This is a MEH card regarding temperatures and noise. I mean louder than reference.. I even made a thread at EVGA forums about this and EVGA folks haven't commented ANYTHING.
JacobF at OCN hasn't said anything either.
I suspect it's because of only the two 8mm heatpipes make contact with the GPU die and the lone 6mm is just there.
Also the VRM cooling is done by that thermal pad that leads the VRM heat to the main heatsink and the second of the 8mm heatpipes just happens to be right above the section where the VRM heat is being carried.
BAD design if you ask me.
MSI is the winner this round.
I'm just waiting for the 4GB FTW ACX model to come up and perhaps it's cooler is better.
At least the picture of the cooler suggests that instead of 2x8+1x6mm heatpipes with direct contact it will have 4x6mm with a heatplate. And hopefully it will have a separate VRM heatsink OR a PCB heatsink with cooling for IC/VRM. I doubt that's going to happen though..
I asked EVGA about this card through email and they wouldn't say anything. At least the CS rep I talked with doesn't know. Said they'll have more info during the next two weeks and things can still change with these FTW cards apparently, or that's what he said.
It's all in the pricing on what I'll get..
I can get a 2GB GTX 670 FTW Signature 2 for a little under 320€ shipped from Germany..
If this is going to be more than 270€ at EVGA's EU shop then the cooler on that FTW ACX card has to be literally AMAZING.