EVGA showed of its almost-ready dual LGA-1366 high-end workstation motherboard at the ongoing CES event. The motherboard pictured sports a component cooling covering all its vital areas except for one of the CPUs' VRM areas, it gives a fair idea about what the final product could look like. The board itself was detailed earlier.

The chipset cooler design borrows heavily from single-slot graphics cards. A monolithic baseplate covers the northbridge Intel 5500(?), ICH10-class southbridge, and the two NVIDIA BR-03 bridge chips. The heatsink becomes taller over one of the CPU sockets' VRM area. Air is drawn in from the round intake, and pushed out near the expansion slots. the gaps between the expansion slots will do their part in directing the hot air away.