- Joined
- Sep 17, 2014
- Messages
- 21,572 (6.00/day)
- Location
- The Washing Machine
Processor | i7 8700k 4.6Ghz @ 1.24V |
---|---|
Motherboard | AsRock Fatal1ty K6 Z370 |
Cooling | beQuiet! Dark Rock Pro 3 |
Memory | 16GB Corsair Vengeance LPX 3200/C16 |
Video Card(s) | ASRock RX7900XT Phantom Gaming |
Storage | Samsung 850 EVO 1TB + Samsung 830 256GB + Crucial BX100 250GB + Toshiba 1TB HDD |
Display(s) | Gigabyte G34QWC (3440x1440) |
Case | Fractal Design Define R5 |
Audio Device(s) | Harman Kardon AVR137 + 2.1 |
Power Supply | EVGA Supernova G2 750W |
Mouse | XTRFY M42 |
Keyboard | Lenovo Thinkpad Trackpoint II |
Software | W10 x64 |
I hear what you guys are saying. Anyway, if you take turing die and it's size and move from 12 to 7nm, considering it's got same amount of cores, shaders etc. the die will be smaller. You have more of them on one wafer. I kinda consider this that way. What it means for me is that you get same performance (because it is the same chip) but it uses less power and it's smaller due to the shrink.
Isn't this going that way?
Yeah you got that right, but now you need to still factor in the actual cost of moving fabs to a smaller node, adjusting the processes and machinery etc. And then all you've got is the same product that uses a bit less power - and has headroom for further improvement. That on its own is not enough to compete. You go smaller so you can go 'bigger'