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- Oct 9, 2007
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System Name | RBMK-1000 |
---|---|
Processor | AMD Ryzen 7 5700G |
Motherboard | ASUS ROG Strix B450-E Gaming |
Cooling | DeepCool Gammax L240 V2 |
Memory | 2x 8GB G.Skill Sniper X |
Video Card(s) | Palit GeForce RTX 2080 SUPER GameRock |
Storage | Western Digital Black NVMe 512GB |
Display(s) | BenQ 1440p 60 Hz 27-inch |
Case | Corsair Carbide 100R |
Audio Device(s) | ASUS SupremeFX S1220A |
Power Supply | Cooler Master MWE Gold 650W |
Mouse | ASUS ROG Strix Impact |
Keyboard | Gamdias Hermes E2 |
Software | Windows 11 Pro |
Intel issued a product change notification (PCN), marked 112432-00, which attempts to improve the reliability of the system under heavy wireless network stress. A design flaw in Intel's reference NUC boxes equipped with wireless LAN and Thunderbolt came to light late last year, when a reviewer at TechReport discovered that when under stress, the mPCIe WLAN card can overheat, causing the neighboring mSATA SSD to malfunction. In its latest PCN, Intel included a 9.5 mm-thick flexible thermal pad on the top panel, which draws heat from the SSD, and conducts it to the chassis.
View at TechPowerUp Main Site
![](https://www.techpowerup.com/img/13-07-19/150a_thm.jpg)
View at TechPowerUp Main Site