Depends on the CPU. This logic might have been good years ago but today in addition to AM4 where chiplet might be in the corner instead of middle and LGA1151 (soon LGA1200) we also have Threadripper etc where using this method would yield bad results. Gamers Nexus tested this years ago. Even their modmat has patterns for best spread printed on it.
Whilst that's true if you do A-B testing of various spread patterns the same day you apply the paste, I can guarantee you that as long as you put enough paste in there and the clamping pressure is sufficient,
all methods result in a thin, even spread after a couple of weeks.
The only thing you have to do is avoid making an air-trap, like drawing a circle of paste, for example. This is why pea, rice grain, single-blob - call it whatever you want - is best. It will guarantee no air bubbles and it'll get squeezed into a very thin, even layer with the excess being pushed out the sides. As I mentioned a few posts back, I also put peas in the location of each individual dies in a multi-chip package, but I have a colleague that built some of our threadripper farm with the "big blob in the middle" method and having to RMA it for a failed board, the single dollop had made full-IHS coverage even without the one-blob per die method.
If that
doesn't happen then you probably have poor clamping force which is a much more serious problem that worrying about the thickness of your thermal paste layer.
But either way, the most important thing is that it simply doesn't matter. People love to argue this until they're blue in the face but if there's enough thermal paste then pretty much any shape or pattern that doesn't trap air is going to be fine and they'll all perform identically after two weeks, if not sooner.