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At GDC, Intel announced a backpedal from its plans to eventually reshape desktop CPUs into components that come hardwired to the motherboards across the line, by announcing three new CPU families. It includes the Haswell-E HEDT platform, Broadwell performance platform, and Devil's Canyon. The three are expected to launch in reverse order, beginning with Devil's Canyon. A variant of existing "Haswell" silicon in the LGA1150 package, Devil's Canyon is codename for a breed of hand-picked chips with "insane" overclocking potential. In addition to binned dies, the chips feature a performance-optimized TIM between the die and the integrated heatspreader (IHS). The dies will be placed on special "high tolerance" packages, with equally "special" LGA contact points. The chips will be designed with higher voltage tolerance levels. Devil's Canyon is expected to branded under the existing Core i7-4xxx series, possibly with "Extreme" brand extension. It will be compatible with motherboards based on the Z97 chipset.
Next up, is "Broadwell." A successor to Haswell, Broadwell is its optical shrink to Intel's new 14-nanometer silicon fab process, with minor improvements to IPC, new power-management features, and likely added instruction sets, much like what "Ivy Bridge" was to "Sandy Bridge." It will take advantage of the new process to step up CPU and iGPU clock speeds. Broadwell is expected to launch in the second half of 2014. Lastly, there's Haswell-E. Built in the company's next-gen LGA2011 socket (incompatible with the current LGA2011), this HEDT (high-end desktop) processor will feature up to eight CPU cores, up to 15 MB of L3 cache, a 48-lane PCI-Express 3.0 root complex, and a quad-channel DDR4 integrated memory controller (IMC). Intel is also planning to launch a socketed variant of the Core i7-4770R, which is based on the company's Haswell GT3e silicon, which features the Iris Pro 5200 graphics core, with 40 execution units, and 128 MB of L4 cache.
View at TechPowerUp Main Site
Next up, is "Broadwell." A successor to Haswell, Broadwell is its optical shrink to Intel's new 14-nanometer silicon fab process, with minor improvements to IPC, new power-management features, and likely added instruction sets, much like what "Ivy Bridge" was to "Sandy Bridge." It will take advantage of the new process to step up CPU and iGPU clock speeds. Broadwell is expected to launch in the second half of 2014. Lastly, there's Haswell-E. Built in the company's next-gen LGA2011 socket (incompatible with the current LGA2011), this HEDT (high-end desktop) processor will feature up to eight CPU cores, up to 15 MB of L3 cache, a 48-lane PCI-Express 3.0 root complex, and a quad-channel DDR4 integrated memory controller (IMC). Intel is also planning to launch a socketed variant of the Core i7-4770R, which is based on the company's Haswell GT3e silicon, which features the Iris Pro 5200 graphics core, with 40 execution units, and 128 MB of L4 cache.
View at TechPowerUp Main Site
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