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System Name | RBMK-1000 |
---|---|
Processor | AMD Ryzen 7 5700G |
Motherboard | ASUS ROG Strix B450-E Gaming |
Cooling | DeepCool Gammax L240 V2 |
Memory | 2x 8GB G.Skill Sniper X |
Video Card(s) | Palit GeForce RTX 2080 SUPER GameRock |
Storage | Western Digital Black NVMe 512GB |
Display(s) | BenQ 1440p 60 Hz 27-inch |
Case | Corsair Carbide 100R |
Audio Device(s) | ASUS SupremeFX S1220A |
Power Supply | Cooler Master MWE Gold 650W |
Mouse | ASUS ROG Strix Impact |
Keyboard | Gamdias Hermes E2 |
Software | Windows 11 Pro |
The upcoming entries to MSI's more overclocker-oriented line of motherboards, the M-Power and X-Power OC Series, will feature an interesting new feature that could appeal to overclockers that like to de-lid (remove the IHS of) their processors, for more direct heat-transfer between the chip and cooler. Called the "Delid Die Guard," the accessory is a replacement LGA socket brace that runs its way around the die, and not the edges of the package. The thickness of the brace puts it at the exact level of the surface of the chip (much like the support braces GPUs come with), and so it prevents heavy coolers (think chunky LN2 pots) from pressing too hard against the die, potentially breaking it. The feature could debut on MSI's upcoming M-Power motherboard based on the Z97 Express chipset.
View at TechPowerUp Main Site
![](https://www.techpowerup.com/img/14-04-17/73a_thm.jpg)
View at TechPowerUp Main Site