Monday, September 8th 2008
Nexus Unveils the Socket LGA 1366-ready FLC-3000 Processor Cooler
Holland-based Nexus unveiled today what's I believe the first cooling reported on our site to support Intel Socket LGA 1366. That's the same socket that will be used with Intel's next-gen Core i7 processors, scheduled to be released later this year (Q4 2008). Made out of pure copper, the Nexus FLC-3000 houses a rather unusual design, measuring 128 (L) x 105 (W) x 119 (H) mm. It weights in 450 grams, has an aluminum heatsink and four 6mm copper heatpipes angled at 30 degrees. The cooling surface is chilled by a 90mm RPM-controlled fan that works between 900 and 2500 RPM and has a sound output between 15 dB(A) and 24 dB(A) depending on the rotation speed. The fan is also equipped with two orange LEDs. In addition, the Nexus FLC-3000 is also Intel LGA 775 and AMD AM2/AM2+ socket compatible. The cooler is yet to be priced.
Source:
TechConnect Magazine
20 Comments on Nexus Unveils the Socket LGA 1366-ready FLC-3000 Processor Cooler
I would clip out those led's though, orange isn't too much my thing. :laugh:
And whats with the angle? Isnt it better to have it blow exhaust air straight out the back?
As for the LEDS, I would just clip them anyway, regardless of color. I hate LEDS.
I have an 80x80x15mm Hiper fan I want to use, but it has Blue leds, i want to turn em off, but would rather not cut em.
:toast:
The slant is a good idea. If it doesnt drop any performance, it should be good.
Just look at the height; 119mm. Compare that to something like the CCF, measuring 155mm (and barely fitting into cases :p)
This is a common misconception. Although it is beneficial to have the air blow out the back, it isn't necessarily better (or worse) that other options. Often people think that if a HSF blows downward or towards other components then it will cause those components to run warmer. This is untrue so long as enough cool air is supplied to the case and warm air is sufficiently exhausted.
Air that has been heated by a CPU HSF should still have enough thermal capacity to absorb more heat from other components on the MB. If it doesn't then your CPU HSF is way too hot.