- Joined
- May 22, 2015
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Processor | Intel i5-12600k |
---|---|
Motherboard | Asus H670 TUF |
Cooling | Arctic Freezer 34 |
Memory | 2x16GB DDR4 3600 G.Skill Ripjaws V |
Video Card(s) | EVGA GTX 1060 SC |
Storage | 500GB Samsung 970 EVO, 500GB Samsung 850 EVO, 1TB Crucial MX300 and 2TB Crucial MX500 |
Display(s) | Dell U3219Q + HP ZR24w |
Case | Raijintek Thetis |
Audio Device(s) | Audioquest Dragonfly Red :D |
Power Supply | Seasonic 620W M12 |
Mouse | Logitech G502 Proteus Core |
Keyboard | G.Skill KM780R |
Software | Arch Linux + Win10 |
Well, you said nothing about density in your first post, you simply said "intel puts out more heat, AMD is harder to cool". That's the part I explicitly quoted.How so?
A candle is 1400C, my oven is 200C - yet the candle is much slower to cook a roast, and definitely slower at heating a room
The AMD's have a lesser amount of heat, condensed into a smaller area
Even considering density, Intel was constantly bashed for using allegedly sub-standard IHSes, AMD is supposed to have the upper hand here. I mean, yes, the chiplet is small. But with the IHS over it and the base of the cooler on top, you'd expect plenty of room foe the heat to dissipate.
So far, cooler have been rating based on the wattage they can handle. Should we start them to be rated based on the wattage and positioning(?) from now on?
I don't think the problem is (just) the process, the problem is when there are two chiplets, they are next to each other. If AMD managed somehow to put the IO die in between the chiplets, the heat would have been much more evenly distributed. But I'm sure they know that and they have good reasons for not going down that route.Intels 10nm should be similarly dense so I guess when Alderlake drops we will see who is better at it.
It'll be interesting when amd transitions to 6nm or 5nm how hard their chips will be to cool then.