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System Name | RBMK-1000 |
---|---|
Processor | AMD Ryzen 7 5700G |
Motherboard | ASUS ROG Strix B450-E Gaming |
Cooling | DeepCool Gammax L240 V2 |
Memory | 2x 8GB G.Skill Sniper X |
Video Card(s) | Palit GeForce RTX 2080 SUPER GameRock |
Storage | Western Digital Black NVMe 512GB |
Display(s) | BenQ 1440p 60 Hz 27-inch |
Case | Corsair Carbide 100R |
Audio Device(s) | ASUS SupremeFX S1220A |
Power Supply | Cooler Master MWE Gold 650W |
Mouse | ASUS ROG Strix Impact |
Keyboard | Gamdias Hermes E2 |
Software | Windows 11 Pro |
AMD X570 chipset is the industry's first PC platform core-logic to support PCI-Express gen 4.0, but has proven to be expensive and hot. Its 600-series chipset successor will be third-party sourced much like its 400-series predecessor, according to a MyDrivers report citing sources in the motherboard industry. AMD is reportedly sourcing its 500-series mid-range chipset, the B550, from ASMedia. The B550 uses PCI-Express 3.0 x4 as its chipset bus, and puts out eight PCIe gen 3.0 downstream general purpose lanes, however, B550 motherboards could still feature PCI-Express 4.0 x16 slots from the socket AM4 SoC (provided a 3rd gen Ryzen processor is installed), and at least one of the M.2 NVMe slots on B550 motherboards could have PCI-Express 4.0 x4, since they're wired to the SoC instead of the chipset.
The MyDrivers report predicts that the successor to X570, the supposed "X670," could be sourced from a third-party firm, much like the B550, and implement PCI-Express gen 4.0, not just as chipset-bus, but also putting out PCI-Express gen 4.0 general purpose lanes. A possible design goal of the X670 could be to implement PCIe gen 4.0 switching fabric without running too hot, resulting in a cooler chipset than can make do with fanless cooling solutions, much like the X470. AMD will continue to make "chipsets" in the form of I/O controller dies for use in its MCM processors, although the relatively low-margin motherboard chipset business could be axed.
View at TechPowerUp Main Site
The MyDrivers report predicts that the successor to X570, the supposed "X670," could be sourced from a third-party firm, much like the B550, and implement PCI-Express gen 4.0, not just as chipset-bus, but also putting out PCI-Express gen 4.0 general purpose lanes. A possible design goal of the X670 could be to implement PCIe gen 4.0 switching fabric without running too hot, resulting in a cooler chipset than can make do with fanless cooling solutions, much like the X470. AMD will continue to make "chipsets" in the form of I/O controller dies for use in its MCM processors, although the relatively low-margin motherboard chipset business could be axed.
View at TechPowerUp Main Site