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System Name | RBMK-1000 |
---|---|
Processor | AMD Ryzen 7 5700G |
Motherboard | ASUS ROG Strix B450-E Gaming |
Cooling | DeepCool Gammax L240 V2 |
Memory | 2x 8GB G.Skill Sniper X |
Video Card(s) | Palit GeForce RTX 2080 SUPER GameRock |
Storage | Western Digital Black NVMe 512GB |
Display(s) | BenQ 1440p 60 Hz 27-inch |
Case | Corsair Carbide 100R |
Audio Device(s) | ASUS SupremeFX S1220A |
Power Supply | Cooler Master MWE Gold 650W |
Mouse | ASUS ROG Strix Impact |
Keyboard | Gamdias Hermes E2 |
Software | Windows 11 Pro |
Here are some of the first pictures of the 10th generation Core "Ice Lake-Y" multi-chip module, designed for ultra low-power platforms, such as notebooks and 2-in-1 convertibles. These chips have a TDP target as low as 8W to 15W, are built in a BGA (ball-grid array) MCM (multi-chip module) to minimize Z-height and conserve mainboard PCB real-estate, respectively. The larger dies of the two of course is the 10 nm "Ice Lake" SoC with 4 "Sunny Cove" CPU cores, and a Gen11 GT2 iGPU. The smaller die is the PCH (platform controller hub), or chipset. The RVP (reference validation platform) is a motherboard that lets you test every possible connectivity option of the platform, by manually switching around PCIe lanes, SATA links, GPIO, LVDS, and TMDS lanes via jumpers. Intel usually hands these out to OEMs, system integrators, and system software developers. We also spotted the "Ice Lake" 4-core wafer.
View at TechPowerUp Main Site
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View at TechPowerUp Main Site