NVIDIA's Compute Unified Device Architecture (CUDA) has long been the de facto standard programming interface for developing GPU-accelerated software. Over the years, NVIDIA has built an entire ecosystem around CUDA, cementing its position as the leading GPU computing and AI manufacturer. However, rivals AMD and Intel have been trying to make inroads with their own open API offerings—ROCm from AMD and oneAPI from Intel. The idea was that developers could more easily run existing CUDA code on non-NVIDIA GPUs by providing open access through translation layers. Developers had created projects like ZLUDA to translate CUDA to ROCm, and Intel's CUDA to SYCL aimed to do the same for oneAPI. However, with the release of CUDA 11.5, NVIDIA appears to have cracked down on these translation efforts by modifying its terms of use, according to developer Longhorn on X.

"You may not reverse engineer, decompile or disassemble any portion of the output generated using Software elements for the purpose of translating such output artifacts to target a non-NVIDIA platform," says the CUDA 11.5 terms of service document. The changes don't seem to be technical in nature but rather licensing restrictions. The impact remains to be seen, depending on how much code still requires translation versus running natively on each vendor's API. While CUDA gave NVIDIA a unique selling point, its supremacy has diminished as more libraries work across hardware. Still, the move could slow the adoption of AMD and Intel offerings by making it harder for developers to port existing CUDA applications. As GPU-accelerated computing grows in fields like AI, the battle for developer mindshare between NVIDIA, AMD, and Intel is heating up.

An Open Image Denoise 2.2 release candidate was released earlier today—as discovered by Phoronix's founder and principal writer; Michael Larabel. Intel's dedicated website has not been updated with any new documentation or changelogs (at the time of writing), but a GitHub release page shows all of the crucial information. Team Blue's open-source oneAPI has been kept up-to-date with the latest technologies—not only limited to Intel's stable of Xe-LP, Xe-HPG and Xe-HPC components—the Phonorix article highlights updated support on competing platforms. The v2.2 preview adds support for Meteor Lake's integrated Arc graphics solution, and additional "denoising quality enhancements and other improvements."

Non-Intel platform improvements include updates for Apple's M-series chipsets, AArch64 processors, and NVIDIA CUDA. OIDn 2.2-rc: "adds Metal device support for Apple Silicon GPUs on recent versions of macOS. OIDn has already been supporting ARM64/AArch64 for Apple Silicon CPUs while now Open Image Denoise has extended that AArch64 support to work on Windows and Linux too. There is better performance in general for Open Image Denoise on CPUs with this forthcoming release." The changelog also highlights a general improvement performance across processors, and a fix that resolves a crash incident: "when releasing a buffer after releasing the device."

At its "AI Everywhere" launch in New York City today, Intel introduced an unmatched portfolio of AI products to enable customers' AI solutions everywhere—across the data center, cloud, network, edge and PC. "AI innovation is poised to raise the digital economy's impact up to as much as one-third of global gross domestic product," Gelsinger said. "Intel is developing the technologies and solutions that empower customers to seamlessly integrate and effectively run AI in all their applications—in the cloud and, increasingly, locally at the PC and edge, where data is generated and used."

Gelsinger showcased Intel's expansive AI footprint, spanning cloud and enterprise servers to networks, volume clients and ubiquitous edge environments. He also reinforced that Intel is on track to deliver five new process technology nodes in four years. "Intel is on a mission to bring AI everywhere through exceptionally engineered platforms, secure solutions and support for open ecosystems. Our AI portfolio gets even stronger with today's launch of Intel Core Ultra ushering in the age of the AI PC and AI-accelerated 5th Gen Xeon for the enterprise," Gelsinger said.

As the world experiences a generational shift to artificial intelligence, each of us is participating in a new era of global expansion enabled by silicon. It's the "Siliconomy," where systems powered by AI are imbued with autonomy and agency, assisting us across both knowledge-based and physical-based tasks as part of our everyday environments.

At Intel Innovation, the company unveiled technologies to bring AI everywhere and to make it more accessible across all workloads - from client and edge to network and cloud. These include easy access to AI solutions in the cloud, better price performance for Intel data center AI accelerators than the competition offers, tens of millions of new AI-enabled Intel PCs shipping in 2024 and tools for securely powering AI deployments at the edge.

What's New: As part of a collaboration with Intel and Dell Technologies, the United Kingdom Atomic Energy Authority (UKAEA) and the Cambridge Open Zettascale Lab plan to build a "digital twin" of the Spherical Tokamak for Energy Production (STEP) prototype fusion power plant. The UKAEA will utilize the lab's supercomputer based on Intel technologies, including 4th Gen Intel Xeon Scalable processors, distributed asynchronous object storage (DAOS) and oneAPI tools to streamline the development and delivery of fusion energy to the grid in the 2040s.

"Planning for the commercialization of fusion power requires organizations like UKAEA to utilize extreme amounts of computational resources and artificial intelligence for simulations. These HPC workloads may be performed using a variety of different architectures, which is why open software solutions that optimize performance needs can lend portability to code that isn't available in closed, proprietary systems. Overall, advanced hardware and software can make the journey to commercial fusion power lower risk and accelerated - a key benefit on the path to sustainable energy."—Adam Roe, Intel EMEA HPC technical director

Today, Intel introduced the Intel Arc Pro A60 and Pro A60M as new members of the Intel Arc Pro A-series professional range of graphics processing units (GPUs). The new products are a significant step up in performance in the Intel Arc Pro family and are carefully designed for professional workstations users with up to 12 GB of video memory (VRAM) and support for four displays with high dynamic range (HDR) and Dolby Vision support.

With built-in ray tracing hardware, graphics acceleration and machine learning capabilities, the Intel Arc Pro A60 GPU unites fluid viewports, the latest in visual technologies and rich content creation in a traditional single slot factor.

In the release of Python 2.0, contributions from Intel using Intel Extension for PyTorch, oneAPI Deep Neural Network Library (oneDNN) and additional support for Intel CPUs enable developers to optimize inference and training performance for artificial intelligence (AI).

As part of the PyTorch 2.0 compilation stack, the TorchInductor CPU backend optimization by Intel Extension for PyTorch and PyTorch ATen CPU achieved up to 1.7 times faster FP32 inference performance when benchmarked with TorchBench, HuggingFace and timm. This update brings notable performance improvements to graph compilation over the PyTorch eager mode.

Intel today marked one of the most important product launches in company history with the unveiling of 4th Gen Intel Xeon Scalable processors (code-named Sapphire Rapids), the Intel Xeon CPU Max Series (code-named Sapphire Rapids HBM) and the Intel Data Center GPU Max Series (code-named Ponte Vecchio), delivering for its customers a leap in data center performance, efficiency, security and new capabilities for AI, the cloud, the network and edge, and the world's most powerful supercomputers.

Working alongside its customers and partners with 4th Gen Xeon, Intel is delivering differentiated solutions and systems at scale to tackle their biggest computing challenges. Intel's unique approach to providing purpose-built, workload-first acceleration and highly optimized software tuned for specific workloads enables the company to deliver the right performance at the right power for optimal overall total cost of ownership. Additionally, as Intel's most sustainable data center processors, 4th Gen Xeon processors deliver customers a range of features for managing power and performance, making the optimal use of CPU resources to help achieve their sustainability goals.

Today, Intel announced the 2023 release of the Intel oneAPI tools - available in the Intel Developer Cloud and rolling out through regular distribution channels. The new oneAPI 2023 tools support the upcoming 4th Gen Intel Xeon Scalable processors, Intel Xeon CPU Max Series and Intel Data Center GPUs, including Flex Series and the new Max Series. The tools deliver performance and productivity enhancements, and also add support for new Codeplay plug-ins that make it easier than ever for developers to write SYCL code for non-Intel GPU architectures. These standards-based tools deliver choice in hardware and ease in developing high-performance applications that run on multiarchitecture systems.

"We're seeing encouraging early application performance results on our development systems using Intel Max Series GPU accelerators - applications built with Intel's oneAPI compilers and libraries. For leadership-class computational science, we value the benefits of code portability from multivendor, multiarchitecture programming standards such as SYCL and Python AI frameworks such as PyTorch, accelerated by Intel libraries. We look forward to the first exascale scientific discoveries from these technologies on the Aurora system next year."
-Timothy Williams, deputy director, Argonne Computational Science Division

In advance of Supercomputing '22 in Dallas, Intel Corporation has introduced the Intel Max Series product family with two leading-edge products for high performance computing (HPC) and artificial intelligence (AI): Intel Xeon CPU Max Series (code-named Sapphire Rapids HBM) and Intel Data Center GPU Max Series (code-named Ponte Vecchio). The new products will power the upcoming Aurora supercomputer at Argonne National Laboratory, with updates on its deployment shared today.

The Xeon Max CPU is the first and only x86-based processor with high bandwidth memory, accelerating many HPC workloads without the need for code changes. The Max Series GPU is Intel's highest density processor, packing over 100 billion transistors into a 47-tile package with up to 128 gigabytes (GB) of high bandwidth memory. The oneAPI open software ecosystem provides a single programming environment for both new processors. Intel's 2023 oneAPI and AI tools will deliver capabilities to enable the Intel Max Series products' advanced features.

On Day 2 of Intel Innovation, Intel illustrated how its efforts and investments to foster an open ecosystem catalyze community innovation, from silicon to systems to apps and across all levels of the software stack. Through an expanding array of platforms, tools and solutions, Intel is focused on helping developers become more productive and more capable of realizing their potential for positive social good. The company introduced new tools to support developers in artificial intelligence, security and quantum computing, and announced the first customers of its new Project Amber attestation service.

"We are making good on our software-first strategy by empowering an open ecosystem that will enable us to collectively and continuously innovate," said Intel Chief Technology Officer Greg Lavender. "We are committed members of the developer community and our breadth and depth of hardware and software assets facilitate the scaling of opportunities for all through co-innovation and collaboration."

Intel today launched its Arctic Sound M line of data-center GPUs. These are not positioned as HPC processors like the "Ponte Vecchio," but GPUs targeting cloud-compute providers, with their main applications being in the realm of visual processing, media, and AI inferencing. Their most interesting aspect has to be the silicon, which are the same 6 nm "ACM-G11" and "ACM-G10" chips powering the Arc "Alchemist" client graphics cards, based on the Xe-HPG architecture. Even more interesting is their typical board power values, ranging between 75 W to 150 W. The cards are built in the PCI-Express add-on card form-factor, with their cooling solutions optimized for rack airflow.

The marketing name for these cards is simply Intel Data Center GPU Flex, with two models being offered: The Data Center GPU Flex-140, and Flex-170. The Flex-170 is a full-sized add-on card based on the larger ACM-G10 silicon, which has 32 Xe Cores (4,096 unified shaders), whereas the Flex-140, interestingly, is a low-profile dual-GPU card with two smaller ACM-G11 chips that each has 8 Xe Cores (1,024 unified shaders). The two chips appear to be sharing a PCIe bridge chip in the renders. Both models come with four Xe Media Engines that pack AV1 encode hardware-acceleration, XMX AI acceleration, real-time ray tracing, and GDDR6 memory.

Intel Arc Alchemist graphics cards span both gamer and creator/professional user market sector, where we witnessed Intel announce gamer and pro-vis GPU SKUs. Today, we are seeing the usage of the flagship Arc Alchemist SKU called A770 in Blender rendering with ray tracing enabled. The GPU is designed to have a DG2-512 GPU with 512 EUs, 4096 Shading Units, 16 GB of GDDR6 memory, and 32 Xe cores for ray tracing, be a powerhouse for games, and handle some professional software as well. At SIGGRAPH 2022, Bob Duffy, Intel's Director of Graphics Community Engagement, showcased a system with Arc A770 GPU running Blender Cycles with ray tracing and denoising.

While we don't have any comparable data to showcase, the system managed to produce a decent rendering in Blender 3.3 LTS release, using Intel's oneAPI. The demo scene had 4,369,466 vertices, 8,702,031 edges, 4,349,606 faces, and 8,682,950 triangles, backed by ray tracing and live denoising. We are yet to see more detailed benchmarks and how the GPU fares against the competition.

Intel's collaboration with Aible enables teams across key industries to leverage artificial intelligence and deliver rapid and measurable business impact. This deep collaboration, which includes engineering optimizations and an innovative benchmarking program, enhances Aible's ability to deliver rapid results to its enterprise customers. When paired with Intel processors, Aible's technology provides a serverless-first approach, allowing developers to build and run applications without having to manage servers, and build modern applications with increased agility and lower total cost of ownership (TCO).

"Today's enterprise IT infrastructure leaders face significant challenges building a foundation that is designed to help business teams drive value from AI initiatives in the data center. We've moved past talking about the potential of AI, as business teams across key industries are experiencing measurable business impact within days, using Intel Xeon Scalable processors with built-in Intel software optimizations with Aible," said Kavitha Prasad, Intel vice president and general manager of Datacenter, AI and Cloud Execution and Strategy.

Super Micro Computer, Inc., a global leader in enterprise computing, storage, networking, and green computing technology, is announcing future Total IT Solutions for availability with Android Cloud Gaming and Media Processing & Delivery. These new solutions will incorporate the Intel Data Center GPU, codenamed Arctic Sound-M, and will be supported on several Supermicro servers. Supermicro solutions that will contain the Intel Data Center GPUs codenamed Arctic Sound-M, include the 4U 10x GPU server for transcoding and media delivery, the Supermicro BigTwin system with up to eight Intel Data Center GPUs, codenamed Arctic Sound-M in 2U for media processing applications, the Supermicro CloudDC server for edge AI inferencing, and the Supermicro 2U 2-Node server with three Intel Data Center GPUs, codenamed Arctic Sound-M per node, optimized for cloud gaming. Additional systems will be made available later this year.

"Supermicro will extend our media processing solutions by incorporating the Intel Data Center GPU," said Charles Liang, President, and CEO, Supermicro. "The new solutions will increase video stream rates and enable lower latency Android cloud gaming. As a result, Android cloud gaming performance and interactivity will increase dramatically with the Supermicro BigTwin systems, while media delivery and transcoding will show dramatic improvements with the new Intel Data Center GPUs. The solutions will expand our market-leading accelerated computing offerings, including everything from Media Processing & Delivery to Collaboration, and HPC."

Intel has released the first set of open source AI reference kits specifically designed to make AI more accessible to organizations in on-prem, cloud and edge environments. First introduced at Intel Vision, the reference kits include AI model code, end-to-end machine learning pipeline instructions, libraries and Intel oneAPI components for cross-architecture performance. These kits enable data scientists and developers to learn how to deploy AI faster and more easily across healthcare, manufacturing, retail and other industries with higher accuracy, better performance and lower total cost of implementation.

"Innovation thrives in an open, democratized environment. The Intel accelerated open AI software ecosystem including optimized popular frameworks and Intel's AI tools are built on the foundation of an open, standards-based, unified oneAPI programming model. These reference kits, built with components of Intel's end-to-end AI software portfolio, will enable millions of developers and data scientists to introduce AI quickly and easily into their applications or boost their existing intelligent solutions."

Intel and Google are working together to drive high performance computing (HPC) forward on Google Cloud with the release of the Cloud HPC Toolkit. This new resource provides access to tools from the Intel oneAPI Base and HPC Toolkits to optimize performance through Intel Select Solutions for Simulations & Modeling. These new tools improve compile times, speed of results and offer multi-vendor acceleration in SYCL.

"Using Cloud HPC Toolkit with an Intel Select Solutions for Simulations & Modeling blueprint brings the added benefit of automatically spinning up a hardware-software configuration that has been rigorously tested and optimized for real-world performance, eliminating guesswork," said Ilias Katsardis, HPC solution lead, Google.

During the International Supercomputing Conference on May 31, 2022, in Hamburg, Germany, Jeff McVeigh, vice president and general manager of the Super Compute Group at Intel Corporation, announced Rialto Bridge, Intel's data center graphics processing unit (GPU). Using the same architecture as the Intel data center GPU Ponte Vecchio and combining enhanced tiles with Intel's next process node, Rialto Bridge will offer up to 160 Xe cores, more FLOPs, more I/O bandwidth and higher TDP limits for significantly increased density, performance and efficiency.

"As we embark on the exascale era and sprint towards zettascale, the technology industry's contribution to global carbon emissions is also growing. It has been estimated that by 2030, between 3% and 7% of global energy production will be consumed by data centers, with computing infrastructure being a top driver of new electricity use," said Jeff McVeigh, vice president and general manager of the Super Compute Group at Intel Corporation.

Since OpenVINO launched in 2018, Intel has enabled hundreds of thousands of developers to dramatically accelerate AI inferencing performance, starting at the edge and extending to the enterprise and the client. Today, ahead of MWC Barcelona 2022, the company launched a new version of the Intel Distribution of OpenVINO Toolkit. New features are built upon three-and-a-half years of developer feedback and include a greater selection of deep learning models, more device portability choices and higher inferencing performance with fewer code changes.

"The latest release of OpenVINO 2022.1 builds on more than three years of learnings from hundreds of thousands of developers to simplify and automate optimizations. The latest upgrade adds hardware auto-discovery and automatic optimization, so software developers can achieve optimal performance on every platform. This software plus Intel silicon enables a significant AI ROI advantage and is deployed easily into the Intel-based solutions in your network," said Adam Burns, vice president, OpenVINO Developer Tools in the Network and Edge Group.

At Intel's 2022 Investor Meeting, Chief Executive Officer Pat Gelsinger and Intel's business leaders outlined key elements of the company's strategy and path for long-term growth. Intel's long-term plans will capitalize on transformative growth during an era of unprecedented demand for semiconductors. Among the presentations, Intel announced product roadmaps across its major business units and key execution milestones, including: Accelerated Computing Systems and Graphics, Intel Foundry Services, Software and Advanced Technology, Network and Edge, Technology Development, More: For more from Intel's Investor Meeting 2022, including the presentations and news, please visit the Intel Newsroom and Intel.com's Investor Meeting site.

Intel today released oneAPI 2022 toolkits. Newly enhanced toolkits expand cross-architecture features to provide developers greater utility and architectural choice to accelerate computing. "I am impressed by the breadth of more than 900 technical improvements that the oneAPI software engineering team has done to accelerate development time and performance for critical application workloads across Intel's client and server CPUs and GPUs. The rich set of oneAPI technologies conforms to key industry standards, with deep technical innovations that enable applications developers to obtain the best possible run-time performance from the cloud to the edge. Multi-language support and cross-architecture performance acceleration are ready today in our oneAPI 2022 release to further enable programmer productivity on Intel platforms," said Greg Lavender, Intel chief technology officer, senior vice president and general manager of the Software and Advanced Technology Group.

New capabilities include the world's first unified compiler implementing C++, SYCL and Fortran, data parallel Python for CPUs and GPUs, advanced accelerator performance modeling and tuning, and performance acceleration for AI and ray tracing visualization workloads. The oneAPI cross-architecture programming model provides developers with tools that aim to improve the productivity and velocity of code development when building cross-architecture applications.

Intel has dropped plans to build Xe-HP server GPUs commercially. This line of products would have powered cloud-based graphics rendering instances, for cloud-gaming or cloud-rendering applications. An announcement to this effect came from Raja Koduri, overseeing the development and monetization of Xe. Koduri stated that Xe-HP based instances were originally set up to power Intel's oneAPI devcloud as a software development vehicle for oneAPI and the upcoming Aurora supercomputer of the Argonne National Laboratory.

The company will now focus on Xe as a compute accelerator in the form of Xe-HPC "Ponte Vecchio," and discrete graphics in the client segment, leveraging the Xe-HPG graphics architecture. The smallest derivatives, the Xe-LP, powers integrated graphics solutions found in the company's Core processors (11th Gen and later). Back in the August 2021 Architecture Day presentation, Intel's technical brief for Xe HPC revealed that the silicon itself features certain on-die hardware relevant to graphics rendering (more here). This would have gone on to power the Xe-HP server GPU solutions.

SiPearl, the designer of the high computing power and low consumption microprocessor that will be the heart of European supercomputers, has entered into a partnership with Intel in order to offer a common offer dedicated to the first exascale supercomputers in Europe. This partnership will offer their European customers the possibility of combining Rhea, the high computing power and low consumption microprocessor developed by SiPearl, with Intel's Ponte Vecchio accelerator, thus creating a high performance computing node that will promote the deployment of the exascale supercomputing in Europe.

To enable this powerful combination, SiPearl plans to use and optimize for its Rhea microprocessor the open and unified programming interface, oneAPI, created by Intel. Using this single solution across the entire heterogeneous compute node, consisting of Rhea and Ponte Vecchio, will increase developer productivity and application performance.

The Linux Foundation, the nonprofit organization enabling mass innovation through open source, today announced an intent to form the Open 3D Foundation to accelerate developer collaboration on 3D game and simulation technology. The Open 3D Foundation will support open source projects that advance capabilities related to 3D graphics, rendering, authoring, and development. As the first project governed by the new foundation, Amazon Web Services, Inc. (AWS) is contributing an updated version of the Amazon Lumberyard game engine as the Open 3D Engine (O3DE), under the permissive Apache 2.0 license. The Open 3D Engine enables developers and content creators to build 3D experiences unencumbered by commercial terms and will provide the support and infrastructure of an open source community through forums, code repositories, and developer events. A developer preview of O3DE is available on GitHub today. For more information and/or to contribute, please visit: https://o3de.org

3D engines are used to create a range of virtual experiences, including games and simulations, by providing capabilities such as 3D rendering, content authoring tools, animation, physics systems, and asset processing. Many developers are seeking ways to build their intellectual property on top of an open source engine where the roadmap is highly visible, openly governed, and collaborative to the community as a whole. More developers look to be able to create or augment their current technological foundations with highly collaborative solutions that can be used in any development environment. O3DE introduces a new ecosystem for developers and content creators to innovate, build, share, and distribute immersive 3D worlds that will inspire their users with rich experiences that bring the imaginations of their creators to life.

At the 2021 International Supercomputing Conference (ISC) Intel is showcasing how the company is extending its lead in high performance computing (HPC) with a range of technology disclosures, partnerships and customer adoptions. Intel processors are the most widely deployed compute architecture in the world's supercomputers, enabling global medical discoveries and scientific breakthroughs. Intel is announcing advances in its Xeon processor for HPC and AI as well as innovations in memory, software, exascale-class storage, and networking technologies for a range of HPC use cases.

"To maximize HPC performance we must leverage all the computer resources and technology advancements available to us," said Trish Damkroger, vice president and general manager of High Performance Computing at Intel. "Intel is the driving force behind the industry's move toward exascale computing, and the advancements we're delivering with our CPUs, XPUs, oneAPI Toolkits, exascale-class DAOS storage, and high-speed networking are pushing us closer toward that realization."