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Samsung Starts Offering First A-Die Based RAM

Makes no difference, some of the bdie ram is only rated 2133 ddr4 and clock up to 4000+ etc these could well overclock pretty good as well, though no one knows so it's useless arguing over their jedec speed as that usually doesn't mean they won't clock like shit off a shovel

That's because these chips don't actually vary that much, even though some might be binned the variance wont ever be that massive.
 
I think you are confusing overclocking potential with actual offical JEDEC spec.
JEDEC spec ram are there to just work on just about every platform without any setting required.
There is no real way to determine how well a new type of IC overclocks except the get some and try. The JEDEC specs of B-die is "laughably slow" as well.
https://www.samsung.com/semiconduct...11/8G_B_DDR4_Samsung_Spec_Rev2_1_Feb_17-0.pdf

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The last time I looked JEDEC supported speed upto DDR4-3200, not B-die related.
 
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The last time I looked JEDEC support porr


The last time I looked JEDEC supported speed upto DDR4-3200, not B-die related.

He was posting the B-Die JEDEC support, not Jedec list.
so that official specifications from the vendor is 2933 cl21 doesn't mean anything was what he was implying.
 
I thought they confirmed that B-die wasn't discontinued...? I can't remember where I saw that.
It is not. This whole "B-Die is discontinued" thing has been spreading like FAKE NEWS since it came out.
B-Die is NOT discontinued. When will outlets stop spreading this misinformation?
 
It is not. This whole "B-Die is discontinued" thing has been spreading like FAKE NEWS since it came out.
B-Die is NOT discontinued. When will outlets stop spreading this misinformation?

You make yourself look like the one spreading misinformation, no link and all.

AFAIK Samsung's discontinuation of b-die is confirmed at this point. But counter me with facts and links and I will gladly recant.
 
I had just assumed these were rdimms based on the cas, I hope no OEM uses these on ryzen boxes...

Cas does go up with capacity, requires extra voltage to compensate and that would exceed jedec spec.
I had cas 6 ddr3 1600 but those were 2gb dimms...
 
You make yourself look like the one spreading misinformation, no link and all.

AFAIK Samsung's discontinuation of b-die is confirmed at this point. But counter me with facts and links and I will gladly recant.
You make yourself look like the one spreading misinformation, no link and all.

AFAIK Samsung's discontinuation of b-die is confirmed at this point. But counter me with facts and links and I will gladly recant.
Next time do you research before posting misinformation:

There's plenty of B-Die configurations in mass production.
The whole confusion started when someone downloaded the original PDF and did not bother to scroll down. The EOL variants were listed first and thus this whole fake news began spreading. Judging from this article it spreads to this day. If we're unlucky it will become a meme like "PC Gaming is dying" reapeated for the last decade.
 
I didn't read the thread.

Is A better than B? :)

I'm shell shocked, emotionally drained to the very bottom, I'm sorry. :oops: Is there some hope
 
No, it's good that you didn't read the thread.

Your shock is duly noted, keep us posted :ohwell:
 
Good that you skip the thread. Hope dies last.

People complaining JEDEC spec ram are slow.
Like water is wet.
"People die when they are killed" etc.
 
Next time do you research before posting misinformation

Thing is, I didn't. I only postulated a claim with a clearly marked "AFAIK" and clarified that you crying wolf without providing links isn't very convincing.

The links however, are appreciated. But they are also minsintrepreted, see below.

There's plenty of B-Die configurations in mass production.

Not really, though. The dies quoted in those threads still being produced are industrial, high temp tolerance parts. "Mass production" for them is much smaller batches, and you'll never see them in consumer products. Again, this is a case of someone not reading the complete PDF. (The thread author aparently even noted this, btw)

In the end, for all practical consumer ram applications, the news remains the same. Looking at the datasheet, I can't find any reference to the original b-die parts being anything but EOL but maybe a 10nm part will be released, dunno. It's performance characteristics however would likely be different. Still same story for practical purposes.
 
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Where do you take that these are industrial parts? Just curious. And who uses 3200Mhz parts in industrial hardware?

But here's another: https://www.samsung.com/semiconduct...esource/2018/06/DDR4_Product_guide_May.18.pdf
This PDF states that all 260 pin B-Die based modules are EOL as of Q1 2019 but Wikipedia says 260pin is SO-DIMM so laptop memory.
Desktop is 288pin.

And if it were true that B-Die was EOL as of Q1 of this year how can G.Skill still be releasing highly binned SKU's based on B-Die later this year. Unless they have a warehouse full of them or something. Does not add up.
 
I didn't read the thread.

Is A better than B? :)

I'm shell shocked, emotionally drained to the very bottom, I'm sorry. :oops: Is there some hope
In summary:
A die has better density per DIMM
B die will generally be the fastest die still, but is no longer being produced in favor of A die.
A die probably will not reach B die clocks for years to come really.
 
Where do you take that these are industrial parts? Just curious. And who uses 3200Mhz parts in industrial hardware?

But here's another: https://www.samsung.com/semiconduct...esource/2018/06/DDR4_Product_guide_May.18.pdf
This PDF states that all 260 pin B-Die based modules are EOL as of Q1 2019 but Wikipedia says 260pin is SO-DIMM so laptop memory.
Desktop is 288pin.

And if it were true that B-Die was EOL as of Q1 of this year how can G.Skill still be releasing highly binned SKU's based on B-Die later this year. Unless they have a warehouse full of them or something. Does not add up.
Samsung only stopped selling their own B-die based DIMMs but is still producing and suppling the ICs to others.
But someone dramatized this into "OMG B-die is EOL!!!1!" and people keep parroting it...
 
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In summary:
A die has better density per DIMM
B die will generally be the fastest die still, but is no longer being produced in favor of A die.
A die probably will not reach B die clocks for years to come really.

So a $400-$500 investment in a 4600Mhz-4800Mhz dual kit is going to remain significant for 2-3years.

Gee, I was so hoping for 5500Mhz XMP kits by Rocket Lake and ddr5. Why does tech take so long? Are they splitting the atom or something? I guess they kinda are. :)
 
Why are some people so emotional about B-die being canceled or not? :eek:
It's just RAM. DDR4 is doomed anyway.
@Tomorrow you're in some B-die religion or what?
 
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Where do you take that these are industrial parts? Just curious. And who uses 3200Mhz parts in industrial hardware?

But here's another: https://www.samsung.com/semiconduct...esource/2018/06/DDR4_Product_guide_May.18.pdf
This PDF states that all 260 pin B-Die based modules are EOL as of Q1 2019 but Wikipedia says 260pin is SO-DIMM so laptop memory.
Desktop is 288pin.

And if it were true that B-Die was EOL as of Q1 of this year how can G.Skill still be releasing highly binned SKU's based on B-Die later this year. Unless they have a warehouse full of them or something. Does not add up.

Rated temps.
 
Why are some people so emotional about B-die being canceled or not? :eek:
It's just RAM. DDR4 is doomed anyway.
@Tomorrow you're in some B-die religion or what?
It's just been elevated to this level of demigod-like reverence because of past RAM issues with Ryzen, back when the only way to get decent overall latency was with B-die... pretty much everything else would fall short. We we're happy just to get 3200mhz with our B-die! While with any other you were taking a bet on either kind of okay or just dismally slow. This whole culture was built around overclocking B-die on Ryzen.

Now, it's not really necessary. BIOS updates have made it so most RAM performs pretty well and B-die is kind of ridiculously expensive for the gains. But the culture around it isn't going to just vanish.

Then there's the aspect of just knowing what's the best RAM and how to spot it. If B-die is gone, and you've been kind of obsessing over tracking it down, what do you do when you want the best RAM for your system? It's not like this stuff is all that obvious. B-die itself was like this mystical thing, where you had to decipher the code in the specs in order to figure out if you could get the speed/timings you'd ideally want. You wouldn't always know just by looking "Oh, that's b-die and it'll do 3200/CL14." from a stick with almost identical specs that will run 400mhz slower or just never get past CL16. And there was no rhyme or reason to it.

Again, now not so much of an issue as far as I can tell, but stuff like that sticks around. I know I'll miss B-die... really it's a quality of life thing. Much easier to work with... you always know what you're getting with it. Other modules were far less consistent with earlier Ryzen chips.
 
Jedec speced 2933 MHz, damn nice. Even 32 per dimm. Can't wait until it gets to 3200W Jedec spec :)
 
We should all go back to BH5 because it has the lowest timings. I remember pushing a kit to CAS 1.
 
Maybe but B-die still has better timming at lower clock/voltage and for Ryzen 3000 timming is just as importent as high memory clock. If not more importent than clock in fact. So no matter what, right now i go for B-die.

I never use XMP. I all ways dial clock and timings in manuel. My current X58 build has XMP on memory, but i dont use it. All memory clock and timings has been done manuel.

Enabling XMP on my previous MSI Z370 board automatically pushed a dangerously high 1.3V to my 8700K IMC without any warning. While I was able to spot something wrong with the voltages quickly, I guarantee that a new PC builder will not be able to.

The XMP "spec" and other stealth massive overvolts on auto is what happens when the industry sells the idea that OCing is an inherently easy and painfree process to clueless kiddies.
 
From the B-Die cancellation articles ...
Samsung’s M-Die memory was originally intended to bring 32GB DIMMs to the consumer market, but data center customers seem to have drained the supply of these products.

Pretty disapponted about this, I want more capacity rather than peak speed.
 
i think these new die are more about capacity, especially for mobile\embedded\consoles etc. smaller denser die with lower power usage and voltage. b-die is the end of the road for high performance ddr4. from here on out high performance die from samsung will be ddr5, not ddr4. get that b-die while its hot. sure they have a decent stockpile of b-die though
 
Thing is, I didn't. I only postulated a claim with a clearly marked "AFAIK" and clarified that you crying wolf without providing links isn't very convincing.

The links however, are appreciated. But they are also minsintrepreted, see below.



Not really, though. The dies quoted in those threads still being produced are industrial, high temp tolerance parts. "Mass production" for them is much smaller batches, and you'll never see them in consumer products. Again, this is a case of someone not reading the complete PDF. (The thread author aparently even noted this, btw)

In the end, for all practical consumer ram applications, the news remains the same. Looking at the datasheet, I can't find any reference to the original b-die parts being anything but EOL but maybe a 10nm part will be released, dunno. It's performance characteristics however would likely be different. Still same story for practical purposes.
Debunked:

Only Samsung's own sticks using B-Die are EOL. Samsung continues to produce the chips for others like G.Skill etc.
 
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