The fact that the temps aren't any better just highlights what others have found, that the problem was never the quality of the paste but the fact that it is paste and paste does poorly with gaps, like the one created by the epoxy layer. That's why you'll see people with no temp improvement after delidding but then after they go back and scrape off more epoxy they finally get a good temp drop. I suspect solder does much better with a gap and that's why the performance is so different.
Which all begs the question why did Intel bother to spend money on new paste to begin with? Did they really just take our word for it that paste was the problem? It would make sense since the importance of the gap only became common knowledge after they had finalized the design, but surely their engineers could have figured that out on their own, right?? I mean if they're going to spend money it should be on solder or some new IHS adhesion method that leaves no gap, not some meaningless new TIM just for the sake of flaunting it in a press release.