AMD today announced its Ryzen 7000X3D "Zen 4" desktop processors with 3D Vertical Cache technology. With these, the company is claiming to have the world's fastest processors for gaming. The company claims to have beaten the Intel Core i9-13900K "Raptor Lake" in gaming, by a margin it feels comfortable to remain competitive with against even the upcoming Core i9-13900KS. At the heart of these processors is the new "Zen 4" 3D Vertical Cache (3DV cache) CCD, which features 64 MB of L3 cache stacked on top of the region of the "Zen 4" CCD that has the on-die 32 MB L3 cache. The 3DV cache runs at the same speed as the on-die L3 cache, and is contiguous with it. The CPU cores see 96 MB of transparent addressable L3 cache.

3DV cache is proven to have a profound impact on gaming performance with the Ryzen 7 5800X3D "Zen 3" processor that helped it beat "Alder Lake" in gaming workloads despite "Zen 3" being a generationally older microarchitecture; and AMD claims to have repeated this magic with the 7000X3D "Zen 4" series, enabling it to beat Intel "Raptor Lake." Unlike with the 5800X3D, AMD don't intend to make gaming performance a trade-off for multi-threaded creator performance, and so it is introducing even 12-core and 16-core SKUs, so you get gaming performance alongside plenty of muscle for creator workloads.

AMD today solved the biggest challenge affecting its mobile processor family against Intel—CPU core-counts in the high-end HX-segment, with the introduction of the new Ryzen 7045HX series "Dragon Range" mobile processors. Based on the "Zen 4" microarchitecture, these processors offer core-counts of up to 16-core/32-thread, and target enthusiast gaming notebooks and mobile workstations. The processors debut the new "Dragon Range" multi-chip module (MCM). This is essentially a non-socketed version of the desktop "Raphael" MCM built in a mobile-friendly BGA package with a thin substrate and no IHS, with up to two 5 nm "Zen 4" 8-core CCDs, and a 6 nm cIOD (client I/O die).

The "Dragon Range" MCM uses the same chiplets as desktop "Raphael" Ryzen 7000 processors, and so its I/O is similar. The cIOD puts out a dual-channel (4 sub-channel) DDR5 memory interface, and a PCI-Express 5.0 x16 interface for discrete graphics, along with two PCI-Express 5.0 x4 links for up to two Gen 5 NVMe SSDs. The platform core-logic (chipset) is functionally similar to the desktop AMD B650E. All processor models in the series come with a TDP of 45 W, and a package power tracking (PPT) of "at least" 75 W. Each "Zen 4" CPU core comes with 1 MB of dedicated L2 cache, and each CCD has 32 MB of L3 cache.

We are coming to you live from the 2023 International CES! AMD CEO Dr Lisa Su is kicking things off with her Keynote address, where her company is expected to announce its next generation Ryzen 7000 series "Zen 4" mobile processors, a much broader range of Ryzen 7000 desktop processors, including the fabled X3D processors; and much more!02:29 UTC: The show is about to begin with AMD CEO Dr Lisa Su taking centerstage, as CEA inaugurates its 2023 show.02:38 UTC: "Intelligence needs computing power"

A few months ago, AMD has launched its highly anticipated Ryzen 7000 series of processors based on Zen 4 architecture. However, the company only launched the "X" SKUs (example being 7900X) for now, while the remaining ones are awaiting a launch date. Today, we have information from VideoCardz that confirm AMD's new launch on January 10th, when team red plans to update its remaining processor family with Ryzen 7000 series non-X SKUs. There will be three initial models to choose from Ryzen 9 7900 (12C/24T), Ryzen 7 7700 (8C/16T), and Ryzen 5 7600 (6C/12T). These SKUs follow the traditional Zen 4 path; however, the only distinction from their "X" counterparts is the reduced TDP to 65 Watts, down from up to 170 Watt TDP in some of those models.

A leaked slide from AMD's product presentation regarding these SKUs is a comparison between AMD's own Ryzen 9 5900X and Ryzen 9 7900, where the Zen 4 variant successfully beat the older SKU by a significant percentage. Pricing and further details are listed on the slides below.

AMD won't release its Ryzen Threadripper 7000WX "Storm Peak" workstation processors any time before September 2023, suggests a reliable source with AMD leaks. The push to Q3 probably has to do with giving AMD enough "Zen 4" CCD volumes to ship high-margin EPYC "Genoa" server processors first, before the company can turn its attention to the HEDT and workstation markets.

While all indications are that AMD give the "Zen 4" Threadripper a similar treatment this generation as it did with the "Zen 3," by confining it to the workstation segment with only Threadripper 7000WX SKUs that could be OEM-exclusives before crawling their way to the retail market; the source has an interesting theory, that the company could even target the client HEDT market with these chips. The company will also adequately segment the Threadripper 7000WX SKUs apart from EPYC "Genoa" processors.

FinalWire Ltd. today announced the immediate availability of AIDA64 Extreme 6.85 software, a streamlined diagnostic and benchmarking tool for home users; the immediate availability of AIDA64 Engineer 6.85 software, a professional diagnostic and benchmarking solution for corporate IT technicians and engineers; the immediate availability of AIDA64 Business 6.85 software, an essential network management solution for small and medium scale enterprises; and the immediate availability of AIDA64 Network Audit 6.85 software, a dedicated network audit toolset to collect and manage corporate network inventories.

The new AIDA64 update introduces AVX-512 optimized stress testing for AMD Ryzen 7000 Series processors, and supports the latest AMD and Intel CPU platforms as well as the new graphics and GPGPU computing technologies by both AMD and NVIDIA.

DOWNLOAD: FinalWire AIDA64 Extreme v6.85

AMD is planning to give its Ryzen 7000 "Zen 4" Socket AM5 desktop processor lineup a significant expansion in January, as rival Intel plans to do the same with its 13th Gen Core "Raptor Lake." AMD's lineup expansion will be in both directions—toward the higher end with its 7000X3D series; and toward the lower end, with its 7000 non-X series. It is now becoming clear that the 7000 non-X series will see a retail-channel launch, and won't be relegated to the OEM/SI channel. This would mean boxed versions of these processors, probably including a stock cooling solution.

The Ryzen 7000 non-X series in the retail channel is expected to include the 6-core/12-thread Ryzen 5 7600, the 8-core/16-thread Ryzen 7 7700, and the 12-core/24-thread Ryzen 9 7900. The defining feature of these SKUs is their significantly lower TDP of just 65 W, which would put their PPT (package power tracking) value around 90 W. Their maximum boost frequencies are still north of the 5 GHz-mark, with the 7600 boosting up to 5.10 GHz, the 7700 going up to 5.30 GHz and the 7900 up to 5.40 GHz, however their base frequencies are significantly lower, with the 7600 around 3.80 GHz, the 7700 and 7900 between 3.60-3.80 GHz. The three are expected to feature aggressive power-management to meet their lower power limits, which should also lower their cooling requirements. Wccftech predicts that AMD could announce these processors in its January 4 International CES Keynote address, followed by availability on January 10. In related news, the 7000X3D could see an announcement in the same January 4 keynote, but with a slightly later product availability date.

AMD is firing full cylinders to release a new line of Ryzen 7000-series "Zen 4" Socket AM5 desktop processors featuring 3D Vertical Cache, at the earliest. Faced with a significant drop in demand due to the slump in the PC industry, and renewed competition from Intel in the form of its 13th Gen Core "Raptor Lake" processors, the company is looking to launch the Ryzen 7000X3D desktop processors within January 2023, with product unveiling expected at AMD's 2023 International CES event. The 3D Vertical Cache technology had a profound impact on the gaming performance of the older "Zen 3" architecture, bringing it up to levels competitive with those of the 12th Gen Core "Alder Lake" processors, and while gaming performance of the Ryzen 7000 "Zen 4" processors launched till take match or beat "Alder Lake," they fall behind those of the 13th Gen "Raptor Lake," which is exactly what AMD hopes to remedy with the Ryzen 7000X3D series.

In a report, Korean tech publication Quasar Zone states that AMD is planning to release 16-core/32-thread, 12-core/24-thread, and 8-core/16-thread SKUs in the Ryzen 7000X3D series. These would use one or two "Zen 4" chiplets with stacked 3D Vertical Cache memory. A large amount of cache memory operating at the same speed as the on-die L3 cache, is made contiguous with it and stacked on top of the region of the CCD (chiplet) that has the L3 cache, while the region with the CPU cores has structural silicon that conveys heat to the surface. On "Zen 3," the 32 MB on-die cache is appended with 64 MB of stacked cache memory operating at the same speed, giving the processor 96 MB of L3 cache that's uniformly accessible by all CPU cores on the CCD. This large cache memory positively impacts gaming performance on the Ryzen 7 5800X3D in comparison to the 5800X; and a similar uplift is expected for the 7000X3D series over their regular 7000-series counterparts.

Lenovo started offering the Ryzen 9 7900 and Ryzen 7 7700 processors as options for its prebuilt desktops, confirming that the 7900 and 7700 will be OEM-exclusives, at least initially. That doesn't mean these chips won't make it to the retail channel, as OEM-only parts from AMD in the past have somehow found their way to retailers, who bought them in trays, and sold them piecemeal as combos with motherboards and CPU coolers. The 7900 is a 12-core/24-thread part, just like its retail-channel sibling, the 7900X. The 7700 is an 8-core/16-thread part, again, similar to the 7700X. Not much else is known about these chips, except for their base frequency of just 3.60 GHz (compared to 4.70 GHz for the 7900X, and 4.50 GHz for the 7700X). Both chips are expected to feature a lowered TDP, with just 65 W for the 7700 (down from 105 W for the 7700X), and possibly 65 W or 105 W for the 7900 (down from 170 W for the 7900X).

TechPowerUp in partnership with Team Group are giving away six pieces of Team Group T-Force gaming hardware. We've actually been at this since November 14, and entries close tomorrow, November 25. That leaves you with a day to fill up a tiny form and answer a couple of quizzy questions on Team Group; for a chance to win a T-Force Delta RGB DDR5-6400 CL40 32 GB (2x 16 GB) memory kit, or one of five Vulcan Z 1 TB SSDs! The Delta RGB DDR5 would be a great addition to your next-generation desktop build, as its DDR5-6400 frequency goes great with the latest "Raptor Lake" and "Zen 4" processors! The Vulcan Z 1 TB makes for a decent game storage drive to add some room to your game library. Both look great when powered up and viewed through a tempered glass panel! Hurry up!

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AMD Ryzen 7000-series "Zen 4" desktop processors got their first round of price-cuts on leading retailer Newegg, as the company has a hard time justifying their launch-prices in the wake of Intel's 13th Gen Core "Raptor Lake" and declining demand in the PC components market. The new pricing sees the top Ryzen 9 7950X 16-core/32-thread chip priced at USD $574, down from $700 (an 18% price-cut). The 12-core/24-thread Ryzen 9 7900X sees its price go down from $550 to $474 (down 14%).

The 8-core/16-thread Ryzen 7 7700X gets a $50 price-cut sending its price down from $400 to roughly $350. The 6-core/12-thread Ryzen 5 7600X gets a similar $50 cut, which means the chip can now be had for roughly $250, down from its $300 launch price. All four SKUs face stiff competition from the aggressively priced 13th Gen Core SKUs, which include the i9-13900K, the i7-13700K, and the i5-13600K. Prices of Socket AM5 motherboards are another big put-off as they're a major contributor to platform costs, which is restricted to DDR5 memory. The Intel platform currently includes entry-level chipset options, as well as motherboards with DDR4 support.

AMD will build "Zen 4" based Ryzen Threadripper processors in an attempt to meet competition from Intel, which is rumored to launch HEDT processors of its own based on "Sapphire Rapids." While Intel's chip tops out at 60-core/120-thread and has a constellation of task-specific hardware-accelerators, AMD will arm its processors with raw CPU core-count, going as high up as 96-core/192-thread. The company has assigned the codename "Storm Peak" for these chips.

The Ryzen Threadripper 7000-series "Storm Peak" processor engineering samples surfaced on the Einstein@Home user database. As many as three OPNs have surfaced, "AMD Eng Sample: 100-000000884-21_N" and "AMD Eng Sample: 100-000000884-20_Y," which are 96-core/192-thread; and the "AMD Eng Sample: 100-000000454-20_Y," which is 64-core/128-thread. "Storm Peak" is likely just a variation of EPYC "Genoa," geared for higher frequencies.

AMD, in its technical presentation for the new Radeon RX 7900 series "Navi 31" GPU, gave us an elaborate explanation on why it had to take the chiplets route for high-end GPUs, devices that are far more complex than CPUs. The company also enlightened us on what sets chiplet-based packages apart from classic multi-chip modules (MCMs). An MCM is a package that consists of multiple independent devices sharing a fiberglass substrate.

An example of an MCM would be a mobile Intel Core processor, in which the CPU die and the PCH die share a substrate. Here, the CPU and the PCH are independent pieces of silicon that can otherwise exist on their own packages (as they do on the desktop platform), but have been paired together on a single substrate to minimize PCB footprint, which is precious on a mobile platform. A chiplet-based device is one where a substrate is made up of multiple dies that cannot otherwise independently exist on their own packages without an impact on inter-die bandwidth or latency. They are essentially what should have been components on a monolithic die, but disintegrated into separate dies built on different semiconductor foundry nodes, with a purely cost-driven motive.

A reliable source with CPU and platform leaks, ECSM_Official, made some new predictions about release timelines of upcoming desktop processors, and how 2023 could play out for Intel and AMD. 2022 is done, with no new desktop processor SKUs expected to launch from either brands. Intel is expected to flesh out its 13th Gen Core "Raptor Lake" desktop processor family in Q1 2023, with the addition of "locked" non-K SKUs spanning all four brand extensions (i3/i5/i7/i9). Besides these, Intel is expected to launch its new flagship, the Core i9-13900KS, with boost frequencies hitting the 6 GHz mark, in an attempt to ward off the threat from "Zen 4" with 3D Vertical Cache, a technology that springboarded "Zen 3" gaming performance to match that of "Alder Lake."

Both the i9-13900KS and AMD Ryzen 7000X3D processors are expected to launch toward the middle of H1-2023 (March-April). AMD is only expected to launch 6-core/12-thread and 8-core/16-thread SKUs with the 3DV cache technology. These would be single-CCD packages. There's no word on dual-CCD ones with 12-core or 16-core counts, so a Ryzen 9 7950X3D is not on the horizon. AMD is expected to debut its entry-level A620 motherboard chipset in Q2-2023. This chipset reportedly lacks CPU overclocking capability, is expected to lack PCIe Gen 5, and caps memory speed to DDR5-4800.

AIC Inc., (from now on referred to as "AIC"), a leading provider in enterprise storage and server solutions, today revealed its new edge server appliance powered by 4th Gen AMD EPYC processors (codename Genoa). The new server, EB202-CP, is designed to deliver superior performance in a compact size while offering excellent cost efficiency. Combined with the 4th Gen AMD EPYC processors, EB202-CP is expected to drive the innovations in AI, training simulation, autonomous vehicles and edge applications. AIC will showcase EB202-CP at SC22 expo from November 14th to 17th, 2022.

AIC EB202-CP is a 2U rackmount server with 22 inches in depth. It supports eight E1.S/ E3.S or U.2 SSDs which are front-serviceable and hot-swappable. The E1.S/ E3.S drives are Enterprise and Datacenter SSD Form Factor (EDSFF) that enables EB202-CP to provide high-density all-flash NVMe for half petabyte storage capabilities and enhance IOPS and space utilization. EB202-CP has great expansion functionality and supports up to two double-stack GPU or accelerator cards, two FHHL/HHHL PCIe 5.0 cards and an OCP 3.0 card. Based on AIC server board Capella, EB202-CP supports single 4th Gen AMD EPYC processor and eight DDR5 DIMMs. The 4th Gen AMD EPYC processors, built on "Zen 4" architecture, are optimized for general-purpose workloads across enterprise, cloud and edge. This new generation of AMD EPYC features the world's highest-performing x86 processor, PCIe 5.0 ready, and enables low TCO. It also delivers leadership energy efficiency as well as state-of-the-art security features.

Yesterday, AMD announced its latest addition to the data center family of processors called EPYC Genoa. Named the 4th generation EPYC processors, they feature a Zen 4 design and bring additional I/O connectivity like PCIe 5.0, DDR5, and CXL support. To disrupt the cloud, enterprise, and HPC offerings, AMD decided to manufacture SKUs with up to 96 cores and 192 threads, an increase from the previous generation's 64C/128T designs. Today, we are learning more about the performance and power aspects of the 4th generation AMD EPYC Genoa 9654, 9554, and 9374F SKUs from 3rd party sources, and not the official AMD presentation. Tom's Hardware published a heap of benchmarks consisting of rendering, compilation, encoding, parallel computing, molecular dynamics, and much more.

In the comparison tests, we have AMD EPYC Milan 7763, 75F3, and Intel Xeon Platinum 8380, a current top-end Intel offering until Sapphire Rapids arrives. Comparing 3rd-gen EPYC 64C/128T SKUs with 4th-gen 64C/128T EPYC SKUs, the new generation brings about a 30% increase in compression and parallel compute benchmarks performance. When scaling to the 96C/192T SKU, the gap is widened, and AMD has a clear performance leader in the server marketplace. For more details about the benchmark results, go here to explore. As far as comparison to Intel offerings, AMD leads the pack as it has a more performant single and multi-threaded design. Of course, beating the Sapphire Rapids to market is a significant win for team red, so we are still waiting to see how the 4th generation Xeon stacks up against Genoa.

TYAN, an industry-leading server platform design manufacturer and a MiTAC Computing Technology Corporation subsidiary, today introduced AMD EPYC 9004 Series processor-based server platforms highlighting energy efficiency and performance breakthroughs designed for next generation server architecture for data centers. "Facing the post-COVID economy world, data centers are required to build on more environmentally friendly, secure and flexible features to respond to the growing of teleworking, video streaming, IoT and 5G," said Danny Hsu, Vice President of MiTAC Computing Technology Corporation's Server Infrastructure BU. "TYAN's new server platforms powered by 4th Gen AMD EPYC processors efficiently enable data centers by doing more tasks with the same number of servers."

"We designed 4th Gen AMD EPYC processors to give our customers exactly what they said they needed, high performance, exceptional energy efficiency and low total cost of ownership," said Ram Peddibhotla, corporate vice president, EPYC product management, AMD. "With the latest "Zen 4" architecture that incorporates modern security by design, 4th Gen AMD EPYC processors are an outstanding choice for IT professionals looking to optimize their data centers for leadership performance while helping address environmental goals."

SK hynix announced that its DRAM, and CXL solutions have been validated with the new AMD EPYC 9004 Series processors, which were unveiled during the company's "together we advance_data centers" event on November 10. SK hynix has worked closely with AMD to provide fully compatible memory solutions for the 4th Gen AMD EPYC processors.

4th Gen AMD EPYC processors are built on an all-new SP5 socket and offer innovative technologies and features including support for advanced DDR5 and CXL 1.1+ memory expansion. SK hynix 1ynm, 1a nm 16 Gb DDR5 and 1a nm 24Gb DDR5 DRAM support 4800 Mbps on 4th Gen AMD EPYC processors, which deliver up to 50% more memory bandwidth than DDR4 product. SK hynix also provides CXL memory device that is a 96 GB product composed of 24 Gb DDR5 DRAMs based on 1a nm. The company expects high customer satisfaction of this product with flexible configuration of bandwidth and capacity expanded cost-efficiently.

GIGABYTE Technology, an industry leader in high-performance servers and workstations, today announced its portfolio of products ready to support the new AMD EPYC 9004 Series Processors in the first wave of GIGABYTE solutions that will target a wide range of demanding workloads that include GPU-centric, high-density, edge, and general computing. A new x86 platform, a new socket, and a wealth of highly performant technologies provided new opportunities for GIGABYTE to tailor products for leading data centers. So far, GIGABYTE has released twenty-two new servers and motherboards to support the new AMD "Zen 4" architecture. Both single-socket and dual-socket options are available to handle big data and digital transformation. The ongoing collaboration between GIGABYTE and AMD has allowed for a comprehensive portfolio of computing solutions that are ready for the market.

The new 4th Gen AMD EPYC processors feature substantial compute performance and scalability by combing high core counts with impressive PCIe and memory throughput. In terms of out of the box performance, AMD estimates found that 4th Gen AMD EPYC CPUs are the highest performing server processors in the worldi. With the advancement to 5 nm technology and other performant innovations, the new AMD EPYC 9004 series processors move to a new SP5 socket. The new architecture leads the way to faster data insights with high performance and built-in security features, and this platform targets HPC, AI, cloud, big data, and general enterprise IT.

AMD at a special media event titled "together we advance_data centers," formally launched its 4th generation EPYC "Genoa" server processors based on the "Zen 4" microarchitecture. These processors debut an all new platform, with modern I/O connectivity that includes PCI-Express Gen 5, CXL, and DDR5 memory. The processors come in CPU core-counts of up to 96-core/192-thread. There are as many as 18 processor SKUs, differentiated not just in CPU core-counts, but also the way the the cores are spread across the up to 12 "Zen 4" chiplets (CCDs). Each chiplet features up to 8 "Zen 4" CPU cores, depending on the model; up to 32 MB of L3 cache, and is built on the 5 nm EUV process at TSMC. The CCDs talk to a centralized server I/O die (sIOD), which is built on the 6 nm process.

The processors AMD is launching today are the EPYC "Genoa" series, targeting general purpose servers, although they can be deployed in large cloud data-centers, too. To large-scale cloud providers such as AWS, Azure, and Google Cloud, AMD is readying a different class of processor, codenamed "Bergamo," which is plans to launch later. In 2023, the company will launch the "Genoa-X" line of processor for technical-compute and HPC applications, which benefit from large on-die caches, as they feature the 3D Vertical Cache technology. There will also be "Siena," a class of EPYC processors targeting the telecom and edge-computing markets, which could see an integration of more Xilinx IP.

The SiSoft SANDRA user database has just been pinged by two new unreleased AMD Ryzen 7000 series "Zen 4" processor models, the Ryzen 7 7700 and Ryzen 5 7600. These chips have the same 8-core/16-thread and 6-core/12-thread core-counts as the 7700X and 7600X, respectively; but with lower clock speeds, and more importantly, a lower TDP of just 65 W. This would put their package power tracking (PPT) limit around 90 W, down from the 105 W and 140 W of the their "X" siblings.

The 7600 and 7700 come with a base frequency of 3.80 GHz, as detected by SANDRA. Every other specification, such as cache size, is the unchanged from the 7600X or 7700X. There's no word on the availability, but it's likely that AMD would debut these chips in the OEM channel first, especially given that the 7600 has the potential to undercut sales of the embattled 7600X. Things could get interesting as Intel debuts the lower end of its 13th Gen Core i5 series, which are rumored to be based on the "Alder Lake" microarchitecture, and 6P+4E SKUs.

AMD (NASDAQ:AMD) today announced revenue for the third quarter of 2022 of $5.6 billion, gross margin of 42%, operating loss of $64 million, net income of $66 million and diluted earnings per share of $0.04. On a non-GAAP(*) basis, gross margin was 50%, operating income was $1.3 billion, net income was $1.1 billion and diluted earnings per share was $0.67.

"Third quarter results came in below our expectations due to the softening PC market and substantial inventory reduction actions across the PC supply chain," said AMD Chair and CEO Dr. Lisa Su. "Despite the challenging macro environment, we grew revenue 29% year-over-year driven by increased sales of our data center, embedded and game console products. We are confident that our leadership product portfolio, strong balance sheet, and ongoing growth opportunities in our data center and embedded businesses position us well to navigate the current market dynamics."

AMD on Monday issued a statement refuting reports of performance deltas noticed for its Ryzen 7000-series "Zen 4" desktop processors observed between Windows 11 and Windows 10 operating systems when gaming. The company said that while it is investigating the reports, it has not been able to reproduce these performance deltas, and maintains that Ryzen 7000 series should perform consistently between both operating systems. Architecturally, "Zen 4" isn't different from "Zen 3" with the exception of its AVX-512 ISA that even Windows 10 supports. Windows 10 has awareness for "Zen 4" multi-core topology since it isn't any different from Ryzen 5000 "Vermeer." AMD stated that it continues to work with game developers to ensure their titles are optimized for Ryzen processors.The statement from AMD on the matter follows.

AMD is preparing to expand its Ryzen 7000-series "Zen 4" desktop processor series with new SKUs, one of which is the Ryzen 7 7700 (non-X). Given past trends with non-X SKUs for the Ryzen 5000-series, the 7700 is very likely an OEM-only SKU to be featured in pre-built desktops. The inclusion of an iGPU with the Ryzen 7000-series changes things dramatically for AMD, as it makes these processors suitable for even home- and commercial desktops that lack discrete graphics. The Ryzen 7 7700 has the same 8-core/16-thread configuration as the Ryzen 7 7700X, but likely lower clock-speeds, due to the lower power-limits. The chip has a TDP of 65 W, compared to the 105 W of the 7700X; which means its package power tracking (PPT) power limit will be closer to 90 W, than the 140 W of the 7700X. This will also significantly lower the cooling requirements for the processor, and OEMs could use cost-effective air coolers. The exact clock-speeds, though, remain under the wraps.

AMD earlier this week released basic enablement for the GNU Compiler Collections (GCC), which extend "Zen 4" microarchitecture awareness. The "basic enablement patch" for the new Zenver4 target is essentially similar to Zenver3, but with added support for the new AVX-512 instructions, namely AVX512F, AVX512DQ, AVX512IFMA, AVX512CD, AVX512BW, AVX512VL, AVX512BF16, AVX512VBMI, AVX512VBMI2, GFNI, AVX512VNNI, AVX512BITALG, and AVX512VPOPCNTDQ. Besides AVX-512, "Zen 4" is largely identical to its predecessor, architecturally, and so the enablement is rather basic. This should come just in time for software vendors to prepare for next-generation EPYC "Genoa" server processors, or even small/medium businesses building servers with Ryzen 7000-series processors.