Intel Meteor Lake, HBM2E-enabled Sapphire Rapids, and Ponte Vecchio Pictured

[AleksandarK]

Intel has allowed the media to get a closer look at the next generation of silicon that will power millions of systems in years to come during its private Vision event. PC Watch, a Japanese tech media, managed to get some shots of the upcoming Meteor Lake, Sapphire Rapids, and Ponte Vecchio processors. Starting with Meteor Lake, Intel has displayed two packages for this processor family. The first one is the ultra-compact, high-density UP9 package used for highly compact mobile systems, and it is made out of silicon with minimal packaging to save space. The second one is a traditional design with more oversized packaging, designed for typical laptop/notebook configurations.



Next in line, we have pictures of the upcoming Intel Sapphire Rapids processors. Powering the exascale Aurora system, the company's processors will arrive as multi-chip module (MCM) designs that support HBM2E memory. In addition to the regular Sapphire Rapids design, we received a picture of the HBM2E-enabled SKU and its mysterious package solution.

Last but not least, we have seen Ponte Vecchio's pictures before. However, PC Watch again took an additional picture of a 47-tile compute monster with over 100 billion transistors. As we move closer to the Aurora exascale supercomputer's launch, we expect to see more of Ponte Vecchio's presence and appearances.


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[Valantar]

Very cool to see these packaging technologies start appearing in real life. Damn impressive stuff - here's hoping AMD is following right along, as their relatively power hungry through-package IF is starting to become a bottleneck in several market segments.

 

[tabascosauz]

I didn't think too much of 13th gen before, but it'll be a pretty interesting product to watch. 2nd gen EMIB and 2nd gen Foveros without changing the socket(?). Had no idea Kaby Lake-G actually counted as first-gen EMIB - not a bad first showing performance-wise.

The glue jokes were amusing for a while, but the current cost effective Fabric links in chiplet products are neither fast nor wide. Curious to see what AM5 will cook up.

 

[Deleted member 24505]

Very nice looking, lets hope the performance matches the looks

 

[Valantar]

I didn't think too much of 13th gen before, but it'll be a pretty interesting product to watch. 2nd gen EMIB and 2nd gen Foveros without changing the socket(?). Had no idea Kaby Lake-G actually counted as first-gen EMIB - not a bad first showing performance-wise.

The glue jokes were amusing for a while, but the current cost effective Fabric links in chiplet products are neither fast nor wide. Curious to see what AM5 will cook up.

Yeah, I kind of can't see AMD not moving to LSI (TSMC's EMIB-alike) for Zen4, unless they instead move to some form of CoWoS 3D stacking with the IOD (IO+Cache die?) on the bottom. Either way, I don't think they can afford sticking to through-package IF for another generation.

As for the glue jokes, while they are wearing off, those server chips have a rather conspicuously white resin around the chips Heck, knowing Koduri's penchant for weird (and not always particularly smart) PR stuff, that might even be intentional.

 

[Nanochip]

I didn't think too much of 13th gen before, but it'll be a pretty interesting product to watch. 2nd gen EMIB and 2nd gen Foveros without changing the socket(?). Had no idea Kaby Lake-G actually counted as first-gen EMIB - not a bad first showing performance-wise.

The glue jokes were amusing for a while, but the current cost effective Fabric links in chiplet products are neither fast nor wide. Curious to see what AM5 will cook up.

13th gen is Raptor Lake which is an optimization of Alder Lake and still monolithic no tiles. Coming 2H 2022.

What you’re seeing here is 14th gen Meteor Lake the first tiled/disaggregated product. coming sometime in 2023.

 

[Deleted member 24505]

13th gen is Raptor Lake which is an optimization of Alder Lake and still monolithic no tiles. Coming 2H 2022.

What you’re seeing here is 14th gen Meteor Lake the first tiled/disaggregated product. coming sometime in 2023.

I think these will give AMD a problem, but we will have to wait and see.

 

[NeuralNexus]

Very cool to see these packaging technologies start appearing in real life. Damn impressive stuff - here's hoping AMD is following right along, as their relatively power hungry through-package IF is starting to become a bottleneck in several market segments.

IF is an architecture that will continue to evolve with time. I do not believe AMD spent R&D on IF to incorporate the tech into their product stack just to allow it to stagnant.

 

[Valantar]

IF is an architecture that will continue to evolve with time. I do not believe AMD spent R&D on IF to incorporate the tech into their product stack just to allow it to stagnant.

That's my belief as well - it's just a fabric after all, so it's somewhat medium independent. Die-to-die implementations are absolutely possible, as are through-die implementations (e.g. 3D stacked dice on top of an interconnect die). And any such solution will be much faster, lower latency and lower power than through-package IF just because of the increased signal integrity and lowered voltage needs of signalling through silicon rather than a fiberglass substrate. The question is just how quickly they will move to more exotic packaging methods and what the specific implementations will look like.

 

[TheinsanegamerN]

IF is an architecture that will continue to evolve with time. I do not believe AMD spent R&D on IF to incorporate the tech into their product stack just to allow it to stagnant.

I mean we'd all like AMD to change, by they have stagnated numerous times before, the moment they got the lead. Athlon 64 and the Evergreen 5000 series immediately come to mind.

 

[Valantar]

I mean we'd all like AMD to change, by they have stagnated numerous times before, the moment they got the lead. Athlon 64 and the Evergreen 5000 series immediately come to mind.

Given their already on the market initial attempts at 3D stacking I think there's little reason to suspect AMD I will be sticking with their current 2D packaging even in the near future. The only question is how close the transition is. They are well aware of current IF implementations and their shortcomings - like the 100W power draws on EPYC.

 

[Dr_b_]

if you look at the reflection on the glued together dies, you can see AMD

 

[kapone32]

I mean we'd all like AMD to change, by they have stagnated numerous times before, the moment they got the lead. Athlon 64 and the Evergreen 5000 series immediately come to mind.

That was then the AMD of today is a much different company.

 

[Richards]

Very cool to see these packaging technologies start appearing in real life. Damn impressive stuff - here's hoping AMD is following right along, as their relatively power hungry through-package IF is starting to become a bottleneck in several market segments.

Ponte vechio is the most impressive gpu i ever seen.. intel's packaging is world class