I do agree it looks more concrete and hopeful than the wording used before 14nm launched, but on the other hand, when you read critically into this;
"Case in point, Samsung currently hopes to use EUV lithography for critical layers with their 7 nm nodes to avoid triple/quadruple patterning, but are being very careful in how they're wording their plans, saying that they are "reviewing possibilities" of EUV insertion at 7 nm. So it is not cast in stone that Samsung will not proceed with a DUV-only 7 nm if it has to. Meanwhile Intel also once considered to start using EUV for 7 nm. Finally, TSMC does not seem to be afraid of multi-patterning and intends to produce semiconductors using DUV-only 7 nm manufacturing tech in 2H 2018."
source: anandtech
Also, this;
https://www.semiwiki.com/forum/content/6631-euv-not-ready-7nm.html
We're actually talking about highly costly DUV lithography because EUV simply isn't good to go yet. In other words, everyone is at the stage where they know they can do 7nm, but the biggest hurdle will be economical of nature. A full DUV process will make the chip very expensive., much more so than the current node. The design phase is underway. But that is all she wrote... It seems highly likely that we'll see affordable consumer-7nm much later than 2018.