newtekie1
Semi-Retired Folder
- Joined
- Nov 22, 2005
- Messages
- 28,473 (4.06/day)
- Location
- Indiana, USA
Processor | Intel Core i7 10850K@5.2GHz |
---|---|
Motherboard | AsRock Z470 Taichi |
Cooling | Corsair H115i Pro w/ Noctua NF-A14 Fans |
Memory | 32GB DDR4-3600 |
Video Card(s) | RTX 2070 Super |
Storage | 500GB SX8200 Pro + 8TB with 1TB SSD Cache |
Display(s) | Acer Nitro VG280K 4K 28" |
Case | Fractal Design Define S |
Audio Device(s) | Onboard is good enough for me |
Power Supply | eVGA SuperNOVA 1000w G3 |
Software | Windows 10 Pro x64 |
There's a concern of pressure though...CPUs have high pressure in order to ensure no air bubbles and tight contact with the HSF. Automotive inverters (what they were testing) are no where near as tight. AS5 could preform the best at high pressure...
I think you are on to something here. AS5 is a pretty thick paste, it doesn't spread all that easily. And mounting pressure, in my experience with AS5, is very important. I even remember some heatsinks having huge bolts that pressed right down on top of the center of the CPU to just put insane amounts of mounting pressure between CPU and heatsink. Now that we have thinner pastes that spread easier, and perform just as well or better, all that junk has gone away.