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Teamgroup Cardea IOPS 1 TB

1 TB
Capacity
Phison E12S
Controller
TLC
Flash
PCIe 3.0 x4
Interface
M.2 2280
Form Factor
Front
Package
Package
PCB Front
PCB Front
PCB Back
PCB Back
Flash
Flash
DRAM
DRAM
SSD Controller
Controller
NAND Die
NAND Die
The Teamgroup Cardea IOPS was a solid-state drive in the M.2 2280 form factor, launched on December 10th, 2020, that is no longer in production. It is only available in the 1 TB capacity listed on this page. With the rest of the system, the Teamgroup Cardea IOPS interfaces using a PCI-Express 3.0 x4 connection. The SSD controller is the PS5012-E12S-32 from Phison, a DRAM cache chip is available. Teamgroup has installed 96-layer TLC NAND flash on the Cardea IOPS, the flash chips are made by Toshiba. To improve write speeds, a pseudo-SLC cache is used, so bursts of incoming writes are absorbed more quickly. The cache is sized at 22 GB, once it is full, writes complete at 1168 MB/s. The Cardea IOPS is rated for sequential read speeds of up to 3,400 MB/s and 3,000 MB/s write; random IO reaches 680K IOPS for read and 670K for writes.
At its launch, the SSD was priced at 150 USD. The warranty length is set to five years, which is an excellent warranty period. Teamgroup guarantees an endurance rating of 1665 TBW, a good value.

Solid-State-Drive

Capacity: 1 TB (1024 GB)
Overprovisioning: 70.3 GB / 7.4 %
Production: End-of-life
Released: Dec 10th, 2020
Price at Launch: 150 USD
Part Number: TM8FPI001T0C322
Market: Consumer

Physical

Form Factor: M.2 2280 (Double-Sided)
Interface: PCIe 3.0 x4
Protocol: NVMe 1.3
Power Draw: Unknown

Controller

Manufacturer: Phison
Name: PS5012-E12S-32
Architecture: ARM 32-bit Cortex-R5
Core Count: Quad-Core
Frequency: 667 MHz
Foundry: TSMC
Process: 12 nm
Flash Channels: 8 @ 667 MT/s
Chip Enables: 4
Controller Features: DRAM (enabled)

NAND Flash

Manufacturer: Toshiba
Name: BiCS4
Part Number: TABBG65AWV
Type: TLC
Technology: 96-layer
Speed: 800 MT/s
Capacity: 4 chips @ 2 Tbit
ONFI: 4.0
Toggle: 3.0
Topology: Charge Trap
Process: 19 nm
Die Size: 86 mm²
(6.0 Gbit/mm²)
Dies per Chip: 4 dies @ 512 Gbit
Planes per Die: 2
Decks per Die: 2
Word Lines: 109 per NAND String
88.1% Vertical Efficiency
Read Time (tR): 58 µs
Program Time (tProg): 561 µs
Die Read Speed: 551 MB/s
Die Write Speed: 57 MB/s
Endurance:
(up to)		 3000 P/E Cycles
(30000 in SLC Mode)
Page Size: 16 KB
Block Size: 1152 Pages
Plane Size: 1822 Blocks

DRAM Cache

Type: DDR3L-1866 CL13
Name: Kingston D1216ECMDXGJD
Capacity: 256 MB
(1x 256 MB)
Organization: 2Gx16

Performance

Sequential Read: 3,400 MB/s
Sequential Write: 3,000 MB/s
Random Read: 680,000 IOPS
Random Write: 670,000 IOPS
Endurance: 1665 TBW
Warranty: 5 Years
MTBF: 1.5 Million Hours
Drive Writes Per Day (DWPD): 0.9
SLC Write Cache: approx. 22 GB
(dynamic only)
Speed when Cache Exhausted: approx. 1168 MB/s

Features

TRIM: Yes
SMART: Yes
Power Loss Protection: No
Encryption:
  • No
RGB Lighting: No
PS5 Compatible: No

Reviews

Notes

Drive:

Although this drive has a small pSLC Cache, it's Dynamic, it's quite commom to see SSDs powered by Phison's E12S with a small Dynamic pSLC Cache that shrinks as it fills up.

Controller:

2 main cores using Cortex-R5 clocked at 667 MHz with CoXProcessor technology (one additional dual-core) Cortex-R5 clocked at a lower clock for better efficience. The difference between this revision and the E12 revision is that this has a nichel IHS to improve the temperature, a smaller size, smaller node (12nm TSMC FinFET) and this works with less DRAM capacity.

NAND Die:

Read latency tR: 58 µs (ABL)
tPROG with ~ 25% Overhead: ~ 750 µs (Avg - 42.7 MB/s per each die)
Jun 1st, 2024 13:18 EDT change timezone

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