- Joined
- Nov 18, 2010
- Messages
- 7,607 (1.47/day)
- Location
- Rīga, Latvia
System Name | HELLSTAR |
---|---|
Processor | AMD RYZEN 9 5950X |
Motherboard | ASUS Strix X570-E |
Cooling | 2x 360 + 280 rads. 3x Gentle Typhoons, 3x Phanteks T30, 2x TT T140 . EK-Quantum Momentum Monoblock. |
Memory | 4x8GB G.SKILL Trident Z RGB F4-4133C19D-16GTZR 14-16-12-30-44 |
Video Card(s) | Sapphire Pulse RX 7900XTX. Water block. Crossflashed. |
Storage | Optane 900P[Fedora] + WD BLACK SN850X 4TB + 750 EVO 500GB + 1TB 980PRO+SN560 1TB(W11) |
Display(s) | Philips PHL BDM3270 + Acer XV242Y |
Case | Lian Li O11 Dynamic EVO |
Audio Device(s) | SMSL RAW-MDA1 DAC |
Power Supply | Fractal Design Newton R3 1000W |
Mouse | Razer Basilisk |
Keyboard | Razer BlackWidow V3 - Yellow Switch |
Software | FEDORA 41 |
Watercooling? You may have heard of it? It's something enthusiasts do to keep their PCs cool. You should google it sometime.
Space is at a premium on mini ITX. The M.2 slot is typically on the bottom of the board, and any additional height could make the drive not fit properly in cases, depending on which case you have. You are talking about adding new screws to hold this heatsink, where are you going to put them? What are you going to take off the mini ITX board so that you can put screws there? If it were that simple, somebody would have already done it.
Could you get reasonable? You told yourself the market(as a whole). Now you are talking about a relatively small niche. Even all enthusiasts won't take it, they are not so fond of sacrificing flow for a such device. Server tasks will make their own custom as they wish usually. The whole thing also may be only combined with bridge or VRM heatsink looking same as thermal armor etc likeness. That is possible.
A simple copper heatsink around 2mm a top the card won't exceed PCIE connector height and will prevent the average throttle.
Continuing with mATX. Are you understanding my idea? Even a copper foil... imagine a sticker set. As 950 Pro owner I know well how it acts and how to tame the heat. And as an engineer and mobile phone technician seeing methods of cooling down performance ARM's even in a smaller envelope... there are no hurdles to implement it at all. It is just pure lack of attention, actually pure lack of any standards lately at all. They will be reasonably hot forever on silicon, you cannot change the physics, it is designed to heat up and perform so. They could make a cold and slow performing hard brick, but none needs that.