- Joined
- Oct 9, 2007
- Messages
- 47,244 (7.54/day)
- Location
- Hyderabad, India
System Name | RBMK-1000 |
---|---|
Processor | AMD Ryzen 7 5700G |
Motherboard | ASUS ROG Strix B450-E Gaming |
Cooling | DeepCool Gammax L240 V2 |
Memory | 2x 8GB G.Skill Sniper X |
Video Card(s) | Palit GeForce RTX 2080 SUPER GameRock |
Storage | Western Digital Black NVMe 512GB |
Display(s) | BenQ 1440p 60 Hz 27-inch |
Case | Corsair Carbide 100R |
Audio Device(s) | ASUS SupremeFX S1220A |
Power Supply | Cooler Master MWE Gold 650W |
Mouse | ASUS ROG Strix Impact |
Keyboard | Gamdias Hermes E2 |
Software | Windows 11 Pro |
VIA, the third active player in the x86 processor market, is known for its low-power processors catering to the ULPC segment of the market. Sources tell HKEPC that the firm is now readying a dual-core variant of its Intel Atom competitor, the Nano 3000. The Nano 3000 series, slated for launches throughout 2009 includes a new architecture by VIA, while bearing the same essential Nano-BGA package.
The processor would use a boarder system interface with the 1333 MHz VIA V4 bus (FSB). It will feature x86-64 extension along with the SSE4 instruction sets to make it standards compliant. It will feature 128KB of L1 and 1MB of L2 caches. VIA is also looking to improve the processor's number-crunching capabilities by working on its integer and floating-point operations efficiency. The processor will be built on the Japanese Fujitsu 65nm manufacturing process which has so far been VIA's foundry partner with processors and S3 Graphics products. The company is also considering a switch to the TSMC 40nm or 45nm node later, sources note. The VIA Nano 3000 Dual-Core variant can be expected in the second-half of 2009, while single core variants of the architecture can be expected earlier.
View at TechPowerUp Main Site
The processor would use a boarder system interface with the 1333 MHz VIA V4 bus (FSB). It will feature x86-64 extension along with the SSE4 instruction sets to make it standards compliant. It will feature 128KB of L1 and 1MB of L2 caches. VIA is also looking to improve the processor's number-crunching capabilities by working on its integer and floating-point operations efficiency. The processor will be built on the Japanese Fujitsu 65nm manufacturing process which has so far been VIA's foundry partner with processors and S3 Graphics products. The company is also considering a switch to the TSMC 40nm or 45nm node later, sources note. The VIA Nano 3000 Dual-Core variant can be expected in the second-half of 2009, while single core variants of the architecture can be expected earlier.
View at TechPowerUp Main Site