequency. It remains to be seen of the feature is leveraged at a CBS level (UEFI setup program), or by Ryzen Master. Lastly, there's mention of new Infinity Fabric dividers that apparently helps you raise DCT (memory controller) frequencies "slightly higher" in mixed mode. AMD is expected to debut its 4th Gen Ryzen "Vermeer" desktop processors within 2020.

According to a report courtesy of Hardwareluxx, where contributor Andreas Schilling reportedly gained access to OEM documentation, AMD's upcoming EPYC Milan CPUs are bound to offer up to 20% performance improvements over the previous EPYC generation. The report claims a 15% IPC performance, paired with an extra 5% added via operating frequency optimization. The report claims that AMD's 64-core designs will feature a lower-clock all-core operating mode, and a 32-core alternate for less threaded workloads where extra frequency is added to the working cores.

Apparently, AMD's approach for the Zen 3 architecture does away with L3 subdivisions according to CCXs; now, a full 32 MB of L3 cache is available for each 8-core Core Compute Die (CCD). AMD has apparently achieved new levels of frequency optimization under Zen 3, with higher upward frequency limits than before. This will see the most benefits in lower core-count designs, as the amount of heat being generated is necessarily lesser compared to more core-dense designs. Milan keeps the same 7 nm manufacturing tech, DDR4, PCIe 4.0, and 120-225 W TDP as the previous-gen Rome. It remains to be seen how these changes actually translate to the consumer versions of Zen 3, Vermeer, later this year.

ASUS today announced the new A520 chipset motherboards for its TUF Gaming, Prime and Pro series. The AMD A520 chipset is the successor to the A320 chipset, and features PCIe 3.0. Designed to cater to a wide range of needs, these motherboards feature a 32 MB BIOS flash ROM, and support future AMD Ryzen Zen 3 architecture CPUs and APUs.

ASUS A520 motherboards can be paired with an AMD APU to create a budget-friendly gaming rig or workstation, making them ideal for DIY PC users and small to medium-sized businesses. ASUS is also pleased to announce that its R&D team broke the existing world memory frequency record, setting DDR4- 6666 on ROG Strix B550-I Gaming, using the AMD Ryzen 4700GE processor and Crucial Ballistix MAX memory.

A May 2020 report put together with info from multiple sources pointed towards AMD's client-segment product roadmap going as far into the future as 2022. The roadmap was partial, with a few missing bits. VideoCardz attempted to reconstruct the roadmap based on new information from one of the primary sources of the May leak, @MeibuW. According to the roadmap, 2020 will see AMD debut its 4th Gen Ryzen "Vermeer" desktop processors featuring "Zen 3" CPU cores, built on TSMC N7e or N7P silicon fabrication process, and offering PCIe Gen 4. The "Renoir" APU silicon combining up to 8 "Zen 2" CPU cores with a 512-SP "Vega" iGPU debuted on the mobile platform, and recently launched on the desktop platform as an OEM-exclusive. It remains to be seen if AMD launches this in the DIY retail channel.

2021 is when three new codenames from AMD get some air-time. "Warhol" is codename for the 5th Gen Ryzen part that succeeds "Vermeer." Interestingly, it too is shown as a combination of "Zen 3" CPU cores, PCIe Gen 4, and 7 nm. Perhaps AMD could innovate in areas such as DRAM (switch to PC DDR5), and maybe increase core counts. DDR5 could herald a new socket, after 4 years of AM4. The second silicon bound for 2021 is "Van Gogh," an APU that combines "Zen 2" CPU cores with an RDNA2 iGPU. Interestingly, "Cezanne," bound for the same year, has the opposite CPU+iGPU combination - a newer gen "Zen 3" CPU component, and an older gen "Vega" iGPU. The two chips could target different markets, looking at their I/O, with "Van Gogh" supporting LPDDR5 memory.

The leading global motherboard manufacturer, ASRock, proudly introduce the new motherboard lineup for AMD A520 chipset, a new value solution to join the AMD 500 series family. The newly launched ASRock AMD A520 motherboards brought the support of latest AMD 3rd Gen Ryzen Desktop Processors along with stunning performance to the masses.

"At AMD, our goal is to provide every PC user with the most powerful, flexible and reliable user experience across all verticals," said Chris Kilburn, corporate vice president and general manager, client component business unit, AMD. "We are pleased to introduce the AMD A520 chipset, offering a robust platform for the award-winning 3rd Gen Ryzen Desktop Processors alongside a promise for future support of the upcoming "Zen 3" architecture. With creative designs in a range of form factors from Mini-ITX to full size Micro-ATX coupled with an abundance of connectivity options from our partners at ASRock, the A520 chipset will offer a streamlined and trusted platform to satisfy even the most demanding home and office PC users."

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions, today announced the launch of AMD A520 chipset motherboards primed to unleash the potential of 3rd Gen AMD Ryzen Desktop Processors and planned support for the next-gen Ryzen Desktop Processors. The GIGABYTE A520 motherboards are designed to deliver abundant functions to fulfill all kinds of needs for families and offices. From digital power design which provides the processors and chipset a stable power supplement, to GIGABYTE Ultra Durable technology, GIGABYTE A520 series motherboards deliver users the most delightful PC experience.

GIGABYTE A520 motherboards comprise AORUS and UD series, which provides various size options of ATX, Micro ATX, and the user-favorite mini ITX size in recent years. Enhanced by pure digital PWM components, GIGABYTE A520 motherboards deliver the promise of a stable power supply. The mini motherboard A520I AC which is specially designed for small systems equips Direct 6 Phases Digital VRM Solution with 55A DrMOS, allowing for ultimate performance with a stable and sufficient power supply when overclocking on 3rd Gen AMD Ryzen Desktop Processors.

AMD's 5th Generation Ryzen "Cezanne" APU sprung up on SiSoft SANDRA database, with big hints as to the areas where the company could innovate next. Apparently, "Cezanne" is a very similar silicon to "Renoir." It appears to feature the same iGPU solution, based on the "Vega" architecture. We're now learning that the iGPU even has the same core configuration, with up to 512 stream processors, and a likely bump in iGPU engine clocks over the Ryzen 4000 "Renoir" chips.

Much of the innovation is with the CPU component. Although the CPU core count is not yet known, the company is deploying its "Zen 3" microarchitecture, which sees all cores on the silicon sharing a large common slab of L3 cache. The "Vega" based iGPU should still perform better than the solution on "Renoir," as it's assisted by higher engine clocks, and possibly a higher IPC CPU component. In the SANDRA screenshot, the iGPU was shown bearing 1.85 GHz engine clocks, which amounts to a 100 MHz speed-bump compared to the engine clocks of the Ryzen 4000H and 4000U.

AMD is preparing to launch its next-generation Ryzen 4000 series of desktop processors based on Zen 3 architecture, codenamed Vermeer. Thanks to the sources over at Igor's Lab, we have some new information about the clock speeds of a rumored Ryzen 9 4950X Vermeer model. Featuring 16 cores and 32 threads, the Ryzen 9 4950X is reportedly going to feature boost frequency of at least 4.8 GHz. Given that this is only an engineering sample, the final frequencies could be higher. In the report, the base frequency of the CPU is said to be 3.5 GHz. This is a very good frequency for a CPU that has that many cores. All of this information is coming from decoding the OPN code which states "100-000000059-52_ 48/35 _ Y". The 48 number indicates the boost, and 35 the base frequency. In the previous reports, we got OPN codes "100-000000059-14_46/37_Y" and "100-000000059-15_46/37_N" which suggested 4.6 GHz boost and base of 3.5 GHz, indicating that this is a new stepping.

AMD late Tuesday released its Q2-2020 financial results, which saw the company rake in revenue of $1.93 billion for the quarter, and clock a 26 percent YoY revenue growth. In both its corporate presentation targeted at the financial analysts, and its post-results conference call, AMD revealed a handful interesting bits looking into the near future. Much of the focus of AMD's presentation was in reassuring investors that [unlike Intel] it is promising a stable and predictable roadmap, that nothing has changed on its roadmap, and that it intends to execute everything on time. "Over the past couple of quarters what we've seen is that they see our performance/capability. You can count on us for a consistent roadmap. Milan point important for us, will ensure it ships later this year. Already started engaging people on Zen4/5nm. We feel customers are very open. We feel well positioned," said president and CEO Dr Lisa Su.

For starters, there was yet another confirmation from the CEO that the company will launch the "Zen 3" CPU microarchitecture across both the consumer and data-center segments before year-end, which means both Ryzen and EPYC "Milan" products based on "Zen 3." Also confirmed was the introduction of the RDNA2 graphics architecture across consumer graphics segments, and the debut of the CDNA scalar compute architecture. The company started shipping semi-custom SoCs to both Microsoft and Sony, so they could manufacture their next-generation Xbox Series X and PlayStation 5 game consoles in volumes for the Holiday shopping season. Semi-custom shipments could contribute big to the company's Q3-2020 earnings. CDNA won't play a big role in 2020 for AMD, but there will be more opportunities for the datacenter GPU lineup in 2021, according to the company. CDNA2 debuts next year.

AMD Executive VP for Computing and Graphics, Rick Bergman, in a company blog post, confirmed that the first client-segment processors based on the next-gen "Zen 3" microarchitecture will launch within 2020. "So, what's next for AMD in the PC space? Well, I cannot share too much, but I can say our high-performance journey continues with our first "Zen 3" Client processor on-track to launch later this year. I will wrap by saying you haven't seen the best of us yet," Bergman writes, in a blog post detailing AMD's renewed efforts to capture the consumer and commercial desktop segments with the new Ryzen 4000G and Ryzen PRO 4000G processor series launched this Tuesday.

A lot seems to be riding on the success of the Ryzen 4000G and Ryzen PRO 4000G segments, so much so, that the new processors are launched exclusively to the high-volume OEM channel, and will be available only through pre-builts from the likes of Lenovo, HP, and Dell. AMD in a recent press meet revealed that it finds the OEM segment about 5 times the size of the retail DIY segment, and the 4000G-series chips, with their integrated graphics and CPU core-counts of up to 8, are more relevant for pre-builts, at least initially. The company does intent to bring these chips to the DIY retail channel, although it didn't give out any tentative dates. Having launched the Ryzen 4000H and 4000U series mobile processors through 1H-2020, and now 4000G series desktop chips, the company hopes to make a dent with upcoming retail crests such as "Back to School," Black Friday/Cyber Monday, and Holiday. AMD had earlier disclosed in its Ryzen 3000XT press meet that "Zen 3" is coming this year, and earlier this month in a tweet by CEO Dr Lisa Su.

Intel just sent out press invites to what is likely an online media event slated for September 2, 2020. The spells nothing other than a one-liner "We have something big to share..." with the September 2 date. Everyone has a theory as to what this could be, depending on who you ask. The Verge has a valid theory pointing to this being a formal launch of the 11th Gen Core "Tiger Lake" mobile processors on the basis of several notebook manufacturers slating their "Tiger Lake" based notebook launches on "Fall 2020."

We believe this could be a desktop-related unveil, possibly a performance preview or teaser of the company's 11th Gen "Rocket Lake-S" processor. Why September? Because September 2020 is going to be a busy month for AMD and NVIDIA, with both launching their next-gen consumer graphics architectures, product lines; and more interestingly, AMD rumored to launch its "Zen 3" microarchitecture in some shape or form. A Ryzen 4000 "Vermeer" product launch could trigger Intel to at least preview "Rocket Lake-S," as it's the first client-desktop microarchitecture in 5 years to introduce IPC gains on the backs of new "Cypress Cove" CPU cores that are a 14 nm back-port of "Willow Cove." It wouldn't surprise us if Intel shed more light on the performance throughput of its big new Xe graphics processors.

ASUS today announced that the new BIOS with AMD AGESA 1.0.0.2 update for X570 and B550 series motherboards are now available for download. While the existing BIOS support Ryzen 3000XT processors, the new BIOS optimize the performance of the latest AMD Ryzen 3000XT series processors (Ryzen 9 3900XT, Ryzen 7 3800XT, and Ryzen 5 3600XT). The UEFI BIOS updates are available from the respective motherboard support pages, and can be accessed via the ASUS Support website.

In a video message posted on her Twitter timeline, AMD CEO Dr Lisa Su confirmed that the company's next-generation "Zen 3" microarchitecture is coming out "later this year." Speaking in context of 7/7 (a year since AMD debuted high-performance CPU- and GPU- architectures on the same day, leveraging 7 nm), and the Ryzen 3000XT series processor announcement, Dr Su stated "As you know with Ryzen, we're always on a journey, a journey to push the highest performance that we can for our users and our fans. So Zen 3 is exactly that. Zen 3 is looking great in the labs, we're on track to launch later this year, and I can't wait to tell you more about it." Watch the video in the source link below.

The earliest reports on AMD's next-generation "Cezanne" APU silicon pointed at the possibility of the chip combining "Zen 3" CPU cores with a next-generation iGPU solution based on RDNA2 ("Navi 2#"). AMD plans to launch "Cezanne" in 2021, which makes it the immediate successor to "Renoir." A report by Igor's Lab has fresh details on "Cezanne." Apparently the chip sticks with the "Vega" graphics architecture on its iGPU. This doesn't necessarily mean that it's the same exact iGPU as the 8 CU version on "Renoir."

On the other hand, the "Van Gogh" silicon slated for 2021 is expected to receive RDNA2 graphics. It's important to note here that "Van Gogh" and "Cezanne" sit in the same product stack, and "Van Gogh" does not succeed "Cezanne." Rather, it's the codename for an entry-level APU, succeeding "Dali" (Athlon 3000G), which also means the RDNA2-based iGPU will be a lot slimmer than the "Vega" based one on "Cezanne." It's only by 2022 that AMD will have a performance-segment APU with RDNA2-based iGPU, with "Rembrandt." Find our older article getting into AMD's roadmaps here.

AMD in an official briefing call with us confirmed that the company's "Zen 3" client processors are on-track for launch within 2020. This refutes rumors that "Zen 3" based Ryzen processors had been delayed to 2021 in favor of giving the upcoming Ryzen 3000XT reign over the rest of the year. The call was chaired by AMD's client-segment product managers who were speaking purely in context of their product segment, which is how we deduce that they were referring to "Vermeer" and not [just] "Milan." They were responding to speculation that "Zen 3" has been delayed to 2021, forcing AMD to refresh its existing IP.

In the call, AMD told us that the information about "Zen 3" launching in 2020 is not under embargo, and so here we are. An AMD spokesperson told us that "the rumor on Zen 3 delay is inaccurate." AMD recently also refuted rumors of "Zen 3" being based on 5 nm, by putting out microarchitecture roadmap slides on the occasion of a recent investor relations event, which reaffirmed "Zen 3" as a 7 nm-class microarchitecture.

AMD has a lot riding on RDNA2, its first graphics architecture that meets the DirectX 12 Ultimate logo requirements, introducing real-time ray-tracing to the lineup. RDNA2 is confirmed to be part of the SoC that powers next-gen consoles PlayStation 5 and Xbox Series X. The company is simultaneously readying its own Radeon RX discrete graphics cards based on the Navi 2# silicon, based on RDNA2, with a leading part unofficially called the "Big Navi" given its alleged lofty specs increase over the "Navi 10." Turns out, that this GPU, and not next-gen consoles, will debut RDNA2.

AMD is planning a big gamer-specific event in late-Q3/early-Q4, likely September, where it plans to announce its 4th generation Ryzen desktop processors based on the "Zen 3" microarchitecture, and Radeon RX graphics cards based on RDNA2, including the "Big Navi." Speaking at the Bank of America Securities Global Technology Conference, AMD CFO Devinder Kumar confirmed that "Big Navi" will be a halo product and not merely a lofty performance increase over the RX 5700 XT to make AMD competitive against GeForce "Ampere." He states "there's a lot of excitement for Navi 2, or what our fans have dubbed as the Big Navi," adding "Big Navi is a halo product." He goes on to state that "enthusiasts love to buy the best, and we are certainly working on giving them the best." AMD's product stack so far is application-specific, rather than competition-specific. The RX 5700 XT was designed for 1440p gaming, and ended up competitive to the RTX 2070. "Big Navi" could hence have a lofty design goal: 4K gaming with ray-tracing.

Earlier this week, we brought you a report about codenames of AMD processors that won't launch before 2022. It referenced "Raphael" being distant 5 nm "Zen 4" based successor to today's "Matisse." At the time, the codename for the 2021 release of AMD's mainstream desktop processor wasn't known. We're now getting a pointer as to what it is - "Warhol."

Named after American artist and filmmaker Andy Warhol, this processor combines CPU chiplets based on the "Zen 3" with a cIOD that retains PCI-Express gen 4.0, just like "Vermeer," but still qualifies as a new generation (and not a refresh). What's more, "Warhol" apparently sticks to a 7 nm-class silicon fabrication process. This means that "Warhol" could see AMD innovate on other fronts, such as leveraging an even more advanced version of TSMC's 7 nm node (such as N7+), to increase core counts over the chiplet that makes it to "Vermeer, "Genesis Peak," and "Milan."

MSI confirmed that AMD's "Zen 3" processor support will be added to the company's AMD 400-series chipset motherboards, including the non-MAX SKUs that only have 16 MB EEPROM chips. Marketing Director Eric van Beurden in an MSI Insider video presentation confirmed that with the non-MAX motherboards, "Zen 3" support will be added as AMD planned to go about doing so (i.e. add "Zen 3" support by cutting out support for older processors and slimming down the UEFI setup program down to the GSE Click BIOS program, which may not correspond with your motherboard's original feature-set). On the other hand, the MAX SKUs, with their 32 MB EEPROMs will receive "Zen 3" support painlessly, meaning that the board may retain support for some, if not all, older processor generations, and retain their original feature-rich UEFI setup programs.

Apparently, AMD will be taking a slightly confusing step with its new AGESA codes - at least for the B550 platform. A report via Hardwareluxx has AMD rebooting AGESA (the most basic firmware for your motherboard and chipset support that's a requirement for correct CPU and feature support) versions back to version 1.0.0.0, but with a catch. The new AGESA version that's supposed to allow for support for AMD's Zen 3 CPUs will be coded as ComboAM4 v2 1.0.0.0 - instead of the next version in the current AGESA nomenclature, 1.0.0.6. It is still unclear if this change only refers to AMD's B550 or if it will also move on to X570's next AGESA releases.

It's expected that new motherboards based on AMD's B550 chipset will start landing in June. For now, there's confirmation on at least two motherboards running with this V2 of AGESA: MSI's MAG B550 Tomahawk (ComboAM4 v2 1.0.0.0), and the Gigabyte B550 Aorus Master (ComboAM4v2 1.0.0.1). So if you're looking to use AMD's B550 motherboard (or even X570) with AMD's upcoming Zen 3 CPUs, make sure to read your motherboard manufacturers' release notes for each AGESA version, so that you install the correct one and avoid yourself a potential load of pain with a non-functioning AGESA for your shiny new Zen 3 CPU.

Several future AMD processor codenames across various computing segments surfaced courtesy of an Expreview leak that's largely aligned with information from Komachi Ensaka. It does not account for "Matisse Refresh" that's allegedly coming out in June-July as three gaming-focused Ryzen socket AM4 desktop processors; but roadmap from 2H-2020 going up to 2022 sees many codenames surface. To begin with, the second half of 2020 promises to be as action packed as last year's 7/7 mega launch. Over in the graphics business, the company is expected to debut its DirectX 12 Ultimate-compliant RDNA2 client graphics, and its first CDNA architecture-based compute accelerators. Much of the processor launch cycle is based around the new "Zen 3" microarchitecture.

The server platform debuting in the second half of 2020 is codenamed "Genesis SP3." This will be the final processor architecture for the SP3-class enterprise sockets, as it has DDR4 and PCI-Express gen 4.0 I/O. The EPYC server processor is codenamed "Milan," and combines "Zen 3" chiplets along with an sIOD. EPYC Embedded (FP6 package) processors are codenamed "Grey Hawk."

Rumors of AMD refreshing its 3rd generation Ryzen desktop processor family are growing louder. On Friday (22/05), reports of the "Matisse Refresh" processor family surfaced, with talk of "Ryzen 7 3850X" and "Ryzen 7 3750X" processors headed for a June 2020 announcement followed by July availability. Turns out AMD has a different naming scheme in mind, targeted at wooing gamers. The company is reportedly bringing its "XT" brand extension over from its Radeon graphics card family over to the Ryzen line.

There are three SKUs AMD is developing, the Ryzen 9 3900XT, the Ryzen 7 3800XT, and the Ryzen 5 3600 XT. All three are likely to retain core counts of the SKUs they are displacing from current price points - with the 3900XT likely being a 12-core/24-thread part; the 3800XT an 8-core/16-thread part, and the 3600XT a 6-core/12-thread part. AMD is likely to give the three a major clock speed increase to shore up gaming performance. It won't surprise us if AMD tinkers with boost algorithms, either. GIGABYTE has already referenced "Matisse Refresh" in its motherboard product roadmaps, which adds plenty of credibilty to this rumor. With "Zen 3" based 4th gen Ryzen processors unlikely to relieve the embattled 3900X, 3800X, and 3600X in the wake of Intel's 10th gen Core "Comet Lake" launch until Q4-2020, it makes sense for AMD to plan a product stack refresh to bolster its competitiveness. AMD is reportedly planning a June 16 product announcement, followed by July 7 availability.

The bulk of AMD's 4th generation Ryzen desktop processors will comprise of "Vermeer," a high core-count socket AM4 processor and successor to the current-generation "Matisse." These chips combine up to two "Zen 3" CCDs with a cIOD (client I/O controller die). While the maximum core count of each chiplet isn't known, they will implement the "Zen 3" microarchitecture, which reportedly does away with CCX to get all cores on the CCD to share a single large L3 cache, this is expected to bring about improved inter-core latencies. AMD's generational IPC uplifting efforts could also include improving bandwidth between the various on-die components (something we saw signs of in the "Zen 2" based "Renoir"). The company is also expected to leverage a newer 7 nm-class silicon fabrication node at TSMC (either N7P or N7+), to increase clock speeds - or so we thought.

An Igor's Lab report points to the possibility of AMD gunning for efficiency, by letting the IPC gains handle the bulk of Vermeer's competitiveness against Intel's offerings, not clock-speeds. The report decodes OPNs (ordering part numbers) of two upcoming Vermeer parts, one 8-core and the other 16-core. While the 8-core part has some generational clock speed increases (by around 200 MHz on the base clock), the 16-core part has lower max boost clock speeds than the 3950X. Then again, the OPNs reference A0 revision, which could mean that these are engineering samples that will help AMD's ecosystem partners to build their products around these processors (think motherboard- or memory vendors), and that the retail product could come with higher clock speeds after all. We'll find out in September, when AMD is expected to debut its 4th generation Ryzen desktop processor family, around the same time NVIDIA launches GeForce "Ampere."

In their briefing leading up to today's Ryzen 3 3100 and 3300X review embargo, AMD disclosed that its upcoming "Zen 3" 4th generation Ryzen desktop processors will only support AMD 500-series (or later) chipsets. The next-gen processors will not work with older 400-series or 300-series chipsets. This comes as a blow to those who bought premium X470 motherboards hoping for latest CPU compatibility running into 2020. At this time only B550 is available, but we expect more news on enthusiast chipsets as the Zen 3 launch date comes closer. AMD B550 is a fascinating new mid-range chipset by AMD. Launching today as a successor to the popular B450 chipset, B550 is a low-power silicon with roughly the same 5-7 W TDP as the older 400-series chipset. Although AMD won't confirm it, it's likely that the chipset is sourced from ASMedia. It brings a lot to the table that could draw buyers away from B450, but it also takes some away.

The AMD B550 currently only supports 3rd generation Ryzen "Matisse" processors. Ryzen 3000 "Picasso" APU are not supported. What's more, older Ryzen 2000 "Pinnacle Ridge," "Raven Ridge," and first gen Ryzen 1000 "Summit Ridge" aren't supported, either. The Athlon 200 and 3000 "Zen" based chips miss out, too. AMD argues that it ran into ROM size limitations when trying to cram AGESA microcode for all the older processors. We find that hard to believe because B450 motherboards with the latest ComboAM4 AGESA support 2nd gen and 3rd gen processors, including APUs and Athlon SKUs based on the two. On the bright side, AMD assured us (within its marketing slides for the B550), that the chipset will support upcoming processors based on the "Zen 3" microarchitecture. The company also came up with a new motherboard packaging label that clarifies that the processors won't work with the 3400G and 3200G.

AMD in its post Q1-2020 earnings release disclosures stated that the company is "on track" to launching its next-generation "Zen 3" CPU microarchitecture and RDNA2 graphics architecture in late-2020. The company did not reveal in what shape or form the two will debut. AMD is readying "Zen 3" based EPYC "Milan" enterprise processors, "Vermeer" Ryzen desktop processors, and "Cezanne" Ryzen mobile APUs based on "Zen 3," although there's no word on which product line the microarchitecture will debut with. "Zen 3" compute dies (CCDs) are expected to do away with the quad-core compute complex (CCX) arrangement of cores, and are expected to be built on a refined 7 nm-class silicon fabrication process, either TSMC N7P or N7+.

The only confirmed RDNA2 based products we have as of now are the semi-custom SoCs that drive the Sony PlayStation 5 and Microsoft Xbox Series X next-generation consoles, which are expected to debut by late-2020. The AMD tweet, however, specifies "GPUs" (possibly referring to discrete GPUs). Also, with AMD forking its graphics IP to RDNA (for graphics processors) and CDNA (for headless compute accelerators), we're fairly sure AMD is referring to a Radeon RX or Radeon Pro launch in the tweet. Microsoft's announcement of the DirectX 12 Ultimate logo is expected to expedite launch of Radeon RX discrete GPUs based on RDNA2, as the current RDNA architecture doesn't meet the logo requirements.

AMD's 7 nm "Renoir" silicon breathed life into the notebook processor market, by bringing 8-core/16-thread CPU performance into segments Intel reserved for 4-core/8-thread; and beat Intel in the iGPU performance front. 7 nm brought performance-Watt uplifts that spell serious competition for Intel across all notebook form factors, be it 15 W or 45 W. According to _rogame, who has a knack of getting far-out hardware rumors right, AMD has its successor on the drawing-board, and it's codenamed "Cézanne," after the French post-impressionist painter Paul Cézanne.

"Cézanne" could prove vital for AMD's foothold in the premium mobile computing segments as Intel is preparing to launch its 10 nm+ "Tiger Lake" processor soon, with advanced "Willow Cove" CPU cores, and Xe based integrated graphics. AMD plans to tap into its very latest IP. Although its core-count is not known, "Cézanne" will feature CPU cores based on the latest "Zen 3" microarchitecture. The iGPU will receive its biggest performance uplift in 3 generations, with an iGPU based on the cutting-edge RDNA2 graphics architecture that meets DirectX 12 Ultimate logo requirements.