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Corsair MP700 Pro SE Hydro X 4 TB

4 TB
Capacity
Phison E26
Controller
TLC
Flash
PCIe 5.0 x4
Interface
M.2 2280
Form Factor
SSD Controller
Controller
NAND Die
NAND Die
The Corsair MP700 Pro SE Hydro X is a solid-state drive in the M.2 2280 form factor, launched on May 9th, 2024. It is available in capacities ranging from 2 TB to 4 TB. This page reports specifications for the 4 TB variant. With the rest of the system, the Corsair MP700 Pro SE Hydro X interfaces using a PCI-Express 5.0 x4 connection. The SSD controller is the PS5026-E26 from Phison, a DRAM cache chip is available. Corsair has installed 232-layer TLC NAND flash on the MP700 Pro SE Hydro X, the flash chips are made by Micron. To improve write speeds, a pseudo-SLC cache is used, so bursts of incoming writes are handled more quickly. The cache is sized at 440 GB, once it is full, writes complete at 4000 MB/s. Copying data out of the SLC cache (folding) completes at 1500 MB/s. Thanks to support for the fast PCI-Express 5.0 interface, performance is excellent. The MP700 Pro SE Hydro X is rated for sequential read speeds of up to 14,000 MB/s and 12,000 MB/s write; random IO reaches 1700K IOPS for read and 1600K for writes.
The SSD's price at launch is unknown. The warranty length is set to none, which is quite short for the SSD industry. Corsair guarantees an endurance rating of 3000 TBW, a very low value compared to other SSDs.

Solid-State-Drive

Capacity: 4 TB (4000 GB)
Variants: 2 TB 4 TB
Overprovisioning: 370.7 GB / 10.0 %
Production: Active
Released: May 9th, 2024
Part Number: CSSD-F4000GBMP700PHXS
Market: Consumer

Physical

Form Factor: M.2 2280 (Double-Sided)
Interface: PCIe 5.0 x4
Protocol: NVMe 2.0
Power Draw: 2.7 W (Idle)
7.4 W (Avg)
12.3 W (Max)

Controller

Manufacturer: Phison
Name: PS5026-E26
Architecture: ARM 32-bit Cortex-R5 + AndesCore 32-bit N25F RISC-V
Core Count: 5-Core
Foundry: TSMC
Process: 12 nm
Flash Channels: 8 @ 2,400 MT/s
Chip Enables: 4
Controller Features: DRAM (enabled)

NAND Flash

Manufacturer: Micron
Name: B58R FortisFlash
Part Number: NY256
Type: TLC
Technology: 232-layer
Speed: 2400 MT/s
Capacity: 4 chips @ 8 Tbit
ONFI: 5.0
Topology: Replacement Gate
Die Size: 70 mm²
(14.6 Gbit/mm²)
Dies per Chip: 8 dies @ 1 Tbit
Planes per Die: 6
Decks per Die: 2
Word Lines: 255 per NAND String
91.0% Vertical Efficiency
Read Time (tR): 61 µs
Program Time (tProg): 600 µs
Block Erase Time (tBERS): 15 ms
Die Read Speed: 1574 MB/s
Die Write Speed: 160 MB/s
Endurance:
(up to)
2500 P/E Cycles
Page Size: 16 KB
Block Size: 2784 Pages
Plane Size: 3402 Blocks

DRAM Cache

Type: LPDDR4-4266
Name: SK Hynix H9HCNNNCPUMLXR-NEE
Capacity: 8192 MB
(2x 4096 MB)

Performance

Sequential Read: 14,000 MB/s
Sequential Write: 12,000 MB/s
Random Read: 1,700,000 IOPS
Random Write: 1,600,000 IOPS
Endurance: 3000 TBW
Warranty: None
MTBF: 1.6 Million Hours
SLC Write Cache: approx. 440 GB
(dynamic only)
Speed when Cache Exhausted: approx. 4000 MB/s
Cache Folding Speed: 1500 MB/s

Features

TRIM: Yes
SMART: Yes
Power Loss Protection: No
Encryption:
  • AES-256
RGB Lighting: No
PS5 Compatible: Yes

Same Drive

This section lists other SSDs in our database using the exact same hardware components

Notes

Controller:

This controller features a dual core Cortex-R5 as a primary cores, while a Tripple AndesCore 32-bit N25F RISC-V at 400-500 MHz act as a CoX Processor.

NAND Die:

2-Deck design with 116 word line per deck
Upper deck: 128-Gates
Lower Deck: 127-gates
Programming Throughput - not confirmed, calculated by estimated tPROG
tPROG - Estimated, not confirmed

Jun 1st, 2024 11:46 EDT change timezone

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